CXG1034TN Receiving Mixer Description The CXG1034TN is a receiving mixer MMIC. This IC is designed using the Sony’s GaAs J-FET process. Features • Low distortion Input IP3=+1.5 dBm (Typ.) • Low LO input power operation PLO=–15 dBm • RF, LO input matching circuit • Single 3 V power supply operation • 10-pin TSSOP package Function Frequency conversion Applications Japan digital cordless telephones (PHS) 10 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VDD 4.5 V • Input power PIN +5 dBm • Operating temperature Topr –35 to +85 °C • Storage temperature Tstg –65 to +150 °C Operating Conditions Supply voltage VDD 3.0 V Structure GaAs J-FET MMIC Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E97Z04-TE CXG1034TN Electrical Characteristics VDD=3.0 V, fRF=1.9 GHz, fLO=1.66 GHz, PLO=–15 dBm, when 50 Ω IF output matching; unless otherwise specified (Ta=25 °C) Item Current consumption Conversion gain Noise figure Input IP3 LO to RF leak level RF input VSWR LO input VSWR Symbol Min. Typ. Max. Unit IDD Gc NF IIP3 PLK VSWRRF VSWRLO — 7 — –1.5 — — — 5 8 8.5 1.5 –19 1.5 2 7 10 10.5 — –14 2.5 3.5 mA dB dB dBm dBm — — Block Diagram RFIN MIX AA AA AA AA IFOUT IF AMP LOIN LO AMP Pin Configuration NC IF OUT/VDD (MIX, IF AMP) RFIN CAP GND GND NC CAP VDD (LO AMP) LOIN 10 1 10-pin TSSOP (Plastic) —2— Measurement condition When no signal CXG1034TN Recommended Evaluation Circuit C5 VDD (MIX, IF AMP) L1 C4 RFIN 50Ω VDD (LO AMP) C2 6 5 7 4 8 3 9 2 10 1 C1 L1 C1 C2 C3 C4 C5 C6 56 nH 18 pF 1000 pF 18 pF 8 pF 1000 pF 0.1 µF —3— IF OUT 50Ω C6 C3 LOIN 50Ω CXG1034TN Example of Representative Characteristics (Ta=25 °C) POUT, IM3 vs. PIN 20 0 –20 –40 IM3 –60 –80 –35 VDD=3.0V fRF1=1.90GHz fRF2=1.9006GHz fLO=1.66GHz PLO=–15dBm –25 –15 –5 PIN-RF input power (dBm) 5 IIP3, PLK vs. PLO Gc, NF vs. PLO 10 15 4 13 2 –5 Gc 11 VDD=3.0V fRF=1.90GHz fLO=1.66GHz 9 4 NF 2 0 –25 –20 –15 –10 PLO-LO input power (dBm) –5 0 IIP3-Input IP3 (dBm) Gc-Conversion gain (dB) 6 NF-Noise figure (dB) IIP3 8 –15 0 PLK –20 –2 VDD=3.0V fRF=1.90GHz fLO=1.66GHz 7 –4 5 –6 –25 —4— –10 –25 –20 –15 –10 PLO-LO input power (dBm) –5 0 –30 PLK-LO-RF leak level (dBm) POUT-IF output power (dBm) POUT CXG1034TN Recommended Evaluation Board Front 25mm SONY CXG1034TN EVB IFOUT C4 C5 L1 C6 C3 RFIN C1 LOIN C2 VDD (LO AMP) GND VDD (MIX, IF AMP) Back VDD (MIX, IF AMP) GND VDD (LO AMP) Glass fabric-base 4-layer epoxy board (thickness: 0.3 mm × 2) GND for the 2nd and 3rd layers —5— CXG1034TN Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 0.1 10 6 + 0.15 0.1 – 0.05 0.45 ± 0.15 3.2 ± 0.2 ∗2.2 ± 0.1 5 1 0.5 + 0.08 0.22 – 0.07 0.1 0.25 0° to 10° M A (0.1) + 0.025 0.12 – 0.015 Package Outline (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.02g SONY CODE TSSOP-10P-L01 —6—