INTEGRATED CIRCUITS DATA SHEET SAA7811HL Single-chip DVD-ROM Preliminary specification File under Integrated Circuits, IC22 1999 Oct 05 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL FEATURES Host interface • Enhanced Integrated Drive Electronics (IDE) Advanced Technology Attachment Program Interface (ATAPI) host interface • Built-in 12-byte ATAPI Packet command First-In, First-Out (FIFO) • On-chip CD error corrector memory with ±8 frame jitter margin • Supports Advanced Technology Attachment (ATA) and ATA-2 PIO and multi-word Direct Memory Access (DMA) data transfer modes • Built-in hardware for double pass DVD error corrector; (can correct 5 errors in C1 frame and 16 errors in C2 frame) • Supports ATA/ATAPI-4 Ultra DMA transfer modes with data rate up to 33 MBytes/s • Error corrector monitor signal available • I2C-bus output available via programmable vampire pins. • Configurable as generic DMA interface, for use with external host interface devices • Automatic sequencing of ATAPI packet command protocol; including command termination Spindle motor control • Advanced motor control loop allows Constant Angular Velocity (CAV), Constant Linear Velocity (CLV) and pseudo-CLV playback • Automatic determination of block length for mode2, form 1 and form 2 sectors (block length transferred is programmable). • Support for 3-pin and 1-pin tacho control Block decoder • Motor control via incoming bit stream or tacho. • Supports CD-ROM, CD-R and CD-R/W; CD-DA and DVD-ROM formats Speed operation • Supports real time error detection and correction in hardware for CD-ROM mode • Supports up to 10 × DVD-ROM playback. • CD-ROM error corrector switchable between single or dual pass (both with Error Detection/Correction [EDC]) Multimedia functions and built-in DAC • Internal registers are memory-mapped • Supports audio playback via DRAM buffer; allows audio discs to be played at higher speeds • Supports up to 56 × CD-ROM playback • Embedded DVD-video authentication module. • IEC958 (SPDIF, AES/EBU and DOBM) output with Q to W subcode bits and programmable category code, output at n = 1 rate Buffer memory controller • Supports up to 2 MBytes of DRAM buffer • Block based sector addressing. • Built-in digital audio DAC including: −4 × oversampling filter Channel decoder • Built-in digital volume control, attenuator and single-sample interpolator • Selectable differential and single-ended HF inputs; compatible with TZA1033 (DVDalas2plus) and TZA1020A (Aeger2); single-ended input has bypassable AGC • Separate left and right channel routing and mute control. Microcontroller interface • Embedded microcontroller can operate as 33 MHz or 67 MHz equivalent 80C51 • Internal 6-bit ADC • Digital PLL and slicer for HF clock regeneration • Embedded co-processor for fast multiply, divide, shift, and normalize instructions; supported by C-compilers • Supports Eight-to-Fourteen Modulation (EFM) and EFM+ demodulation • Co-processor for MSF calculations • Full CD error correction strategy; t = 2 and e = 4 • Memory mapped interfaces to sub functions • External microcontroller support 1999 Oct 05 2 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL • Embedded SRAM (1.5 kbytes Xdata, 512 bytes Idata, 224 bytes data and registers) • Sledge motor servo loop with enhanced Position Control Sledge (PCS) support • 4 banks: on Idata and registers; for better multi-tasking support • Sledge stepper motor support • External flash EPROM programming support • Debug interface for servo. • Adaptive Repetitive Control (ARC) – Serial boot possible with empty flash EPROM Clock multiplier – Internal program upload support. • On-chip clock multipliers allows the use of 8.4672 MHz crystal. • Code space support up to 1 Mbyte through built-in bank switching • Debug interface for embedded microcontroller. Disclaimer Servo processor Supply of this Compact Disc IC does not convey an implied license under any patent right to use this IC in any Compact Disc application. • Switched current analog-to-digital converters for diode and error signal inputs • Selectable servo error or servo diode inputs • Focus and radial servo loops GENERAL DESCRIPTION • Automatic closed loop gain control available for focus and radial loops The SAA7811 is a single-chip device for high speed DVD-ROM applications. The device contains the following blocks previously contained in separate ICs: • Built-in access procedure with fast track count input • channel decoder • High-speed track crossing velocity measurement (>350 kHz) for CD and DVD • block decoder • servo processor • Special DVD track crossing support • microcontroller. • Fast radial brake circuitry • EFM actuator damping circuitry QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VDDD(CO) supply voltage digital part core; note 1 3.0 3.3 3.6 V VDDD1(3P) supply voltage digital part pad cells 3 V 3.0 3.3 3.6 V VDDD2(5P) supply voltage digital part pad cells 5 V 4.5 5.0 5.5 V VDDA supply voltage analog part; note 1 3.0 3.3 3.6 V IDD supply current − tbf − mA fXTAL crystal frequency 8 8.4672 35 MHz Tamb operating ambient temperature 0 − 60 °C Tstg storage temperature −55 − +125 °C Note 1. The analog and digital core supply pins (VDDA and VDDD(CO)) must be connected to the same external supply. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA7811HL 1999 Oct 05 LQFP208 DESCRIPTION plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm 3 VERSION SOT459-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... MEMORY PROCESSOR DRIVE INTERFACE DRAM INTERFACE MULTIMEDIA INTERFACE ERROR CORRECTOR MOTOR/ TACHO INTERFACE HOST INTERFACE MEMORY PROCESSOR Philips Semiconductors BIT DETECTOR AND DEMODULATOR BLOCK DECODER INTERFACE ADC CD/DVD ERROR CORRECTOR Single-chip DVD-ROM BLOCK DIAGRAM 1999 Oct 05 CHANNEL DECODER DAC SUBCODE INTERFACE CSS MODULE SAA7811 4 CONTROL REGISTERS CPU INTERFACE SERVO ADC PCS ACCELERATOR RAM ADC SERVO ACCELERATOR SERVO PROCESSOR ADDRESS DECODER CPU 1.5 KBYTES ROM 1.5 KBYTES AUXILIARY RAM 736-BYTE RAM SFRs PORT REGS handbook, full pagewidth Fig.1 Block diagram. SAA7811HL FCE404 Preliminary specification MICROCONTROLLER Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL PINNING See note 1 SYMBOL PIN DESCRIPTION VDDD1(3P) 1 pad digital supply (3.3 V) VSSD1(3P) 2 pad digital ground (3.3 V) T1 3 tacho 1 input, tcb_tck_pregate T2 4 tacho 2 input T3 5 tacho 3 input DAC/RP 6 DAC differential output right (positive)/debug signal from MACE (opc_int) DAC/RN 7 DAC differential output right (negative)/debug signal from MACE (servo_int) DAC_VPOS 8 DAC Vref (positive) DAC_VNEG 9 DAC Vref (negative) DAC_LP 10 DAC differential output left (positive)/debug signal from MACE (dakota_int0) DAC_LN 11 DAC differential output left (negative)/debug signal from MACE (dakota_int1) TEST1 12 test input, tcb_tms and tcb_tdi connected to an internal pull-down resistor TEST2 13 test input, tcb_trstn connected to an internal pull-down resistor CRIN 14 clock input CROUT 15 clock output VDDA 16 analog supply (3.3 V) VSSA 17 analog supply ground HFIN_DN 18 differential HF in (negative) HFIN_DP 19 differential HF in (positive) HFIN_SE 20 single-ended HF in (AGC) VCOM 21 common mode reference signal (DVDalas2plus) Iref 22 analog current reference WREFLO 23 Vref low; connect to VSSA via capacitor TEST3 24 test input; connect to VSSA VSSA 25 analog supply ground VDDA 26 analog supply (3.3 V) SIN_PHI 27 sine input from hall detectors COS_PHI 28 cosine input from hall detectors TEST4 29 test input; connect to VSSA XDET 30 auxiliary ADC input ACT_EMFP 31 EMF of the actuator; positive input ACT_EMFN 32 EMF of the actuator; negative input TEST5 33 test input; connect to VSSA TEST6 34 test input; connect to VSSA TEST7 35 test input; connect to VSSA UOPB 36 decoupling point for ADC ladder UOPT 37 upper reference voltage for ADC ladder ALPHA0 38 gain control for TZA1030 (DROPPI) VSSA 39 analog supply ground 1999 Oct 05 5 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL SAA7811HL PIN DESCRIPTION VDDA 40 analog supply (3.3 V) D1 41 diode input D2/TLN 42 diode input (normalized); track-loss signal D3/REN 43 diode input (normalized); radial error signal D4/FEN 44 diode input (normalized); focus error signal S1/MIRN 45 satellite diode (normalized); mirror signal S2 46 satellite diode VRIN 47 I/O voltage reference; for servo ADC FTCH 48 track count input P5_7/DEFO 49 defect output (active LOW)/general purpose I/O P5_6/DEFI 50 defect input (active LOW)/general purpose I/O P5_5/TL 51 track-loss means output/general purpose I/O P5_4/RP/FOK 52 radial polarity/focus OK/general purpose I/O P5_3/CE1 53 CS external SRAM/programmable I/O P5_2/CLO 54 servo clock output/alpha0 step pulse for LADIC P5/SDA 55 I2C-bus data/general purpose I/O P5_0/SCL 56 I2C-bus clock/general purpose I/O RA 57 radial output (3-state during reset) SL 58 sledge output (3-state during reset) FO 59 focus output (3-state during reset) RAC_SW 60 disconnects radial actuator (active HIGH) REF_SIN 61 pulse density modulated reference signal; removes DC offset from sin_phi REF_COS 62 pulse density modulated reference signal; removes DC offset from cos_phi VDDD1(3P) 63 pad digital supply (3.3 V) VSSD1(3P) 64 pad digital ground (3.3 V) P4_7/PXT2EN 65 timer 2 input enable/SIDA for DVDalas2plus P4_6/PXT2 66 timer 2 clock input/SICL for DVDalas2plus P4_5/PXT0 67 timer 1 clock input/SILD for DVDalas2plus P4_4/PXT 68 timer 0 clock input/CS2 for external device VDDD(3CO) 69 core digital supply (3.3 V) VSSD(3CO) 70 core digital ground P4_3/A19 71 A19 to EPROM P4_2/A18 72 A18 to EPROM P4_1/A17 73 A17 to EPROM P4_0/A16 74 A16 to EPROM UA15 75 port 2; upper microcontroller address lines UA14 76 port 2; upper microcontroller address lines UA13 77 port 2; upper microcontroller address lines UA12 78 port 2; upper microcontroller address lines UA11 79 port 2; upper microcontroller address lines UA10 80 port 2; upper microcontroller address lines 1999 Oct 05 6 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL UA9 SAA7811HL PIN 81 DESCRIPTION port 2; upper microcontroller address lines UA8 82 port 2; upper microcontroller address lines VDDD1(3P) 83 pad digital supply (3.3 V) VSSD1(3P) 84 pad digital ground (3.3 V) EA_WAIT 85 address input/wait output internal pull-up resistor (active LOW) DSDEN_SRST 86 microcontroller reset SCCLK 87 microcontroller clock for testing PSENN_CS 88 programme strobe enable/output enable for external device internal pull-up resistor ALE_ASTB 89 address latch; chip select internal pull-up resistor VDDD(3CO) 90 core digital supply (3.3 V) VSSD(3CO) 91 core digital ground UA7_P1_7 92 port 1; demultiplexed lower microcontroller address lines (mode3 = vampire7; V4) UA6_P1_6 93 port 1; demultiplexed lower microcontroller address lines (mode3 = vampire6; SYNC) UA5_P1_5 94 port 1; demultiplexed lower microcontroller address lines (mode3 = MON_D) UA4_P1_4 95 port 1; demultiplexed lower microcontroller address lines (mode3 = MON_A) UA3_P1_3 96 port 1; demultiplexed lower microcontroller address lines (mode3 = DEB_OUT) UA2_P1_2 97 port 1; demultiplexed lower microcontroller address lines (mode3 = OTD) UA1_P1_1 98 port 1; demultiplexed lower microcontroller address lines UA0_P1_0 99 port 1; demultiplexed lower microcontroller address lines VDDD1(3P) 100 pad digital supply (3.3 V) VSSD1(3P) 101 pad digital ground (3.3 V) UDA0 102 port 0; multiplexed microcontroller data/lower address lines UDA1 103 port 0; multiplexed microcontroller data/lower address lines UDA2 104 port 0; multiplexed microcontroller data/lower address lines UDA3 105 port 0; multiplexed microcontroller data/lower address lines UDA4 106 port 0; multiplexed microcontroller data/lower address lines UDA5 107 port 0; multiplexed microcontroller data/lower address lines UDA6 108 port 0; multiplexed microcontroller data/lower address lines UDA7 109 port 0; multiplexed microcontroller data/lower address lines P3_7/RD 110 read signal (active LOW) P3_6/WR 111 write signal (active LOW) P3_5/TXD2 112 UART 2 transmit data line P3_4/RXD2 113 UART 2 receive data line VDDD1(3P) 114 pad digital supply (3.3 V) VSSD1(3P) 115 pad digital ground (3.3 V) P3_3/INT1 116 interrupt 1 input/programmable I/O P3_2/INT0 117 interrupt 0 input/programmable I/O P3_1/TXD1 118 UART 1 transmit data line P3_0/RXD1 119 UART 1 receive data line HRESET 120 host reset VDDD2(5P) 121 pad digital supply (5.0 V) 1999 Oct 05 7 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL SAA7811HL PIN DESCRIPTION VSSD5(pad3) 122 pad digital ground (5.0 V) DD7 123 host interface; generic DMA DD8 124 host interface; generic DMA (mode1 = MEAS1_CFLG) DD6 125 host interface; generic DMA DD9 126 host interface; generic DMA (mode1 = MEAS1) DD5 127 host interface; generic DMA DD10 128 host interface; generic DMA (mode1 = MON_A) DD4 129 host interface; generic DMA DD11 130 host interface; generic DMA (mode1 = MON_D) DD3 131 host interface; generic DMA DD12 132 host interface; generic DMA (mode1 = DEB_OUT) DD2 133 host interface; generic DMA DD13 134 host interface; generic DMA (mode1 = OTD) DD1 135 host interface; generic DMA DD14 136 host interface; generic DMA DD0 137 host interface; generic DMA DD15 138 host interface; generic DMA VDDD2(5P) 139 pad digital supply (5.0 V) VSSD2(5P) 140 pad digital ground (5.0 V) DMARQ/GACK 141 host DMA request; generic DMA acknowledge DIOW 142 host interface write strobe DIOR 143 host interface read strobe IORDY 144 host interface ready DMACK/GRQ 145 host DMA acknowledge; generic DMA request INTRQ 146 host interface interrupt request IOCS16 147 host interface 8⁄16 bit port DA1_GWR 148 host add bit 1; generic write PDIAG 149 host interface passed test (mode1 = vampire6; SYNC) DA0 150 host add bit 0 DA2_GRD 151 host add bit 2; generic read VDDD2(5P) 152 pad digital supply (5.0 V) VSSD2(5P) 153 pad digital ground (5.0 V) CS0 154 host interface chip select 0 CS1 155 host interface chip select 1 DASP 156 host interface active slave present (mode1 = vampire7; V4) VDDD1(3P) 157 pad digital supply (3.3 V) VSSD1(3P) 158 pad digital ground (3.3 V) XDA0 159 DRAM address XDA1 160 DRAM address XDA2 161 DRAM address XDA3 162 DRAM address 1999 Oct 05 8 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL SAA7811HL PIN DESCRIPTION XDA4 163 DRAM address XDA5 164 DRAM address XDA6 165 DRAM address XDA7 166 DRAM address XDA8 167 DRAM address XDA9 168 DRAM address VDDD(3CO) 169 core digital supply (3.3 V) VSSD(3CO) 170 core digital ground XRAS 171 DRAM RAS strobe XCAS_HI 172 DRAM CAS strobe XCAS_LO 173 DRAM CAS strobe XWR 174 DRAM write strobe VDDD1(3P) 175 pad digital supply (3.3 V) VSSD1(3P) 176 pad digital ground (3.3 V) XDD0 177 DRAM data bus XDD1 178 DRAM data bus XDD2 179 DRAM data bus XDD3 180 DRAM data bus XDD4 181 DRAM data bus XDD5 182 DRAM data bus XDD6 183 DRAM data bus XDD7 184 DRAM data bus XDD8 185 DRAM data bus XDD9 186 DRAM data bus XDD10 187 DRAM data bus XDD11 188 DRAM data bus XDD12 189 DRAM data bus XDD13 190 DRAM data bus XDD14 191 DRAM data bus XDD15 192 DRAM data bus VSSD1(3P) 193 pad digital ground (3.3 V) VDDD1(3P) 194 pad digital supply (3.3 V) IECO/CL1 195 IEC958 output/CL1 output from HDr62 MCK 196 multimedia master clock input/output (mode2 = MEAS_CFLG) VDDD(3CO) 197 core digital supply (3.3 V) VSSD(3CO) 198 core digital ground WCLK_WSI 199 I2C-bus word clock output/input (mode2 = MEAS1) BCLK_SCKI 200 I2C-bus bit clock output/input (mode2 = MON_D) DATA_SDI 201 I2C-bus data output/input (mode2 = MON_A) FLAG 202 I2C-bus flag output/input (mode2 = DEB_OUT) TEST8 203 test output; leave unconnected 1999 Oct 05 9 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL TEST9 SAA7811HL PIN 204 DESCRIPTION test output; leave unconnected TEST10 205 test output; leave unconnected POR 206 Power-on reset (active LOW) BCA 207 BCA input MOTO1 208 motor control output Note handbook, halfpage 157 208 1. All supply pins must be connected to the same external power supply voltage. 156 1 SAA7811HL 52 105 104 53 FCE405 Fig.2 Pin configuration. 1999 Oct 05 10 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL CHARACTERISTICS VDDD(3CO) = 3.0 to 3.6 V; VDDD1(3P) = 3.0 to 3.6 V; VDDA = 3.0 to 3.6 V; VDDD2(5P) = 4.5 to 5.5 V; VSS = 0 V; Tamb = 0 to 60 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Pins: HFIN_DN and HFIN_DP − − 140 MHz − 46.6 − MHz fclk(sample) clock frequency sample rate Brec recovered bandwidth 1⁄ 3 Nbit(eff) effective number of bits fclk(sample) = 140 MHz 5 − Vi(dif)(p-p) differential input signal voltage (peak-to-peak value) 0 dB; depends on VDDA − 1.4 1.4VDDA V Vi(se)(p-p) single-ended input signal voltage (peak-to-peak voltage) 0 dB; depends on VDDA − 0.7 1.7VDDA V Voffset(dif) differential offset voltage VHFIN_DP; VHFIN_DN −100 − +100 mV Voffset(cm) common mode offset voltage −200 − +100 mV Voffset(ADC) ADC offset voltage Ci static input capacitance Nyquist − −60 − +60 mV input to ground − 7 − pF input to input − 3 − pF Ri input resistance − ∞ − kΩ td(g) group delay − − 100 ps fclk(sample) clock frequency sample rate − − − MHz Brec recovered bandwidth − 35 − MHz GAGC AGC gain (32 steps) −2.1 − +11.4 dB THD total harmonic distortion − − −35 dB S/N signal to noise ratio and distortion of AGC − 50 − dB Vi(se)(p-p) single-ended input signal voltage (peak-to-peak voltage) 0 dB; depends on VDDA − 0.7 0.7VDDA V input to ground − 7 − pF − 8.6 − kΩ 0 to 35 MHz − − 600 ps selectable via gain; note 1 1 − 16 µA Pin: HFIN_SE Ci static input capacitance Ri input resistance td(g) group delay flatness signal = 25 MHz; at Vdif = 1.4 V(p-p) Pins: D1, D2/TL, D3/RE, S1/MIR and S2 Ii/o(max) maximum input/output current Vi voltage at input − VVRIN − V Gtol gain tolerance −20 0 +20 % 1999 Oct 05 11 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL PARAMETER SAA7811HL CONDITIONS MIN. TYP. MAX. UNIT ∆G variation of gain between channels (D1 to D2/TL, D3/RE to D4/FE and S1/MIR to S2) −2 − +2 % Cpar(max) maximum parasitic capacitance connected to input − − 25 pF fclk clock frequency sample rate − 8.4672 − Brec recovered bandwidth − 20 − kHz (THD + N)/S total harmonic distortion-plus-noise to signal ratio Isink or Isource = 6 µA − − −30 dB DR dynamic range Isink or Isource = 6 µA 50 − − dB 0.75 0.9 1.05 V 1.0 − 1⁄ V 2 DDA V(comp)(offset)(FTC) comparator FTC offset voltage −20 − +20 mV V(comp)(hys)(FTC) comparator FTC hysteresis voltage −10 − +10 mV Vcm common mode voltage − 1.2 − V fsample sample rate − 8.4672 − Ci input capacitance − 7 − pF Ri input resistance 100 − − kΩ MHz Pin: VRIN Vo(VRIN) Vi(VRIN) output voltage input voltage + 0.1 V Pin: FTCH input to ground MHz Pins: UOPB and UOPT Vi(UOPB) input voltage on UOPB − 0 − V Vi(UOPT) input voltage on UOPT − 2.9 − V Pins: ACT_EMFP and ACT_EMFN Vi input voltage 0 − Vi(UOPT) V Vcm common mode voltage − tbf − V G gain − 5 − V note 2 B bandwidth − 265 − kHz Ri input resistance 80 100 120 kΩ Ci static input capacitance − 7 − pF Pins: SIN_PHI, COS_PHI, XDET and ACT_EMFP; note 3 Vi input voltage 0 − V(UOPT) V ∆G gain matching between channels −1 − +1 % Ri input resistance − ∞ − kΩ Ci(static) static input capacitance − 7 − pF 1999 Oct 05 12 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL SAA7811HL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Ci(dynamic) dynamic input capacitance − 5 − pF fclk(sample) clock frequency sample rate − 1.05 − MHz Brec recovered bandwidth 5 − − kHz Nbit(eff) effective number of bits − 7.2 − CODEminvi output code for Vi(UOPB) input 0 5 10 CODEmaxvi output code for Vi(UOPT) input 251 253 255 fclk clock frequency sample rate − 1.05 − MHz Vo output voltage 0 − Vi(UOPT) V CL load capacitance − − 25 pF RL load resistance 10 − 30 kΩ at 1.05 MHz Pin: ALPHA0 Pins: DAC_LN, DAC_LP, DAC/RN and DAC/RP fclk clock frequency sample rate − 4.236 − MHz B frequency bandwidth − − 20 kHz S/NAW A-weighted signal-to-noise note 4 ratio 90 − − dB THD total harmonic distortion − − −80 dB note 4 Digital inputs POR, HRESET AND BCA (SCHMITT TRIGGERS) TTL INPUT WITH HYSTERESIS Vsw(th)(r) switching threshold voltage (rising) 1.4 − 1.9 V Vsw(th)(f) switching threshold voltage (falling) 0.9 − 1.45 V Vhys hysteresis voltage 0.4 − 0.7 V CI input capacitance − − 10 pF DESIGNATED BY ‘T’ TTL INPUT; note 5 VIL LOW-level input voltage − − 0.8 V VIH HIGH-level input voltage 2.0 − − V ILI input leakage current −10 − +10 µA Ci input capacitance − − 10 pF − 0.4 V VLI = 0 to VDDD1(3P) Digital outputs DESIGNATED BY ‘L’ (CMOS LEVELS) VOL LOW-level output voltage IOL = 2 mA − VOH HIGH-level output voltage IOH = −2 mA 0.85VDDD1(3P) − − V CL load capacitance − 20 pF 1999 Oct 05 13 − Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL PARAMETER SAA7811HL CONDITIONS MIN. TYP. MAX. UNIT to(r) output rise time CL = 20 pF; 10% to 90% levels − − 20 ns to(f) output fall time CL = 20 pF; 90% to 10% levels − − 20 ns − − 0.4 V DESIGNATED BY ‘M’ (CMOS LEVELS) VOL LOW-level output voltage IOL = 4 mA IOH = −4 mA 0.85VDDD1(3P) − − V − − 20 pF CL = 20 pF; 10% to 90% levels − − 20 ns output fall time CL = 20 pF; 90% to 10% levels − − 20 ns 3-state leakage current VLI = 0 to VDDD1(3P) −10 − +10 µA VOH HIGH-level output voltage CL load capacitance to(r) output rise time to(f) IL(3-state) DESIGNATED BY ‘AL’ (ATA DATA BUS LEVELS) VOL LOW-level output voltage IOL = 4 mA − − 0.5 V VOH HIGH-level output voltage IOH = −4 mA 0.9VDDD2(5P) − − V CL load capacitance − − 100 pF to(r) output rise time CL = 100 pF; 5 0.5 V to 90% VDDD2(5P) − − ns to(f) output fall time 5 CL = 100 pF; 90% VDDD2(5P) to 0.5 V − − ns DESIGNATED BY ‘AH’ (ATA LEVELS) VOL LOW-level output voltage IOL = 12 mA − − 0.5 V VOH HIGH-level output voltage IOH = −4 mA 0.9VDDD2(5P) − − V CL load capacitance − − 100 pF to(r) output rise time CL = 100 pF; 5 0.5 V to 90% VDDD2(5P) − − ns to(f) output fall time CL = 100 pF; 5 90% VDDD2(5P) to 0.5 V − − ns −0.3 − +0.5 V 2.0 − VDDA + 0.3 V 45 − 55 % Input: CRIN (external clock) VIL LOW-level input voltage VIH HIGH-level input voltage tIH input HIGH time ILI input leakage current −10 − +10 µA Ci input capacitance − − 7 pF − 8.4672 − − 17 relative to period Output: CROUT fXTAL crystal frequency gm(mutual) mutual conductance at start-up 1999 Oct 05 note 6 14 − MHz mA/V Philips Semiconductors Preliminary specification Single-chip DVD-ROM SYMBOL PARAMETER SAA7811HL CONDITIONS MIN. TYP. MAX. UNIT C(feedback) feedback capacitance − − 2 pF Co output capacitance − − 7 pF Rbias internal bias resistor − 200 − kΩ Notes 1. Clips at maximum gain setting; input can handle two times the maximum signal amplitude. 2. Gain depends on application components. 3. Pin ACT_EMFP operating in bypass mode. 4. Performance largely determined by application circuit. 5. Does not apply to pins EA_WAIT, PSENN_CS and ALE_ASTB as they have internal pull-up resistors. 6. It is recommended that the nominal running series resistance of the crystal or ceramic resonator is ≤ 60 Ω. 1999 Oct 05 15 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL PACKAGE OUTLINE LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE (A 3) A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.1 27.9 28.1 27.9 0.5 HD HE 30.15 30.15 29.85 29.85 L Lp v w y ZD ZE θ 1.0 0.75 0.45 0.12 0.15 0.1 1.43 1.08 1.43 1.08 7 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-10-02 98-06-17 SOT459-1 1999 Oct 05 EUROPEAN PROJECTION 16 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 1999 Oct 05 17 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable(2) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Oct 05 18 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1999 Oct 05 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 68 © Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545006/01/pp20 Date of release: 1999 Oct 05 Document order number: 9397 750 06164