DYNEX GP1601FSS18

GP1601FSS18
GP1601FSS18
Single Switch Low VCE(SAT) IGBT Module
Replaces January 2000 version, DS5248-3.0
FEATURES
■
Low VCE(SAT)
■
Non Punch Through Silicon
■
Isolated Copper Baseplate
■
Low Inductance Internal Construction
■
1600A Per module
DS5248-4.2 January 2001
KEY PARAMETERS
VCES
(typ)
VCE(sat)
(max)
IC
(max)
IC(PK)
1800V
2.6V
1600A
3200A
External connection
APPLICATIONS
■
High Reliability Inverters
■
Motor Controllers
■
Traction Drives
■
Resonant Converters
E1
E2
External connection
The Powerline range of high power modules includes dual
and single switch configurations covering voltages from 600V to
3300V and currents up to 4800A.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
C2
G
Aux E
The GP1601FSS18 is a single switch 1800V, n channel
enhancement mode, insulated gate bipolar transistor (IGBT)
module. Designed with low VCE(SAT) to minimise conduction
losses, the module is of particular relevance in low to medium
frequency applications. The IGBT has a wide reverse bias safe
operating area (RBSOA) ensuring reliability in demanding
applications.
C1
Aux C
Fig. 1 Single switch circuit diagram
Aux C
E1
C1
E2
C2
Aux E
G
ORDERING INFORMATION
Order As:
GP1601FSS18
Note: When ordering, please use the whole part number.
Outline type code: F
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25˚C unless stated otherwise
Symbol
Test Conditions
Parameter
VCES
Collector-emitter voltage
VGES
Gate-emitter voltage
VGE = 0V
-
Max.
Units
1800
V
±20
V
Continuous collector current
Tcase = 70˚C for Tj = 125˚C
1600
A
IC(PK)
Peak collector current
1ms, Tcase = 115˚C
3200
A
Pmax
Max. transistor power dissipation
Tcase = 25˚C, Tj = 150˚C
11.4
kW
Visol
Isolation voltage
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
4000
V
Min.
Max.
Units
-
11
˚C/kW
-
20
˚C/kW
-
8
˚C/kW
Transistor
-
150
˚C
Diode
-
125
˚C
–40
125
˚C
Mounting - M6
-
5
Nm
Electrical connections - M4
-
2
Nm
Electrical connections - M8
-
10
Nm
IC
THERMAL AND MECHANICAL RATINGS
Rth(j-c)
Test Conditions
Parameter
Symbol
Thermal resistance - transistor
Continuous dissipation junction to case
Rth(j-c)
Thermal resistance - diode
Continuous dissipation junction to case
Rth(c-h)
Thermal resistance - case to heatsink (per module)
Mounting torque 5Nm
(with mounting grease)
Tj
Tstg
-
2/9
Junction temperature
Storage temperature range
Screw torque
-
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise.
Min.
Typ.
Max.
Units
VGE = 0V, VCE = VCES
-
-
2
mA
VGE = 0V, VCE = VCES, Tcase = 125˚C
-
-
50
mA
Gate leakage current
VGE = ±20V, VCE = 0V
-
-
8
µA
VGE(TH)
Gate threshold voltage
IC = 80mA, VGE = VCE
4.5
5.5
6.5
V
VCE(sat)
Collector-emitter saturation voltage
VGE = 15V, IC = 1600A
-
2.6
3.2
V
VGE = 15V, IC = 1600A, Tcase = 125˚C
-
3.3
4
V
Parameter
Symbol
ICES
IGES
Collector cut-off current
Test Conditions
IF
Diode forward current
DC
-
-
1600
A
IFM
Diode maximum forward current
tp = 1ms
-
-
3200
A
VF
Diode forward voltage
IF = 1600A
-
2.2
2.5
V
IF = 1600A, Tcase = 125˚C
-
2.3
2.6
V
VCE = 25V, VGE = 0V, f = 1MHz
-
180
-
nF
-
15
-
nH
Cies
Input capacitance
LM
Module inductance
-
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise
Min.
Typ.
Max.
Units
IC = 1600A
-
1500
1650
ns
Fall time
VGE = ±15V
-
300
350
ns
EOFF
Turn-off energy loss
VCE = 900V
-
850
1050
mJ
td(on)
Turn-on delay time
RG(ON) = RG(OFF) = 2.2Ω
-
400
550
ns
L ~ 50nH
-
300
450
ns
-
500
700
mJ
IF = 1600A, VR = 50% VCES,
-
300
400
µC
dIF/dt = 6000A/µs
-
750
-
A
-
200
-
mJ
Min.
Typ.
Max.
Units
IC = 1600A
-
1700
1900
ns
Fall time
VGE = ±15V
-
300
380
ns
EOFF
Turn-off energy loss
VCE = 900V
-
1100
1300
mJ
td(on)
Turn-on delay time
RG(ON) = RG(OFF) = 2.2Ω
-
500
700
ns
L ~ 50nH
-
350
500
ns
-
700
900
mJ
IF = 1600A, VR = 50% VCES,
-
550
650
µC
dIF/dt = 5000A/µs
-
850
-
A
-
320
-
mJ
Parameter
Symbol
td(off)
tf
tr
Turn-off delay time
Rise time
EON
Turn-on energy loss
Qrr
Diode reverse recovery charge
Irr
Diode reverse current
EREC
Test Conditions
Diode reverse recovery energy
Tcase = 125˚C unless stated otherwise
Parameter
Symbol
td(off)
tf
tr
Turn-off delay time
Rise time
EON
Turn-on energy loss
Qrr
Diode reverse recovery charge
Irr
Diode reverse current
EREC
4/9
Diode reverse recovery energy
Test Conditions
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
TYPICAL CHARACTERISTICS
Vge = 20/15/12/10V
Vge = 20/15/12/10V
3200
3200
Common emitter
Tcase = 25˚C
2800
2800
2400
Collector current, Ic - (A)
Collector current, Ic - (A)
2400
2000
1600
1200
2000
1600
1200
800
800
400
400
0
0
1.0
2.0
3.0
4.0
Collector-emitter voltage, Vce - (V)
0
0
5.0
Fig. 3 Typical output characteristics
1.0
2.0
3.0
4.0
5.0
Collector-emitter voltage, Vce - (V)
6.0
Fig. 4 Typical output characteristics
2000
1200
1000
Common emitter
Tcase = 125˚C
Tcase = 125˚C
VGE = ±15V
VCE = 900V
Rg = 2.2Ω
1800
EOFF
1600
Tcase = 125˚C
VGE = ±15V
VCE = 900V
IT = 1600A
EON
1400
Energy - (mJ)
Energy - (mJ)
800
EON
600
400
EREC
EOFF
1200
1000
800
600
400
EREC
200
200
0
0
0
200
400
600
800 1000 1200 1400
Collector current, IC - (A)
Fig. 5 Typical turn-on energy vs collector current
1600
0
1
2
3
4
5
7
8
9
10
Gate resistance, RG - (Ohms)
Fig. 6 Typical turn-off energy vs collector current
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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6
5/9
GP1601FSS18
3500
3200
2800
3000
Tj = 25˚C
2400
Collector current, IC - (A)
Foward current, IF - (A)
2500
2000
Tj = 125˚C
2000
1600
1500
1200
1000
800
500
400
0
0
Conditions:
Tcase = 125˚C,
Vge = 15V,
Rg(off) = 2.2Ω
0
0.5
2.0
1.0
1.5
2.5
Foward voltage, VF - (V)
3.0
0
3.5
200 400
600 800 1000 1200 1400 1600 1800 2000
Collector-emitter voltage, Vce - (V)
Fig. 7 Diode typical forward characteristics
Fig. 8 Reverse bias safe operating area
10000
100
IC
C
.D
ax
m
100
)
us
uo
tin
on
(c
Collector current, IC - (A)
1000
50µs
100µs
tp = 1ms
10
1
1
10
100
1000
Collector-emitter voltage, Vce - (V)
Fig. 9 Forward bias safe operating area
6/9
10000
Transient thermal impedance, Zth(j-c) - (˚C/kW)
IC max. (single pulse)
Diode
10
Transistor
1
0.1
0.001
0.01
0.1
Pulse width, tp - (s)
1
10
Fig. 10 Transient thermal impedance
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
62
62
15
15
5
E1
C1
E2
C2
65
6
57
18
Aux E
18.5
16
2.5
Aux C
14.5 11
43.3
57
65
G
20
35
6x Ø7
4x M8
38
28
31.5
6x M4
5
140
Nominal weight: 1600g
Module outline type code: F
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Electrostatic handling precautions
AN4502
An introduction to IGBTs
AN4503
IGBT ratings and characteristics
AN4504
Heatsink requirements for IGBT modules
AN4505
Calculating the junction temperature of power semiconductors
AN4506
Gate drive considerations to maximise IGBT efficiency
AN4507
Parallel operation of IGBTs – punch through vs non-punch through characteristics
AN4508
Guidance notes for formulating technical enquiries
AN4869
Principle of rating parallel connected IGBT modules
AN5000
Short circuit withstand capability in IGBTs
AN5167
Driving Dynex Semincoductor IGBT modules with Concept gate drivers
AN5384
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
8/9
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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GP1601FSS18
http://www.dynexsemi.com
e-mail: power[email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontarion, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5248-4 Issue No. 4.2 January 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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