SEMICONDUCTOR TECHNICAL DATA The MC10H166 is a 5–Bit Magnitude Comparator and is a functional/ pinout duplication of the standard MECL 10K part with 100% improvement in propagation delay and no increase in power–supply current. The MC10H166 is a high–speed expandable 5–bit comparator for comparing the magnitude of two binary words. Two outputs are provided: A<B and A>B. The A = B function can be obtained by wire–ORing these outputs (a low level indicates A = B) or by wire–NORing the outputs (a high level indicates A = B). A high level on the enable function forces both outputs low. L SUFFIX CERAMIC PACKAGE CASE 620–10 • Propagation Delay, Data–to–Output, 2.0 ns Typical • Power Dissipation 440 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 MAXIMUM RATINGS TRUTH TABLE Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc E A B A<B A>B 0 to VEE Vdc H X X L L 50 100 mA Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current — Continuous — Surge Iout Operating Temperature Range TA Tstg Storage Temperature Range — Plastic — Ceramic Inputs L WORD A = WORD B L L WORD A > WORD B L H WORD A < WORD B H L 0 to +75 °C L –55 to +150 –55 to +165 °C °C L ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° Characteristic Symbol Min Power Supply Current IE IinH IinL Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage 25° DIP PIN ASSIGNMENT 75° Max Min Max Min — 117 — 106 — 350 — 220 0.5 — 0.5 — Outputs Max Unit — 117 mA VCC1 1 16 VCC2 — 220 µA 2 15 E — µA A>B 0.3 –0.735 Vdc A<B 3 14 B2 VOH VOL –1.02 –0.84 –0.98 –0.81 –0.92 –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc B0 4 13 A2 VIH VIL –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc A0 5 12 A3 –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc A1 6 11 B3 B1 7 10 B4 VEE 8 9 A4 AC PARAMETERS Propagation Delay Data–to–Output Enable–to–Output Rise Time Fall Time tpd tr tf ns 1.1 0.6 3.5 1.7 1.1 0.7 3.7 1.7 1.2 0.7 4.1 1.8 0.6 1.5 0.6 1.6 0.6 1.7 ns 0.6 1.5 0.6 1.6 0.6 1.7 ns NOTES: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–36 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 2–266 REV 5 MC10H166 LOGIC DIAGRAM A4 9 B4 10 A3 12 B3 11 2A>B A2 13 B2 14 3A<B A1 6 B1 7 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 A0 5 B0 4 E 15 FIGURE 1 — 9–BIT MAGNITUDE COMPARATOR A0 B0 A1 B1 A2 B2 A3 B3 A4 B4 A0 A1 B0 A2 B1 A3 B2 A0 A4 B3 A5 B5 A6 B6 A7 B7 A8 B8 A1 B0 B4 A2 B1 A3 B2 A4 B3 B4 MC10H166 A>B A<B A<B A>B A>B A<B A=B For 9–Bit Word For longer word lengths, the MC10H166 can be serially expanded or cascaded. Figure 1 shows two devices in a serial expansion for a 9–bit word length. The A > B and A < B outputs are fed to the A0 and B0 inputs respectively MECL Data DL122 — Rev 6 of the next device. The connection for an A = B output is also shown. The worst case delay time of serial expansion is equal to the number of comparators times the data–to–output delay. 2–267 MOTOROLA MC10H166 FIGURE 2 — 25–BIT MAGNITUDE COMPARATOR B24 A24 B23 A23 B22 A22 B21 A21 B20 A20 B4 A4 B3 A3 A < B B2 A2 B1 A > B A1 B0 A0 B19 A19 B18 A18 B17 A17 B16 A16 B15 A15 B4 A4 B3 A3 A < B B2 A2 B1 A > B A1 B0 A0 B14 A14 B13 A13 B12 A12 B11 A11 B10 A10 B4 A4 B3 A3 A < B B2 A2 B1 A > B A1 B0 A0 B9 A9 B8 A8 B7 A7 B6 A6 B5 A5 B4 A4 B3 A3 B2 A2 B1 A1 B0 A0 MOTOROLA B4 A4 B3 A3 A < B B2 A2 B1 A > B A1 B0 A0 B4 A4 B3 A3 A < B B2 A2 B1 A > B A1 B0 A0 A=B A<B A>B For shorter delay times than possible with serial expansion, devices can be cascaded. Figure 2 shows a 25–bit cascaded comparator whose worst case delay is two data–to–output delays. The cascaded scheme can be extended to longer word lengths. B4 A4 B3 A3 A < B B2 A2 B1 A > B A1 B0 A0 2–268 MECL Data DL122 — Rev 6 MC10H166 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–269 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H166 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–270 *MC10H166/D* MC10H166/D MECL Data DL122 — Rev 6