S D ARF1500 S D ARF1500 BeO RF POWER MOSFET 135-05 G S S N - CHANNEL ENHANCEMENT MODE G S 125V 900W 40MHz The ARF1500 is an RF power transistor designed for very high power scientific, commercial, medical and industrial RF power generator and amplifier applications up to 40 MHz. Specified 150 Volt, 27.12 MHz Characteristics: Output Power = 900 Watts. Gain = 17dB (Class C) Efficiency > 75% High Performance Power RF Package. Very High Breakdown for Improved Ruggedness. Low Thermal Resistance. Nitride Passivated Die for Improved Reliability. MAXIMUM RATINGS Symbol All Ratings: TC = 25°C unless otherwise specified. Parameter ARF 1500 VDSS Drain-Source Voltage 500 VDGO Drain-Gate Voltage 500 ID VGS PD TJ,TSTG TL UNIT Volts 60 Amps Gate-Source Voltage ±30 Volts Total Device Dissipation @ TC = 25°C 1500 Watts Continuous Drain Current @ TC = 25°C -55 to 200 Operating and Storage Junction Temperature Range °C 300 Lead Temperature: 0.063" from Case for 10 Sec. STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS VDS(ON) IDSS IGSS g fs Characteristic / Test Conditions MIN Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 µA) 500 On State Drain Voltage 1 TYP 5.5 (ID(ON) = 30A, VGS = 10V) 100 Zero Gate Voltage Drain Current (VDS = VDSS, VGS = 0V) 1000 Zero Gate Voltage Drain Current (VDS = 0.8 VDSS, VGS = 0V, TC = 125°C) ±400 Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) 3 Forward Transconductance (VDS = 25V, ID = 30A) V isolation RMS Voltage (60Hz Sinewave from terminals to mounting surface for 1 minute) VGS(TH) Gate Threshold Voltage (VDS = VGS, ID = 50mA) MAX 5.8 UNIT Volts µA nA mhos 2500 Volts 3 5 Volts THERMAL CHARACTERISTICS Characteristic (per package unless otherwise noted) MIN RθJC Junction to Case RθCS Case to Sink (Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.) TYP MAX 0.12 0.09 UNIT °C/W CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com USA: EUROPE: 405 S.W. Columbia Street Chemin de Magret Bend, Oregon 97702 -1035 Phone: (541) 382-8028 FAX: (541) 388-0364 F-33700 Merignac - France Phone: (33) 5 57 92 15 15 FAX: (33) 5 56 47 97 61 050-5965 Rev - 10-01 Symbol DYNAMIC CHARACTERISTICS Symbol ARF1500 Test Conditions Characteristic Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance td(on) Turn-on Delay Time tr TYP MAX 3920 4800 350 480 f = 1 MHz 100 120 VGS = 15V 5 10 VDD = 0.5 VDSS 3.0 7 ID = ID[Cont.] @ 25°C 15 25 RG = 1.6 Ω 3 7 MAX VGS = 0V VDS = 150V Rise Time td(off) Turn-off Delay Time tf MIN Fall Time UNIT pF ns FUNCTIONAL CHARACTERISTICS Symbol Characteristic GPS Common Source Amplifier Power Gain η MIN TYP f = 27.12 MHz 17 19 dB 70 75 % VGS = 0V Drain Efficiency ψ Test Conditions VDD = 150V Pout = 900W Electrical Ruggedness VSWR 20:1 UNIT No Degradation in Output Power 1 Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%. APT Reserves the right to change, without notice, the specifications and information contained herein. 1.065 .160 D D S S .500 G S ARF1500 BeO 135-05 1.065 dims: inches .045 S G S .207 .375 .207 .500 .005 HAZARDOUS MATERIAL WARNING The ceramic portion of the device between leads and mounting surface is beryllium oxide. Beryllium oxide dust is highly toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. .105 typ. Thermal Considerations and Package Mounting: yy ;; yyyy ;;;; Clamp 050-5965 Rev - 10-01 ARF 1500 Heat Sink Compliant layer The rated 1500W power dissipation is only available when the package mounting surface is at 25˚C and the junction temperature is 200˚C. The thermal resistance between junctions and case mounting surface is 0.12 ˚C/W. When installed, an additional thermal impedance of 0.09 ˚C/W between the package base and the mounting surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint compound must be used to reduce the effects of small surface irregularities. The heatsink should incorporate a copper heat spreader to obtain best results. The package is designed to be clamped to a heatsink. A clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32 (M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.