ZMD-Standard March 2005 Package SOP16 (300 mil) MDS 773 Dimensions in millimetres Based on JEDEC JEP95 MS-013 1 Dimensions View X bp k x 45° A A2 X 0,1 0,2 M Z 1 e θ c LP HE E A1 16 D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 2,65 Amin 2,35 bPmin 0,35 A1min 0,10 bPmax 0,49 A1max 0,30 enom 1,27 A2min 2,25 HEmin 10,00 A2max 2,45 HEmax 10,65 cmin 0,23 LPmin 0,61 cmax 0,32 Zmax 0,79 Dmin* 10,21 Dmax* 10,46 2 Weight ≤ 0,5 g Emin* 7,40 3 Package Body Material Low Stress Epoxy Emax* 7,60 4 Lead Material Cu-Alloy kmin 0,25 5 Lead Finish solder plating θmin 0° 6 Lead Form Z-bends θmax 8° * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Date: 18 March 2005 Check: signed Marx Quality: signed Tina Kochan Doc-No. QS-000773-HD-01.01