MOTOROLA MC14035B

SEMICONDUCTOR TECHNICAL DATA
The MC14035B 4–bit shift register is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic structure.
It consists of a 4–stage clocked serial–shift register with synchronous
parallel inputs and buffered parallel outputs. The Parallel/Serial (P/S) input
allows serial–right shifting of data or synchronous parallel loading via inputs
DP0 thru DP3. The True/Complement (T/C) input determines whether the
outputs display the Q or Q outputs of the flip–flop stages. J–K logic forms the
serial input to the first stage. With the J and K inputs connected together they
operate as a serial “D” input.
This device may be effectively used for shift–right/shift–left registers,
parallel–to–serial/serial–to–parallel conversion, sequence generation, up/
down Johnson or ring counters, pseudo–random code generation, frequency and phase comparators, sample and hold registers, etc . . .
•
•
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•
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4–Stage Clocked Serial–Shift Operation
Synchronous Parallel Loading of all Four Stages
J–K Serial Inputs on First Stage
Asynchronous True/Complement Control of all Outputs
Fully Static Operation
Asynchronous Master Reset
Data Transfer Occurs on the Positive–Going Clock Transition
No Limit on Clock Rise and Fall Times
All Inputs are Buffered
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
VDD
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, lout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
Storage Temperature
TL
Lead Temperature (8–Second Soldering)
ORDERING INFORMATION
Plastic
Ceramic
SOIC
PIN ASSIGNMENT
Vin, Vout
Tstg
D SUFFIX
SOIC
CASE 751B
TA = – 55° to 125°C for all packages.
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Parameter
P SUFFIX
PLASTIC
CASE 648
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
L SUFFIX
CERAMIC
CASE 620
500
mW
– 65 to + 150
_C
260
_C
Q0
1
16
VDD
T/C
2
15
Q1
K
3
14
Q2
J
4
13
Q3
R
5
12
DP3
C
6
11
DP2
P/S
7
10
DP1
VSS
8
9
DP0
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
TRUTH TABLE
Inputs
C
X
J
K
R
tn Output
Q0
0
0
1
0
1
0
0
0
0
0
Q0 (n – 1)
Q0 (n – 1)
1
X
X
1
X
X
0
0
1
1
Q0 (n – 1)
0
X = Don’t Care
P/S = 0 = Serial Mode
T/C = 1 = True Outputs
REV 3
1/94
MC14035B
Motorola, Inc. 1995
144
MOTOROLA CMOS LOGIC DATA
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs all
buffers switching)
mAdc
IT = (1.0 µA/kHz) f + IDD
IT = (2.0 µA/kHz) f + IDD
IT = (3.0 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
MOTOROLA CMOS LOGIC DATA
MC14035B
145
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25_C, See Figure 1)
Characteristic
Symbol
Output Rise and Fall Time
TTLH, TTHL = (1.5 ns/pF) CL + 25 ns
TTLH, TTHL = (0.75 ns/pF) CL + 12.5 ns
TTLH, TTHL = (0.55 ns/pF) CL + 12.5 ns
Propagation Delay Time, Clock or Reset to Q
TPLH, TPHL = (1.75 ns/pF) CL + 223 ns
TPLH, TPHL = (0.70 ns/pF) CL + 89 ns
TPLH, TPHL = (0.53 ns/pF) CL + 67 ns
VDD
Vdc
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
300
130
95
600
260
190
tTLH,
tTHL
Unit
ns
tPLH,
tPHL
ns
Clock Pulse Width
tWH
5.0
10
15
335
165
125
135
45
40
—
—
—
ns
Reset Pulse Width
tWH
5.0
10
15
400
175
130
80
40
35
—
—
—
ns
Reset Removal Time
trem
5.0
10
15
80
30
25
40
15
10
—
—
—
ns
tTLH, tTHL
5.0
10
15
Clock Pulse Rise and Fall Time
—
No Limit
Clock Pulse Frequency
fcl
5.0
10
15
—
—
—
2.5
6.0
10
1.2
2.0
3.0
MHz
J–K to Clock Setup Time
tsu
5.0
10
15
500
200
150
120
50
30
—
—
—
ns
Clock to J–K Hold Time
th
5.0
10
15
40
30
25
– 40
–5
0
—
—
—
ns
P/S to Clock Setup Time
tsu
5.0
10
15
500
200
150
25
10
7.5
—
—
—
ns
Clock to P/S Hold Time
th
5.0
10
15
30
20
20
– 70
– 20
– 10
—
—
—
ns
DP to Clock Setup Time
tsu
5.0
10
15
500
200
150
90
20
15
—
—
—
ns
Clock to DP Hold Time
th
5.0
10
15
90
40
40
– 25
0
5
—
—
—
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
50%
RESET
trem
CLOCK
INPUT
J–K
INPUT
50%
tWH
1/fcl
50%
th
tsu
tsu
P/S
INPUT
50%
DP0
INPUT
Q0
tsu
th
50%
tTHL
90%
tTLH
10%
th
50%
tsu
T/C INPUT LOW
tPHL
tPLH
tPHL
tPLH
Figure 1. Timing Diagram
MC14035B
146
MOTOROLA CMOS LOGIC DATA
LOGIC DIAGRAM
DP3 12
DP2 11
DP1 10
DP0 9
P/S
7
J
4
D
K
C
3
Q
D
C
R
Q
D
C
R
Q
D
C
R
Q
13 Q3
R
14 Q2
C
6
15 Q1
R
5
T/C
2
1 Q0
APPLICATION DIAGRAM
Shift Left/Shift Right Register
Q0
LEFT SHIFT
SERIAL OUTPUT
Q1
Q2
LEFT SHIFT
SERIAL INPUT
VDD
Q3
16 15
VDD Q1
Q0 T/C
1
2
RIGHT SHIFT
SERIAL INPUT
RIGHT SHIFT
SERIAL OUTPUT
14 13 12 11 10 9
Q2 Q3 DP3 DP2 DP1 DP0
K
3
J
4
R
5
C
6
P/S VSS
7
8
VDD
RESET
CLOCK
LEFT/RIGHT
SHIFT SELECT
MOTOROLA CMOS LOGIC DATA
MC14035B
147
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
K
H
G
D
J
16 PL
0.25 (0.010)
MC14035B
148
SEATING
PLANE
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MOTOROLA CMOS LOGIC DATA
◊
*MC14035B/D*
MC14035B
MC14035B/D
149