24-Pin SOIC-to-22-Pin 0.400" DIP FEATURES •A cost-effective means of upgrading to SOIC without changing your PCB layout. GENERAL SPECIFICATIONS •BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides •PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290 •OPERATING TEMPERATURE: 221ºF [105ºC] MOUNTING CONSIDERATIONS •SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71±0.08] dia. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED PINS 11 AND 14 NOT CONNECTED ON SOIC CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION 22-304504-18-P Optional Panelized Version CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18080 Rev. AB