Philips Semiconductors Product specification Rectifier diodes Schottky barrier FEATURES PBYR1645F, PBYR1645X SYMBOL • Low forward volt drop • Fast switching • Reverse surge capability • High thermal cycling performance • Isolated mounting tab QUICK REFERENCE DATA VR = 40 V/ 45 V k 1 a 2 IF(AV) = 16 A VF ≤ 0.6 V GENERAL DESCRIPTION Schottky rectifier diodes in a plastic envelope with electrically isolated mounting tab. Intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The PBYR1645F is supplied in the SOD100 package. The PBYR1645X is supplied in the SOD113 package. PINNING PIN SOD100 SOD113 DESCRIPTION case 1 cathode 2 anode tab case isolated 1 2 1 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. PBYR16 PBYR16 VRRM VRWM VR IF(AV) IFRM IFSM IRRM Tj Tstg July 1998 Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified forward current Repetitive peak forward current Non-repetitive peak forward current Peak repetitive reverse surge current Operating junction temperature Storage temperature MAX. UNIT - 40F 40X 40 45F 45X 45 V - 40 45 V Ths ≤ 97 ˚C - 40 45 V square wave; δ = 0.5; Ths ≤ 95 ˚C - 16 A square wave; δ = 0.5; Ths ≤ 95 ˚C - 32 A t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 ˚C prior to surge; with reapplied VRRM(max) pulse width and repetition rate limited by Tj max - 120 132 A A - 1 A - 150 ˚C - 65 175 ˚C 1 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR1645F, PBYR1645X ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol Peak isolation voltage from both terminals to external heatsink SOD100 package; R.H. ≤ 65%; clean and dustfree MIN. Visol Cisol TYP. MAX. UNIT - - 1500 V R.M.S. isolation voltage from SOD113 package; f = 50-60 Hz; both terminals to external sinusoidal waveform; R.H. ≤ 65%; clean heatsink and dustfree - - 2500 V Capacitance from pin 1 to external heatsink - 10 - pF f = 1 MHz THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs with heatsink compound - - 4.2 K/W in free air - 55 - K/W Rth j-a Thermal resistance junction to heatsink Thermal resistance junction to ambient MIN. TYP. MAX. UNIT ELECTRICAL CHARACTERISTICS Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS VF Forward voltage IR Reverse current Cd Junction capacitance IF = 16 A; Tj = 125˚C IF = 16 A VR = VRWM VR = VRWM; Tj = 100˚C VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C July 1998 MIN. 2 - TYP. MAX. UNIT 0.53 0.55 0.2 27 470 0.6 0.68 1.7 40 - V V mA mA pF Rev 1.200 Philips Semiconductors Product specification Rectifier diodes Schottky barrier 20 PBYR1645F, PBYR1645X Forward dissipation, PF (W) Ths(max) (C) PBYR1645X 66 Vo = 0.37 V Rs = 0.014 Ohms PBYR1645 Reverse current, IR (mA) 100 125 C D = 1.0 15 10 87 100 C 0.5 75 C 0.2 10 tp I D= 5 0 5 50 C tp T 0.1 129 Tj = 25 C t T 0 1 108 0.1 0.01 150 25 10 15 20 Average forward current, IF(AV) (A) 0 Fig.1. Maximum forward dissipation PF = f(IF(AV)); square current waveform where IF(AV) =IF(RMS) x √D. 15 Forward dissipation, PF (W) PBYR1645X Vo = 0.37 V Rs = 0.014 Ohms 2.8 2.2 Ths(max) (C) 1.9 50 Fig.4. Typical reverse leakage current; IR = f(VR); parameter Tj PBYR1645 Cd / pF 87 10000 a = 1.57 4 10 25 Reverse voltage, VR (V) 108 1000 129 5 0 0 100 1 150 15 5 10 Average forward current, IF(AV) (A) Fig.2. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). 50 Forward current, IF (A) 10 100 VR / V Fig.5. Typical junction capacitance; Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C. PBYR1645 10 Transient thermal impedance, Zth j-hs (K/W) Tj = 25 C Tj = 125 C 40 1 30 typ 20 0.1 max PD tp D= 10 T 0 0.01 0 0.2 0.4 0.6 0.8 1 Forward voltage, VF (V) 1.2 1.4 Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj July 1998 1us 10us 100us tp T t 1ms 10ms 100ms 1s 10s pulse width, tp (s) PBYR1645 Fig.6. Transient thermal impedance; Zth j-hs = f(tp). 3 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR1645F, PBYR1645X MECHANICAL DATA Dimensions in mm 10.2 max 5.7 max 3.2 3.0 Net Mass: 2 g 4.4 max 0.9 0.5 2.9 max 4.4 4.0 7.9 7.5 17 max seating plane 3.5 max not tinned 4.4 13.5 min k 0.4 a 0.9 0.7 M 0.55 max 1.3 5.08 top view Fig.7. SOD100; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". July 1998 4 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR1645F, PBYR1645X MECHANICAL DATA Dimensions in mm 10.3 max 4.6 max Net Mass: 2 g 3.2 3.0 2.9 max 2.8 Recesses (2x) 2.5 0.8 max. depth 6.4 15.8 19 max. max. 15.8 max seating plane 3 max. not tinned 3 2.5 13.5 min. 1 0.4 2 M 1.0 (2x) 0.6 2.54 0.9 0.7 0.5 2.5 5.08 Fig.8. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". July 1998 5 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR1645F, PBYR1645X DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1998 6 Rev 1.200