HITACHI 2SK3174A

2SK3174A
Silicon N Channel MOS FET
UHF Power Amplifier
ADE-208-1451 (Z)
1st. Edition
September 2001
Features
• High power output, High gain, High efficiency
P1dB = 220 W , PG = 15.3dB , ηD = 61 % (at P1dB) typ. (f = 860MHz)
• Compact package
Suitable for push - pull circuit
Outline
RFPAK-F
4
D
G
D
3
5
G
2
S
1
1. Drain
2. Drain
3. Source
4. Gate
5. Gate
This Device is sensitive to Electro Static Discharge. An Adequate handling procedure is requested.
In AC testing, the part should be mounted on heat sink with thermal compound.
2SK3174A
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Drain to source voltage
VDSS
Gate to source voltage
VGSS
Drain current
ID
Drain peak current
Note1
ID(pulse)
Note2
Note3
Ratings
Unit
60
V
±10
V
16
A
32
A
Channel dissipation
Pch
252
W
Channel temperature
Tch
175
°C
Storage temperature
Tstg
–55 to +150
°C
Note:
1. Pin=0, PW ≤ 0.1sec
2. PW ≤ 10ms, duty cycle ≤ 50 %
3. Value at Tc = 25°C
Electrical Characteristics
(Tc = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
IDSS
—
—
1
mA
VDS = 60 V, VGS = 0
IGSS
—
—
±3
µA
VGS = ±10 V, VDS = 0
VGS(off)
1.0
2.3
3.0
V
ID = 1 mA, VDS = 10 V
|yfs|
4.0
6.7
—
S
VDS=10 V, ID = 5 A Note5
Input capacitance Note4
Ciss
—
162
—
pF
VGS = 5 V, VDS = 0
f = 1 MHz
Reverse transfer capacitance Note4
Crss
—
4
—
pF
VDG = 10 V, VGS = 0
f = 1 MHz
Output Power
Pout
200
270
—
W
VDS = 28 V, IDQ = 1.2 A
f = 860 MHz
Pin = 14 W
Drain Rational
ηD
—
64
—
%
VDS = 28 V, IDQ = 1.2 A
f = 860 MHz
Pin = 14 W
Zero gate voltage drain current
Gate to source leak current
Note4
Note4
Gate to source cutoff voltage
Note4
Forward transfer admittance Note4
Note:
4. Shows 1 unit FET
5. Pulse Test
Rev.0, Aug. 2001, page 2 of 8
5
2SK3174A
Main Characteristics
Maximum Safe Operation Area
Power vs. Temperature Derating
n
c
(T
5
=
o
25
C)
I D (A)
Drain Current
10
io
100
t
ra
200
20
pe
300
O
Channel Dissipation
50
DC
Pch (W)
400
2
1
0
0.5
50
100
Case Temperature
150
200
1
Tc (°C)
Typical Output Characteristics
20
10 V
Typical Transfer Characteristics
20
8V
V DS = 10 V
Pulse Test
Shows 1 unit FET
5V
12
Pulse Test
Shows 1 unit FET
4V
4
ID
(A)
16
Drain Current
Drain Current
I D (A)
6V
8
10
20
50 100
2
5
Drain to Source Voltage V DS (V)
16
12
8
4
VGS = 3 V
0
2
4
6
Drain to Source Voltage
8
10
VDS (V)
0
1
2
3
4
Gate to Source Voltage
5
6
VGS (V)
Rev.0, Aug. 2001, page 3 of 8
Drain to Source Saturation Voltage
V DS(on) (V)
10
Drain to Source Saturatioin Voltage vs.
Drain Current
Forward Transfer Admittance vs.
Drain Current
5
2
1
0.5
0.1
0.1 0.2
5
2
1
0.5
0.2
0.1
0.05
V DS = 10 V
Pulse Test
Shows 1 unit FET
0.2
VGS = 10 V
Pulse Test
Shows 1 unit FET
0.02
5 10
1
2
Drain Current I D (A)
0.01
0.1 0.2
20
0.5
5 10 20
0.5 1 2
Drain Current I D (A)
50
Input Capacitance vs.
Gate to Source Voltage
Gate to Source Cutoff Voltage vs.
Ambient Temperature
170
3.6
Shows 1 unit FET
1A
3.2
2.8
100 mA
2.4
10 mA
ID = 1
2.0
1.6
- 25
mA
V DS = 10 V
Shows 1 unit FET
0
25
50
75
Ambient Temperature
Rev.0, Aug. 2001, page 4 of 8
100
Ta (°C)
125
Input Capacitance Ciss (pF)
Gate to Source Cutoff Voltage
V GS(off) (V)
Forward Transfer Admittance |y fs | (S)
2SK3174A
165
160
155
150
V DS = 0
f = 1 MHz
145
140
-10
-6
-2
2
6
Gate to Source Voltage VGS (V)
10
2SK3174A
Reverse Transfer Capacitance Crss (pF)
Output Capacitance vs.
Drain to Source Voltage
Output Capacitance Coss (pF)
1000
500
V GS = 0
f = 1 MHz
Shows 1 unit FET
200
100
50
20
10
1
2
5
10
20
50
100
Reverse Transfer Capacitance vs.
Drain to Gate Voltage
100
V GS = 0
f = 1 MHz
Shows 1 unit FET
50
20
10
5
2
1
1
2
Pout
40
100
0
0
V DS = 28 V
I DQ = 1.2 A
f = 860 MHz
2
4
6
8
10
Input power Pin (W)
12
20
0
14
Drain Rational η D (%)
60
200
50
100
Drain Rational vs. Output Power
ηD
300
20
80
80
Drain Rational η D (%)
Output Power Pout (W)
400
10
Drain to Gate Voltege V DG (V)
Drain to Source Voltage V DS (V)
Output Power, Drain Rational
vs. Input Power
5
60
40
20
V DS = 28 V
I DQ = 1.2 A
f = 860 MHz
0
0
50
100
150
200
250
300
Output Power Pout (W)
Rev.0, Aug. 2001, page 5 of 8
2SK3174A
Output Power, Drain Rational
vs. Frequency
60
150
50
100
40
V DS = 28 V
I DQ = 1.2 A
Pin = 14 W
0
830
840
850
30
860
870
Frequency f (MHz)
Rev.0, Aug. 2001, page 6 of 8
880
20
890
IMD (dBc)
ηD
200
90
IM7L
IM7H
80
VDS = 28 V
IDQ =1.2A
fc = 860 MHz
∆ f=1MHz
70
Inter Modulation
70
Drain Rational η D (%)
Pout
250
50
100
80
300
Output Power Pout (W)
Inter Modulation
vs. Total Output Power
60
IM3H
50
IM3L
40
IM5H
30
IM5L
20
30
34
38
Total Output Power
50
46
42
Pout-total (dBm)
2SK3174A
Package Dimensions
As of July, 2001
(0.5)
29.6 ± 0.5
2-R1.6
11.7 ± 1.0
15.4 ± 0.3
3.2 ± 0.3
2-C1.0
Unit: mm
12.8 ± 0.3
28.4 ± 0.3
9.6 ± 0.3
13.0 ± 0.3
35.6 ± 0.5
Hitachi Code
JEDEC
JEITA
Mass (reference value)
5.67 ± 0.5
4.14 ± 0.3
3.14 ± 0.3
2.5 ± 0.3
(0.1)
38.8 ± 0.5
RFPAK-F
–
–
17.2 g
Rev.0, Aug. 2001, page 7 of 8
2SK3174A
Disclaimer
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copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.
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Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.0, Aug. 2001, page 8 of 8