INFINEON SPU18P06P

SPD18P06P
SPU18P06P
Preliminary data
SIPMOS  Power-Transistor
Features
Product Summary
·
P-Channel
Drain source voltage
VDS
-60
V
·
Enhancement mode
Drain-source on-state resistance
RDS(on)
0.13
W
·
Avalanche rated
Continuous drain current
ID
-18.6
A
·
dv/dt rated
·
175°C operating temperature
Type
Package
Ordering Code
Pin 1
PIN 2/4
PIN 3
SPD18P06P
P-TO252
Q67040-S4189
G
D
S
SPU18P06P
P-TO251
Q67040-S4192
Maximum Ratings,at T j = 25 °C, unless otherwise specified
Parameter
Symbol
Value
ID
Continuous drain current
A
T C = 25 °C
-18.6
T C = 100 °C
-13.2
ID puls
Pulsed drain current
Unit
-74.4
T C = 25 °C
EAS
150
EAR
8
dv/dt
6
Gate source voltage
VGS
±20
V
Power dissipation
Ptot
80
W
-55...+175
°C
Avalanche energy, single pulse
mJ
I D = -18.6 A , V DD = -25 V, RGS = 25 W
Avalanche energy, periodic limited by Tjmax
Reverse diode dv/dt
kV/µs
I S = -18.6 A, V DS = -48 V, di/dt = 200 A/µs,
T jmax = 175 °C
T C = 25 °C
Tj , Tstg
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
55/175/56
Page 1
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
-
1.85
Thermal resistance, junction - ambient, leaded
RthJA
-
-
100
SMD version, device on PCB:
RthJA
@ min. footprint
-
-
75
@ 6 cm 2 cooling area 1)
-
-
50
K/W
Electrical Characteristics, at T j = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
-60
-
-
Gate threshold voltage, VGS = VDS
I D = -1 mA
VGS(th)
-2.1
-3
-4
Zero gate voltage drain current
IDSS
Static Characteristics
Drain- source breakdown voltage
V
VGS = 0 V, I D = -250 µA
µA
VDS = -60 V, V GS = 0 V, T j = 25 °C
-
-0.1
-1
VDS = -60 V, V GS = 0 V, T j = 150 °C
-
-10
-100
IGSS
-
-10
-100
nA
RDS(on)
-
0.1
0.13
W
Gate-source leakage current
VGS = -20 V, VDS = 0 V
Drain-source on-state resistance
VGS = -10 V, I D = -13.2 A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Electrical Characteristics, at T j = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
gfs
4
8
-
S
Ciss
-
690
860
pF
Coss
-
230
290
Crss
-
95
120
td(on)
-
12
18
tr
-
5.8
8.7
td(off)
-
24.5
37
tf
-
11
16.5
Dynamic Characteristics
Transconductance
VDS³2*I D*RDS(on)max , ID = -13.2 A
Input capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Output capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Reverse transfer capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Turn-on delay time
ns
VDD = -30 V, V GS = -10 V, ID = -13.2 A,
RG = 2.7 W
Rise time
VDD = -30 V, V GS = -10 V, ID = -13.2 A,
RG = 2.7 W
Turn-off delay time
VDD = -30 V, V GS = -10 V, ID = -13.2 A,
RG = 2.7 W
Fall time
VDD = -30 V, V GS = -10 V, ID = -13.2 A,
RG = 2.7 W
Page 3
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Electrical Characteristics, at T j = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Qgs
-
4.4
6.6
Qgd
-
9.3
14
Qg
-
22
33
V(plateau)
-
-5.56
-
Dynamic Characteristics
Gate to source charge
nC
VDD = -48 , ID = -18.6 A
Gate to drain charge
VDD = -48 V, ID = -18.6 A
Gate charge total
VDD = -48 V, ID = -18.6 , V GS = 0 to -10 V
Gate plateau voltage
V
VDD = -48 , I D = -18.6 A
Parameter
Symbol
Values
Unit
min.
typ.
max.
IS
-
-
-18.6
ISM
-
-
-74.4
VSD
-
-1
-1.33
V
trr
-
70
105
ns
Qrr
-
139
208
nC
Reverse Diode
Inverse diode continuous forward current
A
T C = 25 °C
Inverse diode direct current,pulsed
T C = 25 °C
Inverse diode forward voltage
VGS = 0 V, I F = -18.6 A
Reverse recovery time
VR = -30 V, IF=I S , di F/dt = 100 A/µs
Reverse recovery charge
VR = -30 V, IF=l S , diF/dt = 100 A/µs
Page 4
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Power dissipation
Drain current
Ptot = f (TC)
ID = f (TC )
parameter: VGS ³ 10 V
SPD18P06P
SPD18P06P
-20
90
A
W
-16
70
ID
Ptot
-14
60
-12
50
-10
40
-8
30
-6
20
-4
10
-2
0
0
20
40
60
80
0
0
100 120 140 160 °C 190
20
40
60
80
100 120 140 160 °C 190
TC
TC
Safe operating area
Transient thermal impedance
I D = f ( VDS )
ZthJC = f (tp )
parameter : D = 0 , T C = 25 °C
parameter : D = tp /T
-10
2
SPD18P06P
10 1
tp = 29.0µs
SPD18P06P
K/W
10 0
A
ID
Z thJC
100 µs
10 -1
-10 1
D
D = 0.50
DS
/I
10
-2
0.20
0.10
=V
1 ms
DS
(on
)
0.05
0.02
R
10 -3
10 ms
0.01
single pulse
DC
-10 0 -1
-10
-10
0
-10
1
V
-10
2
VDS
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
Page 5
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Typ. output characteristic
Typ. drain-source-on-resistance
I D = f (VDS); T j=25°C
parameter: tp = 80 µs
RDS(on) = f (ID )
parameter: VGS
SPD18P06P
-50
SPD18P06P
0.42
Ptot = 80.00W
W
A
VGS [V]
a
jk
b
-4.5
c
-5.0
d
-5.5
e
-6.0
f
-6.5
g
-7.0
f h
-7.5
i
-35
ID
h
-30
g
-25
i
e
-20
d
-15
c
d
e
f
g
h
0.32
0.28
0.24
0.20
-8.0
j
-9.0
k
-10.0
l
-20.0
0.16
i
0.12
j
k
l
c
-10
0.08
b
-5
0
0
b
0.36
-4.0
RDS(on)
l
-40
a
VGS [V] =
0.04
a
-1
-2
-3
-4
-5
-6
-7
-8
V
0.00
0
-10
a
b
c
d
e
f
-4.0 -4.5 -5.0 -5.5 -6.0 -6.5
-4
-8
g
h
i
j
k
l
-7.0 -7.5 -8.0 -9.0 -10.0 -20.0
-12 -16 -20 -24 -28 -32 A
VDS
-38
ID
Typ. transfer characteristics I D= f ( V GS )
Typ. forward transconductance
VDS³ 2 x I D x RDS(on)max
gfs = f(ID); Tj=25°C
parameter: tp = 80 µs
parameter: gfs
10
-40
S
A
8
-30
gfs
ID
7
-25
6
5
-20
4
-15
3
-10
2
-5
0
0
1
-1
-2
-3
-4
-5
-6
-7
-8
V
-10
VGS
0
0
-5
-10
-15
-20
A
-30
ID
Page 6
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Drain-source on-state resistance
Gate threshold voltage
RDS(on) = f (Tj)
VGS(th) = f (Tj)
parameter : I D = -13.2 A, VGS = -10 V
parameter: VGS = VDS , ID = -1 mA
SPD18P06P
0.38
W
-5.0
V
-4.4
0.32
V GS(th)
RDS(on)
-4.0
0.28
0.24
-3.6
-3.2
-2.8
0.20
98%
max
-2.4
0.16
-2.0
typ
0.12
-1.6
typ
-1.2
0.08
-0.8
0.04
min
-0.4
0.00
-60
-20
20
60
100
140 °C
0.0
-60
200
-20
20
60
100
140
Tj
V
200
Tj
Typ. capacitances
Forward characteristics of reverse diode
C = f (VDS)
IF = f (VSD )
parameter: VGS=0V, f=1 MHz
parameter: Tj , tp = 80 µs
10
4
-10 2
pF
SPD18P06P
A
10 3
-10 1
IF
C
Ciss
Coss
10 2
-10 0
Crss
Tj = 25 °C typ
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
10 1
0
-5
-10
-15
-20
-25
V
-35
-10 -1
0.0
-0.4
-0.8
-1.2
-1.6
-2.0
-2.4 V
-3.0
VSD
VDS
Page 7
1999-11-22
SPD18P06P
SPU18P06P
Preliminary data
Avalanche energy
Typ. gate charge
EAS = f (Tj)
VGS = f (QGate )
parameter: ID = -18.6 A pulsed
para.: I D = -18.6 A , VDD = -25 V, RGS = 25
SPD18P06P
160
-16
mJ
V
-12
VGS
E AS
120
100
-10
0,2 VDS max
80
-8
60
-6
40
-4
20
-2
0
25
45
65
85
105
125
145
°C 185
Tj
0
0
4
8
12
0,8 VDS max
16
20
24
28 nC
34
QGate
Drain-source breakdown voltage
V(BR)DSS = f (Tj)
SPD18P06P
-72
V(BR)DSS
V
-68
-66
-64
-62
-60
-58
-56
-54
-60
-20
20
60
100
140 °C
200
Tj
Page 8
1999-11-22
Preliminary data
SPD18P06P
SPU18P06P
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 9
1999-11-22