ETC STB130NH02LT4

STB130NH02L
N-CHANNEL 20V - 0.0034 Ω - 90A D2PAK
STripFET III POWER MOSFET FOR DC-DC CONVERSION
TYPE
STB130NH02L
■
■
■
■
■
■
VDSS
R DS(on)
ID
20 V
< 0.0044 Ω
90 A(#)
TYPICAL RDS(on) = 0.0034 Ω @ 10 V
RDS(ON) * Qg INDUSTRY’s BENCHMARK
CONDUCTION LOSSES REDUCED
SWITCHING LOSSES REDUCED
LOW THRESHOLD DEVICE
SURFACE-MOUNTING D2PAK (TO-263)
POWER PACKAGE IN TUBE (NO SUFFIX) OR
IN TAPE & REEL (SUFFIX “T4”)
3
1
D2 PAK
TO-263
(Suffix “T4”)
DESCRIPTION
The STB130NH02L utilizes the latest advanced design
rules of ST’s proprietary STripFET technology. It is
ideal in high performance DC-DC converter applications
where efficiency is to be achieved at very high output
currents.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ SYNCHRONOUS RECTIFICATIONS FOR
TELECOM AND COMPUTER
■ OR-ING DIODE
ABSOLUTE MAXIMUM RATINGS
Symbol
V DS
V DGR
Parameter
Value
Unit
Drain-source Voltage (VGS = 0)
20
V
Drain-gate Voltage (RGS = 20 kΩ)
20
V
± 20
V
VGS
Gate- source Voltage
ID(#)
90
A
ID(#)
Drain Current (continuous) at TC = 25°C
Drain Current (continuous) at TC = 100°C
90
A
IDM(•)
Drain Current (pulsed)
360
A
Total Dissipation at TC = 25°C
150
W
1
W/°C
900
mJ
-55 to 175
°C
Ptot
Derating Factor
E AS (2)
Tstg
Tj
Single Pulse Avalanche Energy
Storage Temperature
Max. Operating Junction Temperature
(•) Pulse width limit ed by safe operating area.
(#) Value limited by wire bonding
September 2002
(1) Starting Tj = 25 oC, ID = 45A, VDD = 10V
1/9
STB130NH02L
THERMAL DATA
Rthj-case
Rthj-amb
Tl
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
°C/W
°C/W
°C
1.0
62.5
300
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
IDSS
Zero Gate Voltage
Drain Current (V GS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20 V
V(BR)DSS
Min.
Typ.
Max.
20
Unit
V
1
10
µA
µA
±100
nA
Max.
Unit
ON (*)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS
I D = 250 µA
R DS(on)
Static Drain-source On
Resistance
VGS = 10 V
I D = 45 A
Min.
Typ.
1
V
0.0034
0.0044
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
2/9
Parameter
Test Conditions
gfs (*)
Forward Transconductance
VDS = 10 V
C iss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VDS = 15V f = 1 MHz VGS = 0
RG
Gate Input Resistance
f = 1 MHz Gate DC Bias = 0
Test Signal Level = 20 mV
Open Drain
ID = 45 A
Min.
55
S
4450
1126
141
pF
pF
pF
1.6
Ω
STB130NH02L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on Delay Time
Rise Time
VDD = 10 V
I D = 45 A
V GS = 10 V
R G = 4.7 Ω
(Resistive Load, Figure 3)
14
224
Qg
Qgs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD=10 V ID=90 A VGS=10 V
69
13
9
93
nC
nC
nC
Typ.
Max.
Unit
ns
ns
SWITCHING OFF
Symbol
td(off)
tf
Parameter
Test Conditions
Min.
VDD = 10 V
I D = 45 A
VGS = 10 V
RG = 4.7Ω,
(Resistive Load, Figure 3)
Turn-off Delay Time
Fall Time
69
40
ns
ns
SOURCE DRAIN DIODE
Symbol
Parameter
ISD
ISDM (•)
Source-drain Current
Source-drain Current (pulsed)
VSD (*)
Forward On Voltage
ISD = 90 A
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 90 A
di/dt = 100A/µs
T j = 150°C
VDD = 15 V
(see test circuit, Figure 5)
trr
Qrr
IRRM
(*)Pulsed: Pulse duration = 300 µs, duty cycle
(•)Pulse width limit ed by safe operating area.
Safe Operating Area
Test Conditions
Min.
Typ.
VGS = 0
47
58
2.5
Max.
Unit
90
360
A
A
1.3
V
ns
nC
A
1.5 %.
Thermal Impedance
3/9
STB130NH02L
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/9
STB130NH02L
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage vs Temperature
.
.
5/9
STB130NH02L
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/9
STB130NH02L
D2PAK MECHANICAL DATA
DIM.
MIN.
mm.
TYP.
MAX.
MIN.
inch.
TYP.
TYP.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
B
0.03
0.7
0.23
0.93
0.001
0.028
0.009
0.037
B2
C
1.14
0.45
1.7
0.6
0.045
0.018
0.067
0.024
C2
1.21
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
D1
E
10
10.4
0.394
E1
G
8
0.315
8.5
0.409
0.334
4.88
5.28
0.192
0.208
L
15
15.85
0.591
0.624
L2
1.27
1.4
0.050
0.055
L3
M
1.4
2.4
1.75
3.2
0.055
0.094
0.069
0.126
R
V2
0°
8°
0°
0.4
0.015
8°
7/9
STB130NH02L
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
DIM.
mm
MAX.
MIN.
MAX.
A0
10.5
10.7
0.413
0.421
B0
15.7
15.9
0.618
0.626
D
1.5
1.6
0.059
0.063
D1
1.59
1.61
0.062
0.063
E
1.65
1.85
0.065
0.073
F
11.4
11.6
0.449
0.456
K0
4.8
5.0
0.189
0.197
P0
3.9
4.1
0.153
0.161
P1
11.9
12.1
0.468
0.476
P2
1.9
2.1
0075
0.082
R
50
1.574
T
0.25
0.35
.0.0098
0.0137
W
23.7
24.3
0.933
0.956
* on sales type
8/9
inch
MIN.
MIN.
330
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
inch
MAX.
MAX.
12.992
0.059
13.2
0.504
0.520
0.795
26.4
0.960
1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
STB130NH02L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in lif e support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
 2002 STMicroelectronics - All Rights Reserved
All other names are the property of their respective owners.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.
http://w ww.st.com
9/9