DEMO KIT AVAILABLE
DS3150
3.3V, DS3/E3/STS-1 Line Interface Unit
www.maxim-ic.com
FEATURES
GENERAL DESCRIPTION
§
The DS3150 performs all the functions necessary for
interfacing at the physical layer to DS3, E3, and
STS-1 lines. The receiver performs clock and data
recovery, B3ZS/HDB3 decoding, and loss-of-signal
monitoring. The transmitter encodes outgoing data
and drives standards-compliant waveforms onto 75Ω
coaxial cable. The jitter attenuator can be mapped
into the receive path or the transmit path.
§
§
§
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APPLICATIONS
§
SONET/SDH and PDH Multiplexers
Digital Cross-Connects
Access Concentrators
ATM and Frame Relay Equipment
Routers
PBXs
DSLAMs
CSUs/DSUs
§
§
§
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§
ORDERING INFORMATION
PART
DS3150QN
DS3150Q
DS3150TN
DS3150T
TEMP RANGE
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
§
§
§
§
PIN-PACKAGE
28 PLCC
28 PLCC
48 TQFP
48 TQFP
§
FUNCTIONAL DIAGRAM
LINE IN
DS3, E3,
STS-1
Rx+
Rx-
RCLK
RPOS
RNEG
§
§
RECEIVE
CLOCK
AND DATA
§
§
§
§
DS3150
LIU
LINE OUT
DS3, E3,
STS-1
Tx+
Tx-
TCLK
TPOS
TNEG
TRANSMIT
CLOCK
AND DATA
Integrated Transmitter, Receiver, and Jitter
Attenuator for DS3, E3, and STS-1
Performs Receive Clock/Data Recovery and
Transmit Waveshaping
Jitter Attenuator Can Be Placed in the Receive
Path or the Transmit Path
AGC/Equalizer Block Handles from 0dB to
15dB of Cable Loss
Interfaces to 75W Coaxial Cable at Lengths Up to
380m (DS3), 440m (E3), or 360m (STS-1)
Interfaces Directly to a DSX Monitor Signal
(20dB Flat Loss) Using Built-In Preamp
Built-In B3ZS and HDB3 Encoder/Decoder
Bipolar and NRZ Interfaces
Local and Remote Loopbacks
On-Board 215 - 1 and 223 - 1 Pseudorandom Bit
Sequence (PRBS) Generator and Detector
Line Build-Out (LBO) Control
Transmit Line-Driver Monitor Checks for a
Faulty Transmitter or a Shorted Output
Complete DS3 AIS Generator (ANSI T1.107)
Unframed All-Ones Generator (E3 AIS)
Clock Inversion for Glueless Interfacing
Tri-State Line Driver for Low-Power Mode and
Protection Switching Applications
Loss-of-Signal (LOS) Detector (ANSI T1.231
and ITU G.775)
Requires Minimal External Components
Drop-In Replacement for TDK 78P2241/B and
78P7200L (Refer to Application Note 362)
Pin Compatible with TDK 78P7200
3.3V Operation (5V Tolerant I/O), 110mA (max)
Industrial Temperature Range: -40°C to +85°C
Small Packaging: 28-Pin PLCC and
48-Pin TQFP
Pin Configurations appear at end of data sheet.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.
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REV: 012505
DS3150
TABLE OF CONTENTS
1.
1.1
1.2
1.3
1.4
DETAILED DESCRIPTION.................................................................................................4
RECEIVER .................................................................................................................................... 7
TRANSMITTER .............................................................................................................................10
DIAGNOSTICS ..............................................................................................................................15
JITTER ATTENUATOR ...................................................................................................................16
2.
PIN DESCRIPTIONS ........................................................................................................17
3.
ELECTRICAL CHARACTERISTICS ................................................................................21
4.
PIN CONFIGURATIONS ..................................................................................................25
5.
PACKAGE INFORMATION..............................................................................................26
6.
REVISION HISTORY ........................................................................................................28
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DS3150
LIST OF FIGURES
Figure 1-1. Block Diagram ...........................................................................................................4
Figure 1-2. External Connections.................................................................................................6
Figure 1-3. Receiver Jitter Tolerance...........................................................................................9
Figure 1-4. E3 Waveform Template ...........................................................................................13
Figure 1-5. DS3 AIS Structure ...................................................................................................14
Figure 1-6. PRBS Output with Normal RCLK Operation ............................................................15
Figure 1-7. PRBS Output with Inverted RCLK Operation...........................................................15
Figure 1-8. Jitter Attenuation and Jitter Transfer........................................................................16
Figure 3-1. Framer Interface Timing Diagram ............................................................................22
LIST OF TABLES
Table 1-A. Applicable Telecommunications Standards................................................................5
Table 1-B. Transformer Recommendations .................................................................................6
Table 1-C. DS3 Waveform Template .........................................................................................11
Table 1-D. DS3 Waveform Test Parameters and Limits ............................................................11
Table 1-E. STS-1 Waveform Template ......................................................................................12
Table 1-F. STS-1 Waveform Test Parameters and Limits .........................................................12
Table 1-G. E3 Waveform Test Parameters and Limits...............................................................13
Table 2-A. Pin Descriptions........................................................................................................17
Table 2-B. Transmit Data Selection ...........................................................................................20
Table 2-C. RMON and TTS Signal Decode ................................................................................20
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DS3150
1. DETAILED DESCRIPTION
The DS3150 performs all the functions necessary for interfacing at the physical layer to DS3, E3, and
STS-1 lines. The device has independent receive and transmit paths and a built-in jitter attenuator
(Figure 1-1). The receiver performs clock and data recovery from a B3ZS- or HDB3-coded alternate mark
inversion (AMI) signal and monitors for loss-of-signal. The receiver optionally performs B3ZS/HDB3
decoding and outputs the recovered data in either NRZ or bipolar format. The transmitter accepts data in
either NRZ or bipolar format, optionally performs B3ZS/HDB3 encoding, and drives standards-compliant
waveforms onto the outgoing 75Ω coaxial cable. The jitter attenuator can be mapped into the receiver
data path, mapped into the transmitter data path, or disabled. The DS3150 conforms to the
telecommunication standards listed in Table 1-A. Figure 1-2 shows the external components required for
proper operation.
Figure 1-1. Block Diagram
RMON
LOS
MCLK
Output Decode
DS3150
(Analog
Loss Of
Signal
Detect)
Squelch
Analog
Loopback
DM
Driver
Monitor
TX+
Line
Driver
WaveShaping
TX-
mux
Clock
Invert
Remote
Loopback
TTS
LBKS
LBO
VDD
RCLK
ZCSE
ICE
TESS
TNEG
TPOS/TNRZ
B3ZS/
HDB3
Encoder
Loopback Control
Power
Connections
RPOS/RNRZ
RNEG/RLCV
Clock
Invert
Mux
Clock &
Data
Recovery
Mux
RX-
Jitter Attenuator
(can be placed in either the receive path or the transmit path)
Pre
Amp
PRBS
Detector
B3ZS/HDB3
Decoder
Filter/
Equalizer
RX+
Digital Loss Of
Signal Detector
PRBS
AIS/
1010.../
PRBS
Generation
Test Functions
VSS
EFE
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TDS0
TDS1
TCLK
DS3150
Table 1-A. Applicable Telecommunications Standards
SPECIFICATION
T1.102-1993
T1.107-1995
T1.231-1997
T1.404-1994
G.703
G.751
G.775
G.823
G.824
O.151
ETS 300 686
ETS 300 687
ETS EN 300 689
TBR 24
GR-253-CORE
GR-499-CORE
SPECIFICATION TITLE
ANSI
Digital Hierarchy—Electrical Interfaces
Digital Hierarchy—Formats Specification
Digital Hierarchy—Layer 1 In-Service Digital Transmission Performance
Monitoring
Network-to-Customer Installation—DS3 Metallic Interface Specification
ITU-T
Physical/Electrical Characteristics of Hierarchical Digital Interfaces, 1991
Digital Multiplex Equipment Operating at the Third-Order Bit Rate of 34,368kbps
and the Fourth-Order Bit Rate of 139,264kbps and Using Positive Justification,
1993
Loss-of-Signal (LOS) and Alarm Indication Signal (AIS) Defect Detection and
Clearance Criteria, November 1994
The Control of Jitter and Wander Within Digital Networks Which are Based on
the 2048kbps Hierarchy, 1993
The Control of Jitter and Wander Within Digital Networks Which are Based on
the 1544kbps Hierarchy, 1993
Error Performance Measuring Equipment Operating at the Primary Rate and
Above, October 1992
ETSI
Business TeleCommunications; 34Mbps and 140Mbps digital leased lines (D34U,
D34S, D140U, and D140S); Network interface presentation, 1996
Business TeleCommunications; 34Mbps digital leased lines (D34U and D34S);
Connection characteristics, 1996
Access and Terminals (AT); 34Mbps digital leased lines (D34U and D34S);
Terminal equipment interface, July 2001
Business TeleCommunications; 34Mbps digital unstructured and structured lease
lines; attachment requirements for terminal equipment interface, 1997
Telcordia
SONET Transport Systems: Common Generic Criteria, Issue 2, December 1995
Transport Systems Generic Requirements (TSGR): Common Requirements, Issue
2, December 1998
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DS3150
Figure 1-2. External Connections
TRANSMIT
TX+
VDD
0.05µF
330W
(1%)
0.01µF
0.1µF
1µF
VDD
0.01µF
0.1µF
1µF
0.01µF
0.1µF
1µF
VDD
TX-
1:2ct
VDD
3.3V
POWER
PLANE
DS3150
RECEIVE
VSS
RX+
0.05µF
1:2ct
GROUND
VSS
330W
(1%)
PLANE
VSS
RX-
Table 1-B. Transformer Recommendations
MANUFACTURER
PART NO.
TEMP RANGE
Pulse Engineering
PE-65968
0°C to +70°C
Pulse Engineering
PE-65969
0°C to +70°C
Halo Electronics
Halo Electronics
TG070206NS
TD070206NE
0°C to +70°C
0°C to +70°C
PINPACKAGE/
SCHEMATIC
6-SMT
LS-1/C
6-thru-hole
LC-1/C
6-SMT
SMD/B
6-DIP
DIP/B
OCL
PRIMARY
mH MIN
LL
mH
MAX
BANDWIDTH
75W, MHz
19
0.06
0.250 to 500
19
0.06
0.250 to 500
19
0.06
0.250 to 500
19
0.06
0.250 to 500
Note: Table subject to change. Industrial temperature range and dual transformers also available. Contact the manufacturers for details.
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DS3150
1.1 Receiver
Interfacing to the Line. The receiver can be transformer-coupled or capacitor-coupled to the line.
Typically, the receiver interfaces to the incoming coaxial cable (75W) through a 1:2 step-up transformer.
Figure 1-2 shows the arrangement of the transformer and other recommended interface components. The
device expects the incoming signal to be in B3ZS- or HDB3-coded AMI format.
Optional Preamp. The receiver can be used in monitoring applications, which typically have series
resistors that result in a resistive loss of approximately 20dB. When the RMON input pin is high, the
receiver compensates for this resistive loss by applying flat gain to the incoming signal before sending the
signal to the equalizer block.
Adaptive Equalizer. The adaptive equalizer applies both frequency-dependent gain and flat gain to
offset signal losses from the coaxial cable and provides a signal of nominal amplitude and pulse shape to
the clock and data recovery block. The equalizer circuitry automatically adapts to coaxial cable losses
from 0 to 15dB, which translates into 0 to 380 meters (DS3), 0 to 440 meters (E3), or 0 to 360 meters
(STS-1) of coaxial cable (AT&T 734A or equivalent). The equalizer can perform direct (0 meter)
monitoring of the transmitter output signal.
Clock and Data Recovery. The clock and data recovery (CDR) block takes the amplified, equalized
signal from the equalizer and produces separate clock, positive data and negative data signals. The CDR
requires a master clock (44.736MHz for DS3, 34.368MHz for E3, 51.840MHz for STS-1). If the signal
on MCLK is toggling, the device selects the MCLK signal as the master clock. If MCLK is wired high or
left floating, the device uses the signal on the TCLK pin as the master clock. If MCLK is wired low, the
device takes its master clock from an internal oscillator. The selected master clock is also used by the
jitter attenuator.
Loss-of-Signal Detector. The receiver contains both analog and digital LOS detectors. The analog
LOS detector resides in the equalizer block. If the incoming signal level is less than a signal level
approximately 24dB below nominal, analog loss-of-signal (ALOS) is declared. The ALOS signal cannot
be directly examined, but when ALOS occurs the equalizer mutes the recovered data, forcing all zeros out
of the clock and data recovery circuitry and subsequently causing digital loss-of-signal (DLOS), which is
indicated on the LOS pin. ALOS clears when the incoming signal level is greater than or equal to a signal
level approximately 18dB below nominal.
The digital loss-of-signal detector declares DLOS when it detects 175 ±75 consecutive zeros in the
recovered data stream. When DLOS occurs, the receiver asserts the LOS pin. DLOS is cleared when there
are no excessive zero occurrences over a span of 175 ±75 clock periods. An excessive zero occurrence is
defined as three or more consecutive zeros in the DS3 and STS-1 modes and four or more consecutive
zeros in the E3 mode. The LOS pin is deasserted when the DLOS condition is cleared.
The requirements of ANSI T1.231 and ITU-T G.775 for DS3 LOS defects are met by the DLOS detector,
which asserts LOS when it counts 175 ±75 consecutive zeros coming out of the clock and data recovery
block and clears LOS when it counts 175 ±75 consecutive pulse intervals without excessive zero
occurrences.
The requirements of ITU-T G.775 for E3 LOS defects are met by a combination of the ALOS detector
and the DLOS detector as follows:
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DS3150
For E3 LOS Assertion:
1) The ALOS circuitry detects that the incoming signal is less than or equal to a signal level
approximately 24dB below nominal and mutes the data coming out of the clock and data recovery
block. (24dB below nominal is in the “tolerance range” of G.775, where LOS may or may not be
declared.)
2) The DLOS detector counts 175 ±75 consecutive zeros coming out of the clock and data recovery
block and asserts LOS. (175 ±75 meets the 10 £ N £ 255 pulse interval duration requirement of
G.775.)
For E3 LOS Clear:
1) The ALOS circuitry detects that the incoming signal is greater than or equal to a signal level
approximately 18dB below nominal and enables data to come out of the clock and data recovery
block. (18dB below nominal is in the “tolerance range” of G.775 where LOS may or may not be
declared.)
2) The DLOS detector counts 175 ±75 consecutive pulse intervals without excessive zero occurrences
and deasserts LOS. (175 ±75 meets the 10 £ N £ 255 pulse interval duration requirement of G.775.)
The requirements of ANSI T1.231 for STS-1 LOS defects are supported by the DLOS detector. At STS-1
rate, the time required for the DLOS detector to count 175 ±75 consecutive zeros falls in the range of
2.3£T£100ms required by ANSI T1.231 for declaring an LOS defect. Although the time required for the
DLOS detector to count 175 ±75 consecutive pulse intervals with no excessive zeros is less than the
125µs to 250ms period required by ANSI T1.231 for clearing an LOS defect, a period of this length where
LOS is inactive can easily be timed in software.
During LOS, the RCLK output signal is derived from the device’s master clock. The ALOS detector has a
longer time constant than the DLOS detector. Thus, when the incoming signal is lost, the DLOS detector
activates first, asserting the LOS pin, followed by the ALOS detector. When a signal is restored, the
DLOS detector does not get a valid signal that it can qualify for no excessive zero occurrences until the
ALOS detector has seen the incoming signal rise above a signal level approximately 18dB below
nominal.
Framer Interface Format and the B3ZS/HDB3 Decoder. The recovered data can be output in
either NRZ or bipolar format. To select the bipolar format, wire the ZCSE input pin high. In this format,
the B3ZS/HDB3 decoder is disabled, and the recovered data is buffered and output on the RPOS and
RNEG output pins. Received positive-polarity pulses are indicated by RPOS = 1, while negative-polarity
pulses are indicated by RNEG = 1. In bipolar interface format the receiver simply passes on the data
received and does not check it for bipolar violations or excessive zero occurrences.
To select the NRZ format, wire ZCSE low. In this format, the B3ZS/HDB3 decoder is enabled, and the
recovered data is decoded and output as a composite NRZ value on the RNRZ pin. Code violations are
flagged on the RLCV pin. In the discussion that follows, a valid pulse that conforms to the AMI rule is
denoted as B. A pulse that violates the AMI rule is known as bipolar violation (BPV) and is denoted as V.
In DS3 and STS-1 modes, B3ZS decoding is performed. RLCV is asserted during any RCLK cycle where
the data on RNRZ causes ones of the following code violations:
§
§
A BPV immediately preceded by a valid pulse (B, V)
A BPV with the same polarity as the last BPV
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DS3150
§ A third consecutive zero (0, 0, 0)
In E3 mode, HDB3 decoding is performed. RLCV is asserted during any RCLK cycle where the data on
RNRZ causes one of the following code violations:
§
§
§
A BPV immediately preceded by a valid pulse (B, V) or by a valid pulse and a zero (B, 0, V)
A BPV with the same polarity as the last BPV
A fourth consecutive zero (0, 0, 0, 0)
When RLCV is asserted to flag a BPV, the RNRZ pin outputs a 1. The state bit that tracks the polarity of
the last BPV is toggled on every BPV, whether part of a valid B3ZS/HDB3 codeword or not.
To support a glueless interface to a variety of neighboring components, the polarity of RCLK can be
inverted using the ICE input pin. See the ICE pin description in Table 2-A for details.
Receiver Jitter Tolerance. The receiver exceeds the input jitter tolerance requirements of all
applicable telecommunication standards in Table 1-A. See the graphs in Figure 1-3.
Receiver Jitter Transfer. The jitter transfer performance of the receiver, with and without the jitter
attenuator enabled, is shown in Figure 1-8.
Figure 1-3. Receiver Jitter Tolerance
DS3 JITTER TOLERANCE
100
JA in Rx
100
JA disabled
10
UIP-P
UIP-P
10
GR-499 Cat II
1
G.824
0.1
0.1
1
10
100
1000
0.01
0.01
FREQUENCY (kHz)
JA disabled
10
UIP-P
JA in Rx
1
0.1
G.823 and
ETSI 300 689
0.01
0.1
JA disabled
GR-253-CORE
1
10
100
FREQUENCY (kHz)
0.1
1
10
100
FREQUENCY (kHz)
1000
Note 1: All jitter tolerance curves are worst case over temperature,
voltage, cable length (0 to 900 feet), and RMON pin setting.
Note 2: The low-frequency plateau seen in most of the jitter tolerance
curves is not the actual performance of the DS3150 but rather
the limit of the measuring equipment (64 UIP-P). Actual jitter
tolerance in these low-frequency ranges is greater than or equal
to 64 UIP-P.
Note 3: Receiver jitter tolerance is not tested during production test.
E3 JITTER TOLERANCE
100
JA in Rx
0.1
GR-499 Cat I
0.01
0.01
1
STS-1 JITTER TOLERANCE
1000
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DS3150
1.2 Transmitter
Transmit Clock. The clock applied at the TCLK input is used to clock in data on the TPOS/TNRZ and
TNEG pins. If the jitter attenuator is not enabled in the transmit path, the signal on TCLK is the transmit
line clock and must be transmission quality (i.e., ±20ppm frequency accuracy and low jitter). If the jitter
attenuator is enabled in the transmit path, the signal on TCLK can be jittery and/or periodically gapped
(not exceeding 8 UI) but must still have an average frequency within ±20ppm of the nominal line rate.
When enabled in the transmit path, the jitter attenuator generates the transmit line clock from the signal
applied on the MCLK pin. The signal on MCLK must, therefore, be a transmission-quality clock
(±20ppm frequency accuracy and low jitter). The duty cycle of TCLK is not restricted as long as the high
and low times listed in Section 3 are met.
To support a glueless interface to a variety of neighboring components, the polarity of TCLK can be
inverted using the ICE input pin. See the ICE pin description in Table 2-A for details.
Framer Interface Format and the B3ZS/HDB3 Encoder. Data to be transmitted can be input in
either NRZ or bipolar format. To select the bipolar format, wire the ZCSE input pin high. In this format,
the B3ZS/HDB3 encoder is disabled, and the data to be transmitted is sampled on the TPOS and TNEG
input pins. Positive-polarity pulses are indicated by TPOS = 1 while negative-polarity pulses are indicated
by TNEG = 1. TPOS and TNEG should not be active at the same time.
To select the NRZ format, wire ZCSE low. In this format, the B3ZS/HDB3 encoder is enabled, and the
data to be transmitted is sampled on the TNRZ pin. The TNEG pin is ignored in NRZ mode and should
be tied low.
Pattern Generation. The transmitter can generate a number of different patterns internally, including
unframed all ones (E3 AIS), 1010…, and DS3 AIS. See Figure 1-5 for the structure of the DS3 AIS
signal. The TDS0 and TDS1 inputs are used to select these on-board patterns. Table 2-B indicates the
possible selections.
Waveshaping, Line Build-Out, Line Driver. The waveshaping block converts the transmit clock,
positive data, and negative data signals into a single AMI signal that meets applicable
telecommunications standards when transmitted on 75W coaxial cable. Table 1-C through Table 1-G and
Figure 1-4 show the waveform template specifications and test parameters from ANSI T1.102, Telcordia
GR-253-CORE and GR-499-CORE, and ITU-T G.703.
Because DS3 and STS-1 signals must meet the waveform templates at the cross-connect through any
cable length from 0 to 450 feet, the waveshaping circuitry includes a selectable LBO feature. For cable
lengths of 225 feet or greater, the LBO pin should be low. When LBO is low, output pulses are driven
onto the coaxial cable without any preattenuation. For cable lengths less than 225 feet, LBO should be
high. When LBO is high, pulses are preattenuated before being driven onto the coaxial cable. The LBO
circuitry provides attenuation that mimics the attenuation of 225 feet of coaxial cable.
To power down the transmitter and tri-state the TX+ and TX- output pins, pull the TTS input pin low.
Interfacing to the Line. The transmitter interfaces to the outgoing DS3/E3/STS-1 coaxial cable (75W)
through a 2:1 step-down transformer connected to the TX+ and TX- output pins. Figure 1-2 shows the
arrangement of the transformer and other recommended interface components.
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DS3150
Transmit Driver Monitor. If the transmit driver monitor detects a faulty transmitter, it activates the
DM output pin. When the transmitter is tri-stated (TTS = 0), the transmit driver monitor is also disabled.
The transmitter is declared to be faulty when the transmitter outputs see a load of less than about 25W.
The DM pin is only available in the TQFP package.
Transmitter Jitter Generation (Intrinsic). The transmitter meets the jitter generation requirements
of all applicable standards, with or without the jitter attenuator enabled.
Transmitter Jitter Transfer. Without the jitter attenuator enabled in the transmit side, the transmitter
passes jitter through unchanged. With the jitter attenuator enabled in the transmit side, the transmitter
meets the jitter transfer requirements of all applicable telecommunication standards in Table 1-A. See
Figure 1-8.
Table 1-C. DS3 Waveform Template
NORMALIZED AMPLITUDE
EQUATIONS
UPPER CURVE
0.03
0.5 {1 + sin[(p/2)(1 + T/0.34)]} + 0.03
0.08 + 0.407e-1.84(T - 0.36)
LOWER CURVE
-0.03
0.5 {1 + sin[(p/2)(1 + T/0.18)]} - 0.03
-0.03
TIME (IN UNIT INTERVALS)
-0.85 £ T £ -0.68
-0.68 £ T £ 0.36
0.36 £ T £ 1.4
-0.85 £ T £ -0.36
-0.36 £ T £ 0.36
0.36 £ T £ 1.4
Table 1-D. DS3 Waveform Test Parameters and Limits
PARAMETER
Rate
Line Code
Transmission Medium
Test Measurement Point
Test Termination
Pulse Amplitude
Pulse Shape
Unframed All-Ones Power Level at
22.368MHz
Unframed All-Ones Power Level at
44.736MHz
Pulse Imbalance of Isolated Pulses
SPECIFICATION
44.736Mbps (±20ppm)
B3ZS
Coaxial cable (AT&T 734A or equivalent)
At the end of 0 to 450 feet of coaxial cable
75W (±1%) resistive
Between 0.36V and 0.85V
An isolated pulse (preceded by two zeros and
followed by one or more zeros) falls within the
curves listed in Table 1-C.
Between -1.8dBm and +5.7dBm
At least 20dB less than the power measured at
22.368MHz
Ratio of positive and negative pulses must be
between 0.90 and 1.10
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DS3150
Table 1-E. STS-1 Waveform Template
TIME (UNIT INTERVALS)
-0.85 £ T £ -0.68
-0.68 £ T £ 0.26
0.26 £ T £ 1.4
-0.85 £ T £ -0.36
-0.36 £ T £ 0.36
0.36 £ T £ 1.4
NORMALIZED AMPLITUDE
EQUATIONS
UPPER CURVE
0.03
0.5 {1 + sin[(p/2)(1 + T/0.34)]} + 0.03
0.1 + 0.61e-2.4(T - 0.26)
LOWER CURVE
-0.03
0.5 {1 + sin[(p/2)(1 + T/0.18)]} - 0.03
-0.03
Table 1-F. STS-1 Waveform Test Parameters and Limits
PARAMETER
Rate
Line Code
Transmission Medium
Test Measurement Point
Test Termination
Pulse Amplitude
Pulse Shape
Unframed All-Ones Power Level at
25.92MHz
Unframed All-Ones Power Level at
51.84MHz
SPECIFICATION
51.840Mbps (±20ppm)
B3ZS
Coaxial cable (AT&T 734A or equivalent)
At the end of 0 to 450 feet of coaxial cable
75W (±1%) resistive
0.800V nominal (not covered in specs)
An isolated pulse (preceded by two zeros and
followed by one or more zeros) falls within the
curved listed in Table 1-E.
Between -1.8dBm and +5.7dBm
At least 20dB less than the power measured at
25.92MHz
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DS3150
Figure 1-4. E3 Waveform Template
1.2
1.1
17ns
1.0
0.9
8.65ns
0.8
0.7
G.703
E3
Template
Output
0.6
Level (V)
0.5
12.1ns
0.4
0.3
0.2
0.1
24.5ns
0
29.1ns
-0.1
-0.2
Time (ns)
Table 1-G. E3 Waveform Test Parameters and Limits
PARAMETER
Rate
Line Code
Transmission Medium
Test Measurement Point
Test Termination
Pulse Amplitude
Pulse Shape
Ratio of the Amplitudes of Positive and Negative
Pulses at the Center of the Pulse Interval
Ratio of the Widths of Positive and Negative Pulses
at the Nominal Half Amplitude
SPECIFICATION
34.368Mbps (± 20ppm)
HDB3
Coaxial cable (AT&T 734A or equivalent)
At the transmitter
75W (±1%) resistive
1.0V (nominal)
An isolated pulse (preceded by two zeros and
followed by one or more zeros) falls within the
template shown in Figure 1-4.
0.95 to 1.05
0.95 to 1.05
13 of 28
DS3150
Figure 1-5. DS3 AIS Structure
M1 Subframe
84
X1 Info F1
(1) Bits (1)
84
Info
Bits
M2 Subframe
84
X2 Info F1
(1) Bits (1)
C1
(0)
84
Info
Bits
F2
(0)
84
Info
Bits
C2
(0)
84
Info
Bits
F3
(0)
84
Info
Bits
84
Info
Bits
C1
(0)
84
Info
Bits
F2
(0)
84
Info
Bits
C2
(0)
84
Info
Bits
M3 Subframe
84
P1 Info F1
(0) Bits (1)
84
Info
Bits
C1
(0)
84
Info
Bits
F2
(0)
84
Info
Bits
C2
(0)
84
Info
Bits
M4 Subframe
84
P2 Info F1
(0) Bits (1)
84
Info
Bits
C1
(0)
84
Info
Bits
F2
(0)
84
Info
Bits
M5 Subframe
84
M1 Info F1
(0) Bits (1)
84
Info
Bits
C1
(0)
84
Info
Bits
F2
(0)
84
Info
Bits
M6 Subframe
84
M2 Info F1
(1) Bits (1)
84
Info
Bits
C1
(0)
84
Info
Bits
M7 Subframe
84
M3 Info F1
(0) Bits (1)
84
Info
Bits
C1
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
F3
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
F3
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
C2
(0)
84
Info
Bits
F3
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
C2
(0)
84
Info
Bits
F3
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
F2
(0)
84
Info
Bits
C2
(0)
84
Info
Bits
F3
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
F2
(0)
84
Info
Bits
C2
(0)
84
Info
Bits
F3
(0)
84
Info
Bits
C3
(0)
84
Info
Bits
F4
(1)
84
Info
Bits
Note 1: X1 is transmitted first.
Note 2: The 84 info bits contain the sequence 101010…, where the first 1 immediately follows each X, P, F, C, or M bit.
14 of 28
DS3150
1.3 Diagnostics
PRBS Generator and Detector. The DS3150 contains on-board pseudorandom bit sequence (PRBS)
generator and detector circuitry for physical layer testing. The device generates and detects unframed
215 - 1 (DS3 or STS-1) or 223 - 1 PRBS patterns compliant with the ITU O.151 specification. The PRBS
generator is enabled through the TDS0 and TDS1 inputs (Table 2-A and Table 2-B). The PRBS detector
is always enabled and reports its status on the PRBS output pin. When the PRBS detector is out of
synchronization, the PRBS pin is forced high. When the detector synchronizes to an incoming PRBS
pattern, the PRBS pin is driven low and then pulses high, synchronous with RCLK, for each bit error
detected (Figure 1-6 and Figure 1-7). The PRBS detector and PRBS pin are only available in the TQFP
package.
Figure 1-6. PRBS Output with Normal RCLK Operation
ICE = 0 or 1
RCLK
PRBS
PRBS Detector
is Not in Sync
PRBS Detector is in sync; the PRBS
Signal Pulses High for Each Bit Error Detected
Figure 1-7. PRBS Output with Inverted RCLK Operation
ICE = Float
RCLK
PRBS
PRBS Detector
is Not in Sync
PRBS Detector is in sync; the PRBS
Signal Pulses High for Each Bit Error Detected
Loopbacks. The DS3150 has two internal loopbacks (Figure 1-1). The analog loopback loops the
outgoing transmit waveform back to the receiver inputs. This is a local or equipment loopback. During
analog loopback data is transmitted normally on TX+ and TX- but the incoming data on RX+ and RX- is
ignored. The remote loopback loops recovered clock and data back through the LIU transmitter. During
remote loopback, recovered clock and data are output normally on RCLK, RPOS/RNRZ and
RNEG/RLCV, but the TPOS/TNRZ and TNEG pins are ignored. These two loopbacks are invoked using
the LBKS input pin (Table 2-A).
15 of 28
DS3150
1.4 Jitter Attenuator
The DS3150 contains an on-board jitter attenuator (JA) that can be placed in the receive path or in the
transmit path or disabled. This selection is made using the RMON and TTS input pins. See Table 2-C for
selection details. Figure 1-8 shows the minimum jitter attenuation for the device when the JA is enabled.
Figure 1-8 also shows the jitter transfer of the receiver when the JA is disabled.
The jitter attenuator consists of a narrowband PLL to retime the selected clock, a 16 x 2-bit FIFO to
buffer the associated data while the clock is being retimed, and logic to prevent over/underflow of the
FIFO in the presence of very large jitter amplitudes.
The jitter attenuator requires a transmission-quality master clock (i.e., ±20ppm frequency accuracy and
low jitter). When enabled in the receive path, the JA can obtain its master clock from the MCLK pin or
the TCLK pin. If the signal on the MCLK pin is toggling, the JA uses the signal on MCLK as its master
clock. If MCLK is high or floating, the JA uses the signal on the TCLK pin as its master clock. When
enabled in the transmit path, the JA must take its master clock from the MCLK pin. The selected master
clock is also used by the clock and data recovery block.
The JA has a loop bandwidth of master_clock / 2058874 (see corner frequencies in Figure 1-8). The JA
attenuates jitter at frequencies higher than the loop bandwidth while allowing jitter (and wander) at lower
frequencies to pass through relatively unaffected.
Figure 1-8. Jitter Attenuation and Jitter Transfer
21.7Hz (DS3)
16.7Hz (E3) 27Hz
25.2Hz (STS-1)
40Hz
1k
>150k
40k 59.6k
0
DS3 [GR-253 (1999)]
Category I
DS3150
Typical
Receiver Jitter
Transfer with
Jitter Attenuator
Disabled
DS3 [GR-499 (1995)]
Category I
STS-1
[GR-253 (1999)]
Category II
-10
E3 [TBR24 (1997)]
Jitter
Attenuation
(dB)
DS3150
DS3 / E3 / STS-1
Minimum Jitter
Attenuation with
Jitter Attenuator
Enabled
-20
DS3 [GR-499 (1999)]
Category II
-30
10
100
1k
10k
100k
Frequency (Hz)
NOTE: JITTER ATTENUATION AND JITTER TRANSFER ARE NOT TESTED DURING PRODUCTION TEST.
16 of 28
1M
DS3150
2. PIN DESCRIPTIONS
Pins are listed in alphabetical order. Section 4 shows the pin configurations for both packages.
Table 2-A. Pin Descriptions
NAME
TYPE
FUNCTION
DM
O
Active-Low Driver Monitor (Open Drain). When the transmit driver monitor detects
a faulty transmitter, DM is driven low. Requires an external pullup to VDD. Not bonded
out in the PLCC package.
I3
(Note 2)
Enhanced Feature Enable. EFE enables the enhanced DS3150 features (PRBS
generation/detection and the transmission of patterns, including all ones, DS3 AIS, and
the 1010… pattern).
0 = enhanced features disabled: TDS0 and TDS1 ignored and PRBS tri-stated
1 = enhanced features enabled: TDS0, TDS1, and PRBS active
loat = test mode enabled: TDS0, TDS1, LBO, LOS redefined as test pins
I3
Invert Clock Enable. ICE determines on which RCLK edge RPOS/RNRZ and
RNEG/RLCV are updated and on which TCLK edge TPOS/TNRZ and TNEG are
sampled.
0 = Normal RCLK/Normal TCLK: update RPOS/RNRZ and RNEG/RLCV on falling
edge of RCLK; sample TPOS/TNRZ and TNEG on rising edge of TCLK
1 = Normal RCLK/Inverted TCLK: update RPOS/RNRZ and RNEG/RLCV on falling
edge of RCLK; sample TPOS/TNRZ and TNEG on falling edge of TCLK
Float = Inverted RCLK/Inverted TCLK: update RPOS/RNRZ and RNEG/RLCV on
rising edge of RCLK; sample TPOS/TNRZ and TNEG on falling edge of TCLK
LBKS
I3
(Note 2)
Active-Low Loopback Select. LBKS determines if either the analog loopback or the
remote loopback is enabled. See the block diagram in Figure 1-1 for details.
0 = analog loopback enabled
1 = no loopback enabled
Float = remote loopback enabled
LBO
I3
(Note 2)
Line Build-Out. LBO indicates cable length for waveform shaping in DS3 and STS-1
modes. LBO is ignored for E3 mode and should be wired high or low.
0 = cable length ³ 225ft
1 = cable length < 225ft
EFE
ICE
LOS
MCLK
O
Active-Low Loss of Signal. LOS is asserted upon detection of 175 ±75 consecutive
zeros in the receive data stream. LOS is deasserted when there are no excessive zero
occurrences over a span of 175 ±75 clock periods. An excessive zero occurrence is
defined as three or more consecutive zeros in the DS3 and STS-1 modes or four or more
zeros in the E3 mode. See Section 1.2 for additional details.
I
Master Clock. If the signal on MCLK is toggling, the device assumes it is a
transmission-quality clock (44.736MHz for DS3, 34.368MHz for E3, 51.840MHz for
STS-1, ±20ppm, low jitter) and uses it as its master clock. The duty cycle of the applied
clock signal should be between 30% and 70%. If MCLK is wired high or left floating,
the device uses the signal on the TCLK pin as the master clock. If MCLK is wired low,
the device takes its master clock from an internal oscillator. The frequency of this
oscillator is determined by a resistor placed between the OFSEL pin and VSS. MCLK
has an internal 15kW pullup resistor to VDD. The selected master clock is used by the JA
and CDR blocks.
17 of 28
DS3150
NAME
PRBS
RCLK
RMON
TYPE
FUNCTION
O3
(Note 3)
PRBS Detector. The PRBS pin reports the status of the PRBS detector. The PRBS
detector constantly searches for either a 215 - 1 (DS3 or STS-1) or 223 - 1 (E3)
pseudorandom bit sequence. When the PRBS detector is out of synchronization, the
PRBS pin is driven high. When the detector synchronizes to an incoming PRBS pattern,
the PRBS pin is driven low and then pulses high, synchronous with RCLK, for each bit
error detected. See Figure 1-6 and Figure 1-7 for more details. If EFE = 0, the PRBS pin
is tri-stated. The PRBS pin is only available in the TQFP package type.
O
I3
(Note 2)
RNEG/
RLCV
O
RPOS/
RNRZ
O
RX+,
RX-
I
TCLK
I
TDS0
I3
(Note 2)
Receive Clock. The recovered clock is output on the RCLK pin. The recovered data is
updated at the RPOS/RNRZ and RNEG/RLCV outputs on either the falling edge of
RCLK (ICE = 0 or 1) or the rising edge of RCLK (ICE = FLOAT). During loss of
signal (LOS = 0), the RCLK output signal is derived from the device’s master clock.
Receive Monitor Mode. RMON determines whether or not the receiver’s preamp is
enabled to provide flat to the incoming signal before it is processed by the equalizer.
This feature should be enabled when the device is being used to monitor signals that
have been resistively attenuated by a monitor jack.
This input also controls the jitter attenuator (Table 2-C).
0 = disable the monitor preamp, disable the jitter attenuator in the receive path
1 = enable the monitor preamp, disable the jitter attenuator in the receive path
Float = disable the monitor preamp, enable the jitter attenuator in the receive path
Receive Negative Data or Receive Line Code Violation. When the B3ZS/HDB3
decoder is disabled (ZCSE = 1), RNEG pulses high to indicate reception of a negative
AMI pulse. When the B3ZS/HDB3 decoder is enabled (ZCSE = 0), the NRZ data
stream is output on RNRZ while RLCV is pulsed high for one RCLK period whenever
the decoder sees a line coding violation. RNEG/RLCV is updated either on the rising
edge of RCLK (ICE = Float) or the falling edge of RCLK (ICE = 0 or 1).
Receive Positive Data or Receive NRZ Data. When the B3ZS/HDB3 decoder is
disabled (ZCSE = 1), RPOS pulses high to indicate reception of a positive AMI pulse.
When the B3ZS/HDB3 decoder is enabled (ZCSE = 0), the NRZ data stream is output
on RNRZ while RLCV is pulsed high whenever the decoder sees a line coding
violation. RPOS/RNRZ is updated either on the rising edge of RCLK (ICE = Float) or
the falling edge of RCLK (ICE = 0 or 1).
Receive Analog Inputs. These differential AMI inputs are coupled to the inbound 75W
coaxial cable through a 1:2 step-up transformer (Figure 1-2).
Transmit Clock. A DS3 (44.736MHz), E3 (34.368MHz), or STS-1 (51.840MHz) clock
should be applied to the TCLK pin. Data to be transmitted is clocked into the device at
TPOS/TNRZ and TNEG either on the rising edge of TCLK (ICE = 0) or the falling
edge of TCLK (ICE = 1 or FLOAT). The duty cycle on TCLK is not restricted as long
the high and low times listed in Section 3 are met. See Section 1.3 for additional details
Transmit Data Select Bit 0. If EFE = 1, TDS0, TDS1 and TESS select the source of
the transmit data (Table 2-B). If EFE = 0, TDS0 is ignored.
18 of 28
DS3150
NAME
TYPE
TDS1/
OFSEL
I3
(Note 2)
TESS
TNEG
TPOS/
TNRZ
FUNCTION
Transmit Data Select Bit 1/Oscillator Frequency Select. If EFE = 1, TDS1, TDS0
and TESS select the source of the transmit data (Table 2-B). If EFE = 0, TDS1 is
ignored. If MCLK is wired low, TDS1 is internally pulled low, and a resistor connected
between this pin (OFSEL) and ground determines the frequency of an internal
oscillator. The following resistor values should be used for specific applications:
E3: 6.81kW, ±2%
DS3: 5.23kW, ±2%
STS-1: 4.53kW, ±2%
When switching among DS3, E3, and STS-1 modes, do not allow OFSEL to float.
Instead, hardwire the highest resistor value and switch in series or parallel resistors as
needed. Example: For a DS3/E3 application, hardwire 5.23kΩ for DS3 and switch in
series 1.58kΩ to get 6.81kΩ for E3.
I3
(Note 2)
T3/E3/STS-1 Select. TESS determines the mode of operation for the device.
0 = E3
1 = T3 (DS3)
Float = STS-1
I3
(Note 2)
Transmit Negative Data. When the B3ZS/HDB3 encoder is disabled (ZCSE = 1),
TNEG should be driven high to transmit a negative AMI pulse. When the B3ZS/HDB3
encoder is enabled (ZCSE = 0), the NRZ data stream should be applied to TNRZ, while
TNEG is ignored and can be wired either high or low. TNEG is sampled either on the
falling edge of TCLK (ICE = 1 or Float) or the rising edge of TCLK (ICE = 0).
I
Transmit Positive Data. When the B3ZS/HDB3 encoder is disabled (ZCSE = 1),
TPOS should be driven high to transmit a positive AMI pulse. When the B3ZS/HDB3
encoder is enabled (ZCSE = 0), the NRZ data stream should be applied to TNRZ.
TPOS/TNRZ is sampled either on the falling edge of TCLK (ICE = 1 or Float) or the
rising edge of TCLK (ICE = 0).
TTS
I3
(Note 2)
Transmit Tri-State. TTS determines whether the TX+ and TX- analog outputs are tristated or active. This input also controls the jitter attenuator (Table 2-C).
0 = tri-state the transmit output driver, disable the jitter attenuator in the transmit path
1 = enable the transmit output driver, disable the jitter attenuator in the transmit path
Float = enable the transmit output driver, enable the jitter attenuator in the transmit path
TX+,
TX-
O3
(Note 3)
Transmit Analog Outputs. These differential AMI outputs are coupled to the
outbound 75W coaxial cable through a 2:1 step-down transformer (Figure 1-2). These
outputs can be tri-stated using the TTS input pin.
VDD
P
Positive Supply. 3.3V ±5%. All VDD pins should be wired together.
VSS
P
Ground Reference. All VSS pins should be wired together.
I
Active-Low Zero Code Suppression Enable. ZCSE has an internal 80kW pullup to
VDD.
0 = B3ZS/HDB3 encoder/decoder enabled (NRZ interface enabled)
1 = B3ZS/HDB3 encoder/decoder disabled (bipolar interface enabled)
ZCSE
Note 1:
Pin type I = input pin. Pin type O = output pin. Pin type P = power-supply pin.
Note 2:
Pin type I3 is an input capable of detecting three states: high, low, and float. All I3 inputs have an internal 13kW pullup to
approximately 1.5V. The voltage range of the float state is approximately 1.2V to 1.9V. If the function of the float state of an I3 pin
is not defined in Table 2-A, then the float state is used for factory test only.
Note 3:
Pin type O3 is an output that is tri-state capable.
19 of 28
DS3150
Table 2-B. Transmit Data Selection
TDS1
TDS0
0
0
1
1
1
1
0
1
0
0
1
1
TESS
TRANSMIT MODE SELECTED
X
Transmit normal data clocked in on TPOS/TNRZ and TNEG
X
Transmit unframed all ones
0 or Float Transmit unframed 101010… pattern
1
Transmit DS3 AIS (Figure 1-5)
0
Transmit 223 - 1 PRBS pattern (per ITU O.151)
1 or Float Transmit 215 - 1 PRBS pattern (per ITU O.151)
Note: When EFE is low, the device ignores TDS0 and TDS1 and always transmits normal data clocked in on TPOS/TNRZ and TNEG.
Table 2-C. RMON and TTS Signal Decode
RMON
TTS
0
0
0
1
1
1
Float
Float
Float
0
1
Float
0
1
Float
0
1
Float
RECEIVER
PREAMP
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Disabled
Disabled
Disabled
TRANSMIT LINE
DRIVER
Tri-stated
Enabled
Enabled
Tri-stated
Enabled
Enabled
Tri-stated
Enabled
Enabled
20 of 28
JITTER ATTENUATOR
Disabled
Disabled
Enabled in Transmit Path
Disabled
Disabled
Enabled in Transmit Path
Enabled in Receive Path
Enabled in Receive Path
Enabled in Receive Path
DS3150
3. ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Lead with Respect to VSS (except VDD)
Supply Voltage Range (VDD) with Respect to VSS
Operating Temperature Range
Storage Temperature Range
Soldering Temperature Range
-0.3V to 5.5V
-0.3V to 3.63V
-40°C to +85°C
-55°C to +125°C
See IPC/JEDEC J-STD-020 Standard
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
Note: The typical values listed below are not production tested.
RECOMMENDED DC OPERATING CONDITIONS
(TA = 0°C to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.)
PARAMETER
Logic 1
Logic 0
Power Supply
SYMBOL
MIN
VIH
VIL
VDD
2.4
-0.3
3.135
TYP
MAX
UNITS
5.5
+0.8
3.465
V
V
V
DC CHARACTERISTICS
(VDD = 3.3V ±5%, TA = 0°C to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.)
PARAMETER
SYMBOL
E3 Supply Current (Note 1)
DS3 Supply Current (Note 1)
STS-1 Supply Current (Note 1)
Power-Down Current (Note 2)
Lead Capacitance
Input Leakage (Note 3)
Input Leakage (I3 Pins or Pins with
Internal Pullup Resistors) (Note 3)
Output Leakage (PRBS Pin, when High-Z)
Output Current (VOH = 2.4V)
Output Current (VOL = 0.4V)
Pullup Resistor on I3 Pins
IDD
IDD
IDD
IPD
CIO
IIL
-10
IILP
ILO
IOH
IOL
ZI3
Note 1:
MIN
TYP
MAX
UNITS
75
87
95
45
7
90
102
110
+10
mA
mA
mA
mA
pF
mA
-500
+500
mA
-10
-4.0
+4.0
+10
mA
mA
mA
kW
13
TCLK at 34.368MHz for E3, 44.736MHz for DS3, or 51.84MHz for STS-1; MCLK floating; TX+/TX- driving all ones into 150W
resistive load; all ones driven into RX+/RX- (1.0V square wave); all other inputs at VDD or grounded; all other outputs open.
Note 2:
VDD = 3.465V; MCLK = 44.736MHz and TTS = 0; other inputs at VDD or grounded; other outputs left open-circuited.
Note 3:
0V < VIN < VDD.
21 of 28
DS3150
FRAMER INTERFACE TIMING
(VDD = 3.3V ±5%, TA = 0°C to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.) (Figure 3-1)
PARAMETER
RCLK/TCLK Clock Period
SYMBOL
t1
CONDITIONS
(Note 4)
(Note 5)
(Note 6)
(Note 4)
(Note 5)
(Note 6)
MIN
9.0
11.6
7.7
TYP
22.4
29.1
19.3
11.2
14.5
9.6
MAX
UNITS
ns
13.4
17.4
11.5
RCLK Clock High/Low Time
t2, t3
TCLK Clock High/Low Time
TPOS/TNRZ, TNEG to TCLK
Setup Time
TPOS/TNRZ, TNEG Hold
Time
RCLK to RPOS/RNRZ Valid,
RNEG/RLCV Valid, State
Change on PRBS
t2, t3
7
ns
t4
2
ns
t5
2
ns
t6
(Notes 7, 8)
2
6
ns
ns
Note 4:
DS3 mode.
Note 5:
E3 mode.
Note 6:
STS-1 mode.
Note 7:
In normal mode, TPOS/TNRZ and TNEG are sampled on the rising edge of TCLK and RPOS/RNRZ and RNEG/RLCV are
updated on the falling edge of RCLK.
Note 8:
In inverted mode, TPOS/TNRZ and TNEG are sampled on the falling edge of TCLK and RPOS/RNRZ and RNEG/RLCV are
updated on the rising edge of RCLK.
Figure 3-1. Framer Interface Timing Diagram
t1
t2
t3
RCLK (normal mode),
TCLK (inverted mode)
TCLK (normal mode),
RCLK (inverted mode)
t4
t5
TPOS/TNRZ, TNEG
t6
RPOS/RNRZ,
RNEG/RLCV, PRBS
22 of 28
DS3150
RECEIVER INPUT CHARACTERISTICS—DS3 AND STS-1 MODES
(VDD = 3.3V ±5%, TA = 0°C to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.)
PARAMETER
Receive Sensitivity (Length of Cable)
Signal-to-Noise Ratio, Interfering Signal Test (Notes 9, 10)
Input Pulse Amplitude, RMON = 0 (Notes 10, 11)
Input Pulse Amplitude, RMON = 1 (Notes 10, 11)
Analog LOS Declare, RMON = 0 (Note 12)
Analog LOS Clear, RMON = 0 (Note 12)
Analog LOS Declare, RMON = 1 (Note 12)
Analog LOS Clear, RMON = 1 (Note 12)
Intrinsic Jitter Generation (Note 10)
MIN
900
TYP
1200
10
MAX
UNITS
feet
1300
260
-25
mVpk
mVpk
dB
dB
dB
dB
UIP-P
-18
-39
-32
0.03
RECEIVER INPUT CHARACTERISTICS—E3 MODE
(VDD = 3.3V ±5%, TA = 0°C to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.)
PARAMETER
Receive Sensitivity (Length of Cable)
Signal-to-Noise Ratio, Interfering Signal Test (Notes 9, 10)
Input Pulse Amplitude, RMON = 0 (Notes 10, 11)
Input Pulse Amplitude, RMON = 1 (Notes 10, 11)
Analog LOS Declare, RMON = 0 (Note 12)
Analog LOS Clear, RMON = 0 (Note 12)
Analog LOS Declare, RMON = 1 (Note 12)
Analog LOS Clear, RMON = 1 (Note 12)
Intrinsic Jitter Generation (Note 10)
MIN
900
TYP
1200
12
MAX
UNITS
feet
1300
260
-25
mVpk
mVpk
dB
dB
dB
dB
UIP-P
-18
-39
-32
0.03
Note 9:
An interfering signal (215 - 1 PRBS for DS3/STS-1, 223 - 1 PRBS for E3, B3ZS/HDB3 encoded, compliant waveshape, nominal bit
rate) is added to the wanted signal. The combined signal is passed through 0 to 900 feet of coaxial cable and presented to the
DS3150 receiver. This spec indicates the lowest signal-to-noise ratio that results in a bit error ratio < 10-9.
Note 10:
Not tested during production test.
Note 11:
Measured on the line side (the BNC connector side) of the 1:2 receive transformer (Figure 1-2). During measurement, incoming
data traffic is unframed 215 - 1 PRBS for DS3/STS-1 and unframed 223 - 1 PRBS for E3.
Note 12:
With respect to nominal 800mVpk signal for DS3/STS-1 and nominal 1000mVpk signal for E3.
23 of 28
DS3150
TRANSMITTER OUTPUT CHARACTERISTICS—DS3 AND STS-1 MODES
(VDD = 3.3V ±5%, TA = 0 to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.)
PARAMETER
DS3 Output Pulse Amplitude, LBO = 0 (Note 13)
DS3 Output Pulse Amplitude, LBO = 1 (Note 13)
STS-1 Output Pulse Amplitude, LBO = 0 (Note 13)
STS-1 Output Pulse Amplitude, LBO = 1 (Note 13)
Ratio of Positive and Negative Pulse Peak Amplitudes
DS3 Unframed All-Ones Power Level at 22.368MHz, 3kHz
Bandwidth
DS3 Unframed All-Ones Power Level at 44.736MHz, 3kHz
Bandwidth
STS-1 Power Level, Wideband (<200MHz)
Intrinsic Jitter Generation (Note 14)
MIN
700
580
700
520
0.9
TYP
800
700
800
700
MAX
900
800
1100
850
1.1
UNITS
mVpk
mVpk
mVpk
mVpk
-1.8
+5.7
dBm
-21.8
-14.3
dBm
-2.7
+4.7
0.05
dBm
UIP-P
MAX
1100
UNITS
mVpk
ns
0.02
TRANSMITTER OUTPUT CHARACTERISTICS—E3 MODE
(VDD = 3.3V ±5%, TA = 0 to +70°C for DS3150Q/T, TA = -40°C to +85°C for DS3150QN/TN.)
PARAMETER
Output Pulse Amplitude (Note 13)
Pulse Width
Ratio of Positive and Negative Pulse Amplitudes (at
Centers of Pulses)
Ratio of Positive and Negative Pulse Widths (at Nominal
Half Amplitude)
Intrinsic Jitter Generation (Note 14)
MIN
900
TYP
1000
14.55
0.95
1.05
0.95
1.05
0.02
0.05
UIP-P
Note 13:
Measured on the line side (the BNC connector side) of the 2:1 transmit transformer (Figure 1-2).
Note 14:
Output jitter generated by the transmitter with a jitter-free clock signal applied to the TCLK pin. Not tested during production test.
24 of 28
DS3150
4. PIN CONFIGURATIONS
TDS0
RX-
EFE
RX+
LBKS
LOS
VDD
TOP VIEW
4
3
2
1
28
27
26
25
RPOS/RNRZ
6
24
RNEG/RLCV
VDD
7
23
RCLK
VSS
8
22
VSS
TX+
9
21
RMON
ICE
10
20
ZCSE
TX-
11
19
MCLK
12
13
14
15
16
17
18
TNEG
TCLK
VDD
TTS
DS3150
TPOS/TNRZ
VSS
TESS
5
LBO
TDS1/OFSEL
48
47
46
45
44
43
42
41
40
39
38
37
VSS
VSS
TDS0
VSS
RXEFE
RX+
VSS
LBKS
LOS
VDD
VDD
PLCC
DS3150
VSS
TESS
TPOS/TNRZ
TNEG
TCLK
VSS
VDD
VDD
TTS
VSS
VSS
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
10
11
12
LBO
VSS
TDS1/OFSEL
VSS
VSS
VDD
VDD
VSS
DM
TX+
ICE
TXVSS
TQFP
25 of 28
36
35
34
33
32
31
30
29
28
27
26
25
VSS
RPOS/RNRZ
RNEG/RLCV
RCLK
VSS
VSS
VSS
PRBS
RMON
ZCSE
MCLK
VSS
DS3150
5. PACKAGE INFORMATION
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo.)
28-Pin PLCC
Dimensions: millimeters
Thermal Information: qJA = +68°C/W
DIM
A
A1
A2
B
B1
c
D
D1
D2
E
E1
E2
L1
N
e1
CH1
MIN
MAX
0.165 0.180
0.090 0.120
0.020
—
0.026 0.033
0.013 0.021
0.009 0.012
0.485 0.495
0.450 0.456
0.390 0.430
0.485 0.495
0.450 0.456
0.390 0.430
0.060
—
28
—
0.050 BSC
0.042 0.048
26 of 28
DS3150
48-Pin TQFP
Dimensions: millimeters
Thermal Information: qJA = +46°C/W
DIM
A
A1
A2
D
D1
E
E1
L
E
B
C
27 of 28
MIN
MAX
—
1.20
0.05
0.15
0.95
1.05
8.80
9.20
7.00 BSC
8.80
9.20
7.00 BSC
0.45
0.75
0.50 BSC
0.17
0.27
0.09
0.20
DS3150
6. REVISION HISTORY
REVISION
020602
062702
072602
010703
032904
082404
012505
DESCRIPTION
Official new product release.
Section 3: Electrical Characteristics: DC Characteristics table—added IDD parameter
for each device mode operation (E3, T3, STS-1 supply current over temperature).
Table 2-A. Signal Descriptions: “< float = Test Mode (not recommended)” was added
to the LBO description for = 1.
Table 2-A. Signal Descriptions: Note 1—“All I3 inputs have an internal 10kW pullup to
1.5V.” was changed to “All I3 inputs have an internal 13kW pullup to approximately
1.5V. The float state voltage range is approximately 1.2V to 1.9V.”
Added G.824 and ETS EN 300 689 to Table 1-A.
Extensive additional description was added to the Receiver and Transmitter sections,
including an LOS discussion, jitter tolerance graphs, and RLCV discussion.
Added Receiver Input Characteristics and Transmitter Output Characteristics tables in
Section 3: Electrical Characteristics
Deleted Section 6: Applications
Section 3: Electrical Characteristics: Transmitter Output Characteristics—E3 Mode.
Corrections were made to Notes 13 and 14 (were originally transposed).
References to “HBD3” were changed to the correct“HDB3.”
Section 3: Electrical Characteristics: Updated temperature ranges on the electrical
tables to indicate the commercial temperature range (0°C to +70°C) for DS3150Q/T
and industrial temperature range (-40°C to +85°C) for DS3150QN/TN.
Section 3: Electrical Characteristics: Transmitter Output Characteristics—DS3 and
STS-1 Modes table (page 24): The spec “STS-1 Output Pulse Amplitude, LBO = 0”
changed the MAX limit from 900mVpk to 1100mVpk. For spec “STS-1 Output Pulse
Amplitude, LBO = 1” changed the MIN limit from 580mVpk to 520mVpk and changed
the MAX limit from 800mVpk to 850mVpk.
28 of 28
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
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© 2005 Maxim Integrated Products · Printed USA
are registered trademarks of Maxim Integrated Products, Inc., and Dallas Semiconductor Corporation.