SAMSUNG KM681002BT-8

PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
Document Title
128Kx8 Bit High Speed Static RAM(5V Operating), Revolutionary Pin out.
Operated at Commercial and Industrial Temperature Range.
Revision History
Rev No.
History
Rev. 0.0
Initial release with Design Target.
Apr. 1st, 1997
Design Target
Rev.1.0
Release to Preliminary Data Sheet.
1. Replace Design Target to Preliminary.
Jun. 1st, 1997
Preliminary
Rev.2.0
Release to Final Data Sheet.
2.1. Delete Preliminary
2.2. Delete 32-SOJ-300 package
2.3. Delete L-version.
2.4. Delete Data Retention Characteristics and Waveform.
2.5. Add Capacitive load of the test environment in A.C test load
2.6. Change D.C characteristics
Previous spec.
Changed spec.
Items
(8/10/12ns part)
(8/10/12ns part)
Icc
160/150/140mA
160/155/150mA
Isb
30mA
50mA
Feb. 25th, 1998
Final
Draft Data
Remark
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters
of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or contact Headquart ers.
-1-
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
128K x 8 Bit High-Speed CMOS Static RAM
FEATURES
GENERAL DESCRIPTION
• Fast Access Time 8,10,12ns(Max.)
• Low Power Dissipation
Standby (TTL)
: 50 mA(Max.)
(CMOS) : 10 mA(Max.)
Operating KM681002B - 8 : 160 mA(Max.)
KM681002B - 10 : 155 mA(Max.)
KM681002B - 12 : 150 mA(Max.)
• Single 5.0V ±10% Power Supply
• TTL Compatible Inputs and Outputs
• I/O Compatible with 3.3V Device
• Fully Static Operation
- No Clock or Refresh required
• Three State Outputs
• Center Power/Ground Pin Configuration
• Standard Pin Configuration
KM681002BJ : 32-SOJ-400
KM681002BT: 32-TSOP2-400F
The KM681002B is a 1,048,576-bit high-speed Static Random
Access Memory organized as 131,072 words by 8 bits. The
KM681002B uses 8 common input and output lines and has an
output enable pin which operates faster than address access
time at read cycle. The device is fabricated using Samsung ′s
advanced CMOS process and designed for high-speed circuit
technology. It is particularly well suited for use in high-density
high-speed system applications. The KM681002B is packaged
in a 400mil 32-pin plastic SOJ or TSOP2 forward.
ORDERING INFORMATION
KM681002B -8/10/12
Commercial Temp.
KM681002BI -8/10/12
Industrial Temp.
PIN CONFIGURATION (Top View)
FUNCTIONAL BLOCK DIAGRAM
Clk Gen.
Pre-Charge Circuit
A0
1
32 A16
A1
2
31 A15
A2
3
30 A14
A3
4
29 A13
CS
5
28 OE
I/O1
6
27 I/O8
I/O2
7
26 I/O7
Vcc
8
Vss
9
A0
A2
A3
A4
A5
Row Select
A1
Memory Array
256 Rows
512x8 Columns
I/O3 10
A6
A7
I/O1~I/O8
Data
Cont.
I/O Circuit
Column Select
CLK
Gen.
SOJ/
25 Vss
24 Vcc
TSOP2
23 I/O6
I/O4 11
22 I/O5
WE
12
21 A12
A4
13
20 A11
A5
14
19 A10
A6
15
18
A9
A7
16
17
A8
PIN FUNCTION
A8 A9 A10 A11 A12 A13 A14 A15 A16
Pin Name
A0 - A16
Pin Function
Address Inputs
CS
WE
Write Enable
WE
CS
Chip Select
OE
Output Enable
OE
I/O1 ~ I/O8
-2-
Data Inputs/Outputs
VCC
Power(+5.0V)
VSS
Ground
N.C
No Connection
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
ABSOLUTE MAXIMUM RATINGS*
Parameter
Symbol
Rating
Unit
VIN, VOUT
-0.5 to 7.0
V
Voltage on V CC Supply Relative to V SS
VCC
-0.5 to 7.0
V
Power Dissipation
PD
1.0
W
Voltage on Any Pin Relative to V SS
TSTG
-65 to 150
°C
Commercial
TA
0 to 70
°C
Industrial
TA
-40 to 85
°C
Storage Temperature
Operating Temperature
* Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress r ating only and
functional operation of the device at these or any other conditions above those indicated in the operating sections of this spec ification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS (TA=0 to 70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VCC
4.5
5.0
5.5
V
Ground
VSS
0
0
0
V
Input High Voltage
VIH
2.2
-
VCC + 0.5**
V
Input Low Voltage
VIL
-0.5*
-
0.8
V
NOTE: The above parameters are also guaranteed at industrial temperature range.
* VIL(Min) = -2.0V a.c(Pulse Width≤6ns) for I≤20mA
** VIH(Max) = VCC + 2.0V a.c (Pulse Width≤6ns) for I≤20mA
DC AND OPERATING CHARACTERISTICS (TA=0 to 70°C, Vcc=5.0V±10%, unless otherwise specified)
Parameter
Symbol
Min
Test Conditions
Max
Unit
Input Leakage Current
ILI
VIN = VSS to VCC
-2
2
µA
Output Leakage Current
ILO
CS=VIH or OE=VIH or WE=VIL
VOUT=VSS to VCC
-2
2
µA
Operating Current
ICC
Min. Cycle, 100% Duty
CS=VIL, VIN=VIH or VIL,
IOUT=0mA
8ns
-
160
mA
10ns
-
155
12ns
-
150
Standby Current
Output Low Voltage Level
Output High Voltage Level
ISB
Min. Cycle, CS=VIH
-
50
mA
ISB1
f=0MHz, CS ≥VCC-0.2V,
VIN≥VCC-0.2V or V IN≤0.2V
-
10
mA
VOL
IOL=8mA
-
0.4
V
VOH
IOH=-4mA
2.4
-
V
-
3.95
V
VOH1*
IOH1=-0.1mA
NOTE: The above parameters are also guaranteed at industrial temperature range.
* VCC=5.0V, Temp.=25°C
CAPACITANCE *(TA=25°C, f=1.0MHz)
Item
Symbol
Test Conditions
MIN
Max
Unit
Input/Output Capacitance
CI/O
VI/O=0V
-
8
pF
Input Capacitance
CIN
VIN=0V
-
6
pF
* NOTE : Capacitance is sampled and not 100% tested.
-3-
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
AC CHARACTERISTICS (TA=0 to 70°C, VCC=5.0V±10%, unless otherwise noted.)
TEST CONDITIONS
Parameter
Value
Input Pulse Levels
0V to 3V
Input Rise and Fall Times
3ns
Input and Output timing Reference Levels
1.5V
Output Loads
See below
NOTE: The above test conditions are also applied at industrial temperature range.
Output Loads(B)
for tHZ, tLZ, tWHZ, tOW, tOLZ & tOHZ
Output Loads(A)
+5.0V
RL = 50Ω
DOUT
480Ω
VL = 1.5V
ZO = 50Ω
DOUT
30pF*
255Ω
5pF*
* Including Scope and Jig Capacitance
* Capacitive Load consists of all components of the
test environment.
READ CYCLE
Parameter
Symbol
KM681002B-8
KM681002B-10
KM681002B-12
Min
Max
Min
Max
Min
Max
Unit
Read Cycle Time
tRC
8
-
10
-
12
-
ns
Address Access Time
tAA
-
8
-
10
-
12
ns
Chip Select to Output
tCO
-
8
-
10
-
12
ns
Output Enable to Valid Output
tOE
-
4
-
5
-
6
ns
Chip Enable to Low-Z Output
tLZ
3
-
3
-
3
-
ns
Output Enable to Low-Z Output
tOLZ
0
-
0
-
0
-
ns
Chip Disable to High-Z Output
tHZ
0
4
0
5
0
6
ns
Output Disable to High-Z Output
tOHZ
0
4
0
5
0
6
ns
Output Hold from Address Change
tOH
3
-
3
-
3
-
ns
Chip Selection to Power Up Time
tPU
0
-
0
-
0
-
ns
Chip Selection to Power DownTime
tPD
-
8
-
10
-
12
ns
NOTE: The above parameters are also guaranteed at industrial temperature range.
-4-
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
WRITE CYCLE
Parameter
Symbol
KM681002B-8
KM681002B-10
KM681002B-12
Min
Max
Min
Max
Min
Max
Unit
Write Cycle Time
tWC
8
-
10
-
12
-
ns
Chip Select to End of Write
tCW
6
-
7
-
8
-
ns
Address Set-up Time
tAS
0
-
0
-
0
-
ns
Address Valid to End of Write
tAW
6
-
7
-
8
-
ns
Write Pulse Width( OE High)
tWP
6
-
7
-
8
-
ns
Write Pulse Width( OE Low)
tWP1
8
-
10
-
12
-
ns
Write Recovery Time
tWR
0
-
0
-
0
-
ns
Write to Output High-Z
tWHZ
0
4
0
5
0
6
ns
Data to Write Time Overlap
tDW
4
-
5
-
6
-
ns
Data Hold from Write Time
tDH
0
-
0
-
0
-
ns
End Write to Output Low-Z
tOW
3
-
3
-
3
-
ns
NOTE: The above parameters are also guaranteed at industrial temperature range.
TIMMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1)
(Address Controlled, CS=OE=VIL, WE=VIH)
tRC
Address
tAA
tOH
Data Out
Valid Data
Previous Valid Data
TIMING WAVEFORM OF READ CYCLE(2)
(WE=VIH)
tRC
Address
tAA
tCO
CS
tHZ(3,4,5)
tOE
tOHZ
OE
tOH
tOLZ
tLZ(4,5)
Data out
Valid Data
VCC
ICC
Current
ISB
tPU
tPD
50%
50%
-5-
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
NOTES(READ CYCLE)
1. WE is high for read cycle.
2. All read cycle timing is referenced from the last valid address to the first transition address.
3. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit condition and are not referenced to V OH or
VOL levels.
4. At any given temperature and voltage condition, t HZ(Max.) is less than tLZ(Min.) both for a given device and from device to
device.
5. Transition is measured ±200mV from steady state voltage with Load(B). This parameter is sampled and not 100% tested.
6. Device is continuously selected with CS=VIL.
7. Address valid prior to coincident with CS transition low.
8. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycl e.
TIMING WAVEFORM OF WRITE CYCLE(1)
(OE= Clock)
tWC
Address
tWR(5)
tAW
OE
tCW(3)
CS
tWP(2)
tAS(4)
WE
tDW
Data in
High-Z
tDH
Valid Data
tOHZ(6)
High-Z(8)
Data out
TIMING WAVEFORM OF WRITE CYCLE(2)
(OE=Low Fixed)
tWC
Address
tWR(5)
tAW
tCW(3)
CS
tAS(4)
tWP1(2)
WE
tDW
Data in
High-Z
tDH
Valid Data
tWHZ(6)
tOW
(10)
(9)
High-Z(8)
Data out
-6-
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
TIMING WAVEFORM OF WRITE CYCLE(3)
(CS = Controlled)
tWC
Address
tAW
tWR(5)
tCW(3)
CS
tAS(4)
tWP(2)
WE
tDW
High-Z
Data in
Data Valid
tLZ
High-Z
tWHZ(6)
High-Z(8)
High-Z
Data out
tDH
NOTES(WRITE CYCLE)
1. All write cycle timing is referenced from the last valid address to the first transition address.
2. A write occurs during the overlap of a low CS and WE. A write begins at the latest transition CS going low and WE going low ;
A write ends at the earliest transition CS going high or WE going high. tWP is measured from the beginning of write to the end of
write.
3. tCW is measured from the later of CS going low to end of write.
4. tAS is measured from the address valid to the beginning of write.
5. tWR is measured from the end of write to the address change. t WR applied in case a write ends as CS or WE going high.
6. If OE, CS and WE are in the Read Mode during this period, the I/O pins are in the output low-Z state. Inputs of opposite phase
of the output must not be applied because bus contention can occur.
7. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycl e.
8. If CS goes low simultaneously with WE going or after WE going low, the outputs remain high impedance state.
9. Dout is the read data of the new address.
10. When CS is low : I/O pins are in the output state. The input signals in the opposite phase leading to the output should not be
applied.
FUNCTIONAL DESCRIPTION
CS
WE
OE
Mode
I/O Pin
Supply Current
H
X
X*
Not Select
High-Z
ISB, ISB1
L
H
H
Output Disable
High-Z
ICC
L
H
L
Read
DOUT
ICC
L
L
X
Write
DIN
ICC
* NOTE : X means Don′t Care.
-7-
Rev 2.0
February 1998
PRELIMINARY
Preliminary
PRELIMINARY
CMOS SRAM
KM681002B, KM681002BI
PACKAGE DIMENSIONS
32-SOJ-400
Units:millimeters/Inches
#17
10.16
0.400
#32
11.18 ±0.12
0.440 ±0.005
9.40 ±0.25
0.370 ±0.010
0.20
#1
#16
0.008
0.69
0.027 MIN
21.36 MAX
0.841
20.95 ±0.12
0.825 ±0.005
( 1.30 )
0.051
( 1.30 )
0.051
( 0.95 )
0.0375
+0.10
-0.05
+0.004
0.017 -0.002
0.43
0.71
1.27
0.050
+0.10
-0.05
+0.004
-0.002
3.76 MAX
0.148
0.10
MAX
0.004
+0.10
-0.05
0.028 +0.004
-0.002
32-TSOP2-400F
0~8°
0.25
( 0.010 )
#17
0.45 ~0.75
0.018 ~ 0.030
11.76 ±0.20
0.463 ±0.008
#1
10.16
0.400
#32
( 0.50 )
0.020
#16
0.15 +0.10
-0.05
0.006 +0.004
-0.002
21.35 MAX
0.841
20.95 ±0.10
0.825 ±0.004
1.00 ±0.10
0.039 ±0.004
( 0.95 )
0.037
0.40 ±0.10
0.016 ±0.004
1.27
0.050
1.20
0.047MAX
0.10 MAX
0.004 MAX
0.05
0.002MIN
-8-
Rev 2.0
February 1998