ROHM BD67922EFV

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCTSERIES
3-phase brushless motor driver
TYPE
BD67922EFV
FUNCTION
・3-phase MOS direct PWM driver
・Built-in PLL control circuit
・Built-in over current protection circuit
○Absolute maximum ratings (Ta=25℃)
Item
Supply voltage
Symbol
Limit
Unit
VCC
-0.2~+36.0
V
VLD, FG
-0.2~+6.5
V
VHB
-0.2~+6.5
V
Hall signal input voltage
VHALL
-0.2~+6.5
V
Input voltage for CLK pin
VCLK
-0.2~+6.5
V
VIN
-0.2~+6.5
V
LD, FG applied voltage
HB applied voltage
Input voltage for control pin (SS, SB)
Power dissipation
※1
W
4.70※2
W
1.45
Pd
※3
Output current
IOUT
Operating temperature range
Topr
-25~+85
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
+150
℃
※1
※2
※3
2300
mA
70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃.
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
Do not, however exceed Pd, ASO, and Tjmax=150℃.
○Recommend operating conditions (Ta= -25~+85℃)
Item
Symbol
Min.
Typ.
Max.
Unit
Supply voltage
VCC
19
24
28
V
5V constant voltage output current
IREG
-20
-
0
mA
HB pin current
IHB
0
-
20
mA
LD, FG pin supply voltage
VLD, FG
0
-
5.5
V
LD, FG pin current
ILD, FG
0
-
15
mA
This product isn't designed for protection against radioactive rays.
REV. A
2/4
○Electrical characteristics (Unless otherwise specified, Ta=25℃, VCC=24V)
Item
Whole
Circuit current 1
Circuit current 2
VREG output
Output voltage
Output (U, V, W)
Output on resistance
Min.
Limit
Typ.
Max.
ICC1
ICC2
-
4.0
1.5
VREG
4.65
RON
-
Symbol
Lower side diode forward voltage
VD1
0.70
Upper side diode forward voltage
VD2
0.70
Output leak current
ILEAK
Hall comparator Input (HUP, HUN, HVP, HVN, HWP, HWN)
Common mode input voltage
1.5
VICM
range
Hysteresis width
ΔVIN
15
LD, FG output
Low level output voltage
VOD
PD output
High level output voltage
VPDH
4.5
Low level output voltage
VPDL
Integral amplifier
EO High level output voltage
VEOH
3.5
EO Low level output voltage
VEOL
EI input current
IEI
-2.0
Current limit circuit
Drive gain during starting mode
GH
1.2
Drive gain during steady mode
GL
0.4
Limiter voltage
VCL
0.45
CLK input
External input frequency
FCLK
High level input voltage
VCLKH
3.0
Low level input voltage
VCLKL
Low level input current
ICLKL
-75
Control input (SS, SB)
High level input voltage
VINH
3.0
Low level input voltage
VINL
Low level input current
IINL
-75
OSC
OSC oscillating frequency
FOSC
130
OSC High voltage
VOSCH
1.6
OSC Low voltage
VOSCL
1.2
PROCLK
CLK cycle for protection circuit
TPCLK
13
Hall bias
Hall bias voltage
VHB
0.70
REV. A
Unit
Conditions
9.0
2.3
mA
mA
SS=L output ON mode
SS=H output OFF mode
5.00
5.35
V
1.35
1.76
Ω
1.10
1.10
-
1.55
1.55
10
V
V
μA
-
3.5
V
24
42
mV
0.15
0.50
V
ILD, FG=10mA
4.9
0.2
0.3
V
V
IPD=-100μA
IPD=100μA
4.1
0.9
-0.1
1.5
-
V
V
μA
IEO=-500μA
IEO=500μA
VEI=0V
1.5
0.5
0.50
1.8
0.6
0.55
times
times
V
-50
10
1.5
-25
kHz
V
V
μA
VCLK=0V
-50
1.5
-25
V
V
μA
VIN=0V
200
2.0
1.5
270
2.4
1.8
kHz
V
V
COSC =220pF
20
27
msec
CPCLK=0.1μF
0.85
1.00
V
IOUT=1.0A
Sum of upper and lower
IOUT=-1.0A
IOUT=1.0A
Sum of upper and lower
IHB=10mA
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○Package outline
○Pin No. / Pin name
Product No.
BD67922EFV
Lot No.
Pin No.
Pin name
Pin No.
Pin name
1
GND
15
HUP
2
VCC
16
VREG
3
FG
17
PD
4
CS
18
TEST
5
RNF
19
EI
6
W
20
EO
7
V
21
PROCLK
8
U
22
CLK
9
HB
23
SS
10
HWN
24
LD
11
HWP
25
OSC
12
HVN
26
BRMODE
13
HVP
27
CNF
14
HUN
28
SB
HTSSOP-B28 (Unit: mm)
○Block diagram
HUP 15
2 VCC
HUN 14
HALL
HYS
COMP
HVP 13
HVN 12
LOGIC
8 U
7 V
HWP 11
6 W
HWN 10
CLK 22
5 RNF
PD 17
EI 19
24 LD
EO 20
3 FG
HALL BIAS
9 HB
CNF 27
OSC 25
4 CS
OSC
BRMODE 26
18 TEST
TSD
SB 28
OCP
OVLO
SS 23
RESET
UVLO
Regulator
16 VREG
PROOSC
21 PROCLK
1 GND
REV. A
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Actions in strong electromagnetic field
The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no
malfunction is found when using the IC in a strong electromagnetic field.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(9) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(10) Mounting errors and Inter-pin short
When attaching to a printed circuit board, pay attention to the direction of the IC and displacement.
Improper attachment may lead to destruction of the IC. There is also possibility of destruction from shortcircuits which can be caused by foreign matter entering between pins.
(11) TEST pin
Be sure to connect TEST pin to GND.
REV. A
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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