ROHM R5007ANJ

10V Drive Nch MOSFET
R5007ANJ
zDimensions (Unit : mm)
zStructure
Silicon N-channel MOSFET
LPTS
10.1
1.3
13.1
9.0
zFeatures
1) Low on-resistance.
2) Fast switching speed.
3) Wide SOA (safe operating area).
4) Gate-source voltage (VGSS) guaranteed to be ±30V.
5) Drive circuits can be simple.
6) Parallel use is easy.
4.5
2.54
0.4
0.78
2.7
5.08
(1) Base (Gate)
(1)
(2)
1.2
3.0
1.0
1.24
(3)
(2) Collector (Drain)
(3) Emitter (Source)
zApplications
Switching
Each lead has same dimensions
zInner circuit
∗1
zPackaging specifications
Package
Taping
TL
Code
Type
(1)
1000
Basic ordering unit (pieces)
(1) Gate
(2) Drain
(3) Source
R5007ANJ
(2)
(3)
∗1 Body Diode
zAbsolute maximum ratings (Ta=25°C)
Symbol
Limits
Unit
Drain-source voltage
VDSS
500
V
Gate-source voltage
VGSS
±30
V
Parameter
Drain current
Continuous
ID
Pulsed
IDP
Continuous
IS
Pulsed
ISP
∗3
±7
A
∗1
±28
A
∗3
7
A
∗1
28
A
IAS
∗2
3.5
A
Avalanche Energy
EAS
∗2
3.5
mJ
Total power dissipation (Tc=25°C)
PD
40
W
Source current
(Body Diode)
Avalanche Current
Channel temperature
Tch
150
°C
Range of storage temperature
Tstg
−55 to +150
°C
∗1 Pw≤10µs, Duty cycle≤1%
∗2 L 500µH, VDD=50V, RG=25Ω, Starting, Tch=25°C
∗3 Limited only by maximum tempterature allowed
zThermal resistance
Parameter
Channel to case
Symbol
Limits
Unit
Rth(ch-c)
3.13
°C/W
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1/5
2009.02 - Rev.A
Data Sheet
R5007ANJ
zElectrical characteristics (Ta=25°C)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
IGSS
−
−
±100
nA
VGS=±30V, VDS=0V
V(BR)DSS
500
−
−
V
ID=1mA, VGS=0V
IDSS
−
−
100
µA
VDS=500V, VGS=0V
Gate threshold voltage
VGS(th)
2.5
−
4.5
V
VDS=10V, ID=1mA
Static drain-source on-state resistance
RDS(on) ∗
−
0.8
1.05
Ω
ID=3.5A, VGS=10V
Forward transfer admittance
| Yfs |
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
∗
2.5
−
−
S
ID=3.5A, VDS=10V
Input capacitance
Ciss
−
500
−
pF
VDS=25V
Output capacitance
Coss
−
300
−
pF
VGS=0V
Reverse transfer capacitance
Crss
−
23
−
pF
f=1MHz
∗
−
20
−
ns
ID=3.5A, VDD 250V
∗
−
22
−
ns
VGS=10V
∗
−
50
−
ns
RL=71.4Ω
∗
−
25
−
ns
RG=10Ω
∗
−
13
−
nC
∗
−
3.5
−
nC
∗
−
5.5
−
nC
VDD 250V
ID=7A
VGS=10V
RL=35.7Ω / RG=10Ω
Turn-on delay time
td(on)
tr
Rise time
Turn-off delay time
td(off)
tf
Fall time
Qg
Total gate charge
Gate-source charge
Qgs
Gate-drain charge
Qgd
∗ Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter
Forward voltage
Symbol
VSD ∗
Min.
−
Typ.
−
Max.
1.5
Unit
V
Conditions
IS= 7A, VGS=0V
∗ Pulsed
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c 2009 ROHM Co., Ltd. All rights reserved.
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2/5
2009.02 - Rev.A
Data Sheet
R5007ANJ
zElectrical characteristic curves
Operation in this
area is limited
by RDS(ON)
10
PW =100us
PW =1ms
1
DC operation
0.1
Ta = 25°C
Single Pulse
0.01
6.0V
6.5V
6
5
5.5V
4
5.0V
2
10
100
1000
20
30
40
1.5
3.0
4.5
6.0
6
VDS= 10V
ID= 1mA
5
4
3
2
1
0
-50
GATE-SOURCE VOLTAGE : VGS (V)
2.5
2
1.5
ID= 7.0A
1
ID= 3.5A
0.5
0
5
10
15
GATE-SOURCE VOLTAGE : VGS (V)
Fig.7 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
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5.5V
6.0V
2
5.0V
1
0
1
2
3
4
5
DRAIN-SOURCE VOLTAGE: VDS (V)
Fig.3 Typical Output Characteristics(Ⅱ)
10
VGS= 10V
Pulsed
1
Ta=
Ta=
Ta=
Ta=
125°C
75°C
25°C
-25°C
0.1
0
50
100
150
0.1
1
10
100
DRAIN CURRENT : ID (A)
Fig.5 Gate Threshold Voltage
vs. Channel Temperature
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
Ta=25°C
Pulsed
6.5V
CHANNEL TEMPERATURE: Tch (°C)
Fig.4 Typical Transfer Characteristics
3
7.0V
3
50
Fig.2 Typical Output Characteristics(Ⅰ)
0.01
0
10
Fig.1 Maximum Safe Operating Area
0.1
0.001
0.0
0
DRAIN-SOURCE VOLTAGE : VDS ( V )
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= -25°C
1
10V
8.0V
VGS= 4.5V
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
10
4
0
DRAIN-SOURCE VOLTAGE: VDS (V)
VDS= 10V
Pulsed
Ta= 25°C
Pulsed
VGS= 4.5V
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current
100
3
VGS= 10V
Pulsed
2.5
2
ID= 7A
1.5
1
ID= 3.5A
0.5
0
-50
0
50
100
150
FORWARD TRANSFER ADMITTANCE :
|Yfs| (S)
1
GATE THRESHOLD VOLTAGE: VGS(th) (V)
100
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
8.0V
Ta= 25°C
Pulsed
0
0.1
DRAIN CURRENT : ID (A)
7.0V
8
10V
DRAIN CURRENT: ID (A)
10
DRAIN CURRENT: ID (A)
DRAIN CURRENT : ID (A)
100
VDS= 10V
Pulsed
10
1
Ta= -25°C
Ta= 25°C
Ta= 75°C
Ta= 125°C
0.1
0.01
0.01
0.1
1
10
100
CHANNEL TEMPERATURE: Tch (°C)
DRAIN CURRENT : ID (A)
Fig.8 Static Drain-Source On-State
Resistance vs. Channel Temperature
Fig.9 Forward Transfer Admittance
vs. Drain Current
3/5
2009.02 - Rev.A
Data Sheet
10
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= -25°C
0.1
0.01
Ciss
1000
Crss
100
Coss
10
Ta= 25°C
f= 1MHz
VGS= 0V
1
0.5
1
1.5
1
10
100
1000
SOURCE-DRAIN VOLTAGE : VSD (V)
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.10 Reverse Drain Current vs.
Sourse-Drain Voltage
Fig.11 Typical Capacitance vs.
Drain-Source Voltage
10000
1000
100
Ta= 25°C
di / dt= 100A / µs
VGS= 0V
Pulsed
10
5
0
5
10
15
20
25
TOTAL GATE CHARGE : Qg (nC)
Fig.12 Dynamic Input Characteristics
Ta= 25°C
VDD= 250V
VGS= 10V
RG= 10Ω
Pulsed
tf
1000
100
Ta= 25°C
VDD= 250V
ID= 7A
RG= 10Ω
Pulsed
0
0.1
SWITCHING TIME : t (ns)
REVERSE RECOVERY TIME: trr (ns)
GATE-SOURCE VOLTAGE : VGS (V)
VGS= 0V
Pulsed
0
td(off)
10
td(on)
tr
1
10
0.1
1
10
0.01
100
REVERSE DRAIN CURRENT : IDR (A)
0.1
1
10
100
DRAIN CURRENT : ID (A)
Fig.14 Switching Characteristics
Fig.13 Reverse Recovery Time
vs.Reverse Drain Current
NORMARIZED TRANSIENT THERMAL
RESISTANCE : r (t)
15
10000
100
CAPACITANCE : C (pF)
REVERSE DRAIN CURRENT : IDR (A)
R5007ANJ
10
1
0.1
Ta = 25°C
Single Pulse : 1Unit
Rth(ch-a)(t) = r(t)×Rth(ch-a)
Rth(ch-a) = 54.3°C/W
0.01
0.001
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s)
Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
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c 2009 ROHM Co., Ltd. All rights reserved.
○
4/5
2009.02 - Rev.A
Data Sheet
R5007ANJ
zSwitching characteristics measurement circuit
Fig.1 Switching time measurement circuit
Fig.2 Switching waveforms
IG(Const.)
Fig.3 Gate charge measurement circuit
Fig.5
Fig.4 Gate charge waveform
Avalanche measurement circuit
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c 2009 ROHM Co., Ltd. All rights reserved.
○
Fig.6
5/5
Avalanche waveform
2009.02 - Rev.A
Appendix
Notes
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upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to
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Please be sure to implement in your equipment using the Products safety measures to guard against the
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Appendix-Rev4.0