RM807 Power Amplifier Module for TDMA PCS (1850–1910 MHz) The RM807 Power Amplifier Module (PAM) for Personal Communications Service (PCS) is a fully matched 6-pin surface mount module developed for PCS and wireless local loop applications. This small and efficient power amplifier packs a full 1850–1910 MHz bandwidth coverage into a single compact package. This device meets the stringent spectral linearity requirements of Time Division Multiple Access (TDMA) PCS transmission with high power added efficiency to output power of 29.5 dBm. A single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains onboard bias circuitry as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 ohm load. This device is manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the RM807 can be supplied directly from a three-cell nickel cadmium, single cell lithium ion, or other suitable battery with output in the 3–4 volts range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. Distinguishing Features • • • • • • Low voltage positive bias supply Good linearity High efficiency Large dynamic range 6-pin LCC package (6 x 6 x 1.5 mm) Power down control Applications • • Personal Communications Services (TDMA) Wireless Local Loop (WLL) Functional Block Diagram VREF (3) VCC2 (4) VCC1 (1) Driver Stage Bias RF Input (2) Input Match Power Stage Bias Inter Stage Match DA PA Output Match RF Output (5) MMIC MODULE (6, 7) GND Data Sheet © 2001, Skyworks Solutions, Inc., All Rights Reserved. (6, 7) GND 100409F February 7, 2002 RM807 Electrical Specifications Power Amplifier Module for TDMA PCS (1850–1910 MHz) Electrical Specifications The following tables list the electrical characteristics for the RM807 Power Amplifier. Table 1 lists the absolute maximum rating for continuous operation. Table 2 lists the recommended operating conditions for achieving the electrical performance listed in Table 3, which contains the electrical performance data of the RM807 Power Amplifier under recommended operating conditions. Table 1. Absolute Maximum Ratings(1) Parameter RF Input Power Symbol Minimum Nominal Maximum Unit Pin — 3.0 8.0 dBm Volts Supply Voltage Vcc — 3.5 5.0(2) Reference Voltage Vref — 3.1 3.3 Volts Tc –30 +25 +110 °C Tstg –55 — +125 °C Case Operating Temperature Storage Temperature NOTE(S): (1) No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value. (2) Under pulsed TDMA modulated mode, operation at maximum supply voltage of 6.2 V up to 100 ms. Table 2. Recommended Operating Conditions Parameter 2 Symbol Minimum Nominal Maximum Unit Supply Voltage Vcc 3.0 3.5 4.2 Volts Reference Voltage Vref 3.0 3.1 3.3 Volts Operating Frequency Fo 1850 1880 1910 MHz Operating Temperature To –30 +25 +85 °C Skyworks 100409F February 7, 2002 RM807 Electrical Specifications Power Amplifier Module for TDMA PCS (1850–1910 MHz) Table 3. Electrical Specifications for TDMA/PCS Nominal Operating Conditions(1) Characteristic Condition Symbol Minimum Typical Maximum Unit Quiescent current — Iq — 120.0 140.0 mA Reference current — Iref — 2.0 3.0 mA — 4.5 25.0 µA Leakage current PA off Gain Po = 0 dBm Po = 29.5 dBm G Gp 26.0 26.0 30.0 29.0 31.5 31.5 dB dB — PAED 32.0 37.0 — % Po ≤ 29.5 dBm Po ≤ 29.5 dBm Po ≤ 29.5 dBm ACP1 ACP2 ACP3 — — — –30.0 –51.0 –55.0 –28.5 –47.0 — dBc dBc dBc Po ≤ 29.5 dBm Po ≤ 29.5 dBm DFo2 DFo3 — — –49.0 –60.0 — — dBc dBc PA “Turn off time” — — — 10.0 — µS PA “Turn on time” — — — 10.0 — µS Po ≤ 29.5 dBm Np — –136.5 –136.0 dBm/Hz Noise Figure — NF — 6.0 — dB Input Voltage Standing Wave Ratio — VSWR — 1.5:1 1.8:1 — Stability (spurious output) 5:1 VSWR all phases S — — –60.0 dBc Ruggedness—no damage Po ≤ 29.5 dBm Ru — — 10:1 VSWR Power Added Efficiency Adjacent Channel Power –30 kHz offset –60 kHz offset –90 kHz offset Harmonics Second Third Noise Power in RX band 1930 – 1990 MHz(2) NOTE(S): (1) (2) TDMA MODE, Vcc = +3.5 V, Vref = +3.1 V, Freq = 1880 MHz, Tc = +25 °C. With NADC modulation applied. 100409F February 7, 2002 Skyworks 3 RM807 Electrical Specifications Power Amplifier Module for TDMA PCS (1850–1910 MHz) Table 4. Electrical Specifications for TDMA/PCS Recommended Operating Conditions(1) Characteristic Condition Symbol Minimum Maximum Unit Quiescent current — Iq — 150.0 mA Reference current — Iref — 9.0 mA — 25.0 µA Leakage current(3) PA off Gain Po = 0 dBm Po = 29.5 dBm G Gp 24.0 23.0 32.5 34.0 dB dB — PAED 30.0 — % Po ≤ 29.5 dBm Po ≤ 29.5 dBm Po ≤ 29.5 dBm ACP1 ACP2 ACP3 — — — –26.0 –46.0 –50.0 dBc dBc dBc Po ≤ 29.5 dBm Po ≤ 29.5 dBm DFo2 DFo3 — — –35.0 –35.0 dBc dBc PA “Turn off time” — — — 30.0 µS PA “Turn on time” — — — 30.0 µS Po ≤ 29.5 dBm Np — –133.0 dBm/Hz — VSWR — 2.3:1 — 5:1 VSWR all phases S — –60.0 dBc Po ≤ 29.5 dBm Ru — 10:1 VSWR Power Added Efficiency Adjacent Channel Power –30 kHz offset –60 kHz offset –90 kHz offset Harmonics Second Third Noise Power in RX band 1930 – 1990 MHz(2) Input Voltage Standing Wave Ratio (3) Stability (spurious output) Ruggedness—no damage(3) NOTE(S): (1) TDMA MODE, Vcc = +3.5 V, Vref = +3.1 V, Freq = 1850 – 1910 MHz, Tc = –30 °C to +85 °C. With NADC modulation applied. (3) Tc = +25 °C. (2) 4 Skyworks 100409F February 7, 2002 RM807 Characterization Data Power Amplifier Module for TDMA PCS (1850–1910 MHz) Characterization Data The following charts illustrate the characteristics of a typical RM807 Power Amplifier tested in the evaluation board described in the following section. The amplifier was selected by characterizing a group of devices and choosing a part with average electrical performance at both nominal and worst case conditions. Figures 1 through 5 illustrate the digital signal characteristics of the RM807. Figure 1. Digital Gain vs. Output Power Vref = 3.1V, Vcc = 3.5V 40 35 Gain (dB) 30 25 20 15 10 0 5 1850 MHz@-30 C 1880 MHz@-30 C 1910 MHz@-30 C 100409F February 7, 2002 10 15 Output Pow er (dBm ) 1850 MHz@+85 C 1880 MHz@+85 C 1910 MHz@+85 C Skyworks 20 25 30 1850 MHz@+25 C 1880 MHz@+25 C 1910 MHz@+25 C 5 RM807 Characterization Data Power Amplifier Module for TDMA PCS (1850–1910 MHz) Figure 2. Digital Adjacent Channel Power vs. Output Power Vref = 3.1V, Vcc = 3.5V 0 ACPR1 (dBc) -10 -20 -30 -40 -50 0 5 10 15 20 25 30 20 25 30 Output Pow er (dBm ) Figure 3. Digital Alternate Channel Power vs. Output Power Vref = 3.1V, Vcc = 3.5V -30 ACPR2 (dBc) -40 -50 -60 -70 -80 0 5 10 15 Output Pow er (dBm ) 1850 MHz@-30 C 1880 MHz@-30 C 1910 MHz@-30 C 6 1850 MHz@+85 C 1880 MHz@+85 C 1910 MHz@+85 C Skyworks 1850 MHz@+25 C 1880 MHz@+25 C 1910 MHz@+25 C 100409F February 7, 2002 RM807 Characterization Data Power Amplifier Module for TDMA PCS (1850–1910 MHz) Figure 4. Digital Power Added Efficiency vs. Output Power Vref = 3.1V, Vcc = 3.5V 50 DPAE (%) 40 30 20 10 0 0 5 10 15 Output Pow er (dBm ) 20 25 30 20 25 30 Figure 5. Analog Second Order Harmonic Suppression vs. Output Power Vref = 3.1V, Vcc = 3.5V 0 -10 DFo2 (dBc) -20 -30 -40 -50 -60 0 5 10 15 Output Pow er (dBm ) 1850 MHz@-30 C 1880 MHz@-30 C 1910 MHz@-30 C 100409F February 7, 2002 1850 MHz@+85 C 1880 MHz@+85 C 1910 MHz@+85 C Skyworks 1850 MHz@+25 C 1880 MHz@+25 C 1910 MHz@+25 C 7 RM807 Evaluation Board Description Power Amplifier Module for TDMA PCS (1850–1910 MHz) Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the RM807, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 6 shows the basic schematic of the board for the 1850 MHz to 1910 MHz range. Figure 7 illustrates the board layout. Figure 6. Evaluation Board Schematic VCC C5 10,000 pF 50 W Transmission Line (40 mils) 50 W Transmission Line GND 6 VCC 1 RM807 RFIN RFIN 2 C1 18 pF 50 W Transmission Line RFOUT RFOUT 5 3 VREF 4 VCC2 C3 1,000 pF C2 4.7 µF C4 1,000 pF VREF VCC NOTE: Both Vcc may be tied together at the supply. 100409_003 Figure 7. Evaluation Board Diagram C5 J1 C1 RF IN J2 C2 C3 C4 RF OUT SKYWORKS GND Vcc GND Vref J3 REF DESIGNATIONS VALUES C1 18 pF 4.7 µF C2 C3 1,000 pF C4 1,000 pF 10,000 pF C5 QTY 1 1 1 1 1 100409_004 8 Skyworks 100409F February 7, 2002 RM807 Package Dimensions and Pin Description Power Amplifier Module for TDMA PCS (1850–1910 MHz) Package Dimensions and Pin Description The RM807 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 8. RM807 Package Drawing 2.870 (2x) 1.981 (2x) 1.219 (2x) PIN 1 INDICATOR 1 6 6 (PIN 7) 2.500 (4x) 2 5 3 4 5.92/6.15 2 5 3 4 - TOP VIEWS - .762 6x R .500 TYP 5.92/6.15 NOTE: Solder mask pattern pad layout as seen from top looking through package. 1.500 TYP All dimensions in millimeters. FRONT VIEW 100409_002 Table 5. Pin Description Pin # Function 1 VCC1(1) 2 RF Input 3 VREF 4 VCC2(1) 5 RF Output 6 GND (7) GND PAD GND(2) NOTE(S): (1) (2) All supply pins may be connected together at the supply. Package underside is GND. 100409F February 7, 2002 Skyworks 9 RM807 Package and Handling Information Power Amplifier Module for TDMA PCS (1850–1910 MHz) Package and Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The RM807 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second; maximum temperature should not exceed 225 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Conexant, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J–STD–020A. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568. Figure 9. Typical Case Markings SKYWORKS Mark Pin 1 Identifier RM807-NN NXXXXX.XX YYWW MEX Manufacturing Part Number-Revision Number Lot Number YY = Manufacture Year WW = Week Package Sealed MEX = Country Code 100409_006 10 Skyworks 100409F February 7, 2002 RM807 Electrostatic Discharge Sensitivity Power Amplifier Module for TDMA PCS (1850–1910 MHz) Electrostatic Discharge Sensitivity The RM807 is a Class I device. Figure 10 lists the Electrostatic Discharge (ESD) immunity level for each pin of the RM807 product. The numbers in Figure 10 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. Since 2000 volts represents the maximum measurement limit of the test equipment used, pins marked > 2000 V pass 2000V ESD stress. Figure 10. ESD Sensitivity Areas > +2000 V < –2000 V VCC1 1 6 GND > +2000 V < –2000 V RFIN 2 5 RFOUT > +2000 V < –2000 V > +2000 V VREF < –2000 V 3 4 VCC2 > +2000 V < –2000 V 100409_008 Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards which fail devices only after “the pin fails the electrical specification limits” or “the pin becomes completely non-functional”. Skyworks employs most stringent criteria, fails devices as soon as the pin begins to show any degradation on a curve tracer. To avoid ESD damage, latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed in Table 6. Table 6. Precautions for GaAs ICs with ESD Thresholds Greater Than 200V But Less Than 2000V Personnel Grounding Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Facility Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 Ω to GND) Protective Workstation Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors Protective Packaging & Transportation Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders 100409F February 7, 2002 Skyworks 11 RM807 Electrostatic Discharge Sensitivity Power Amplifier Module for TDMA PCS (1850–1910 MHz) 12 Skyworks 100409F February 7, 2002 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature RM807 RM807-15 15 6x6LM–6 –30 °C to +85 °C Revision History Revision Level Date Description A March 2000 Initial Release B March 2000 Amend Title, Added Package Drawing C March 2001 Add Soldering and Temperature Change Guidelines, Evaluation Board information, Case Marking drawing, ESD data D April 2001 Revise: Manufacturing Part Number; Figure 3; ESD Data Add: Table 4; Figures 1 through 5, Packaging and Handling Information Section E September 2001 Revise: Add footnote to Table 1 F February 7, 2002 Revise: Table 1 footnote 2. References Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel, Document Number 101568 JEDEC Standard J–STD–020A © 2002, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. 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