MAXIM MAX1057BETM

19-3280; Rev 2; 8/04
KIT
ATION
EVALU
E
L
B
AVAILA
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Features
♦ 10-Bit, 300ksps ADC
Analog Multiplexer with True-Differential
Track/Hold (T/H)
16 Single-Ended Channels or 8 Differential
Channels (Unipolar or Bipolar)
12 Single-Ended Channels or 6 Differential
Channels (Unipolar or Bipolar)
8 Single-Ended Channels or 4 Differential
Channels (Unipolar or Bipolar)
Excellent Accuracy: ±0.5 LSB INL, ±0.5 LSB DNL
♦ 10-Bit, Octal, 2µs Settling DAC
Ultra-Low Glitch Energy (4nV•s)
Power-Up Options from Zero Scale or Full Scale
Excellent Accuracy: ±1 LSB INL
♦ Internal Reference or External Single-Ended/
Differential Reference
Internal Reference Voltage 2.5V or 4.096V
♦ Internal ±1°C Accurate Temperature Sensor
♦ On-Chip FIFO Capable of Storing 16 ADC
Conversion Results and One Temperature Result
♦ On-Chip Channel-Scan Mode and Internal
Data-Averaging Features
♦ Analog Single-Supply Operation
+2.7V to +3.6V or +4.75V to +5.25V
♦ 25MHz, SPI/QSPI/MICROWIRE Serial Interface
♦ AutoShutdown Between Conversions
♦ Low-Power ADC
2.5mA at 300ksps
22µA at 1ksps
0.2µA at Shutdown
♦ Low-Power DAC: 1.5µA
♦ Evaluation Kit Available (Order MAX1258EVKIT)
Applications
Controls for Optical Components
Base-Station Control Loops
System Supervision and Control
Data-Acquisition Systems
PART
TEMP RANGE
PIN-PACKAGE
Ordering Information/Selector Guide
REF
ANALOG
RESOLUTION
ADC
DAC
VOLTAGE
SUPPLY
GPIOs
BITS***
CHANNELS CHANNELS
(V)
VOLTAGE (V)
4.096
4.75 to 5.25
10
8
8
4
MAX1021BETX* -40°C to +85°C 36 Thin QFN-EP**
2.5
2.7 to 3.6
10
8
8
4
MAX1022BETX* -40°C to +85°C 36 Thin QFN-EP**
4.096
4.75 to 5.25
10
12
8
0
MAX1023BETX* -40°C to +85°C 36 Thin QFN-EP**
2.5
2.7 to 3.6
10
12
8
0
-40°C to +85°C 48 Thin QFN-EP**
2.5
2.7 to 3.6
10
16
8
12
4.75 to 5.25
10
16
8
12
MAX1020BETX
MAX1057BETM
-40°C to +85°C 36 Thin QFN-EP**
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
AutoShutdown is a trademark of Maxim Integrated Products, Inc.
MAX1058BETM -40°C to +85°C 48 Thin QFN-EP**
4.096
*Future product—contact factory for availability.
**EP = Exposed pad.
***Number of resolution bits refers to both DAC and ADC.
Pin Configurations appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX1020–MAX1023/MAX1057/MAX1058
General Description
The MAX1020–MAX1023/MAX1057/MAX1058 integrate a
multichannel, 10-bit, analog-to-digital converter (ADC)
and an octal, 10-bit, digital-to-analog converter (DAC) in a
single IC. These devices also include a temperature sensor and configurable general-purpose I/O ports (GPIOs)
with a 25MHz SPI™-/QSPI™-/MICROWIRE™-compatible
serial interface. The ADC is available in 8/12/16 inputchannel versions. The octal DAC outputs settle within
2.0µs, and the ADC has a 300ksps conversion rate.
All devices include an internal reference (2.5V or 4.096V)
providing a well-regulated, low-noise reference for both
the ADC and DAC. Programmable reference modes for
the ADC and the DAC allow the use of an internal reference, an external reference, or a combination of both.
Features such as an internal ±1°C accurate temperature
sensor, FIFO, scan modes, programmable internal
or external clock modes, data averaging, and
AutoShutdown™ allow users to minimize both power consumption and processor requirements. The low glitch
energy (4nV•s) and low digital feedthrough (0.5nV•s) of
the integrated octal DACs make these devices ideal for
digital control of fast-response closed-loop systems.
The devices are guaranteed to operate with a supply voltage from +2.7V to +3.6V (MAX1021/MAX1023/MAX1057)
and from +4.75V to +5.25V (MAX1020/MAX1022/
MAX1058). The devices consume 2.5mA at 300ksps
throughput, only 22µA at 1ksps throughput, and under
0.2µA in the shutdown mode. The MAX1057/MAX1058
feature 12 GPIOs, while the MAX1020/MAX1021 offer 4
GPIOs that can be configured as inputs or outputs.
The MAX1057/MAX1058 are available in 48-pin thin QFN
packages. The MAX1020–MAX1023 are available in 36pin thin QFN packages. All devices are specified over the
-40°C to +85°C temperature range.
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND .........................................................-0.3V to +6V
DGND to AGND.....................................................-0.3V to +0.3V
DVDD to AVDD .......................................................-3.0V to +0.3V
Digital Inputs to DGND.............................................-0.3V to +6V
Digital Outputs to DGND .........................-0.3V to (DVDD + 0.3V)
Analog Inputs, Analog Outputs and REF_
to AGND...............................................-0.3V to (AVDD + 0.3V)
Maximum Current into Any Pin (except AGND, DGND, AVDD,
DVDD, and OUT_) ...........................................................50mA
Maximum Current into OUT_.............................................100mA
Continuous Power Dissipation (TA = +70°C)
36-Pin Thin QFN (6mm x 6mm)
(derate 26.3mW/°C above +70°C) ......................2105.3mW
48-Pin Thin QFN (7mm x 7mm)
(derate 26.3mW/°C above +70°C) ......................2105.3mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note: If the package power dissipation is not exceeded, one output at a time may be shorted to AVDD, DVDD, AGND, or DGND
indefinitely
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ADC
DC ACCURACY (Note 1)
Resolution
10
Bits
Integral Nonlinearity
INL
±0.5
±1.0
LSB
Differential Nonlinearity
DNL
±0.5
±1.0
LSB
±0.25
±2.0
LSB
±0.025
±2.0
LSB
Offset Error
Gain Error
(Note 2)
Gain Temperature Coefficient
±1.4
ppm/°C
Channel-to-Channel Offset
±0.1
LSB
DYNAMIC SPECIFICATIONS (10kHz sine wave input, VIN = 2.5VP-P (MAX1021/MAX1023/MAX1057), VIN = 4.096VP-P
(MAX1020/MAX1022/MAX1058), 300ksps, fSCLK = 4.8MHz)
Signal-to-Noise Plus Distortion
SINAD
61
dB
Total Harmonic Distortion
(Up to the Fifth Harmonic)
THD
-70
dBc
Spurious-Free Dynamic Range
SFDR
66
dBc
fin1 = 9.9kHz, fin2 = 10.2kHz
72
dBc
Full-Linear Bandwidth
SINAD > 70dB
100
kHz
Full-Power Bandwidth
-3dB point
1
MHz
External reference
0.8
µs
Internal reference (Note 4)
218
Conversion
Clock
Cycles
Intermodulation Distortion
IMD
CONVERSION RATE (Note 3)
Power-Up Time
2
tPU
_______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
PARAMETER
Acquisition Time
SYMBOL
tACQ
Conversion Time
tCONV
Internal Clock Frequency
External Clock Frequency
CONDITIONS
(Note 5)
MIN
Externally clocked conversion (Note 5)
Duty Cycle
UNITS
µs
3.5
µs
2.7
Internally clocked conversion
fCLK
MAX
0.6
Internally clocked
Externally clocked
TYP
4.3
MHz
0.1
4.8
MHz
40
60
%
Aperture Delay
30
ns
Aperture Jitter
<50
ps
ANALOG INPUTS
Unipolar
Input Voltage Range (Note 6)
Bipolar
0
VREF
-VREF / 2
VREF / 2
Input Leakage Current
±0.01
Input Capacitance
±1
24
V
µA
pF
INTERNAL TEMPERATURE SENSOR
Measurement Error (Notes 5, 7)
TA = +25°C
±0.7
TA = TMIN to TMAX
±1.0
Temperature Resolution
±3.0
1/8
°C
°C/LSB
INTERNAL REFERENCE
REF1 Output Voltage (Note 8)
REF1 Voltage Temperature
Coefficient
MAX1021/MAX1023/MAX1057
2.482
2.50
2.518
MAX1020/MAX1022/MAX1058
4.066
4.096
4.126
TCREF
REF1 Output Impedance
REF1 Short-Circuit Current
V
±30
ppm/°C
6.5
kΩ
VREF = 2.5V
0.39
VREF = 4.096V
0.63
mA
EXTERNAL REFERENCE
REF1 Input Voltage Range
VREF1
REF2 Input Voltage Range
(Note 4)
VREF2
REF mode 11 (Note 4)
1
AVDD +
0.05
REF mode 01
1
AVDD +
0.05
REF mode 11
0
1
V
V
_______________________________________________________________________________________
3
MAX1020–MAX1023/MAX1057/MAX1058
ELECTRICAL CHARACTERISTICS (continued)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
PARAMETER
REF1 Input Current (Note 9)
REF2 Input Current
SYMBOL
IREF1
IREF2
CONDITIONS
MIN
TYP
MAX
UNITS
VREF = 2.5V
(MAX1021/MAX1023/MAX1057),
fSAMPLE = 300ksps
25
80
VREF = 4.096V
(MAX1020/MAX1022/MAX1058),
fSAMPLE = 300ksps
40
80
Acquisition between conversions
±0.01
±1
VREF = 2.5V
(MAX1021/MAX1023/MAX1057),
fSAMPLE = 300ksps
25
80
VREF = 4.096V
(MAX1020/MAX1022/MAX1058),
fSAMPLE = 300ksps
40
80
Acquisition between conversions
±0.01
±1
±0.5
±1
LSB
±0.5
LSB
±10
mV
µA
µA
DAC
DC ACCURACY (Note 10)
Resolution
10
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
Guaranteed monotonic
Offset Error
VOS
(Note 8)
±3
Offset-Error Drift
Gain Error
Bits
ppm of
FS/°C
±10
GE
(Note 8)
±1.25
Gain Temperature Coefficient
±10
LSB
ppm of
FS/°C
±8
DAC OUTPUT
No load
0.02
AVDD 0.02
0.1
AVDD 0.1
Output-Voltage Range
V
10kΩ load to either rail
DC Output Impedance
Resistive Load to AGND
4
Ω
0.5
Capacitive Load
(Note 11)
1
AVDD = 2.7V, VREF = 2.5V
(MAX1021/MAX1023/MAX1057),
gain error < 1%
2000
AVDD = 4.75V, VREF = 4.096V
(MAX1020/MAX1022/MAX1058),
gain error < 2%
500
nF
Ω
RL
_______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
From power-down mode, AVDD = 5V
25
From power-down mode, AVDD = 2.7V
21
1kΩ Output Termination
Programmed in power-down mode
1
kΩ
100kΩ Output Termination
At wake-up or programmed in
power-down mode
100
kΩ
Wake-Up Time (Note 12)
µs
DYNAMIC PERFORMANCE (Notes 5, 13)
Output-Voltage Slew Rate
SR
Positive and negative
Output-Voltage Settling Time
tS
To 1 LSB, 400 - C00 hex (Note 7)
Digital Feedthrough
Code 0, all digital inputs from 0 to DVDD
Major Code Transition Glitch
Impulse
Between codes 2047 and 2048
Output Noise (0.1Hz to 50MHz)
Output Noise (0.1Hz to 500kHz)
3
V/µs
2
µs
0.5
nV•s
4
nV•s
From VREF
660
Using internal reference
720
From VREF
260
Using internal reference
320
DAC-to-DAC Transition
Crosstalk
5
µVP-P
µVP-P
0.5
nV•s
INTERNAL REFERENCE
REF1 Output Voltage (Note 8)
REF1 Temperature Coefficient
MAX1021/MAX1023/MAX1057
2.482
2.50
2.518
MAX1020/MAX1022/MAX1058
4.066
4.096
4.126
TCREF
REF1 Short-Circuit Current
ppm/°C
±30
VREF = 2.5V
0.39
VREF = 4.096V
0.63
V
mA
EXTERNAL-REFERENCE INPUT
REF1 Input Voltage Range
VREF1
REF1 Input Impedance
RREF1
REF modes 01, 10, and 11 (Note 4)
0.7
70
100
AVDD
V
130
kΩ
DIGITAL INTERFACE
DIGITAL INPUTS (SCLK, DIN, CS, CNVST, LDAC)
Input-Voltage High
VIH
Input-Voltage Low
VIL
Input Leakage Current
Input Capacitance
DVDD = 2.7V to 5.25V
2.4
V
DVDD = 3.6V to 5.25V
0.8
DVDD = 2.7V to 3.6V
0.6
IL
±0.01
CIN
15
±10
V
µA
pF
DIGITAL OUTPUT (DOUT) (Note 14)
Output-Voltage Low
VOL
ISINK = 2mA
0.4
V
_______________________________________________________________________________________
5
MAX1020–MAX1023/MAX1057/MAX1058
ELECTRICAL CHARACTERISTICS (continued)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
PARAMETER
SYMBOL
Output-Voltage High
VOH
CONDITIONS
MIN
TYP
DVDD 0.5
ISOURCE = 2mA
±10
COUT
UNITS
V
Tri-State Leakage Current
Tri-State Output Capacitance
MAX
15
µA
pF
DIGITAL OUTPUT (EOC) (Note 14)
Output-Voltage Low
VOL
ISINK = 2mA
Output-Voltage High
VOH
ISOURCE = 2mA
0.4
DVDD 0.5
V
Tri-State Leakage Current
Tri-State Output Capacitance
±10
COUT
V
15
µA
pF
DIGITAL OUTPUTS (GPIO_) (Note 14)
GPIOB_, GPIOC_ OutputVoltage Low
ISINK = 2mA
0.4
ISINK = 4mA
0.8
GPIOB_, GPIOC_ OutputVoltage High
ISOURCE = 2mA
GPIOA_ Output-Voltage Low
ISINK = 15mA
GPIOA_ Output-Voltage High
ISOURCE = 15mA
DVDD 0.5
V
0.8
DVDD 0.8
±10
COUT
V
V
Tri-State Leakage Current
Tri-State Output Capacitance
V
15
µA
pF
POWER REQUIREMENTS (Note 15)
Digital Positive-Supply Voltage
Digital Positive-Supply Current
Analog Positive-Supply Voltage
DVDD
DIDD
AVDD
2.70
Idle, all blocks shut down
Only ADC on, external reference
REF1 Positive-Supply Rejection
DAC Positive-Supply Rejection
6
AIDD
AVDD
V
4
µA
1
mA
MAX1021/MAX1023/MAX1057
2.7
3.6
MAX1020/MAX1022/MAX1058
4.75
5.25
Idle, all blocks shut down
Analog Positive Supply Current
0.2
Only ADC on,
external reference
0.2
1
fSAMPLE = 300ksps
2.8
4.2
fSAMPLE = 100ksps
2.6
All DACs on, no load, internal reference
1.5
AVDD = 2.7V
MAX1021/MAX1023/MAX1057
-77
AVDD = 4.75V
MAX1020/MAX1022/MAX1058
-80
µA
mA
4.0
PSRR
PSRD
V
dB
MAX1021/MAX1023/MAX1057
Output AVDD = 2.7V to 3.6V
code =
FFFhex MAX1020/MAX1022/MAX1058
AVDD = 4.75V to 5.25V
±0.1
±0.5
±0.1
±0.5
mV
_______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
PARAMETER
ADC Positive-Supply Rejection
SYMBOL
PSRA
CONDITIONS
Fullscale
input
MIN
TYP
MAX
MAX1021/MAX1023/
MAX1057 AVDD = 2.7V to 3.6V
±0.06
±0.5
MAX1020/MAX1022/
MAX1058 AVDD = 4.75V to 5.25V
±0.06
±0.5
UNITS
mV
TIMING CHARACTERISTICS (Figures 6–13)
SCLK Clock Period
tCP
SCLK Pulse-Width High
tCH
SCLK Pulse-Width Low
tCL
GPIO Output Rise/Fall After
CS Rise
GPIO Input Setup Before CS Fall
LDAC Pulse Width
tGOD
40
ns
40/60 duty cycle
16
ns
60/40 duty cycle
16
ns
CLOAD = 20pF
100
ns
tGSU
0
ns
tLDACPWL
20
ns
SCLK Fall to DOUT Transition
(Note 16)
tDOT
SCLK Rise to DOUT Transition
(Notes 16, 17)
tDOT
CLOAD = 20pF, SLOW = 0
1.8
12.0
CLOAD = 20pF, SLOW = 1
10
40
CLOAD = 20pF, SLOW = 0
1.8
12.0
CLOAD = 20pF, SLOW = 1
10
40
ns
ns
CS Fall to SCLK Fall Setup Time
tCSS
10
ns
SCLK Fall to CS Rise Setup Time
tCSH
0
ns
tDS
10
ns
tDH
0
ns
tCSPWH
50
DIN to SCLK Fall Setup Time
DIN to SCLK Fall Hold Time
CS Pulse-Width High
CS Rise to DOUT Disable
tDOD
CLOAD = 20pF
CS Fall to DOUT Enable
tDOE
CLOAD = 20pF
EOC Fall to CS Fall
tRDS
CS or CNVST Rise to EOC Fall
CNVST Pulse Width
tDOV
tCSW
ns
25
1.5
25.0
30
ns
ns
ns
CKSEL = 01 (temp sense) or CKSEL =
10 (temp sense), internal reference on
55
CKSEL = 01 (temp sense) or CKSEL =
10 (temp sense), internal reference
initially off
120
CKSEL = 01 (voltage conversion)
8
CKSEL = 10 (voltage conversion),
internal reference on
8
CKSEL = 10 (voltage conversion),
internal reference initially off
80
µs
CKSEL = 00, CKSEL = 01 (temp sense)
40
ns
CKSEL = 01 (voltage conversion)
1.4
µs
_______________________________________________________________________________________
7
MAX1020–MAX1023/MAX1057/MAX1058
ELECTRICAL CHARACTERISTICS (continued)
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = 2.7V to 3.6V (MAX1021/MAX1023/MAX1057), external reference VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD =
DVDD = 4.75V to 5.25V (MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fSCLK = 4.8MHz
(50% duty cycle), TA = -40°C to +85°C, unless otherwise noted. Typical values are at AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057),
AVDD = DVDD = 5V (MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
Note 1: Tested at DVDD = AVDD = +3.6V (MAX1021/MAX1023/MAX1057), DVDD = AVDD = +5.25V (MAX1020/MAX1022/MAX1058).
Note 2: Offset nulled.
Note 3: No bus activity during conversion. Conversion time is defined as the number of conversion clock cycles multiplied by the
clock period.
Note 4: See Table 5 for reference-mode details.
Note 5: Not production tested. Guaranteed by design.
Note 6: See the ADC/DAC References section.
Note 7: Fast automated test, excludes self-heating effects.
Note 8: Specified over the -40°C to +85°C temperature range.
Note 9: REFSEL[1:0] = 00 or when DACs are not powered up.
Note 10: DAC linearity, gain, and offset measurements are made between codes 115 and 3981.
Note 11: The DAC buffers are guaranteed by design to be stable with a 500pF load.
Note 12: Time required by the DAC output to power up and settle within 1 LSB in the external reference mode.
Note 13: All DAC dynamic specifications are valid for a load of 1nF and 10kΩ.
Note 14: Only one digital output (either DOUT, EOC, or the GPIOs) can be indefinitely shorted to either supply at one time.
Note 15: All digital inputs at either DVDD or DGND. DVDD should not exceed AVDD.
Note 16: See the Reset Register section and Table 9 for details on programming the SLOW bit.
Note 17: Clock mode 11 only.
Typical Operating Characteristics
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
SHUTDOWN CURRENT
vs. ANALOG SUPPLY VOLTAGE
0.15
0.10
0.18
0.16
0.14
0.12
0.05
0.5
0.4
0.3
0.2
0.1
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
0.10
0
4.75
4.85
4.95
5.05
SUPPLY VOLTAGE (V)
8
0.6
SHUTDOWN CURRENT (µA)
0.20
MAX1020 toc02
0.25
0.20
SHUTDOWN CURRENT (µA)
MAX1020 toc01
0.30
SHUTDOWN CURRENT
vs. TEMPERATURE
MAX1020 toc03
SHUTDOWN CURRENT
vs. ANALOG SUPPLY VOLTAGE
SHUTDOWN CURRENT (µA)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
5.15
5.25
2.7
3.0
3.3
SUPPLY VOLTAGE (V)
3.6
0
-40
-15
10
35
TEMPERATURE (°C)
_______________________________________________________________________________________
60
85
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
INTERNAL OSCILLATOR FREQUENCY
vs. ANALOG SUPPLY VOLTAGE
4.2
4.1
MAX1020/MAX1022/MAX1058
4.0
4.80
4.75
4.70
4.65
MAX1021/MAX1023/MAX1057
4.60
4.85
4.95
5.05
5.25
5.15
MAX1020 toc06
MAX1021/MAX1023/MAX1057
4.4
4.2
4.0
MAX1020/MAX1022/MAX1058
3.3
3.6
-40
-15
10
35
60
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
ADC INTEGRAL NONLINEARITY
vs. OUTPUT CODE
ADC INTEGRAL NONLINEARITY
vs. OUTPUT CODE
ADC DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
0
-0.1
0.1
0
-0.1
-0.2
MAX1020/MAX1022/MAX1058
512
0.1
0
-0.1
-0.2
MAX1020/MAX1022/MAX1058
-0.3
256
0.2
MAX1021/MAX1023/MAX1057
-0.3
768
-0.3
256
0
1024
512
768
1024
0
256
512
768
OUTPUT CODE
OUTPUT CODE
OUTPUT CODE
ADC DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
ADC OFFSET ERROR
vs. ANALOG SUPPLY VOLTAGE
ADC OFFSET ERROR
vs. ANALOG SUPPLY VOLTAGE
0.1
0
-0.1
-0.5
OFFSET ERROR (LSB)
OFFSET ERROR (LSB)
-0.6
-0.7
1024
MAX1020 toc12
0.2
0
MAX1020 toc11
-0.4
MAX1020 toc10
0.3
85
MAX1020 toc09
0.2
0.3
DIFFERENTIAL NONLINEARITY (LSB)
0.1
MAX1020 toc08
MAX1020 toc07
0.2
0.3
-0.2
DIFFERENTIAL NONLINEARITY (LSB)
4.6
SUPPLY VOLTAGE (V)
0.3
0
4.8
3.8
3.0
2.7
INTEGRAL NONLINEARITY (LSB)
4.75
INTEGRAL NONLINEARITY (LSB)
4.85
5.0
INTERNAL OSCILLATOR FREQUENCY (MHz)
4.3
INTERNAL OSCILLATOR FREQUENCY
vs. TEMPERATURE
MAX1020 toc05
4.4
4.90
INTERNAL OSCILLATOR FREQUENCY (MHz)
MAX1020 toc04
INTERNAL OSCILLATOR FREQUENCY (MHz)
4.5
INTERNAL OSCILLATOR FREQUENCY
vs. ANALOG SUPPLY VOLTAGE
-0.5
-1.0
-1.5
-0.2
0
256
512
OUTPUT CODE
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
MAX1021/MAX1023/MAX1057
-0.8
-0.3
768
1024
-2.0
4.75
4.85
4.95
5.05
SUPPLY VOLTAGE (V)
5.15
5.25
2.7
3.0
3.3
3.6
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
9
MAX1020–MAX1023/MAX1057/MAX1058
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
0.025
MAX1020 toc15
0.50
MAX1020 toc14
MAX1020/MAX1022/MAX1058
0.050
MAX1020 toc13
0
0.45
-1.0
GAIN ERROR (LSB)
-0.5
GAIN ERROR (LSB)
OFFSET ERROR (LSB)
ADC GAIN ERROR
vs. ANALOG SUPPLY VOLTAGE
ADC GAIN ERROR
vs. ANALOG SUPPLY VOLTAGE
ADC OFFSET ERROR
vs. TEMPERATURE
0
-0.025
MAX1021/MAX1023/MAX1057
-1.5
-0.050
0.40
0.35
0.30
0.25
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
10
35
60
5.15
2.7
5.25
3.0
3.3
3.6
ADC EXTERNAL REFERENCE
INPUT CURRENT vs. SAMPLING RATE
ANALOG SUPPLY CURRENT
vs. SAMPLING RATE
MAX1021/MAX1023/MAX1057
0
MAX1020/MAX1022/MAX1058
-0.50
10
35
60
40
MAX1020/MAX1022/MAX1058
30
20
10
MAX1020 toc18
50
3.0
ANALOG SUPPLY CURRENT (mA)
MAX1020 toc16
0.25
60
2.5
MAX1020/MAX1022/MAX1058
2.0
1.5
1.0
0.5
MAX1021/MAX1023/MAX1057
MAX1021/MAX1023/MAX1057
0
0
0
85
50
100
150
200
250
0
300
50
100
150
200
250
TEMPERATURE (°C)
SAMPLING RATE (ksps)
SAMPLING RATE (ksps)
ANALOG SUPPLY CURRENT
vs. ANALOG SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT
vs. ANALOG SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT
vs. TEMPERATURE
2.6
2.5
2.4
2.3
2.4
2.3
2.2
2.1
300
MAX1020 toc21
2.5
SUPPLY CURRENT (mA)
2.7
2.7
ANALOG SUPPLY CURRENT (mA)
2.6
MAX1020 toc19
2.8
MAx1020 toc20
GAIN ERROR (LSB)
5.05
ADC GAIN ERROR
vs. TEMPERATURE
0.50
-15
4.95
SUPPLY VOLTAGE (V)
0.75
-40
4.85
SUPPLY VOLTAGE (V)
1.00
-0.25
4.75
85
TEMPERATURE (°C)
MAX1020 toc17
-15
ADC EXTERNAL REFERENCE INPUT CURRENT (µA)
-40
2.6
2.5
2.4
2.0
MAX1020/MAX1022/MAX1058
MAX1021/MAX1023/MAX1057
2.2
MAX1020/MAX1022/MAX1058
2.3
1.9
4.75
4.85
4.95
5.05
SUPPLY VOLTAGE (V)
10
0.20
-0.075
-2.0
SUPPLY CURRENT (mA)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
5.15
5.25
2.7
3.0
3.3
SUPPLY VOLTAGE (V)
3.6
-40
-15
10
35
TEMPERATURE (°C)
______________________________________________________________________________________
60
85
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ANALOG SUPPLY CURRENT
vs. TEMPERATURE
2.13
2.12
2.11
0.1
0
-0.1
10
35
60
MAX1021/MAX1023/MAX1057
256
512
768
0
1024
256
512
768
OUTPUT CODE
OUTPUT CODE
DAC DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
DAC DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
DAC FULL-SCALE ERROR
vs. ANALOG SUPPLY VOLTAGE
-0.05
0
-0.05
MAX1020/MAX1022/MAX1058
1029
1032
0.03
0.02
0.01
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
-0.10
1026
1035
1038
0
1023
1026
1029
1032
1035
1038
4.75
4.85
4.95
5.05
5.15
OUTPUT CODE
OUTPUT CODE
SUPPLY VOLTAGE (V)
DAC FULL-SCALE ERROR
vs. ANALOG SUPPLY VOLTAGE
DAC FULL-SCALE ERROR
vs. TEMPERATURE
DAC FULL-SCALE ERROR
vs. TEMPERATURE
-0.60
-0.65
1.0
0.5
0
EXTERNAL REFERENCE = 4.096V
-0.5
MAX1021/MAX1023/MAX1057
3.0
3.3
3.6
-0.50
EXTERNAL REFERENCE = 2.500V
-0.75
-1.00
INTERNAL REFERENCE
-1.25
-1.50
MAX1021/MAX1023/MAX1057
-2.00
-1.0
SUPPLY VOLTAGE (V)
-0.25
-1.75
MAX1020/MAX1022/MAX1058
-0.70
5.25
MAX1020 toc30
MAX1020 toc29
INTERNAL REFERENCE
1.5
0
DAC FULL-SCALE ERROR (LSB)
-0.55
2.0
DAC FULL-SCALE ERROR (LSB)
MAx1020 toc28
-0.50
1024
MAX1020 toc27
MAX1020 toc26
0.05
0.04
DAC FULL-SCALE ERROR (LSB)
0
0.10
DIFFERENTIAL NONLINEARITY (LSB)
MAX1020 toc25
DIFFERENTIAL NONLINEARITY (LSB)
0
-0.10
DAC FULL-SCALE ERROR (LSB)
-0.1
-0.3
-0.3
85
0.05
2.7
0
TEMPERATURE (°C)
0.10
1023
0.1
MAX1020/MAX1022/MAX1058
2.10
-15
0.2
-0.2
-0.2
MAX1021/MAX1023/MAX1057
-40
MAX1020 toc24
0.2
0.3
INTEGRAL NONLINEARITY (LSB)
2.14
MAX1020 toc23
2.15
0.3
INTEGRAL NONLINEARITY (LSB)
MAX1020 toc22
ANALOG SUPPLY CURRENT (mA)
2.16
DAC INTEGRAL NONLINEARITY
vs. OUTPUT CODE
DAC INTEGRAL NONLINEARITY
vs. OUTPUT CODE
-40
-15
10
35
TEMPERATURE (°C)
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
______________________________________________________________________________________
11
MAX1020–MAX1023/MAX1057/MAX1058
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
DAC FULL-SCALE ERROR
vs. REFERENCE VOLTAGE
0.50
0.25
0
-0.25
-0.50
-0.5
-1.0
-1.5
-2.0
-2.5
1
MAX1020 toc33
MAX1020 toc32
DAC FULL-SCALE ERROR (LSB)
0.75
0
DAC FULL-SCALE ERROR (LSB)
MAX1020 toc31
1.00
DAC FULL-SCALE ERROR
vs. LOAD CURRENT
DAC FULL-SCALE ERROR (LSB)
DAC FULL-SCALE ERROR
vs. REFERENCE VOLTAGE
0
-1
-2
-3
-0.75
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
1
2
3
4
1.5
2.0
2.5
-4
3.0
0
10
15
20
25
LOAD CURRENT (mA)
DAC FULL-SCALE ERROR
vs. LOAD CURRENT
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
-2
-3
4.11
4.10
4.09
MAX1021/MAX1023/MAX1057
1.0
1.5
2.0
2.5
-40
3.0
-15
10
2.51
2.50
2.49
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
2.48
4.08
0.5
35
60
-40
85
-15
10
35
60
LOAD CURRENT (mA)
TEMPERATURE (°C)
TEMPERATURE (°C)
ADC REFERENCE SUPPLY CURRENT
vs. ANALOG SUPPLY VOLTAGE
ADC REFERENCE SUPPLY CURRENT
vs. ANALOG SUPPLY VOLTAGE
ADC REFERENCE SUPPLY CURRENT
vs. TEMPERATURE
42.4
42.2
25.7
25.6
25.5
MAX1020/MAX1022/MAX1058
4.95
5.05
SUPPLY VOLTAGE (V)
5.15
5.25
MAX1020 toc39
85
46
44
42
MAX1020/MAX1022/MAX1058
40
25.4
4.85
48
MAX1021/MAX1023/MAX1057
42.0
4.75
50
ADC REFERENCE SUPPLY CURRENT (µA)
42.6
MAX1020 toc38
42.8
25.8
ADC REFERENCE SUPPLY CURRENT (µA)
MAX1020 toc37
43.0
30
MAX1020 toc36
2.52
INTERNAL REFERENCE VOLTAGE (V)
-1
4.12
MAX1020 toc35
MAX1020 toc34
0
0
5
REFERENCE VOLTAGE (V)
-4
12
1.0
REFERENCE VOLTAGE (V)
1
DAC FULL-SCALE ERROR (LSB)
0.5
0
5
INTERNAL REFERENCE VOLTAGE (V)
0
MAX1020/MAX1022/MAX1058
-3.0
-1.00
ADC REFERENCE SUPPLY CURRENT (µA)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
2.7
3.0
3.3
SUPPLY VOLTAGE (V)
3.6
-40
-15
10
35
TEMPERATURE (°C)
______________________________________________________________________________________
60
85
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ADC FFT PLOT
fSAMPLE = 32.768kHz
fANALOG_)N = 10.080kHz
fCLK = 5.24288MHz
SINAD = 61.21dBc
SNR = 61.21dBc
THD = 73.32dBc
SFDR = 81.25dBc
-20
-40
AMPLITUDE (dB)
26.50
26.25
26.00
25.75
-60
fCLK = 5.24288MHz
fIN1 = 9.0kHz
fIN2 = 11.0kHz
AIN = -6dBFS
IMD = 78.0dBc
-20
-40
AMPLITUDE (dB)
26.75
ADC IMD PLOT
0
MAX1020 toc41
0
MAX1020 toc40
ADC REFERENCE SUPPLY CURRENT (µA)
27.00
-80
-100
MAX1020 toc42
ADC REFERENCE SUPPLY CURRENT
vs. TEMPERATURE
-60
-80
-100
25.50
-120
-120
25.25
-140
-140
MAX1021/MAX1023/MAX1057
-160
60
-160
50
0
85
-80
-100
-120
-140
2.05
2.04
SINKING
SOURCING
2.02
2.01
-160
0
50
100
4
MAX1020 toc46
MAX1020/MAX1022/MAX1058
GPIOA0–A3 OUTPUTS
3
2
GPIOB0–B3,
C0–C3 OUTPUTS
1
20
40
60
SOURCE CURRENT (mA)
80
100
SINKING
1.23
SOURCING
DAC OUTPUT = MIDSCALE
MAX1021/MAX1023/MAX1057
1.21
GPIO OUTPUT VOLTAGE
vs. SINK CURRENT
MAX1021/MAX1023/MAX1057
GPIOA0–A3 OUTPUTS
2.5
2.0
1.5
-30
90
60
GPIOB0–B3, C0–C3
OUTPUTS
1.0
-20
20
30
1500
GPIOB0–B3, C0–C3
OUTPUTS
1200
900
600
GPIOA0–A3 OUTPUTS
300
MAX1020/MAX1022/MAX1058
0
0
1.24
GPIO OUTPUT VOLTAGE
vs. SOURCE CURRENT
30
0.5
0
1.25
0
10
-10
OUTPUT CURRENT (mA)
3.0
GPIO OUTPUT VOLTAGE (V)
GPIO OUTPUT VOLTAGE (V)
5
1.26
OUTPUT CURRENT (mA)
0
ANALOG INPUT FREQUENCY (kHz)
GPIO OUTPUT VOLTAGE
vs. SOURCE CURRENT
1.27
1.22
DAC OUTPUT = MIDSCALE
MAX1020/MAX1022/MAX1058
-30
200
1.28
2.00
200
150
150
1.29
MAX1020 toc44
2.06
2.03
100
DAC OUTPUT LOAD REGULATION
vs. OUTPUT CURRENT
2.07
DAC OUTPUT VOLTAGE (V)
AMPLITUDE (dB)
-60
50
0
ANALOG INPUT FREQUENCY (kHz)
2.08
MAX1020 toc43
fCLK = 5.24288MHz
fIN1 = 10.080kHz
fIN2 = 8.0801kHz
SNR = 61.11dBc
THD = 73.32dBc
ENOB = 9.86 BITS
SFDR = 86.34dBc
-40
200
DAC OUTPUT LOAD REGULATION
vs. OUTPUT CURRENT
ADC CROSSTALK PLOT
-20
150
ANALOG INPUT FREQUENCY (kHz)
TEMPERATURE (°C)
0
100
MAX1020 toc45
35
DAC OUTPUT VOLTAGE (V)
10
GPIO OUTPUT VOLTAGE (mV)
-15
MAX1020 toc47
-40
MAX1020 toc48
25.00
0
0
20
40
60
SOURCE CURRENT (mA)
80
100
0
20
40
60
80
100
SINK CURRENT (mA)
______________________________________________________________________________________
13
MAX1020–MAX1023/MAX1057/MAX1058
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
GPIO OUTPUT VOLTAGE
vs. SINK CURRENT
900
600
GPIOA0–A3 OUTPUTS
300
DAC-TO-DAC CROSSTALK
RLOAD = 10kΩ, CLOAD = 100pF
MAX1020 toc51
MAX1020 toc50
1200
1.00
TEMPERATURE SENSOR ERROR (°C)
GPIOB0–B3, C0–C3
OUTPUTS
MAX1020 toc49
TEMPERATURE SENSOR ERROR
vs. TEMPERATURE
1500
GPIO OUTPUT VOLTAGE (mV)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
0.75
VOUTA
1V/div
0.50
0.25
0
-0.25
VOUTB
10mV/div
AC-COUPLED
-0.50
-0.75
MAX1021/MAX1023/MAX1057
0
MAX1021/MAX1023/MAX1057
-1.00
0
10
20
30
40
50
60
SINK CURRENT (mA)
-40
-15
10
35
60
85
100µs
TEMPERATURE (°C)
DAC-TO-DAC CROSSTALK
RLOAD = 10kΩ, CLOAD = 100pF
DYNAMIC RESPONSE RISE TIME
RLOAD = 10kΩ, CLOAD = 100pF
DYNAMIC RESPONSE RISE TIME
RLOAD = 10kΩ, CLOAD = 100pF
MAX1020 toc52
MAX1020 toc54
MAX1020 toc53
MAX1021/MAX1023/MAX1057
VOUTA
2V/div
CS
2V/div
VOUT
1V/div
VOUTB
10mV/div
AC-COUPLED
VOUT
2V/div
CS
1V/div
MAX1020/MAX1022/MAX1058
MAX1020/MAX1022/MAX1058
100µs
DYNAMIC RESPONSE FALL TIME
RLOAD = 10kΩ, CLOAD = 100pF
MAX1020 toc55
1µs
1µs
DYNAMIC RESPONSE FALL TIME
RLOAD = 10kΩ, CLOAD = 100pF
MAJOR CARRY TRANSITION
RLOAD = 10kΩ, CLOAD = 100pF
MAX1020 toc57
MAX1020 toc56
MAX1021/MAX1023/MAX1057
CS
2V/div
VOUT
1V/div
MAX1020/MAX1022/MAX1058
14
VOUT
10mV/div
AC-COUPLED
VOUT
2V/div
CS
1V/div
1µs
CS
1V/div
1µs
MAX1021/MAX1023/MAX1057
1µs
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
DAC DIGITAL FEEDTHROUGH (RLOAD = 10kΩ,
CLOAD = 100pF, CS = HIGH, DIN = LOW)
MAJOR CARRY TRANSITION
RLOAD = 10kΩ, CLOAD = 100pF
DAC DIGITAL FEEDTHROUGH (RLOAD = 10kΩ,
CLOAD = 100pF, CS = HIGH, DIN = LOW)
MAX1020 toc59
MAX1020 toc58
MAX1020 toc60
CS
2V/div
VOUT
100mV/div
AC-COUPLED
VOUT
20mV/div
AC-COUPLED
MAX1021/MAX1023/MAX1057
MAX1020/MAX1022/MAX1058
SCLK
2V/div
SCLK
1V/div
VOUT
100mV/div
AC-COUPLED
MAX1020/MAX1022/MAX1058
1µs
200ns
200ns
NEGATIVE FULL-SCALE SETTLING TIME
RLOAD = 10kΩ, CLOAD = 100pF
NEGATIVE FULL-SCALE SETTLING TIME
RLOAD = 10kΩ, CLOAD = 100pF
POSITIVE FULL-SCALE SETTLING TIME
RLOAD = 10kΩ, CLOAD = 100pF
MAX1020 toc61
MAX1020 toc62
MAX1020 toc63
MAX1021/MAX1023/MAX1057
MAX1021/MAX1023/MAX1057
VLDAC
2V/div
VOUT
1V/div
VOUT_
1V/div
VOUT_
2V/div
VLDAC
1V/div
1µs
VLDAC
1V/div
MAX1020/MAX1022/MAX1058
2µs
POSITIVE FULL-SCALE SETTLING TIME
RLOAD = 10kΩ, CLOAD = 100pF
1µs
ADC REFERENCE FEEDTHROUGH
RLOAD = 10kΩ, CLOAD = 100pF
MAX1020 toc64
MAX1020 toc65
VOUT_
2V/div
1µs
MAX1020 toc66
VREF2
1V/div
VLDAC
2V/div
MAX1020/MAX1022/MAX1058
ADC REFERENCE FEEDTHROUGH
RLOAD = 10kΩ, CLOAD = 100pF
VREF2
2V/div
VDAC-OUT
10mV/div
AC-COUPLED
MAX1021/MAX1023/MAX1057
ADC REFERENCE SWITCHING
MAX1020/MAX1022/MAX1058
ADC REFERENCE SWITCHING
200µs
200µs
VDAC-OUT
2mV/div
AC-COUPLED
______________________________________________________________________________________
15
MAX1020–MAX1023/MAX1057/MAX1058
Typical Operating Characteristics (continued)
(AVDD = DVDD = 3V (MAX1021/MAX1023/MAX1057), external VREF = 2.5V (MAX1021/MAX1023/MAX1057), AVDD = DVDD = 5V
(MAX1020/MAX1022/MAX1058), external VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 4.8MHz (50% duty cycle), fSAMPLE
= 300ksps, CLOAD = 50pF, 0.1µF capacitor at REF, TA = +25°C, unless otherwise noted.)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Pin Description
MAX1020/
MAX1021
MAX1022/
MAX1023
MAX1057/
MAX1058
1, 2
—
—
3
3
4
EOC
Active-Low End-of-Conversion Output. Data is valid after the falling edge
of EOC.
4
4
7
DVDD
Digital Positive-Power Input. Bypass DVDD to DGND with a 0.1µF
capacitor.
5
5
8
DGND
Digital Ground. Connect DGND to AGND.
6
6
9
DOUT
Serial-Data Output. Data is clocked out on the falling edge of the SCLK
clock in modes 00, 01, and 10. Data is clocked out on the rising edge of
the SCLK clock in mode 11. It is high impedance when CS is high.
7
7
10
SCLK
Serial-Clock Input. Clocks data in and out of the serial interface. (Duty
cycle must be 40% to 60%.) See Table 5 for details on programming the
clock mode.
8
8
11
DIN
9–12,
16–19
9–12,
16–19
12–15,
22–25
OUT0–OUT7
13
13
18
AVDD
Positive Analog Power Input. Bypass AVDD to AGND with a 0.1µF
capacitor.
14
14
19
AGND
Analog Ground
—
N.C.
15, 23, 32, 2, 15, 24, 32
32
33
16
NAME
GPIOA0, GPIOA1 General-Purpose I/O A0, A1. GPIOA0, A1 can sink and source 15mA.
20
20
26
LDAC
21
21
27
CS
22
22
28
24, 25
—
—
FUNCTION
RES_SEL
Serial-Data Input. DIN data is latched into the serial interface on the
falling edge of SCLK.
DAC Outputs
No Connection. Not internally connected.
Active-Low Load DAC. LDAC is an asynchronous active-low input that
updates the DAC outputs. Drive LDAC low to make the DAC registers
transparent.
Active-Low Chip-Select Input. When CS is low, the serial interface is
enabled. When CS is high, DOUT is high impedance.
Reset Select. Select DAC wake-up mode. Set RES_SEL low to wake up
the DAC outputs with a 100kΩ resistor to GND or set RES_SEL high to
wake up the DAC outputs with a 100kΩ resistor to VREF. Set RES_SEL
high to power up the DAC input register to FFFh. Set RES_SEL low to
power up the DAC input register to 000h.
GPIOC0, GPIOC1 General-Purpose I/O C0, C1. GPIOC0, C1 can sink 4mA and source 2mA.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
MAX1020/
MAX1021
MAX1022/
MAX1023
MAX1057/
MAX1058
NAME
FUNCTION
Reference 1 Input. Reference voltage; leave unconnected to use the
internal reference (2.5V for the MAX1021/MAX1023/MAX1057 or 4.096V
for the MAX1020/MAX1022/MAX1058). REF1 is the positive reference in
ADC external differential reference mode. Bypass REF1 to AGND with a
0.1µF capacitor in external reference mode only. See the ADC/DAC
References section.
26
26
35
REF1
27–31, 34
—
—
AIN0–AIN5
Analog Inputs
Reference 2 Input/Analog-Input Channel 6. See Table 5 for details on
programming the setup register. REF2 is the negative reference in the
ADC external differential reference.
35
—
—
REF2/AIN6
36
—
—
CNVST/AIN7
—
1
—
CNVST/AIN11
—
23, 25,
27–31,
33, 34, 35
—
AIN0–AIN9
Analog Inputs
—
36
—
REF2/AIN10
Reference 2 Input/Analog-Input Channel 10. See Table 5 for details on
programming the setup register. REF2 is the negative reference in the
ADC external differential reference.
—
—
1
CNVST/AIN15
—
—
2, 3, 5, 6
—
—
16, 17,
20, 21
GPIOB0–GPIOB3
General-Purpose I/O B0–B3. GPIOB0–GPIOB3 can sink 4mA and
source 2mA.
—
—
29–32
GPIOC0–GPIOC3
General-Purpose I/O C0–C3. GPIOC0–GPIOC3 can sink 4mA and
source 2mA.
—
—
33, 34,
36–47
AIN0–AIN13
Analog Inputs
—
—
48
REF2/AIN14
Reference 2 Input/Analog-Input Channel 14. See Table 5 for details on
programming the setup register. REF2 is the negative reference in the
ADC external differential reference.
—
—
—
EP
Active-Low Conversion-Start Input/Analog Input 7. See Table 5 for details
on programming the setup register.
Active-Low Conversion-Start Input/Analog Input 11. See Table 5 for
details on programming the setup register.
Active-Low Conversion-Start Input/Analog Input 15. See Table 5 for
details on programming the setup register.
GPIOA0–GPIOA3 General-Purpose I/O A0–A3. GPIOA0–GPIOA3 can sink and source 15mA.
Exposed Paddle. Must be externally connected to AGND. Do not use as
a ground connect.
______________________________________________________________________________________
17
MAX1020–MAX1023/MAX1057/MAX1058
Pin Description (continued)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Detailed Description
The MAX1020–MAX1023/MAX1057/MAX1058 integrate
a multichannel, 10-bit ADC and an octal, 10-bit DAC in
a single IC. These devices also include a temperature
sensor and configurable GPIOs with a 25MHz SPI/QSPI-/MICROWIRE-compatible serial interface. The
ADC is available in 8/12/16 input-channel versions. The
octal DAC outputs settle within 2.0µs, and the ADC has
a 300ksps conversion rate.
All devices include an internal reference (2.5V or
4.096V) providing a well-regulated, low-noise reference
for both the ADC and DAC. Programmable reference
modes for the ADC and DAC allow the use of an internal reference, an external reference, or a combination
of both. Features such as an internal ±1°C accurate
temperature sensor, FIFO, scan modes, programmable
internal or external clock modes, data averaging, and
AutoShutdown allow users to minimize both power consumption and processor requirements. The low glitch
energy (4nV•s) and low digital feedthrough (0.5nV•s) of
the integrated octal DACs make these devices ideal for
digital control of fast-response closed-loop systems.
The devices are guaranteed to operate with a supply
voltage from +2.7V to +3.6V (MAX1021/MAX1023/
MAX1057) and from +4.5V to +5.5V (MAX1020/
MAX1022/MAX1058), they consume 25mA at 300ksps
throughput, only 22µA at 1ksps throughput, and under
0.2µA in the shutdown mode. The MAX1057/MAX1058
feature 12 GPIOs, while the MAX1020/MAX1021 offer 4
GPIOs that can be configured as inputs or outputs.
Figure 1 shows the MAX1057/MAX1058 functional diagram. The MAX1020/MAX1021 only include the GPIO
A0, A1, GPIO C0, C1 block. The MAX1022/MAX1023
exclude the GPIOs. The output-conditioning circuitry
takes the internal parallel data bus and converts it to a
serial data format at DOUT, with the appropriate wakeup timing. The arithmetic logic unit (ALU) performs the
averaging function.
SPI-Compatible Serial Interface
The MAX1020–MAX1023/MAX1057/MAX1058 feature a
serial interface that is compatible with SPI and
MICROWIRE devices. For SPI, ensure the SPI bus master (typically a microcontroller (µC)) runs in master
mode so that it generates the serial clock signal. Select
the SCLK frequency of 25MHz or less, and set the
clock polarity (CPOL) and phase (CPHA) in the µC con-
18
trol registers to the same value. The MAX1020–
MAX1023/MAX1057/MAX1058 operate with SCLK idling
high or low, and thus operate with CPOL = CPHA = 0 or
CPOL = CPHA = 1. Set CS low to latch any input data
at DIN on the falling edge of SCLK. Output data at
DOUT is updated on the falling edge of SCLK in clock
modes 00, 01, and 10. Output data at DOUT is updated
on the rising edge of SCLK in clock mode 11. See
Figures 6–11. Bipolar true-differential results and temperature-sensor results are available in two’s complement format, while all other results are in binary.
A high-to-low transition on CS initiates the data-input
operation. Serial communications to the ADC always
begin with an 8-bit command byte (MSB first) loaded
from DIN. The command byte and the subsequent data
bytes are clocked from DIN into the serial interface on
the falling edge of SCLK. The serial-interface and fastinterface circuitry is common to the ADC, DAC, and
GPIO sections. The content of the command byte
determines whether the SPI port should expect 8, 16, or
24 bits and whether the data is intended for the ADC,
DAC, or GPIOs (if applicable). See Table 1. Driving CS
high resets the serial interface.
The conversion register controls ADC channel selection, ADC scan mode, and temperature-measurement
requests. See Table 4 for information on writing to the
conversion register. The setup register controls the
clock mode, reference, and unipolar/bipolar ADC configuration. Use a second byte, following the first, to
write to the unipolar-mode or bipolar-mode registers.
See Table 5 for details of the setup register and see
Tables 6, 7, and 8 for setting the unipolar- and bipolarmode registers. Hold CS low between the command
byte and the second and third byte. The ADC averaging register is specific to the ADC. See Table 9 to
address that register. Table 11 shows the details of the
reset register.
Begin a write to the DAC by writing 0001XXXX as a
command byte. The last 4 bits of this command byte
are don’t-care bits. Write another 2 bytes (holding CS
low) to the DAC interface register following the command byte to select the appropriate DAC and the data
to be written to it. See the DAC Serial Interface section
and Tables 10, 20, and 21.
Write to the GPIOs (if applicable) by issuing a command byte to the appropriate register. Writing to the
MAX1020/MAX1021 GPIOs requires 1 additional byte
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
USER-PROGRAMMABLE
I/O
MAX1020–MAX1023/MAX1057/MAX1058
AVDD
GPIOA0– GPIOB0– GPIOC0–
GPIOA3 GPIOB3 GPIOC3
DVDD
MAX1057
MAX1058
GPIO
CONTROL
OSCILLATOR
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT0
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT1
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT2
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT3
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT4
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT5
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT6
INPUT
REGISTER
DAC
REGISTER
10-BIT
DAC
BUFFER
OUTPUT
CONDITIONING
OUT7
SCLK
CS
DIN
SPI
PORT
DOUT
TEMPERATURE
SENSOR
ADDRESS
EOC
LOGIC
CONTROL
CNVST
AIN0
AIN13
REF2/
AIN14
CNVST/
AIN15
REF1
T/H
10-BIT
SAR
ADC
FIFO AND
ALU
REF2
INTERNAL
REFERENCE
LDAC
AGND
DGND
RES_SEL
Figure 1. MAX1057/MAX1058 Functional Diagram
______________________________________________________________________________________
19
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Table 1. Command Byte (MSB First)
REGISTER NAME
Conversion
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
1
CHSEL3
CHSEL2
CHSEL1
CHSEL0
SCAN1
SCAN0
TEMP
Setup
0
1
CKSEL1
CKSEL0
REFSEL1
REFSEL0
DIFFSEL1
DIFFSEL0
ADC Averaging
0
0
1
AVGON
NAVG1
NAVG0
NSCAN1
NSCAN0
DAC Select
0
0
0
1
X
X
X
X
Reset
0
0
0
0
1
RESET
SLOW
FBGON
GPIO Configure*
0
0
0
0
0
0
1
1
GPIO Write*
0
0
0
0
0
0
1
0
GPIO Read*
0
0
0
0
0
0
0
1
No Operation
0
0
0
0
0
0
0
0
X = Don’t care.
*Only applicable on the MAX1020/MAX1021/MAX1057/MAX1058.
following the command byte. Writing to the MAX1057/
MAX1058 requires 2 additional bytes following the
command byte. See Tables 12–19 for details on GPIO
configuration, writes, and reads. See the GPIO
Command section. Command bytes written to the
GPIOs on devices without GPIOs are ignored.
Power-Up Default State
The MAX1020–MAX1023/MAX1057/MAX1058 power up
with all blocks in shutdown (including the reference). All
registers power up in state 00000000, except for the
setup register and the DAC input register. The setup
register powers up at 0010 1000 with CKSEL1 = 1 and
REFSEL1 = 1. The DAC input register powers up to
FFFh when RES_SEL is high and it powers up to 000h
when RES_SEL is low.
10-Bit ADC
The MAX1020–MAX1023/MAX1057/MAX1058 ADCs
use a fully differential successive-approximation register (SAR) conversion technique and on-chip track-andhold (T/H) circuitry to convert temperature and voltage
signals into 10-bit digital results. The analog inputs
accept both single-ended and differential input signals.
Single-ended signals are converted using a unipolar
transfer function, and differential signals are converted
using a selectable bipolar or unipolar transfer function.
See the ADC Transfer Functions section for more data.
ADC Clock Modes
When addressing the setup, register bits 5 and 4 of the
command byte (CKSEL1 and CKSEL0, respectively)
control the ADC clock modes. See Table 5. Choose
between four different clock modes for various ways to
start a conversion and determine whether the acquisitions are internally or externally timed. Select clock
20
mode 00 to configure CNVST/AIN_ to act as a conversion start and use it to request internally timed conversions, without tying up the serial bus. In clock mode 01,
use CNVST to request conversions one channel at a
time, thereby controlling the sampling speed without
tying up the serial bus. Request and start internally
timed conversions through the serial interface by writing to the conversion register in the default clock mode,
10. Use clock mode 11 with SCLK up to 4.8MHz for
externally timed acquisitions to achieve sampling rates
up to 300ksps. Clock mode 11 disables scanning and
averaging. See Figures 6–9 for timing specifications on
how to begin a conversion.
These devices feature an active-low, end-of-conversion
output. EOC goes low when the ADC completes the
last requested operation and is waiting for the next
command byte. EOC goes high when CS or CNVST go
low. EOC is always high in clock mode 11.
Single-Ended or Differential Conversions
The MAX1020–MAX1023/MAX1057/MAX1058 use a
fully differential ADC for all conversions. When a pair of
inputs are connected as a differential pair, each input is
connected to the ADC. When configured in singleended mode, the positive input is the single-ended
channel and the negative input is referred to AGND.
See Figure 2.
In differential mode, the T/H samples the difference
between two analog inputs, eliminating common-mode
DC offsets and noise. IN+ and IN- are selected from
the following pairs: AIN0/AIN1, AIN2/AIN3, AIN4/AIN5,
AIN6/AIN7, AIN8/AIN9, AIN10/AIN11, AIN12/AIN13,
AIN14/AIN15. AIN0–AIN7 are available on all devices.
AIN0–AIN11 are available on the MAX1022/MAX1023.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Unipolar or Bipolar Conversions
Address the unipolar- and bipolar-mode registers
through the setup register (bits 1 and 0). See Table 5 for
the setup register. See Figures 3 and 4 for the transferfunction graphs. Program a pair of analog inputs for differential operation by writing a one to the appropriate bit
of the bipolar- or unipolar-mode register. Unipolar mode
sets the differential input range from 0 to VREF1. A negative differential analog input in unipolar mode causes
the digital output code to be zero. Selecting bipolar
mode sets the differential input range to ±VREF1 / 2. The
digital output code is binary in unipolar mode and two’s
complement in bipolar mode.
In single-ended mode, the MAX1020–MAX1023/
MAX1057/MAX1058 always operate in unipolar mode.
The analog inputs are internally referenced to AGND
with a full-scale input range from 0 to the selected reference voltage.
Analog Input (T/H)
The equivalent circuit of Figure 2 shows the ADC input
architecture of the MAX1020–MAX1023/MAX1057/
MAX1058. In track mode, a positive input capacitor is
connected to AIN0–AIN15 in single-ended mode and
AIN0, AIN2, and AIN4–AIN14 (only positive inputs) in
AIN0–AIN15
(SINGLE-ENDED),
AIN0, AIN2,
AIN4–AIN14
(DIFFERENTIAL)
REF1
ACQ
DAC
AGND
CIN+
COMPARATOR
HOLD
CINAGND
(SINGLE-ENDED),
AIN1, AIN3,
AIN5–AIN15
(DIFFERENTIAL)
ACQ
HOLD
AVDD / 2
Figure 2. Equivalent Input Circuit
ACQ
HOLD
differential mode. A negative input capacitor is connected to AGND in single-ended mode or AIN1, AIN3,
and AIN5–AIN15 (only negative inputs) in differential
mode. For external T/H timing, use clock mode 01.
After the T/H enters hold mode, the difference between
the sampled positive and negative input voltages is
converted. The input capacitance charging rate determines the time required for the T/H to acquire an input
signal. If the input signal’s source impedance is high,
the required acquisition time lengthens.
Any source impedance below 300Ω does not significantly affect the ADC’s AC performance. A high-impedance source can be accommodated either by
lengthening tACQ (only in clock mode 01) or by placing
a 1µF capacitor between the positive and negative analog inputs. The combination of the analog-input source
impedance and the capacitance at the analog input creates an RC filter that limits the analog input bandwidth.
Input Bandwidth
The ADC’s input-tracking circuitry has a 1MHz smallsignal bandwidth, making it is possible to digitize highspeed transient events and measure periodic signals
with bandwidths exceeding the ADC’s sampling rate by
using undersampling techniques. Anti-alias prefiltering
of the input signals is necessary to avoid high-frequency signals aliasing into the frequency band of interest.
Analog-Input Protection
Internal electrostatic-discharge (ESD) protection diodes
clamp all analog inputs to AVDD and AGND, allowing
the inputs to swing from (AGND - 0.3V) to (AVDD +
0.3V) without damage. However, for accurate conversions near full scale, the inputs must not exceed AVDD
by more than 50mV or be lower than AGND by 50mV. If
an analog input voltage exceeds the supplies, limit the
input current to 2mA.
Internal FIFO
The MAX1020–MAX1023/MAX1057/MAX1058 contain a
first-in/first-out (FIFO) buffer that holds up to 16 ADC
results plus one temperature result. The internal FIFO
allows the ADC to process and store multiple internally
clocked conversions and a temperature measurement
without being serviced by the serial bus.
If the FIFO is filled and further conversions are requested without reading from the FIFO, the oldest ADC
results are overwritten by the new ADC results. Each
result contains 2 bytes, with the MSB preceded by four
leading zeros and the LSB followed by 2 sub-bits. After
each falling edge of CS, the oldest available pair of
bytes of data is available at DOUT, MSB first. When the
FIFO is empty, DOUT is zero.
______________________________________________________________________________________
21
MAX1020–MAX1023/MAX1057/MAX1058
AIN0–AIN15 are available on the MAX1057/MAX1058.
See Tables 5–8 for more details on configuring the
inputs. For the inputs that are configurable as CNVST,
REF2, and an analog input, only one function can be
used at a time.
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
The first 2 bytes of data read out after a temperature
measurement always contain the 12-bit temperature
result, preceded by four leading zeros, MSB first. If
another temperature measurement is performed before
the first temperature result is read out, the old measurement is overwritten by the new result. Temperature
results are in degrees Celsius (two’s complement), at a
resolution of 8 LSB per degree. See the Temperature
Measurements section for details on converting the digital code to a temperature.
10-Bit DAC
In addition to the 10-bit ADC, the MAX1020–MAX1023/
MAX1057/MAX1058 also include eight voltage-output,
10-bit, monotonic DACs with less than 4 LSB integral
nonlinearity error and less than 1 LSB differential nonlinearity error. Each DAC has a 2µs settling time and
ultra-low glitch energy (4nV•s). The 10-bit DAC code is
unipolar binary with 1 LSB = VREF / 4096.
DAC Digital Interface
Figure 1 shows the functional diagram of the MAX1057/
MAX1058. The shift register converts a serial 16-bit
word to parallel data for each input register operating
with a clock rate up to 25MHz. The SPI-compatible digital interface to the shift register consists of CS, SCLK,
DIN, and DOUT. Serial data at DIN is loaded on the
falling edge of SCLK. Pull CS low to begin a write
sequence. Begin a write to the DAC by writing
0001XXXX as a command byte. The last 4 bits of the
DAC select register are don’t-care bits. See Table 10.
Write another 2 bytes to the DAC interface register following the command byte to select the appropriate DAC
and the data to be written to it. See Tables 20 and 21.
The eight double-buffered DACs include an input and a
DAC register. The input registers are directly connected to the shift register and hold the result of the most
recent write operation. The eight 10-bit DAC registers
hold the current output code for the respective DAC.
Data can be transferred from the input registers to the
DAC registers by pulling LDAC low or by writing the
appropriate DAC command sequence at DIN. See
Table 20. The outputs of the DACs are buffered through
eight rail-to-rail op amps.
The MAX1020–MAX1023/MAX1057/MAX1058 DAC output-voltage range is based on the internal reference or
an external reference. Write to the setup register (see
Table 5) to program the reference. If using an external
voltage reference, bypass REF1 with a 0.1µF capacitor
to AGND. The MAX1021/MAX1023/MAX1057 internal
22
reference is 2.5V. The MAX1020/MAX1022/MAX1058
internal reference is 4.096V. When using an external
reference on any of these devices, the voltage range is
0.7V to AVDD.
DAC Transfer Function
See Table 2 for various analog outputs from the DAC.
DAC Power-On Wake-Up Modes
The state of the RES_SEL input determines the wake-up
state of the DAC outputs. Connect RES_SEL to AVDD or
AGND upon power-up to be sure the DAC outputs
wake up to a known state. Connect RES_SEL to AGND
to wake up all DAC outputs at 000h. While RES_SEL is
low, the 100kΩ internal resistor pulls the DAC outputs to
AGND and the output buffers are powered down.
Connect RES_SEL to AVDD to wake up all DAC outputs
at FFFh. While RES_SEL is high, the 100kΩ pullup
resistor pulls the DAC outputs to VREF1 and the output
buffers are powered down.
DAC Power-Up Modes
See Table 21 for a description of the DAC power-up
and power-down modes.
GPIOs
In addition to the internal ADC and DAC, the
MAX1057/MAX1058 also provide 12 general-purpose
input/output channels, GPIOA0–GPIOA3, GPIOB0–
Table 2. DAC Output Code Table
DAC CONTENTS
MSB
LSB
ANALOG OUTPUT
11
1111
1111
 1023 
+ VREF 

 1024 
10
0000
0001
 513 
+ VREF 

 1024 
10
0000
0000
01
0111
0111
 511 
+ VREF 

 1024 
00
0000
0001
 1 
+ VREF 

 1024 
00
0000
0000
 512   + VREF 
+ VREF 
 = 

 1024   2 
______________________________________________________________________________________
0
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Clock Modes
Internal Clock
The MAX1020–MAX1023/MAX1057/MAX1058 can
operate from an internal oscillator. The internal oscillator is active in clock modes 00, 01, and 10. Figures 6,
7, and 8 show how to start an ADC conversion in the
three internally timed conversion modes.
Read out the data at clock speeds up to 25MHz
through the SPI interface.
External Clock
Set CKSEL1 and CKSEL0 in the setup register to 11 to
set up the interface for external clock mode 11. See
Table 5. Pulse SCLK at speeds from 0.1MHz to
4.8MHz. Write to SCLK with a 40% to 60% duty cycle.
The SCLK frequency controls the conversion timing.
See Figure 9 for clock mode 11 timing. See the ADC
Conversions in Clock Mode 11 section.
ADC/DAC References
Address the reference through the setup register, bits 3
and 2. See Table 5. Following a wake-up delay, set
REFSEL[1:0] = 00 to program both the ADC and DAC
for internal reference use. Set REFSEL[1:0] = 10 to program the ADC for internal reference. Set REFSEL[1:0] =
10 to program the DAC for external reference, REF1.
When using REF1 or REF2/AIN_ in external-reference
mode, connect a 0.1µF capacitor to AGND. Set REFSEL[1:0] = 01 to program the ADC and DAC for external-reference mode. The DAC uses REF1 as its external
reference, while the ADC uses REF2 as its external reference. Set REFSEL[1:0] = 11 to program the ADC for
external differential reference mode. REF1 is the positive reference and REF2 is the negative reference in the
ADC external differential mode.
When REFSEL [1:0] = 00 or 10, REF2/AIN_ functions as
an analog input channel. When REFSEL [1:0] = 01 or 11,
REF2/AIN_ functions as the device’s negative reference.
Temperature Measurements
Issue a command byte setting bit 0 of the conversion
register to one to take a temperature measurement.
See Table 4. The MAX1020–MAX1023/MAX1057/
MAX1058 perform temperature measurements with an
internal diode-connected transistor. The diode bias current changes from 68µA to 4µA to produce a temperature-dependent bias voltage difference. The second
conversion result at 4µA is subtracted from the first at
68µA to calculate a digital value that is proportional to
absolute temperature. The output data appearing at
DOUT is the digital code above, minus an offset to
adjust from Kelvin to Celsius.
The reference voltage used for the temperature measurements is always derived from the internal reference
source to ensure that 1 LSB corresponds to 1/8 of a
degree Celsius. On every scan where a temperature
measurement is requested, the temperature conversion
is carried out first. The first 2 bytes of data read from
the FIFO contain the result of the temperature measurement. If another temperature measurement is performed before the first temperature result is read out,
the old measurement is overwritten by the new result.
Temperature results are in degrees Celsius (two’s complement). See the Applications Information section for
information on how to perform temperature measurements in each clock mode.
Register Descriptions
The MAX1020–MAX1023/MAX1057/MAX1058 communicate between the internal registers and the external
Table 3. GPIO Maximum Sink/Source Current
MAX1057/MAX1058
CURRENT
MAX1020/MAX1021
GPIOA0–GPIOA3
GPIOB0–GPIOB3
GPIOC0–GPIOC3
GPIOA0, GPIOA1
GPIOC0, GPIOC1
SINK CURRENT
15mA
4mA
4mA
15mA
4mA
SOURCE CURRENT
15mA
2mA
2mA
15mA
2mA
______________________________________________________________________________________
23
MAX1020–MAX1023/MAX1057/MAX1058
GPIOB3, and GPIOC0–GPIOC3. The MAX1020/MAX1021
include four GPIO channels (GPIOA0, GPIOA1, GPIOC0,
GPIOC1). Read and write to the GPIOs as detailed in
Table 1 and Tables 12–19. Also, see the GPIO Command
section. See Figures 11 and 12 for GPIO timing.
Write to the GPIOs by writing a command byte to the
GPIO command register. Write a single data byte to the
MAX1020/MAX1021 following the command byte. Write
2 bytes to the MAX1057/MAX1058 following the command byte.
The GPIOs can sink and source current. The
MAX1057/MAX1058 GPIOA0–GPIOA3 can sink and
source up to 15mA. GPIOB0–GPIOB3 and GPIOC0–
GPIOC3 can sink 4mA and source 2mA. The MAX1020/
MAX1021 GPIOA0 and GPIOA1 can sink and source up
to 15mA. The MAX1020/MAX1021 GPIOC0 and GPIOC1
can sink 4mA and source 2mA. See Table 3.
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
circuitry through the SPI-compatible serial interface.
Table 1 details the command byte, the registers, and
the bit names. Tables 4–12 show the various functions
within the conversion register, setup register, unipolarmode register, bipolar-mode register, ADC averaging
register, DAC select register, reset register, and GPIO
command register, respectively.
Conversion Register
Select active analog input channels, scan modes, and
a single temperature measurement per scan by issuing
a command byte to the conversion register. Table 4
details channel selection, the four scan modes, and
how to request a temperature measurement. Start a
scan by writing to the conversion register when in clock
mode 10 or 11, or by applying a low pulse to the
CNVST pin when in clock mode 00 or 01. See Figures 6
and 7 for timing specifications for starting a scan with
CNVST.
A conversion is not performed if it is requested on a
channel or one of the channel pairs that has been configured as CNVST or REF2. For channels configured as
differential pairs, the CHSEL0 bit is ignored and the two
pins are treated as a single differential channel.
Select scan mode 00 or 01 to return one result per single-ended channel and one result per differential pair
within the selected scanning range (set by bits 2 and 1,
SCAN1 and SCAN0), plus one temperature result if
selected. Select scan mode 10 to scan a single input
channel numerous times, depending on NSCAN1 and
NSCAN0 in the ADC averaging register (Table 9).
Select scan mode 11 to return only one result from a
single channel.
Setup Register
Issue a command byte to the setup register to configure the clock, reference, power-down modes, and ADC
single-ended/differential modes. Table 5 details the bits
in the setup-register command byte. Bits 5 and 4
(CKSEL1 and CKSEL0) control the clock mode, acquisition and sampling, and the conversion start. Bits 3
and 2 (REFSEL1 and REFSEL0) set the device for either
internal or external reference. Bits 1 and 0 (DIFFSEL1
and DIFFSEL0) address the ADC unipolar-mode and
bipolar-mode registers and configure the analog-input
channels for differential operation.
The ADC reference is always on if any of the following
conditions are true:
24
Table 4. Conversion Register*
BIT
NAME
—
BIT
FUNCTION
7 (MSB)
Set to one to select conversion register.
CHSEL3
6
Analog-input channel select.
CHSEL2
5
Analog-input channel select.
CHSEL1
4
Analog-input channel select.
CHSEL0
3
Analog-input channel select.
SCAN1
2
Scan-mode select.
SCAN0
1
TEMP
0 (LSB)
Scan-mode select.
Set to one to take a single temperature measurement. The first
conversion result of a scan contains
temperature information.
*See below for bit details.
CHSEL3
CHSEL2
CHSEL1
CHSEL0
SELECTED
CHANNEL
(N)
0
0
0
0
AIN0
0
0
0
1
AIN1
0
0
1
0
AIN2
0
0
1
1
AIN3
0
1
0
0
AIN4
0
1
0
1
AIN5
0
1
1
0
AIN6
0
1
1
1
AIN7
1
0
0
0
AIN8
1
0
0
1
AIN9
1
0
1
0
AIN10
1
0
1
1
AIN11
1
1
0
0
AIN12
1
1
0
1
AIN13
1
1
1
0
AIN14
1
1
1
1
AIN15
SCAN MODE
(CHANNEL N IS SELECTED BY
BITS CHSEL3–CHSEL0)
Scans channels 0 through N.
SCAN1
SCAN0
0
0
0
1
Scans channels N through the highest
numbered channel.
1
0
Scans channel N repeatedly. The ADC
averaging register sets the number of
results.
1
1
No scan. Converts channel N once only.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
BIT NAME
BIT
—
7 (MSB)
Set to zero to select setup register.
FUNCTION
—
6
Set to one to select setup register.
CKSEL1
5
Clock mode and CNVST configuration; resets to one at power-up.
CKSEL0
4
Clock mode and CNVST configuration.
REFSEL1
3
Reference-mode configuration.
REFSEL0
2
Reference-mode configuration.
DIFFSEL1
1
Unipolar-/bipolar-mode register configuration for differential mode.
DIFFSEL0
0 (LSB)
Unipolar-/bipolar-mode register configuration for differential mode.
*See below for bit details.
Table 5a. Clock Modes (see the Clock Mode section)
CKSEL1
CKSEL0
CONVERSION CLOCK
ACQUISITION/SAMPLING
CNVST CONFIGURATION
0
0
Internal
Internally timed.
CNVST
0
1
Internal
Externally timed by CNVST.
CNVST
1
0
Internal
Internally timed.
AIN15/AIN11/AIN7
1
1
External (4.8MHz max)
Externally timed by SCLK.
AIN15/AIN11/AIN7
Table 5b. Clock Modes 00, 01, and 10
REFSEL1 REFSEL0
VOLTAGE
REFERENCE
OVERRIDE
CONDITIONS
AIN
0
0
Internal (DAC
and ADC)
0
1
1
0
AIN
1
Internal reference required. There is a programmed
delay of 244 internal-conversion clock cycles for the
internal reference to settle after wake-up.
Internal reference not used.
Internal reference required. There is a programmed
delay of 244 internal-conversion clock cycles for the
internal reference to settle after wake-up.
AIN
Default reference mode. Internal reference turns off
after scan is complete. If internal reference is turned
off, there is a programmed delay of 218 internalconversion clock cycles.
Temperature
1
Internal reference turns off after scan is complete. If
internal reference is turned off, there is a programmed
delay of 218 internal-conversion clock cycles.
Temperature
Internal (ADC)
and external
REF1 (DAC)
External
differential
(ADC), external
REF1 (DAC)
REF2
CONFIGURATION
AIN14/AIN10/AIN6
Temperature
External singleended (REF1
for DAC and
REF2 for ADC)
AUTOSHUTDOWN
AIN
Temperature
REF2
AIN14/AIN10/AIN6
Internal reference required. There is a programmed
delay of 244 internal-conversion clock cycles for the
internal reference to settle after wake-up.
Internal reference not used.
Internal reference required. There is a programmed
delay of 244 internal-conversion clock cycles for the
internal reference to settle after wake-up.
REF2
______________________________________________________________________________________
25
MAX1020–MAX1023/MAX1057/MAX1058
Table 5. Setup Register*
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
1)The FBGON bit is set to one in the reset register.
2)At least one DAC output is powered up and
REFSEL[1:0] (in the setup register) = 00.
3)At least one DAC is powered down through the
100kΩ to VREF and REFSEL[1:0] = 00.
If any of the above conditions exist, the ADC reference
is always on, but there is a 188 clock-cycle delay
before temperature-sensor measurements begin, if
requested.
Table 5c. Clock Mode 11
REFSEL1 REFSEL0
0
0
VOLTAGE
REFERENCE
OVERRIDE
CONDITIONS
AIN
Internal reference turns off after scan is complete. If
internal reference is turned off, there is a programmed
delay of 218 external conversion clock cycles.
Temperature
Internal reference required. There is a programmed
delay of 244 external conversion clock cycles for the
internal reference. Temperature-sensor output appears
at DOUT after 188 further external clock cycles.
Internal (DAC
and ADC)
AIN
0
1
1
0
External singleended (REF1
for DAC and
REF2 for ADC)
Temperature
AIN
Default reference mode. Internal reference turns off
after scan is complete. If internal reference is turned
off, there is a programmed delay of 218 external
conversion clock cycles.
Temperature
Internal reference required. There is a programmed
delay of 244 external conversion clock cycles for the
internal reference. Temperature-sensor output appears
at DOUT after 188 further external clock cycles.
1
AIN14/AIN10/AIN6
REF2
AIN14/AIN10/AIN6
AIN
1
REF2
CONFIGURATION
Internal reference not used.
Internal reference required. There is a programmed
delay of 244 external conversion clock cycles for the
internal reference. Temperature-sensor output appears
at DOUT after 188 further external clock cycles.
Internal (ADC)
and external
REF1 (DAC)
External
differential
(ADC), external
REF1 (DAC)
AUTOSHUTDOWN
Temperature
Internal reference not used.
Internal reference required. There is a programmed
delay of 244 external conversion clock cycles for the
internal reference. Temperature-sensor output appears
at DOUT after 188 further external clock cycles.
REF2
Table 5d. Differential Select Modes
DIFFSEL1 DIFFSEL0
26
FUNCTION
0
0
No data follows the command setup byte. Unipolar-mode and bipolar-mode registers remain unchanged.
0
1
No data follows the command setup byte. Unipolar-mode and bipolar-mode registers remain unchanged.
1
0
1 byte of data follows the command setup byte and is written to the unipolar-mode register.
1
1
1 byte of data follows the command setup byte and is written to the bipolar-mode register.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
BIT NAME
BIT
UCH0/1
7 (MSB)
Configure AIN0 and AIN1 for unipolar differential conversion.
FUNCTION
UCH2/3
6
Configure AIN2 and AIN3 for unipolar differential conversion.
UCH4/5
5
Configure AIN4 and AIN5 for unipolar differential conversion.
UCH6/7
4
Configure AIN6 and AIN7 for unipolar differential conversion.
UCH8/9
3
Configure AIN8 and AIN9 for unipolar differential conversion.
UCH10/11
2
Configure AIN10 and AIN11 for unipolar differential conversion.
UCH12/13
1
Configure AIN12 and AIN13 for unipolar differential conversion.
UCH14/15
0 (LSB)
Configure AIN14 and AIN15 for unipolar differential conversion.
Table 7. Bipolar-Mode Register (Addressed Through the Setup Register)
BIT NAME
BIT
FUNCTION
BCH0/1
7 (MSB)
Set to one to configure AIN0 and AIN1 for bipolar differential conversion. Set the corresponding bits
in the unipolar-mode and bipolar-mode registers to zero to configure AIN0 and AIN1 for unipolar
single-ended conversion.
BCH2/3
6
Set to one to configure AIN2 and AIN3 for bipolar differential conversion. Set the corresponding bits
in the unipolar-mode and bipolar-mode registers to zero to configure AIN2 and AIN3 for unipolar
single-ended conversion.
BCH4/5
5
Set to one to configure AIN4 and AIN5 for bipolar differential conversion. Set the corresponding bits
in the unipolar-mode and bipolar-mode registers to zero to configure AIN4 and AIN5 for unipolar
single-ended conversion.
BCH6/7
4
Set to one to configure AIN6 and AIN7 for bipolar differential conversion. Set the corresponding bits
in the unipolar-mode and bipolar-mode registers to zero to configure AIN6 and AIN7 for unipolar
single-ended conversion.
BCH8/9
3
Set to one to configure AIN8 and AIN9 for bipolar differential conversion. Set the corresponding bits
in the unipolar-mode and bipolar-mode registers to zero to configure AIN8 and AIN9 for unipolar
single-ended conversion.
BCH10/11
2
Set to one to configure AIN10 and AIN11 for bipolar differential conversion. Set the corresponding
bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN10 and AIN11 for
unipolar single-ended conversion.
BCH12/13
1
Set to one to configure AIN12 and AIN13 for bipolar differential conversion. Set the corresponding
bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN12 and AIN13 for
unipolar single-ended conversion.
BCH14/15
0 (LSB)
Set to one to configure AIN14 and AIN15 for bipolar differential conversion. Set the corresponding
bits in the unipolar-mode and bipolar-mode registers to zero to configure AIN14 and AIN15 for
unipolar single-ended conversion.
______________________________________________________________________________________
27
MAX1020–MAX1023/MAX1057/MAX1058
Table 6. Unipolar-Mode Register (Addressed Through the Setup Register)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Unipolar/Bipolar Registers
The final 2 bits (LSBs) of the setup register control the
unipolar-/bipolar-mode address registers. Set
DIFFSEL[1:0] = 10 to write to the unipolar-mode register. Set bits DIFFSEL[1:0] = 11 to write to the bipolarmode register. In both cases, the setup command byte
must be followed by 1 byte of data that is written to the
unipolar-mode register or bipolar-mode register. Hold
CS low and run 16 SCLK cycles before pulling CS high.
Table 8. Unipolar/Bipolar Channel Function
UNIPOLARMODE
REGISTER BIT
BIPOLAR-MODE
REGISTER BIT
CHANNEL PAIR
FUNCTION
0
0
Unipolar single-ended
0
1
Bipolar differential
1
0
Unipolar differential
1
1
Unipolar differential
If the last 2 bits of the setup register are 00 or 01, neither the unipolar-mode register nor the bipolar-mode
register is written. Any subsequent byte is recognized
as a new command byte. See Tables 6, 7, and 8 to program the unipolar- and bipolar-mode registers.
Both registers power up at all zeros to set the inputs as
16 unipolar single-ended channels. To configure a
channel pair as single-ended unipolar, bipolar differential, or unipolar differential, see Table 8.
In unipolar mode, AIN+ can exceed AIN- by up to
VREF. The output format in unipolar mode is binary. In
bipolar mode, either input can exceed the other by up
to VREF/2. The output format in bipolar mode is two’s
complement (see the ADC Transfer Functions section).
ADC Averaging Register
Write a command byte to the ADC averaging register to
configure the ADC to average up to 32 samples for
each requested result, and to independently control the
number of results requested for single-channel scans.
Table 9. ADC Averaging Register*
BIT NAME
BIT
FUNCTION
—
7 (MSB)
Set to zero to select ADC averaging register.
—
6
Set to zero to select ADC averaging register.
—
5
Set to one to select ADC averaging register.
AVGON
4
Set to one to turn averaging on. Set to zero to turn averaging off.
NAVG1
3
Configures the number of conversions for single-channel scans.
NAVG0
2
Configures the number of conversions for single-channel scans.
NSCAN1
1
Single-channel scan count. (Scan mode 10 only.)
NSCAN0
0 (LSB)
Single-channel scan count. (Scan mode 10 only.)
*See below for bit details.
FUNCTION
AVGON
NAVG1
NAVG0
0
X
X
Performs one conversion for each requested result.
1
0
0
Performs four conversions and returns the average for each requested result.
1
0
1
Performs eight conversions and returns the average for each requested result.
1
1
0
Performs 16 conversions and returns the average for each requested result.
1
1
1
Performs 32 conversions and returns the average for each requested result.
28
NSCAN1
NSCAN0
0
0
Scans channel N and returns four results.
FUNCTION (APPLIES ONLY IF SCAN MODE 10 IS SELECTED)
0
1
Scans channel N and returns eight results.
1
0
Scans channel N and returns 12 results.
1
1
Scans channel N and returns 16 results.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
DAC Select Register
Write a command byte 0001XXXX to the DAC select
register (as shown in Table 9) to set up the DAC interface and indicate that another word will follow. The last
4 bits of the DAC select register are don’t-care bits. The
word that follows the DAC select-register command
byte controls the DAC serial interface. See Table 20
and the DAC Serial Interface section.
Table 10. DAC Select Register
BIT
NAME
—
BIT
FUNCTION
7 (MSB) Set to zero to select DAC select register.
Reset Register
Write to the reset register (as shown in Table 11) to
clear the FIFO or to reset all registers to their default
states. Set the RESET bit to one to reset the FIFO. Set
the RESET bit to zero to return the MAX1020–MAX1023/
MAX1057/MAX1058 to their default power-up state. All
registers power up in state 00000000, except for the
setup register that powers up in clock mode 10
(CKSEL1 = 1). Set the SLOW bit to one to add a 15ns
delay in the DOUT signal path to provide a longer hold
time. Writing a one to the SLOW bit also clears the contents of the FIFO. Set the FBGON bit to one to force the
bias block and bandgap reference to power up regardless of the state of the DAC and activity of the ADC
block. Setting the FBGON bit high also removes the
programmed wake-up delay between conversions in
clock modes 01 and 11. Setting the FBGON bit high
also clears the FIFO.
GPIO Command
Write a command byte to the GPIO command register
to configure, write, or read the GPIOs, as detailed in
Table 12.
Write the command byte 00000011 to configure the
GPIOs. The eight SCLK cycles following the command
byte load data from DIN to the GPIO configuration register in the MAX1020/MAX1021. The 16 SCLK cycles
—
6
Set to zero to select DAC select register.
—
5
Set to zero to select DAC select register.
—
4
Set to one to select DAC select register.
X
3
Don’t care.
X
2
Don’t care.
X
1
Don’t care.
BIT NAME
BIT
FUNCTION
Don’t care.
—
7 (MSB)
Set to zero to select GPIO register.
—
6
Set to zero to select GPIO register.
—
5
Set to zero to select GPIO register.
—
4
Set to zero to select GPIO register.
—
3
Set to zero to select GPIO register.
—
2
Set to zero to select GPIO register.
X
0
Table 12. GPIO Command Register
Table 11. Reset Register
BIT
NAME
—
BIT
FUNCTION
7 (MSB) Set to zero to select ADC reset register.
—
6
Set to zero to select ADC reset register.
—
5
Set to zero to select ADC reset register.
—
4
Set to zero to select ADC reset register.
—
3
Set to one to select ADC reset register.
2
Set to zero to clear the FIFO only. Set to
one to set the device in its power-on
condition.
RESET
SLOW
1
FBGON
0 (LSB)
GPIOSEL1
1
GPIOSEL2
0 (LSB)
GPIOSEL1
GPIOSEL2
1
1
GPIO configuration; written data is
entered in the GPIO configuration
register.
1
0
GPIO write; written data is entered
in the GPIO write register.
0
1
GPIO read; the next 8/16 SCLK
cycles transfer the state of all GPIO
drivers into DOUT.
Set to one to turn on slow mode.
Set to one to force internal bias block and
bandgap reference to be always powered
up.
GPIO configuration bit.
GPIO write bit.
FUNCTION
______________________________________________________________________________________
29
MAX1020–MAX1023/MAX1057/MAX1058
Table 9 details the four scan modes available in the
ADC conversion register. All four scan modes allow
averaging as long as the AVGON bit, bit 4 in the
averaging register, is set to 1. Select scan mode 10 to
scan the same channel multiple times. Clock mode 11
disables averaging. For example, if AVGON = 1,
NAVG[1:0] = 00, NSCAN [1:0] = 11 and SCAN [1:0] =
10, 16 results are written to the FIFO, with each result
being the average of four conversions of channel N.
GPIO Write
Write the command byte 00000010 to indicate a GPIO
write operation. The eight SCLK cycles following the
command byte load data from DIN into the GPIO write
register in the MAX1020/MAX1021. The 16 SCLK
cycles following the command byte load data from DIN
into the GPIO write register in the MAX1057/MAX1058.
See Tables 15 and 16. The register bits are updated
after the last CS rising edge.
following the command byte load data from DIN to the
GPIO configuration register in the MAX1057/MAX1058.
See Tables 13 and 14. The register bits are updated
after the last CS rising edge. All GPIOs default to inputs
upon power-up.
The data in the register controls the function of each
GPIO, as shown in Tables 13–19.
Table 13. MAX1020/MAX1021 GPIO Configuration
DATA PIN
GPIO COMMAND BYTE
DATA BYTE
DIN
0
0
0
0
0
0
1
1
GPIOC1
GPIOC0
GPIOA1
GPIOA0
X
X
X
X
DOUT
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Table 14. MAX1057/MAX1058 GPIO Configuration
DATA PIN
GPIO COMMAND BYTE
DATA BYTE 1
DATA BYTE 2
0
0
0
0
0
0
1
1
GPIOC2
GPIOC1
GPIOC0
GPIOB3
GPIOB2
GPIOB1
GPIOB0
GPIOA3
GPIOA2
GPIOA1
DOUT
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
GPIOA0
DIN
GPIOC3
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
X
X
X
X
0
0
0
0
0
Table 15. MAX1020/MAX1021 GPIO Write
DATA PIN
GPIO COMMAND BYTE
DATA BYTE
DIN
0
0
0
0
0
0
1
0
GPIOC1
GPIOC0
GPIOA1
GPIOA0
X
X
X
X
DOUT
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Table 16. MAX1057/MAX1058 GPIO Write
DATA PIN
GPIO COMMAND BYTE
DATA BYTE 1
DATA BYTE 2
0
0
0
0
0
0
1
0
GPIOC3
GPIOC2
GPIOC1
GPIOC0
GPIOB3
GPIOB2
GPIOB1
GPIOB0
GPIOA3
GPIOA2
GPIOA1
DOUT
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
30
GPIOA0
DIN
X
X
X
X
0
0
0
0
0
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
DAC Serial Interface
Write a command byte 0001XXXX to the DAC select
register to indicate the word to follow is written to the
DAC serial interface, as detailed in Tables 1, 10, 20, and
21. Write the next 16 bits to the DAC interface register,
as shown in Tables 20 and 21. Following the high-to-low
transition of CS, the data is shifted synchronously and
latched into the input register on each falling edge of
SCLK. Each word is 16 bits. The first 4 bits are the control bits followed by 10 data bits (MSB first) and 2 don’tcare sub-bits. See Figures 9–12 for DAC timing
specifications.
Table 17. GPIO-Mode Control
CONFIGURATION
BIT
WRITE
BIT
OUTPUT
STATE
GPIO
FUNCTION
1
1
1
Output
1
0
0
Output
0
1
Tri-state
Input
0
Pulldown
(open drain)
0
0
If CS goes high prior to completing 16 SCLK cycles,
the command is discarded. To initiate a new transfer,
drive CS low again.
For example, writing the DAC serial interface word
1111 0000 and 1111 0100 disconnects DAC outputs 4
through 7 and forces them to a high-impedance state.
DAC outputs 0 through 3 remain in their previous state.
Table 18. MAX1020/MAX1021 GPIO Read
DATA PIN
GPIO COMMAND BYTE
DATA BYTE
DIN
0
0
0
0
0
0
0
1
X
X
X
X
X
X
X
X
DOUT
0
0
0
0
0
0
0
0
0
0
0
0
GPIOC1
GPIOC0
GPIOA1
GPIOA0
Table 19. MAX1057/MAX1058 GPIO Read
DATA PIN
GPIO COMMAND BYTE
DATA BYTE 1
DATA BYTE 2
DIN
0
0
0
0
0
0
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
DOUT
0
0
0
0
0
0
0
0
0
0
0
0
GPIOC3
GPIOC2
GPIOC1
GPIOC0
GPIOB3
GPIOB2
GPIOB1
GPIOB0
GPIOA3
GPIOA2
GPIOA1
GPIOA0
______________________________________________________________________________________
31
MAX1020–MAX1023/MAX1057/MAX1058
GPIO Read
Write the command byte 00000001 to indicate a GPIO
read operation. The eight SCLK cycles following the
command byte transfer the state of the GPIOs to DOUT
in the MAX1020/MAX1021. The 16 SCLK cycles following the command byte transfer the state of the GPIOs to
DOUT in the MAX1057/MAX1058. See Tables 18 and 19.
Table 20. DAC Serial-Interface Configuration
16-BIT SERIAL WORD
MSB
LSB
CONTROL
BITS
DESCRIPTION
DATA BITS
C3 C2 C1 C0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
NOP
FUNCTION
No operation.
X
X
X
X
X
X
X
X
X
RESET
0
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
Pull-High
Preset all internal registers to FFFh and
leave output buffers in their present state.
0
0
1
0
—
—
—
—
—
—
—
—
—
—
X
X
DAC0
D9–D0 to input register 0,
DAC output unchanged.
0
0
1
1
—
—
—
—
—
—
—
—
—
—
X
X
DAC1
D9–D0 to input register 1,
DAC output unchanged.
0
1
0
0
—
—
—
—
—
—
—
—
—
—
X
X
DAC2
D9–D0 to input register 2,
DAC output unchanged.
0
1
0
1
—
—
—
—
—
—
—
—
—
—
X
X
DAC3
D9–D0 to input register 3,
DAC output unchanged.
0
1
1
0
—
—
—
—
—
—
—
—
—
—
X
X
DAC4
D9–D0 to input register 4,
DAC output unchanged.
0
1
1
1
—
—
—
—
—
—
—
—
—
—
X
X
DAC5
D9–D0 to input register 5,
DAC output unchanged.
1
0
0
0
—
—
—
—
—
—
—
—
—
—
X
X
DAC6
D9–D0 to input register 6,
DAC output unchanged.
1
0
0
1
—
—
—
—
—
—
—
—
—
—
X
X
DAC7
D9–D0 to input register 7,
DAC output unchanged.
1
0
1
0
—
—
—
—
—
—
—
—
—
—
X
X
DAC0–DAC3
D9–D0 to input registers 0–3 and DAC
registers 0–3. DAC outputs updated
(write-through).
1
0
1
1
—
—
—
—
—
—
—
—
—
—
X
X
DAC4–DAC7
D9–D0 to input registers 4–7 and DAC
registers 5–8. DAC outputs updated
(write-through).
1
1
0
0
—
—
—
—
—
—
—
—
—
—
X
X
DAC0–DAC7
D9–D0 to input registers 0–7 and DAC
Registers 0–7. DAC outputs updated
(write-through).
1
1
0
1
—
—
—
—
—
—
—
—
—
—
X
X
DAC0–DAC7
D9–D0 to input registers 0–7.
DAC outputs unchanged.
DAC0–DAC7
Input registers to DAC registers indicated
by ones, DAC outputs updated,
equivalent to software LDAC.
(No effect on DACs indicated by zeros.)
1
32
1
1
0
DAC0
X
DAC1
X
DAC2
0
DAC3
1
DAC4
0
DAC5
0
DAC6
0
Reset all internal registers to 000h and
leave output buffers in their present state.
DAC7
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
X
X
X
X
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
CONTROL
BITS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DAC0
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
C3 C2 C1 C0
DATA BITS
DESCRIPTION
FUNCTION
D3 D2 D1 D0
— — — — — — — — 0
— — — — — — — — 0
— — — — — — — — 1
— — — — — — — — 0
— — — — — — — — 1
0
1
0
0
1
1
0
0
0
1
X
Power-Up
Power up individual DAC buffers indicated by data
in DAC0 through DAC7. A one indicates the DAC
output is connected and active. A zero does not
affect the DAC’s present state.
X
Power down individual DAC buffers indicated by
data in DAC0 through DAC7. A one indicates the
Power-Down 1
DAC output is disconnected and high impedance.
A zero does not affect the DAC’s present state.
X
Power down individual DAC buffers indicated by
data in DAC0 through DAC7. A one indicates the
Power-Down 2 DAC output is disconnected and pulled to AGND
with a 1kΩ resistor. A zero does not affect the DAC’s
present state.
X
Power down individual DAC buffers indicated by
data in DAC0 through DAC7. A one indicates the
Power-Down 3 DAC output is disconnected and pulled to AGND
with a 100kΩ resistor. A zero does not affect the
DAC’s present state.
X
Power down individual DAC buffers indicated by
data in DAC0 through DAC7. A one indicates the
Power-Down 4 DAC output is disconnected and pulled to REF1 with
a 100kΩ resistor. A zero does not affect the DAC’s
present state.
Output-Data Format
Figures 6–9 illustrate the conversion timing for the
MAX1020–MAX1023/MAX1057/MAX1058. All 10-bit
conversion results are output in 2-byte format, MSB
first, with four leading zeros and with the LSB followed
by 2 sub-bits. Data appears on DOUT on the falling
edges of SCLK. Data is binary for unipolar mode and
two’s complement for bipolar mode and temperature
results. See Figures 3, 4, and 5 for input/output and
temperature-transfer functions.
ADC Transfer Functions
Figure 3 shows the unipolar transfer function for singleended or differential inputs. Figure 4 shows the bipolar
transfer function for differential inputs. Code transitions
occur halfway between successive-integer LSB values.
Output coding is binary, with 1 LSB = VREF1 / 1024
(MAX1021/MAX1023/MAX1057) and 1 LSB = VREF1 /
1024 (MAX1020/MAX1022/MAX1058) for unipolar and
bipolar operation, and 1 LSB = +0.125°C for temperature measurements. Bipolar true-differential results and
temperature-sensor results are available in two’s complement format, while all others are in binary. See
Tables 6, 7, and 8 for details on which setting (unipolar
or bipolar) takes precedence.
In unipolar mode, AIN+ can exceed AIN- by up to
VREF1. In bipolar mode, either input can exceed the
other by up to VREF1 / 2.
______________________________________________________________________________________
33
MAX1020–MAX1023/MAX1057/MAX1058
Table 21. DAC Power-Up and Power-Down Commands
Applications Information
Internally Timed Acquisitions and
Conversions Using CNVST
ADC Conversions in Clock Mode 00
In clock mode 00, the wake-up, acquisition, conversion,
and shutdown sequence is initiated through CNVST
and performed automatically using the internal oscillator. Results are added to the internal FIFO to be read
out later. See Figure 6 for clock mode 00 timing after a
command byte is issued. See Table 5 for details on
programming the clock mode in the setup register.
Initiate a scan by setting CNVST low for at least 40ns
before pulling it high again. The MAX1020–MAX1023/
MAX1057/MAX1058 then wake up, scan all requested
channels, store the results in the FIFO, and shut down.
After the scan is complete, EOC is pulled low and the
results are available in the FIFO. Wait until EOC goes
low before pulling CS low to communicate with the serial interface. EOC stays low until CS or CNVST is pulled
low again. A temperature-conversion result, if requested, precedes all other FIFO results. Temperature
results are available in 12-bit format.
VREF = VREF+ - VREFVREF
VREF
011....111
OFFSET BINARY OUTPUT CODE (LSB)
Partial Reads and Partial Writes
If the first byte of an entry in the FIFO is partially read
(CS is pulled high after fewer than eight SCLK cycles),
the remaining bits are lost for that byte. The next byte of
data that is read out contains the next 8 bits. If the first
byte of an entry in the FIFO is read out fully, but the
second byte is read out partially, the rest of that byte is
lost. The remaining data in the FIFO is unaffected and
can be read out normally after taking CS low again, as
long as the 4 leading bits (normally zeros) are ignored.
If CS is pulled low before EOC goes low, a conversion
may not be completed and the FIFO data may not be
correct. Incorrect writes (pulling CS high before completing eight SCLK cycles) are ignored and the register
remains unchanged.
011....110
011....101
FS = VREF / 2 + VCOM
ZS = COM
-FS = -VREF / 2
VREF
1 LSB = VREF / 1024
000....001
000....000
(COM)
111....111
VREF
100....011
100....010
100....001
100....000
-FS
-1 0 +1
(COM)
INPUT VOLTAGE (LSB)
+FS - 1 LSB
Figure 4. Bipolar Transfer Function—Full Scale (±FS) = ±VREF / 2
OUTPUT CODE
FULL-SCALE
TRANSITION
111....111
OFFSET BINARY OUTPUT CODE (LSB)
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
111....110
FS = VREF
111....101
1 LSB = VREF / 1024
011....111
011....110
000....010
000....001
000....000
111....111
000....011
111....110
111....101
000....010
000....001
000....000
0 1 2 3
FS
100....001
100....000
INPUT VOLTAGE (LSB)
FS - 3/2 LSB
-256
0
TEMPERATURE (°C)
Figure 3. Unipolar Transfer Function—Full Scale (FS) = VREF
34
Figure 5. Temperature Transfer Function
______________________________________________________________________________________
+255.5
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
(UP TO 514 INTERNALLY CLOCKED ACQUISITIONS AND CONVERSIONS)
CS
SCLK
DOUT
MSB1
LSB1
MSB2
tRDS
EOC
Figure 6. Clock Mode 00—After writing a command byte, set CNVST low for at least 40ns to begin a conversion.
tCSW
CNVST
(CONVERSION 2)
(ACQUISITION 1)
(ACQUISITION 2)
CS
tDOV
SCLK
(CONVERSION 1)
DOUT
MSB1
LSB1
MSB2
EOC
Figure 7. Clock Mode 01—After writing a command byte, request multiple conversions by setting CNVST low for each conversion.
Do not issue a second CNVST signal before EOC goes
low; otherwise, the FIFO can be corrupted. Wait until all
conversions are complete before reading the FIFO. SPI
communications to the DAC and GPIO registers are permitted during conversion. However, coupled noise may
result in degraded ADC signal-to-noise ratio (SNR).
Externally Timed Acquisitions and
Internally Timed Conversions with CNVST
ADC Conversions in Clock Mode 01
In clock mode 01, conversions are requested one at a
time using CNVST and performed automatically using
the internal oscillator. See Figure 7 for clock mode 01
timing after a command byte is issued.
Setting CNVST low begins an acquisition, wakes up the
ADC, and places it in track mode. Hold CNVST low for
at least 1.4µs to complete the acquisition. If reference
mode 00 or 10 is selected, an additional 45µs is
required for the internal reference to power up. If a temperature measurement is being requested, reference
power-up and temperature measurement is internally
timed. In this case, hold CNVST low for at least 40µs.
Set CNVST high to begin a conversion. Sampling is
completed approximately 500ns after CNVST goes
high. After the conversion is complete, the ADC shuts
down and pulls EOC low. EOC stays low until CS or
CNVST is pulled low again. Wait until EOC goes low
before pulling CS or CNVST low. The number of CNVST
signals must equal the number of conversions requested by the scan and averaging registers to correctly
update the FIFO. Wait until all conversions are complete before reading the FIFO. SPI communications to
the DAC and GPIO registers are permitted during con-
______________________________________________________________________________________
35
MAX1020–MAX1023/MAX1057/MAX1058
CNVST
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
DIN
(CONVERSION BYTE)
(UP TO 514 INTERNALLY CLOCKED ACQUISITIONS AND CONVERSIONS)
CS
SCLK
DOUT
MSB1
tDOV
LSB1
MSB2
EOC
Figure 8. Clock Mode 10—The command byte to the conversion register begins the acquisition (CNVST is not required).
version. However, coupled noise may result in degraded ADC SNR.
Internally Timed Acquisitions and
Conversions Using the Serial Interface
If averaging is turned on, multiple CNVST pulses need to
be performed before a result is written to the FIFO. Once
the proper number of conversions has been performed
to generate an averaged FIFO result (as specified to the
averaging register), the scan logic automatically switches the analog-input multiplexer to the next requested
channel. If a temperature measurement is programmed,
it is performed after the first rising edge of CNVST following the command byte written to the conversion register.
The temperature-conversion result is available on DOUT
once EOC has been pulled low. Temperature results are
available in 12-bit format.
ADC Conversions in Clock Mode 10
In clock mode 10, the wake-up, acquisition, conversion,
and shutdown sequence is initiated by writing a command byte to the conversion register, and is performed
automatically using the internal oscillator. This is the
default clock mode upon power-up. See Figure 8 for
clock mode 10 timing.
36
Initiate a scan by writing a command byte to the conversion register. The MAX1020–MAX1023/MAX1057/
MAX1058 then power up, scan all requested channels,
store the results in the FIFO, and shut down. After the
scan is complete, EOC is pulled low and the results are
available in the FIFO. If a temperature measurement is
requested, the temperature result precedes all other
FIFO results. Temperature results are available in 12-bit
format. EOC stays low until CS is pulled low again. Wait
until all conversions are complete before reading the
FIFO. SPI communications to the DAC and GPIO registers are permitted during conversion. However, coupled noise may result in degraded ADC SNR.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
(CONVERSION BYTE)
(ACQUISITION1)
(CONVERSION1)
(ACQUISITION2)
CS
SCLK
DOUT
MSB1
LSB1
MSB2
EOC
Figure 9. Clock Mode 11—Externally Timed Acquisition, Sampling, and Conversion without CNVST
Externally Clocked Acquisitions and
Conversions Using the Serial Interface
ADC Conversions in Clock Mode 11
In clock mode 11, acquisitions and conversions are initiated by writing a command byte to the conversion
register and are performed one at a time using the
SCLK as the conversion clock. Scanning, averaging
and the FIFO are disabled, and the conversion result is
available at DOUT during the conversion. Output data
is updated on the rising edge of SCLK in clock mode
11. See Figure 9 for clock mode 11 timing.
Initiate a conversion by writing a command byte to the
conversion register followed by 16 SCLK cycles. If CS
is pulsed high between the eighth and ninth cycles, the
pulse width must be less than 100µs. To continuously
convert at 16 cycles per conversion, alternate 1 byte of
zeros (NOP byte) between each conversion byte. If 2
NOP bytes follow a conversion byte, the analog cells
power down at the end of the second NOP. Set the
FBGON bit to one in the reset register to keep the internal bias block powered.
If reference mode 00 is requested, or if an external reference is selected but a temperature measurement is being
requested, wait 45µs with CS high after writing the conversion byte to extend the acquisition and allow the internal reference to power up. To perform a temperature
measurement, write 24 bytes (192 cycles) of zeros after
the conversion byte. The temperature result appears on
DOUT during the last 2 bytes of the 192 cycles.
Temperature results are available in 12-bit format.
Conversion-Time Calculations
The conversion time for each scan is based on a number of different factors: conversion time per sample,
samples per result, results per scan, if a temperature
measurement is requested, and if the external reference is in use. Use the following formula to calculate
the total conversion time for an internally timed conversion in clock mode 00 and 10 (see the Electrical
Characteristics, as applicable):
Total conversion time =
tCNV x nAVG x nSCAN + tTS + tINT-REF,SU
where:
tCNV = tDOV, where tDOV is dependent on clock mode
and reference mode selected
nAVG = samples per result (amount of averaging)
nSCAN = number of times each channel is scanned; set
to one unless [SCAN1, SCAN0] = 10
t TS = time required for temperature measurement
(53.1µs); set to zero if temperature measurement is not
requested
tINT-REF,SU = tWU (external-reference wake-up); if a
conversion using the external reference is requested
In clock mode 01, the total conversion time depends on
how long CNVST is held low or high. Conversion time in
externally clocked mode (CKSEL1, CKSEL0 = 11)
depends on the SCLK period and how long CS is held
high between each set of eight SCLK cycles. In clock
mode 01, the total conversion time does not include the
time required to turn on the internal reference.
______________________________________________________________________________________
37
MAX1020–MAX1023/MAX1057/MAX1058
DIN
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
tCL
SCLK
1
tDS
2
3
D13
D14
D12
D11
D1
D0
tDOT
tDOE
D15
D7
DOUT
32
16
8
5
4
tDH
D15
DIN
tCH
D14
D6
D13
D5
tDOD
D12
D4
D1
D0
tCSS
tCSPWH
tCSH
CS
Figure 10. DAC/GPIO Serial-Interface Timing (Clock Modes 00, 01, and 10)
DAC/GPIO Timing
Figures 10–13 detail the timing diagrams for writing to
the DAC and GPIOs. Figure 10 shows the timing specifications for clock modes 00, 01, and 10. Figure 11
shows the timing specifications for clock mode 11.
Figure 12 details the timing specifications for the DAC
input select register and 2 bytes to follow. Output data
38
is updated on the rising edge of SCLK in clock mode
11. Figure 13 shows the GPIO timing. Figure 14 shows
the timing details of a hardware LDAC command DACregister update. For a software-command DAC-register
update, tS is valid from the rising edge of CS, which follows the last data bit in the software command word.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
MAX1020–MAX1023/MAX1057/MAX1058
tCH
tCL
SCLK
1
2
3
32
16
8
5
4
tDH
tDS
D15
DIN
D14
D13
D12
D11
D1
D0
tDOE
tDOT
D15
D7
DOUT
D14
D6
tDOD
D13
D5
D12
D4
D1
D0
tCSS
tCSPWH
tCSH
CS
Figure 11. DAC/GPIO Serial-Interface Timing (Clock Mode 11)
SCLK
DIN
1
2
BIT 7 (MSB)
8
BIT 6
BIT 0 (LSB)
10
9
BIT 15
BIT 14
24
BIT 1
BIT 0
DOUT
THE COMMAND BYTE
INITIALIZES THE DAC SELECT
REGISTER
THE NEXT 16 BITS SELECT THE DAC
AND THE DATA WRITTEN TO IT
CS
Figure 12. DAC-Select Register Byte and DAC Serial-Interface Word
______________________________________________________________________________________
39
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
CS
tGOD
GPIO INPUT/OUTPUT
tGSU
Figure 13. GPIO Timing
tLDACPWL
LDAC
tS
±1 LSB
OUT_
Figure 14. LDAC Functionality
LDAC Functionality
Drive LDAC low to transfer the content of the input registers to the DAC registers. Drive LDAC permanently
low to make the DAC register transparent. The DAC
output typically settles from zero to full scale within ±1
LSB after 2µs. See Figure 14.
Layout, Grounding, and Bypassing
For best performance, use PC boards. Ensure that digital and analog signal lines are separated from each
other. Do not run analog and digital signals parallel to
one another (especially clock signals) or do not run
digital lines underneath the MAX1020–MAX1023/
MAX1057/MAX1058 package. High-frequency noise in
the AV DD power supply may affect performance.
Bypass the AV DD supply with a 0.1µF capacitor to
AGND, close to the AVDD pin. Bypass the DVDD supply
with a 0.1µF capacitor to DGND, close to the DVDD pin.
Minimize capacitor lead lengths for best supply-noise
rejection. If the power supply is very noisy, connect a
10Ω resistor in series with the supply to improve powersupply filtering.
40
The MAX1020–MAX1023/MAX1057/MAX1058 thin QFN
packages contain an exposed pad on the underside of
the device. Connect this exposed pad to AGND. Refer to
the MAX1258EVKIT for an example of proper layout.
Definitions
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values
on an actual transfer function from a straight line. This
straight line can be either a best-straight-line fit or a line
drawn between the end points of the transfer function,
once offset and gain errors have been nullified. INL for
the MAX1020–MAX1023/MAX1057/MAX1058 is measured using the end-point method.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A
DNL error specification of less than 1 LSB guarantees
no missing codes and a monotonic transfer function.
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Signal-to-Noise Plus Distortion
Signal-to-noise plus distortion (SINAD) is the ratio of the
fundamental input frequency’s RMS amplitude to the
RMS equivalent of all other ADC output signals:
SINAD(dB) = 20 x log (SignalRMS / NoiseRMS)
Bipolar ADC Offset Error
While in bipolar mode, the ADC’s ideal midscale transition occurs at AGND -0.5 LSB. Bipolar offset error is the
measured deviation from this ideal value.
ADC Gain Error
Gain error is defined as the amount of deviation
between the ideal transfer function and the measured
transfer function, with the offset error removed and with
a full-scale analog input voltage applied to the ADC,
resulting in all ones at DOUT.
DAC Offset Error
DAC offset error is determined by loading a code of all
zeros into the DAC and measuring the analog output
voltage.
DAC Gain Error
DAC gain error is defined as the amount of deviation
between the ideal transfer function and the measured
transfer function, with the offset error removed, when
loading a code of all ones into the DAC.
Aperture Jitter
Aperture jitter (tAJ) is the sample-to-sample variation in
the time between the samples.
Aperture Delay
Aperture delay (t AD ) is the time between the rising
edge of the sampling clock and the instant when an
actual sample is taken.
Signal-to-Noise Ratio
For a waveform perfectly reconstructed from digital samples, signal-to-noise ratio (SNR) is the ratio of full-scale
analog input (RMS value) to the RMS quantization error
(residual error). The ideal, theoretical minimum analogto-digital noise is caused by quantization error only and
results directly from the ADC’s resolution (N bits):
SNR = (6.02 x N + 1.76)dB
In reality, there are other noise sources besides quantization noise, including thermal noise, reference noise,
clock jitter, etc. Therefore, SNR is calculated by taking
the ratio of the RMS signal to the RMS noise. RMS noise
includes all spectral components to the Nyquist frequency excluding the fundamental, the first five harmonics, and the DC offset.
Effective Number of Bits
Effective number of bits (ENOB) indicates the global
accuracy of an ADC at a specific input frequency and
sampling rate. An ideal ADC’s error consists of quantization noise only. With an input range equal to the fullscale range of the ADC, calculate the ENOB as follows:
ENOB = (SINAD - 1.76) / 6.02
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:
THD = 20 x log

(V22 + V32 + V42 + V52 + V62) / V1
where V1 is the fundamental amplitude, and V2 through
V6 are the amplitudes of the first five harmonics.
Spurious-Free Dynamic Range
Spurious-free dynamic range (SFDR) is the ratio of RMS
amplitude of the fundamental (maximum signal component) to the RMS value of the next largest distortion
component.
ADC Channel-to-Channel Crosstalk
Bias the ON channel to midscale. Apply a full-scale sine
wave test tone to all OFF channels. Perform an FFT on
the ON channel. ADC channel-to-channel crosstalk is
expressed in dB as the amplitude of the FFT spur at the
frequency associated with the OFF channel test tone.
Intermodulation Distortion (IMD)
IMD is the total power of the intermodulation products
relative to the total input power when two tones, f1 and
f2, are present at the inputs. The intermodulation products are (f1 ± f2), (2 x f1), (2 x f2), (2 x f1 ± f2), (2 x f2 ±
f1). The individual input tone levels are at -7dB FS.
Small-Signal Bandwidth
A small -20dB FS analog input signal is applied to an
ADC so the signal’s slew rate does not limit the ADC’s
performance. The input frequency is then swept up to
the point where the amplitude of the digitized conversion result has decreased by -3dB. Note that the T/H
performance is usually the limiting factor for the smallsignal input bandwidth.
______________________________________________________________________________________
41
MAX1020–MAX1023/MAX1057/MAX1058
Unipolar ADC Offset Error
For an ideal converter, the first transition occurs at 0.5
LSB, above zero. Offset error is the amount of deviation
between the measured first transition point and the
ideal first transition point.
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
Full-Power Bandwidth
DAC Power-Supply Rejection
A large -0.5dB FS analog input signal is applied to an
ADC, and the input frequency is swept up to the point
where the amplitude of the digitized conversion result
has decreased by -3dB. This point is defined as fullpower input bandwidth frequency.
DAC PSR is the amount of change in the converter’s
value at full-scale as the power-supply voltage changes
from its nominal value. PSR assumes the converter’s
linearity is unaffected by changes in the power-supply
voltage.
DAC Digital Feedthrough
DAC digital feedthrough is the amount of noise that
appears on the DAC output when the DAC digital control lines are toggled.
ADC Power-Supply Rejection
ADC power-supply rejection (PSR) is defined as the
shift in offset error when the power-supply is moved
from the minimum operating voltage to the maximum
operating voltage.
42
Chip Information
TRANSISTOR COUNT: 58,141
PROCESS: BiCMOS
______________________________________________________________________________________
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
GPIOA0
GPIOA1
1
27
AIN0
2
26
28
29
AIN6
AIN5
AIN4
AIN3
31
30
AIN7
N.C.
33
32
AIN9
AIN8
35
34
REF2/AIN10
36
28
29
30
31
N.C.
N.C.
AIN4
AIN3
AIN2
AIN1
33
32
REF2/AIN6
AIN5
35
34
CNVST/AIN7
36
TOP VIEW
CNVST/AIN11
N.C.
1
27
AIN2
2
26
EOC
3
25
REF1
GPIOC1
EOC
3
25
REF1
AIN1
DVDD
4
24
GPIOC0
DVDD
4
24
N.C.
DGND
DOUT
5
23
DGND
DOUT
5
23
SCLK
DIN
OUT0
7
21
21
20
8
20
AIN0
RES_SEL
CS
LDAC
9
19
OUT7
SCLK
DIN
OUT0
7
8
N.C.
RES_SEL
CS
LDAC
9
19
OUT7
11
16
17
18
OUT2
OUT3
AVDD
AGND
N.C.
OUT4
OUT5
OUT6
15
10
OUT1
14
18
OUT6
THIN QFN
13
17
OUT5
12
16
15
14
11
22
10
12
MAX1022
MAX1023
6
OUT2
OUT3
AVDD
AGND
N.C.
OUT4
22
OUT1
13
MAX1020
MAX1021
6
REF2/AIN14
AIN13
AIN12
AIN11
AIN10
AIN9
AIN8
AIN7
AIN6
AIN5
AIN4
AIN3
48
47
46
45
44
43
42
41
40
39
38
37
THIN QFN
CNVST/AIN15
1
36
AIN2
GPIOA0
2
35
REF1
GPIOA1
3
34
AIN1
EOC
4
33
AIN0
GPIOA2
5
32
GPIOC3
GPIOA3
6
31
GPIOC2
DVDD
7
30
GPIOC1
DGND
8
29
GPIOC0
DOUT
9
28
RES_SEL
SCLK
10
27
CS
DIN
11
26
LDAC
OUT0
12
25
OUT7
13
14
15
16
17
18
19
20
21
22
23
24
OUT1
OUT2
OUT3
GPIOB0
GPIOB1
AVDD
AGND
GPIOB2
GPIOB3
OUT4
OUT5
OUT6
MAX1057
MAX1058
THIN QFN
______________________________________________________________________________________
43
MAX1020–MAX1023/MAX1057/MAX1058
Pin Configurations
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
32, 44, 48L QFN.EPS
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
D2
D
CL
D/2
b
D2/2
k
E/2
E2/2
CL
(NE-1) X e
E
E2
k
L
DETAIL A
e
(ND-1) X e
DETAIL B
e
CL
L
L1
CL
L
L
e
A1
A2
e
DALLAS
SEMICONDUCTOR
A
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE
32, 44, 48, 56L THIN QFN, 7x7x0.8mm
APPROVAL
DOCUMENT CONTROL NO.
21-0144
44
______________________________________________________________________________________
REV.
D
1
2
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE
32, 44, 48, 56L THIN QFN, 7x7x0.8mm
APPROVAL
DOCUMENT CONTROL NO.
21-0144
REV.
D
2
______________________________________________________________________________________
2
45
MAX1020–MAX1023/MAX1057/MAX1058
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
QFN THIN 6x6x0.8.EPS
MAX1020–MAX1023/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
D2
D
CL
D/2
b
D2/2
k
E/2
E2/2
(NE-1) X e
E
CL
E2
k
e
L
(ND-1) X e
e
L
CL
CL
L1
L
L
e
A1
A2
e
A
PACKAGE OUTLINE
36, 40, 48L THIN QFN, 6x6x0.8mm
21-0141
46
______________________________________________________________________________________
E
1
2
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT FOR 0.4mm LEAD PITCH PACKAGE T4866-1.
PACKAGE OUTLINE
36, 40, 48L THIN QFN, 6x6x0.8mm
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
21-0141
E
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
47 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX1020–MAX1023/MAX1057/MAX1058
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)