MOTOROLA MRF329

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by MRF329/D
SEMICONDUCTOR TECHNICAL DATA
The RF Line
. . . designed primarily for wideband large–signal output and driver amplifier
stages in the 100 to 500 MHz frequency range.
• Specified 28 Volt, 400 MHz Characteristics —
Output Power = 100 Watts
Minimum Gain = 7.0 dB
Efficiency = 50% (Min)
100 W, 100 to 500 MHz
CONTROLLED “Q”
BROADBAND RF POWER
TRANSISTOR
NPN SILICON
• Built–In Matching Network for Broadband Operation Using Double Match
Technique
• 100% Tested for Load Mismatch at all Phase Angles with 3:1 VSWR
• Gold Metallization System for High Reliability
CASE 333–04, STYLE 1
MAXIMUM RATINGS
Symbol
Value
Unit
Collector–Emitter Voltage
Rating
VCEO
30
Vdc
Collector–Base Voltage
VCBO
60
Vdc
Emitter–Base Voltage
VEBO
4.0
Vdc
Collector Current — Continuous
Collector Current — Peak
IC
9.0
12
Adc
Total Device Dissipation @ TC = 25°C (1)
Derate above 25°C
PD
270
1.54
Watts
W/°C
Storage Temperature Range
Tstg
– 65 to +150
°C
Symbol
Max
Unit
RθJC
0.65
°C/W
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case (2)
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Symbol
Min
Typ
Max
Unit
Collector–Emitter Breakdown Voltage
(IC = 80 mAdc, IB = 0)
V(BR)CEO
30
—
—
Vdc
Collector–Emitter Breakdown Voltage
(IC = 80 mAdc, VBE = 0)
V(BR)CES
60
—
—
Vdc
Emitter–Base Breakdown Voltage
(IE = 8.0 mAdc, IC = 0)
V(BR)EBO
4.0
—
—
Vdc
Characteristic
OFF CHARACTERISTICS
NOTES:
(continued)
1. This device is designed for RF operation. The total device dissipation rating applies only when the device is operated as an RF amplifier.
2. Thermal Resistance is determined under specified RF operating conditions by infrared measurement techniques.
REV 6
RF DEVICE DATA
MOTOROLA
Motorola, Inc. 1994
MRF329
1
ELECTRICAL CHARACTERISTICS — continued (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
V(BR)CBO
60
—
—
Vdc
ICBO
—
—
5.0
mAdc
hFE
20
—
80
—
Cob
—
95
125
pF
Common–Emitter Amplifier Power Gain
(VCC = 28 Vdc, Pout = 100 W, f = 400 MHz)
GPE
7.0
9.7
—
dB
Collector Efficiency
(VCC = 28 Vdc, Pout = 100 W, f = 400 MHz)
η
50
60
—
%
Load Mismatch
(VCC = 28 Vdc, Pout = 100 W, f = 400 MHz,
VSWR = 3:1 all angles)
ψ
OFF CHARACTERISTICS (continued)
Collector–Base Breakdown Voltage
(IC = 80 mAdc, IE = 0)
Collector Cutoff Current
(VCB = 30 Vdc, IE = 0)
ON CHARACTERISTICS
DC Current Gain
(IC = 4.0 Adc, VCE = 5.0 Vdc)
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 28 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS (Figure 1)
No Degradation in Output Power
L3
+
C12
28 Vdc
C13
–
C14
L1
L2
DUT
C10
RF
OUTPUT
Z2
RF
INPUT
Z1
C1
C2
C3
C4
C1, C2, C7, C9 — 1.0 – 20 pF Johanson (JMC 5501)
C3, C4 — 36 pF 100 mil Chip Cap (ATC)
C5, C6 — 50 pF 100 mil Chip Cap (ATC)
C8 — 30 pF 100 mil Chip Cap (ATC)
C10 — 2.0 – 150 pF 100 mil Chip Caps in Parallel (ATC)
C11 — 1.0 – 10 pF Johanson (JMC 5201)
C12, C13 — 1000 pF UNELCO Feedthru
C14 — 0.1 µF Erie Redcap
C5
C6
C7
C8
C9
C11
L1 — 0.15 µH Molded Choke with Ferrite Bead
L1 — (Ferroxcube #56–590–65/4B) on Ground End
L2 — 4 Turns #18 AWG, 1/4″ ID
L3 — Ferroxcube VK200–19/4B
Z1 — Microstrip Line 2300 mils L x 210 mils W
Z2 — Microstrip Line 2300 mils L x 280 mils W
Board — Glass Teflon, t = 0.062″, εr = 2.56
Figure 1. 400 MHz Test Circuit
MRF329
2
MOTOROLA RF DEVICE DATA
120
f = 100 MHz
100
Pout , POWER OUTPUT (WATTS)
Pout , POWER OUTPUT (WATTS)
120
225 MHz
400 MHz
80
60
40
20
0
VCC = 28 Vdc
0
2
4
6
8
10
Pin = 11 W
100
9W
80
6W
60
4W
40
20
VCC = 28 Vdc
0
100
12
150
200
Figure 2. Output Power versus Input Power
300
100
Pin = 11 W
80
8.5 W
60
6.5 W
40
20
14
18
22
400
Pin = 11 W
80
8.5 W
6.5 W
60
40
20
f = 400 MHz
f = 225 MHz
0
10
350
Figure 3. Output Power versus Frequency
Pout , POWER OUTPUT (WATTS)
Pout , POWER OUTPUT (WATTS)
100
250
f, FREQUENCY (MHz)
Pin, INPUT POWER (WATTS)
0
10
30
26
14
18
22
26
30
VCC, SUPPLY VOLTAGE (VOLTS)
VCC, SUPPLY VOLTAGE (VOLTS)
Figure 4. Output Power versus Supply Voltage
Figure 5. Output Power versus Supply Voltage
12.5
G PE , POWER GAIN (dB)
Pout = 100 W
VCC = 28 V
11.5
10.5
9.5
8.5
0
100
200
300
400
f, FREQUENCY (MHz)
Figure 6. Power Gain versus Frequency
MOTOROLA RF DEVICE DATA
MRF329
3
f = 100 MHz
350
400
225
Zin
300
225
300
350
ZOL*
400
Pout = 100 W, VCC = 28 V
f = 100 MHz
Zo = 10 Ω
f
MHz
Zin
Ohms
ZOL*
Ohms
100
225
300
350
400
0.55 + j0.40
0.60 + j1.40
1.00 + j2.15
1.50 + j2.20
1.85 + j1.70
3.56 – j1.60
2.30 – j1.10
1.95 – j0.70
1.70 – j0.20
1.50 + j0.30
ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, voltage and frequency.
Figure 7. Series Equivalent Input/Output Impedance
MRF329
4
MOTOROLA RF DEVICE DATA
PACKAGE DIMENSIONS
–A–
Q
N
0.13 (0.005)
D
M
T A
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
H
J
K
L
N
P
Q
K
2
1
2 PL
3
–B–
P
K
4
F
G
J
N
H
STYLE 1:
PIN 1.
2.
3.
4.
N
C
–T–
INCHES
MIN
MAX
0.965
0.985
0.390
0.410
0.250
0.290
0.190
0.210
0.095
0.115
0.215
0.235
0.725 BSC
0.155
0.175
0.004
0.006
0.195
0.205
0.740
0.770
0.415
0.425
0.390
0.400
0.120
0.135
MILLIMETERS
MIN
MAX
24.51
25.02
9.91
10.41
6.73
7.36
4.83
5.33
2.42
2.92
5.47
5.96
18.42 BSC
3.94
4.44
0.10
0.15
4.95
5.21
18.80
19.55
10.54
10.80
9.91
10.16
3.05
3.42
EMITTER
COLLECTOR
EMITTER
BASE
SEATING
PLANE
CASE 333–04
ISSUE E
MOTOROLA RF DEVICE DATA
MRF329
5
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
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MRF329
6
◊
*MRF329/D*
MRF329/D
MOTOROLA RF DEVICE
DATA