ZMD-Standard January 2002 Package SSOP28 (5,3 mm) MDS 762 Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions View X A A2 X 0,15 G A1 bp e HE E Z LP c 0,1 28 1 k x 45° M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,99 Amin 1,73 bPmin 0,25 A1min 0,05 bPmax 0,38 A1max 0,21 enom 0,65 A2min 1,68 HEmin 7,65 A2max 1,78 HEmax 7,90 cmin 0,09 LPmin 0,63 cmax 0,20 Zmax 1,22 Dmin* 10,07 Dmax* 10,33 2 Weight £ 0,4 g Emin* 5,20 3 Package Body Material Low Stress Epoxy Emax* 5,38 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 10° * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 25.01.2002 Check: signed Marx Quality: signed Lorenz Doc-No. QS-000762-HD-01