ETC GFD55N03

GFD55N03
Vishay Semiconductors
New Product
N-Channel Enhancement-Mode MOSFET
H
C
N
E ET
R
T ENF
G TO-252 (DPAK)
D
VDS 30V
RDS(ON) 7mΩ
ID 75A
®
0.265 (6.73)
0.255 (6.48)
G
0.094 (2.39)
0.087 (2.21)
S
0.214 (5.44)
0.206 (5.23)
0.023 (0.58)
0.018 (0.46)
0.190
(4.826)
D
0.050 (1.27)
0.035 (0.89)
0.165
(4.191)
0.170 (4.32) min.
0.245 (6.22)
0.235 (5.97)
G
0.410 (10.41)
0.380 (9.65)
0.060 (1.52)
0.045 (1.14)
S
0.100
(2.54)
0.197 (5.00)
0.177 (4.49)
0.118
(3.0)
0.035 (0.89)
0.028 (0.71)
0.040 (1.02)
0.025 (0.64)
0.023 (0.58)
0.018 (0.46)
0.204 (5.18)
0.156 (3.96)
0.020 (0.51)
min.
0.045 (1.14)
0.035 (0.89)
0.009 (0.23)
0.001 (0.03)
0.243
(6.172)
Dimensions in inches
and (millimeters)
0.063
(1.6)
Mounting Pad Layout
Mechanical Data
Features
Case: JEDEC TO-252 molded plastic body
Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
High temperature soldering guaranteed:
250°C/10 seconds at terminals
Weight: 0.011oz., 0.4g
• Advanced Trench Process Technology
• High Density Cell Design for Ultra Low On-Resistance
• Specially Designed for Low Voltage DC/DC Converters
and motor drives
• Fast Switching for High Efficiency
Maximum Ratings and Thermal Characteristics (T
C
Parameter
= 25°C unless otherwise noted)
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
± 20
ID
75
47
IDM
180
PD
62.5
25.0
2.5
W
TJ, Tstg
–55 to 150
°C
RθJC
2.0
°C/W
RθJA
50
°C/W
Continuous Drain Current(3)
TJ = 150°C
Pulsed Drain Current
TC = 25°C
TC = 100°C
(1)
Power Dissipation
TJ = 150°C
TC = 25°C
TC = 100°C
TA = 25°C (2)
Operating Junction and Storage Temperature Range
Junction-to-Case Thermal Resistance
(2)
Junction-to-Ambient Thermal Resistance
Unit
V
A
Notes: (1) Pulse width limited by maximum junction temperature
(2) Surface mounted on a 1-in2 2oz. Cu PCB (FR-4 material)
(3) Maximum DC current limited by the package
Document Number 74591
8-Jan-02
www.vishay.com
1
GFD55N03
Vishay Semiconductors
Electrical Characteristics (T
= 25°C unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
BVDSS
VGS = 0V, ID = 250µA
30
–
–
V
–
17
–
mV/ °C
1.0
–
3.0
V
J
Static
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient ∆BVDSS/∆TJ Ref. to 25°C, ID = 250µA
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
∆VGS(th)/∆TJ Ref. to 25°C, ID = 250µA
Gate Threshold VoltageTemp. Coefficient
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Current(1)
ID(on)
Drain-Source On-State Resistance(1)
RDS(on)
Forward Transconductance(1)
gfs
–
–5
–
mV/ °C
VDS = 0V, VGS = ±20V
–
–
±100
nA
VDS = 24V, VGS = 0V
–
–
1.0
VDS = 24V, VGS = 0V, TJ = 125°C
–
–
10
VDS ≥ 5V, VGS = 10V
50
–
–
VGS = 10V, ID = 25A
–
5.0
7
VGS = 4.5V, ID = 20A
–
7.5
10
VDS = 10V, ID = 25A
–
60
–
VDS=15V, VGS=5V, ID=25A
–
31
45
–
58
80
–
9.4
–
µA
A
mΩ
S
Dynamic
Total Gate Charge (1)
Gate-Source Charge
Qg
(1)
Qgs
VDS = 15V, VGS = 10V
ID = 25A
Gate-Drain Charge (1)
Qgd
–
10.5
–
Turn-On Delay Time (1)
td(on)
–
10
20
tr
VDD = 15V, ID = 1A
–
13
25
td(off)
VGEN = 10V, RG = 6Ω
–
82
120
Rise Time (1)
Turn-Off Delay Time
(1)
Fall Time (1)
nC
ns
tf
–
30
50
Input Capacitance
Ciss
3100
–
Output Capacitance
Coss
–
670
–
Reverse Transfer Capacitance
Crss
VGS = 0V
VDS = 15V
f = 1.0MHZ
–
–
410
–
IS
–
–
–
75
A
ISM
–
–
–
180
A
VSD
IS = 25A, VGS = 0V
–
0.9
1.3
V
–
220
–
ns
IF = 15A, di/dt = 100A/µs
–
3.3
–
A
–
400
–
nC
pF
Source-Drain Diode
Maximum Diode Forward Current (3)
Max. Pulsed Diode Forward Current
(2)
(1)
Diode Forward Voltage
(1)
Reverse Recovery Time
trr
Diode Forward Voltage(1)
VSD
(1)
Reverse Recovery Charge
Qrr
Notes: (1) Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2%
(2) Pulse width limited by max. junction temp.
(3) Max. DC current limited by the package
RD
VIN
Switching
Test Circuit
ton
VOUT
D
Switching
Waveforms
td(on)
RG
tr
td(off)
tf
90 %
90%
Output, VOUT
VGEN
toff
10%
10%
INVERTED
DUT
G
90%
50%
S
Input, VIN
50%
10%
PULSE WIDTH
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Document Number 74591
8-Jan-02
GFD55N03
Vishay Semiconductors
Ratings and
Characteristic Curves (T
A
= 25°C unless otherwise noted)
Fig. 2 – Transfer Characteristics
Fig. 1 – Output Characteristics
70
80
VDS = 10V
ID -- Drain Source Current (A)
ID -- Drain-to-Source Current (A)
VGS = 4.0V, 4.5V, 5.0V, 6.0V, 10.0V
3.5V
60
40
3.0V
20
VGS = 2.5V
0
60
50
40
30
TJ = 125°C
20
25°C
--55°C
10
0
0
1
2
3
4
5
1
1.5
2
2.5
3
3.5
4
VDS -- Drain-to-Source Voltage (V)
VGS -- Gate-to-Source Voltage (V)
Fig. 3 – Threshold Voltage
Fig. 4 – On-Resistance vs.
Drain Current
1.4
4.5
0.015
RDS(ON) -- On-Resistance (Ω)
V(th) -- Gate-to-Source Threshold
Voltage (Normalized)
ID = 250µA
1.2
1
0.8
0.6
0.4
--50
0.01
VGS = 4.5V
0.005
VGS = 10V
0
--25
0
25
50
75
100
125
0
150
10
20
Fig. 5 – On-Resistance vs.
Junction Temperature
50
70
60
80
0.03
VGS = 10V
ID = 25A
ID = 25A
RDS(ON) -- On-Resistance (Ω)
RDS(ON) -- On-Resistance
(Normalized)
40
Fig. 6 – On-Resistance vs.
Gate-to-Source Voltage
1.6
1.4
1.2
1
0.8
0.6
--50
30
ID -- Drain Current (A)
TJ -- Junction Temperature (°C)
--25
0
25
50
75
100
TJ -- Junction Temperature (°C)
Document Number 74591
8-Jan-02
125
150
0.025
0.02
0.015
TJ = 125°C
0.01
0.005
0
2.0
25°C
4.0
6.0
8.0
10.0
VGS -- Gate-to-Source Voltage (V)
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3
GFD55N03
Vishay Semiconductors
Ratings and
Characteristic Curves (T
A
= 25°C unless otherwise noted)
Fig. 7 – Gate Charge
Fig. 8 – Capacitance
4000
VDS = 15V
ID = 25A
f = 1MHZ
VGS = 0V
3500
Ciss
8
C -- Capacitance (pF)
VGS -- Gate-to-Source Voltage (V)
10
6
4
3000
2500
2000
1500
1000
Coss
2
500
0
0
0
10
20
30
40
50
60
70
Crss
0
5
10
15
20
25
Qg -- Gate Charge (nC)
VDS -- Drain-to-Source Voltage (V)
Fig. 9 – Source-Drain Diode
Forward Voltage
Fig. 10 – Transient Thermal
Impedance
30
100
D = 0.5
RθJA (norm) -- Normalized Thermal
Impedance
IS -- Source Current (A)
VGS = 0V
TJ = 125°C
10
25°C
0.2
0.1
0.05
Single Pulse, 0.02
1. Duty Cycle, D = t1/t2
2. RθJC(t) = RθJC(norm) *RθJC
3. RθJC = 2.0°C/W
4. TJ -- TC = PDM* RθJC(t)
--55°C
1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Pulse Duration (sec.)
VSD -- Source-to-Drain Voltage (V)
Fig. 11 – Power vs. Pulse Duration
Fig. 12 – Maximum Safe Operating Area
1000
1000
Single Pulse
RθJC = 2.0°C/W
TC = 25°C
ID -- Drain Current (A)
800
600
400
10
1m
0.001
0.01
0.1
1
10
m
0m
RDS(ON) Limit
DC
10
s
10
10
s
s
VGS = 10V
Single Pulse
RθJC = 2.0°C/W
TC = 25°C
200
0
0.0001
0µ
s
100
1
0.1
1
10
100
VDS -- Drain-Source Voltage (V)
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Document Number 74591
8-Jan-02