INTEGRATED CIRCUITS DATA SHEET SAA8116HL Digital PC-camera signal processor, microcontroller and USB interface Objective specification File under Integrated Circuits, IC22 2000 Apr 13 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL FEATURES • High precision digital processing with 10-bit input • Embedded microcontroller (80C51 core based) for control loops Auto Optical Black (AOB), Auto White Balance (AWB), Auto Exposure (AE) and USB interface control • Compliant for VGA CCD and VGA CMOS sensors (RGB Bayer) • USB 1.1 compliant core • RGB processing APPLICATIONS • Optical black processing • USB PC-camera (video and audio). • Defect pixel concealment • Programmable colour matrix • RGB to YUV transform GENERAL DESCRIPTION • Programmable gamma correction (including knee) The SAA8116HL is a highly integrated third generation of USB PC-camera ICs. It is the successor of the SAA8112HL and SAA8115HL. It processes the digitized sensor data and converts it to a high quality, compressed YUV signal. Together with the audio signal, this video signal is then properly formatted in USB packets. • Programmable edge enhancement • Video formatter with SIF/QSIF downscaler • Compression engine • Flexible Measurement Engine (ME) with up to eight measurements per frame In addition, an 80C51 microcontroller derivative with five I/O ports, I2C-bus, 512 bytes of RAM and 32 kbytes of program memory is embedded in the SAA8116HL. The microcontroller is used in combination with the programmable statistical measurement capabilities to provide advanced AE, AWB and AOB. The microcontroller is also used to control the USB interface. • Internal Pulse Pattern Generator (PPG) for wide range of VGA CCDs (Sony, Sharp and Panasonic) and frame rate selection • Programmable H and V timings for the support of CMOS sensors • Programmable output pulse for switched mode power supply of the sensor • 3-wire interface to control the TDA8787A: Correlated Double Sampling (CDS) circuit, Automatic Gain Control (AGC) circuit and 10-bit ADC • Analog microphone/audio input to USB: Low DropOut (LDO) supply filter, microphone supply, low noise amplifier, programmable amplifier, PLL and ADC • Integrated analog USB driver (ATX) • Integrated main oscillator including a clock PLL to increase the crystal frequency (from 12 to 48 MHz) • USB 1.1 compliant bus-powered USB device with integrated power management and POR circuit. 2000 Apr 13 2 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL QUICK REFERENCE DATA Measured over full voltage and temperature range: VDD = 3.3 V ±10% and Tamb = 0 to 70 °C; unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDD supply voltage 3.0 3.3 3.6 V IDD(tot) total supply current VDD = 3.6 V; Tamb = 70 °C − − tbf mA Vi input voltage 3.0 V < VDD < 3.6 V low voltage TTL compatible V Vo output voltage 3.0 V < VDD < 3.6 V low voltage TTL compatible V f(i)xtal crystal input frequency − 12 − MHz δ crystal frequency duty factor − 50 − % Ptot total power dissipation − − 300 mW Tstg storage temperature VDD = 3.3 V; Tamb = 25 °C −55 − +150 °C Tamb ambient temperature 0 25 70 °C Tj junction temperature − − 125 °C Tamb = 70 °C ORDERING INFORMATION TYPE NUMBER SAA8116HL 2000 Apr 13 PACKAGE NAME LQFP100 DESCRIPTION plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm 3 VERSION SOT407-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 96 10 9 ROG FH1, FH2 1, 2 3, 98 BCP, DCP RG CRST 91, 92 93 97 FS, FCDS 92 5, 6 RESERVED2, RESERVED3 SMP RESERVED1 23, 24 94 64 83, 84 VSP PXL9 to PXL0 STROBE SDATA SCLK 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 25 27 26 ANALOG MODULES WINDOW TIMING AND CONTROL REFERENCE TIMING MODE DECODER PULSE PATTERN GENERATOR Y PROCESSING PREPROCESSING RGB RECONSTRUCTION RGB PROCESSING PRE-PROCESSING INTERFACE RGB TO YUV 4:2:2 FORMATTER UV PROCESSING LDO SUPPLY FILTER 57 58 59 MICROPHONE SUPPLY 60 AUDIO LOW NOISE AMPLIFIER 61 62 LDOIN LDOFIL LDOOUT MICSUPPLY MICIN LNAOUT MEASUREMENT ENGINE PROGRAMMABLE AUDIO GAIN AMPLIFIER 63 PGAININ Philips Semiconductors FV1, FV2 ASCLK PCLK Digital PC-camera signal processor, microcontroller and USB interface 95 V BLOCK DIAGRAM 2000 Apr 13 FV3, FV4 H 4 AUDIO PLL GPI1 GPI2 GPI3 LED FULLPOWER SNAPRES PRIVRES SDA, SCL EA ALE, PSEN AD14 to AD8 P0.7 to P0.0 34 70 71 4 89 28 29 33, 32 VIDEO FORMATTER COMPRESSION ENGINE TRANSFER BUFFER 80C51 MICROCONTROLLER USB INTERFACE SAA8116HL 2 3 72, 81 AGND1 to AGND3 6 56, 21 8 7, 30, 43, 76, 87, 99 VDDD1, VDD1 to VDDD2 VDD6 8, 31, 44, 77, 88, 100, 55, 22 GND1 to GND8 Fig.1 Block diagram. 80 79 82 86 POR 69 XSEL XIN XOUT ATXDP ATXDN DELAYATT PSEL PORE FCE673 Objective specification VDDA2 2 75, 78, 68 POWER MANAGEMENT ATX 85 74 73 SAA8116HL VDDA1, AUDIO ADC OSCILLATOR AND CPLL VFC 54 49, 50 48, 51, 47, 52, 46, 53, 45 39, 38, 40, 37, 41, 35, 42, 36 AUDIO DECIMATION Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL PINNING PIN SYMBOL TYPE(1) 1 FV1 O vertical CCD transfer pulse output 2 FV2 O vertical CCD transfer pulse output 3 FV3 O vertical CCD transfer pulse output 4 LED O output to drive LED 5 FS O data sample-and-hold pulse output to TDA8787A (SHD) 6 FCDS O preset sample-and-hold pulse output to TDA8787A (SHP) 7 VDD1 P supply voltage 1 for output buffers 8 GND1 P ground 1 for output buffers 9 PCLK I pixel input clock 10 ASCLK O clock1 (pixel clock) or clock2 (2 × pixel clock) output for ADC or CMOS sensor 11 PXL9 I pixel data input; bit 9 12 PXL8 I pixel data input; bit 8 13 PXL7 I pixel data input; bit 7 14 PXL6 I pixel data input; bit 6 15 PXL5 I pixel data input; bit 5 16 PXL4 I pixel data input; bit 4 17 PXL3 I pixel data input; bit 3 18 PXL2 I pixel data input; bit 2 19 PXL1 I pixel data input; bit 1 DESCRIPTION 20 PXL0 I pixel data input; bit 0 21 VDDD2 P supply voltage 2 for the digital core 22 GND8 P ground 8 for input buffers and predrivers 23 BCP O optical black clamp pulse output to TDA8787A 24 DCP O dummy clamp pulse output to TDA8787A 25 STROBE O strobe signal output to TDA8787A or general purpose output of the microcontroller 26 SCLK O serial clock output to TDA8787A or general purpose output of the microcontroller 27 SDATA O serial data output to TDA8787A or general purpose output of the microcontroller 28 SNAPRES I snapshot input or remote wake-up trigger input (programmable) 29 PRIVRES I privacy shutter input or remote wake-up trigger input (programmable) 30 VDD2 P supply voltage 2 for input buffers and predrivers 31 GND2 P ground 2 for input buffers and predrivers 32 SCL I/O I2C-bus clock input/output (master/slave) 33 SDA I/O I2C-bus data input/output (master/slave) 34 GPI1 I 35 P0.2 I/O microcontroller Port 0 bidirectional (data - address); bit 2 36 P0.0 I/O microcontroller Port 0 bidirectional (data - address); bit 0 37 P0.4 I/O microcontroller Port 0 bidirectional (data - address); bit 4 38 P0.6 I/O microcontroller Port 0 bidirectional (data - address); bit 6 39 P0.7 I/O microcontroller Port 0 bidirectional (data - address); bit 7 2000 Apr 13 general purpose input 1 (Port 4; bit 6) 5 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL PIN SYMBOL TYPE(1) 40 P0.5 I/O microcontroller Port 0 bidirectional (data - address); bit 5 41 P0.3 I/O microcontroller Port 0 bidirectional (data - address); bit 3 42 P0.1 I/O microcontroller Port 0 bidirectional (data - address); bit 1 43 VDD3 P supply voltage 3 for output buffers 44 GND3 P ground 3 for output buffers 45 AD8 O microcontroller Port 2 output (address); bit 0 46 AD10 O microcontroller Port 2 output (address); bit 2 47 AD12 O microcontroller Port 2 output (address); bit 4 48 AD14 O microcontroller Port 2 output (address); bit 6 49 ALE O address latch enable output for external latch 50 PSEN O program store enable output for external memory (active LOW) 51 AD13 O microcontroller Port 2 output (address); bit 5 52 AD11 O microcontroller Port 2 output (address); bit 3 53 AD9 O microcontroller Port 2 output (address); bit 1 DESCRIPTION 54 EA I external access select input - internal or external program memory (active LOW) 55 GND7 P ground 7 for input buffers and predrivers 56 VDDD1 P supply voltage 1 for the digital core 57 LDOIN P analog supply voltage for LDO supply filter 58 LDOFIL − external capacitor connection (filter of LDO) 59 LDOOUT − external capacitor connection (internal analog supply voltage for PLL, amplifier and ADC) 60 MICSUPPLY O microphone supply output 61 MICIN I microphone input 62 LNAOUT O low noise amplifier output 63 PGAININ I programmable gain amplifier input 64 RESERVED1 O test pin 1 (should not be used) 65 REF1 I reference voltage 1 (used in the amplifier and the ADC) 66 REF2 I reference voltage 2 (used in the ADC) 67 REF3 I reference voltage 3 (used in the ADC) 68 AGND3 P analog ground 3 for PLL, amplifier and ADC 69 PORE I external Power-on reset (backup) 70 GPI2 I general purpose input 2 (Port 1; bit 4) 71 GPI3 I general purpose input 3 (Port 3; bit 5) 72 VDDA1 P analog supply voltage 1 for crystal oscillator (12 MHz, fundamental) 73 XOUT O oscillator output 74 XIN I oscillator input 75 AGND1 P analog ground 1 for crystal oscillator 76 VDD4 P supply voltage 4 for input buffers and predrivers 77 GND4 P ground 4 for input buffers and predrivers 78 AGND2 P analog ground 2 for ATX transceiver 79 ATXDN I/O 2000 Apr 13 negative driver of the differential data pair input/output (ATX) 6 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface PIN SYMBOL TYPE(1) 80 ATXDP I/O SAA8116HL DESCRIPTION positive driver of the differential data pair input/output (ATX) 81 VDDA2 P analog supply voltage 2 for ATX transceiver 82 DELAYATT O delay attached control output; connected with pull-up resistor on ATXDP (USB) 83 RESERVED2 I test pin 2 (should not be used) 84 RESERVED3 I test pin 3 (should not be used) 85 XSEL I crystal selection input (backup) 86 PSEL I POR selection input (backup) 87 VDD5 P supply voltage 5 for output buffers 88 GND5 P ground 5 for output buffers 89 FULLPOWER O full power signal output (active LOW) 90 FH2 O horizontal CCD transfer pulse output 91 FH1 O horizontal CCD transfer pulse output 92 RG O reset output for CCD output amplifier gate 93 ROG O vertical CCD load pulse output 94 SMP O switch mode pulse output for CCD supply 95 H O horizontal synchronization pulse output 96 V I/O vertical synchronization pulse input/output 97 CRST O CCD charge reset output for shutter control 98 FV4 O vertical CCD transfer pulse output 99 VDD6 P supply voltage 6 for output buffers 100 GND6 P ground 6 for output buffers Note 1. I = input, O = output and P = power supply. 2000 Apr 13 7 Philips Semiconductors Objective specification 76 VDD4 77 GND4 78 AGND2 79 ATXDN 81 VDDA2 80 ATXDP 82 DELAYATT 83 RESERVED2 84 RESERVED3 85 XSEL 86 PSEL 87 VDD5 SAA8116HL 88 GND5 89 FULLPOWER 90 FH2 91 FH1 92 RG 93 ROG 94 SMP 95 H 96 V 97 CRST 98 FV4 handbook, full pagewidth 99 VDD6 100 GND6 Digital PC-camera signal processor, microcontroller and USB interface FV1 1 75 AGND1 FV2 2 74 XIN FV3 3 73 XOUT LED 4 72 VDDA1 FS 5 71 GPI3 FCDS 6 70 GPI2 VCC1 7 69 PORE GND1 8 68 AGND3 PCLK 9 67 REF3 ASCLK 10 66 REF2 PXL9 11 65 REF1 PXL8 12 64 RESERVED1 SAA8116HL PXL7 13 63 PGAININ PXL6 14 62 LNAOUT PXL5 15 61 MICIN PXL4 16 60 MICSUPPLY PXL3 17 59 LDOOUT PXL2 18 58 LDOFIL PXL1 19 57 LDOIN PXL0 20 56 VDDD1 VDDD2 21 55 GND7 GND8 22 54 EA Fig.2 Pin configuration. 2000 Apr 13 8 PSEN 50 ALE 49 AD14 48 AD12 47 AD10 46 AD8 45 GND3 44 VDD3 43 P0.1 42 P0.3 41 P0.5 40 P0.7 39 P0.6 38 P0.4 37 P0.0 36 P0.2 35 GPI1 34 SDA 33 SCL 32 GND2 31 VDD2 30 PRIVRES 29 51 AD13 SNAPRES 28 52 AD11 STROBE 25 SCLK 26 53 AD9 DCP 24 SDATA 27 BCP 23 FCE674 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL PARAMETER MIN. MAX. UNIT −0.5 +4.0 pins GND and AGND −0.5 +4.0 V all other pins −0.5 VDD + 0.5 V VDD supply voltage Vn voltage on V Tstg storage temperature −55 +150 °C Tamb ambient temperature 0 70 °C Tj junction temperature −40 +125 °C Note 1. Stress beyond these levels may cause permanent damage to the device. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT 53 K/W in free air CHARACTERISTICS VDD = VDDD = VDDA = 3.3 V ±10%; Tamb = 0 to 70 °C; unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage 3.0 3.3 3.6 V VDDD supply voltage for digital core 3.0 3.3 3.6 V VDDA analog supply voltage 3.0 3.3 3.6 V IDDD(tot) total digital supply current VDD = VDDD = 3.3 V; Tamb = 25 °C − − 75 mA IDDA(tot) total analog supply current VDDA = 3.3 V; Tamb = 25 °C − − 16 mA Digital data and control inputs VIL LOW-level input voltage − − 0.8 V VIH HIGH-level input voltage 2 − − V Digital data and control outputs VOL LOW-level output voltage 0 − 0.1VDD V VOH HIGH-level output voltage 0.9VDD − VDD V LDO supply filter Vref reference voltage at 0.5VDDA − 1.50 − V VO output voltage on pin LDOUT VDDA = 3.0 V − 3.0 − V IO output current on pin LDOUT − 5 10 mA 2000 Apr 13 9 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SYMBOL PARAMETER SAA8116HL CONDITIONS MIN. TYP. MAX. UNIT Microphone supply IDDA supply current − 0.85 1.2 mA Vref reference voltage at 0.5VDDA − 1.50 − V VO output voltage on pin MICSUPPLY VDDA = 3.0 V − 2.7 − V IO output current on pin MICSUPPLY − − 2.0 mA Audio low noise amplifier TRANSFER FUNCTION Ri input resistance 3.5 5.0 − kΩ IDDA supply current − 0.85 1.2 mA A amplification 28 30 32 dB THD total harmonic distortion − −70 −60 dB Vo(rms) output voltage (RMS value) − − 800 mV VOO output offset voltage − 0.0 1.0 mV reference current − 10 − µA note 1 BIASING Iref Programmable audio gain amplifier TRANSFER FUNCTION Ri input resistance 7.0 10.5 25 kΩ IDDA supply current − 0.45 0.6 mA VOO output offset voltage A = 0 dB − 1.0 2.0 mV A = 30 dB − 14 30 mV A amplification 0.0 − 30 dB THD total harmonic distortion A = 0 dB; note 1 − −83 −78 dB A = 30 dB; note 1 − −59 −54 dB − 10 − µA − 48 − MHz − 8.19200 − MHz − 11.2996 − MHz − 12.2880 − MHz BIASING Iref reference current Audio phase-locked loop fi(clk) clock input frequency fo(clk) clock output frequency note 2 B bandwidth − 2.3 − ζ damping − 0.98 − kHz Audio ADC (∑∆ converter) INPUTS fi input signal frequency 1 − 20 kHz Vi(rms) input voltage (RMS value) − 800 − mV 2000 Apr 13 10 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SYMBOL PARAMETER SAA8116HL CONDITIONS MIN. TYP. MAX. UNIT TRANSFER FUNCTION N order of the ∑∆ − 3 − Nbit number of output bits − 1 − Nbit(eq) equivalent output resolution (bit) − 16 − DRi dynamic range at input − 96.6 − dB fclk clock frequency − − 5.6448 MHz δ clock frequency duty factor − 50 − % THD total harmonic distortion − −70 −55 dB note 3 ATX transceiver full speed mode: pins ATXDP and ATXDN DRIVER CHARACTERISTICS tt(rise) rise transition time CL = 50 pF 4 − 20 ns tt(fall) fall transition time CL = 50 pF 4 − 20 ns note 4 tt(match) transition time matching Vcr output signal crossover voltage Zo driver output impedance steady state drive 90 − 110 % 1.3 − 2.0 V 30 − 42 Ω RECEIVER CHARACTERISTICS fi(D) data input frequency rate − 12.00 − Mbits/s tframe frame interval − 1.000 − ms Notes 1. The distortion is measured at HIGH level, 1 kHz and Vo = 800 mV (RMS). 2. Frequencies depend on PLL settings. input voltage 3. Defined here as: 20 × log ------------------------------------------------------------------------------equivalent input noise voltage t t ( rise ) 4. Transition time matching: t t ( match ) = --------------- × 100% t f ( fall ) 2000 Apr 13 11 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... XIN XOUT SDA SCL ALE PSEN AD14 to AD8 P0.7 to P0.0 EA 12 MHz ASCLK PXL9 to PXL0 CCD SENSOR TDA8787A SDATA SCLK SAA8116HL STROBE DELAYATT XSEL LED SNAPRES PRIVRES PORE PSEL Philips Semiconductors PCLK EEPROM Digital PC-camera signal processor, microcontroller and USB interface EPROM (optional) APPLICATION INFORMATION 2000 Apr 13 handbook, full pagewidth LDOIN LDOFIL FULLPOWER FH1, FH2, RG, ROG MICIN MICSUPPLY PGAININ REF1 LNAOUT REF3 LDOOUT FS, FCDS, DCP, BCP REF2 12 V-DRIVER ATXDP ATXDN 5VBUS USB LDO LDO FV1, FV2, FV3, FV4, CRST SMP FCE675 SAA8116HL Fig.3 CCD sensor application. 3.3 V Objective specification 3.3 V This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... SDA XOUT 12 MHz CMOS SENSOR XIN SCL ALE PSEN AD14 to AD8 P0.7 to P0.0 EA EEPROM V ASCLK PCLK SAA8116HL DELAYATT PXL7 to PXL0 XSEL LED SNAPRES PRIVRES PORE PSEL Philips Semiconductors EPROM (optional) Digital PC-camera signal processor, microcontroller and USB interface 2000 Apr 13 handbook, full pagewidth LDOIN LDOFIL FULLPOWER MICIN MICSUPPLY PGAININ REF1 LNAOUT LDOOUT REF3 REF2 13 ATXDP ATXDN 5VBUS USB LDO LDO 3.3 V FCE676 Objective specification SAA8116HL Fig.4 CMOS sensor application. 3.3 V Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL PACKAGE OUTLINE LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M θ bp Lp L pin 1 index 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 14.1 13.9 0.5 HD HE 16.25 16.25 15.75 15.75 L Lp v w y 1.0 0.75 0.45 0.2 0.08 0.08 Z D (1) Z E (1) θ 1.15 0.85 7 0o 1.15 0.85 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT407-1 136E20 MS-026 2000 Apr 13 EIAJ EUROPEAN PROJECTION ISSUE DATE 00-01-19 00-02-01 14 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2000 Apr 13 15 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable(2) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Apr 13 16 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2000 Apr 13 17 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL NOTES 2000 Apr 13 18 Philips Semiconductors Objective specification Digital PC-camera signal processor, microcontroller and USB interface SAA8116HL NOTES 2000 Apr 13 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 69 © Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753505/01/pp20 Date of release: 2000 Apr 13 Document order number: 9397 750 06807