19-3693; Rev 2; 1/07 Ultra-Small, Overvoltage Protection/ Detection Circuits The MAX16010–MAX16014 is a family of ultra-small, lowpower, overvoltage protection circuits for high-voltage, high-transient systems such as those found in automotive, telecom, and industrial applications. These devices operate over a wide 5.5V to 72V supply voltage range, making them also suitable for other applications such as battery stacks, notebook computers, and servers. The MAX16010 and MAX16011 offer two independent comparators for monitoring both undervoltage and overvoltage conditions. These comparators offer opendrain outputs capable of handling voltages up to 72V. The MAX16010 features complementary enable inputs (EN/EN), while the MAX16011 features an active-high enable input and a selectable active-high/low OUTB output. The MAX16012 offers a single comparator and an independent reference output. The reference output can be directly connected to either the inverting or noninverting input to select the comparator output logic. The MAX16013 and MAX16014 are overvoltage protection circuits that are capable of driving two p-channel MOSFETs to prevent reverse-battery and overvoltage conditions. One MOSFET (P1) eliminates the need for external diodes, thus minimizing the input voltage drop. The second MOSFET (P2) isolates the load or regulates the output voltage during an overvoltage condition. The MAX16014 keeps the MOSFET (P2) latched off until the input power is cycled. Features ♦ Wide 5.5V to 72V Supply Voltage Range ♦ Open-Drain Outputs Up to 72V (MAX16010/MAX16011/MAX16012) ♦ Fast 2µs (max) Propagation Delay ♦ Internal Undervoltage Lockout ♦ p-Channel MOSFET Latches Off After an Overvoltage Condition (MAX16014) ♦ Adjustable Overvoltage Threshold ♦ -40°C to +125°C Operating Temperature Range ♦ Small 3mm x 3mm TDFN Package Ordering Information PINPACKAGE PKG CODES -40°C to +125°C 8 TDFN-EP** T833-2 -40°C to +125°C 8 TDFN-EP** T833-2 MAX16012TT-T -40°C to +125°C 6 TDFN-EP** T633-2 MAX16013TT-T -40°C to +125°C 6 TDFN-EP** T633-2 MAX16014TT-T -40°C to +125°C 6 TDFN-EP** T633-2 PART* TEMP RANGE MAX16010TA_-T MAX16011TA_-T Note: Replace the “_” with “A” for 0.5% hysteresis, “B” for 5% hysteresis, and “C” for 7.5% hysteresis. *Replace -T with +T for lead-free packages. **EP = Exposed pad. The MAX16010 and MAX16011 are available in small 8-pin TDFN packages, while the MAX16012/MAX16013/ MAX16014 are available in small 6-pin TDFN packages. These devices are fully specified from -40°C to +125°C. Typical Operating Circuit P1 P2 Applications Automotive VBATT Industrial 48V Telecom/Server/Networking 2MΩ* FireWire® Notebook Computers GATE1 VCC GATE2 Multicell Battery-Stack Powered Equipment R1 FireWire is a registered trademark of Apple Computer, Inc. SET R2 Pin Configurations appear at end of data sheet. MAX16013 MAX16014 GND *OPTIONAL ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX16010–MAX16014 General Description MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/ Detection Circuits ABSOLUTE MAXIMUM RATINGS (All pins referenced to GND, unless otherwise noted.) VCC .........................................................................-0.3V to +80V EN, EN, LOGIC...........................................-0.3V to (VCC + 0.3V) INA+, INB-, IN+, IN-, REF, SET ..............................-0.3V to +12V OUTA, OUTB, OUT.................................................-0.3V to +80V GATE1, GATE2 to VCC ...........................................-12V to +0.3V GATE1, GATE2...........................................-0.3V to (VCC + 0.3V) Current Sink/Source (all pins) .............................................50mA Continuous Power Dissipation (TA = +70°C) 6-Pin TDFN (derate 18.2mW/°C above +70°C) .........1455mW 8-Pin TDFN (derate 18.2mW/°C above +70°C) .........1455mW Operating Temperature Range .........................-40°C to +125°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-60°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = 14V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER Supply Voltage Range Input Supply Current VCC Undervoltage Lockout SYMBOL CONDITIONS VCC ICC VUVLO VTH- TYP 5.5 VCC = 48V 25 40 4.75 5 5.25 1.215 1.245 1.265 0.5% hysteresis, MAX16010/MAX16011 1.21 1.223 1.26 5.0% hysteresis, MAX16010/MAX16011/ MAX16013/MAX16014 1.15 1.18 1.21 7.5% hysteresis MAX16010/MAX16011 1.12 1.15 1.18 No load VCC rising, part enabled, VINA+ = 2V, OUTA deasserted (MAX16010/MAX16011), VIN = 2V, VOUT deasserted (MAX16012), VSET = 0V, GATE2 = VCLMP (MAX16013/ MAX16014) Threshold-Voltage Hysteresis MAX16010TAB/MAX16011TAB/ MAX16013/MAX16014 5.0 SET/IN_ Input Current SET/IN_ = 2V MAX16010TAC/MAX16011TAC IN_ Operating Voltage Range tSTART VCC rising from 0 to 5.5V IN_ to OUT/SET to GATE2 Propagation Delay tPROP IN_/SET rising from (VTH - 100mV) to (VTH + 100mV) or falling from (VTH + 100mV) to (VTH - 100mV) (no load) OUT_ Output-Voltage Low VOL µA V V % 7.5 -100 +100 0 Startup Response Time 2 V 30 0.5 ILEAK UNITS 72.0 20 MAX16010TAA/MAX16011TAA OUT_ Leakage Current MAX VCC = 12V VTH+ INA+/INB-/SET Threshold Voltage MIN 4 100 nA V µs 2 µs VCC ≥ 5.5V, ISINK = 3.2mA 0.4 V VCC ≥ 2.8V, ISINK = 100µA 0.4 V OUT_ = 72V 500 nA _______________________________________________________________________________________ Ultra-Small, Overvoltage Protection/ Detection Circuits (VCC = 14V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX VIL EN/EN, LOGIC Input Voltage UNITS 0.4 VIH V 1.4 EN/EN, LOGIC Input Current 1 EN/EN, LOGIC Pulse Width 2 µA 10 µs VCC to GATE_ Output Low Voltage IGATE_SINK = 75µA, IGATE_SOURCE = 1µA, VCC = 14V 7 11 V VCC to GATE_ Clamp Voltage VCC = 24V 12 18 V 1.320 V MAX16012 Reference Output Voltage VREF Reference Short-Circuit Current No load ISHORT Reference Load Regulation Input Offset Voltage 1.275 1.3 REF = GND 100 Sourcing, 0 ≤ IREF ≤ 1µA 0.1 Sinking, -1µA ≤ IREF ≤ 0 0.1 VCM = 0 to 2V µA mV/µA -12.5 +12.5 mV Input Offset Current 3 nA Input Hysteresis 8 mV Common-Mode Voltage Range CMVR Common-Mode Rejection Ratio CMRR DC 0 70 2.0 dB V Comparator Power-Supply Rejection Ratio PSRR MAX16012, DC 70 dB Note 1: 100% production tested at TA = +25°C and TA = +125°C. Specifications at TA = -40°C are guaranteed by design. Typical Operating Characteristics (VIN = 14V, TA = +25°C, unless otherwise noted.) 25 15 MAX16012 IN+ = IN- = GND MAX16010/MAX16011 INA+ = INB- = GND OUTPUTS ENABLED 26.40 26.35 26.30 26.25 26.20 26.15 26.10 25 35 40 VGATE 30 20 VCC - VGATE 10 0 26.00 15 MAX16013/MAX16014 SET = GND, EN = VCC 50 26.05 10 5 60 MAX16010 toc02 MAX16013/MAX16014 SET = GND, EN = VCC GATE VOLTAGE (V) SUPPLY CURRENT (µA) 30 26.45 SUPPLY CURRENT (µA) MAX16013/MAX16014 SET = GND, EN = VCC 20 26.50 MAX16010 toc01 40 35 GATE VOLTAGE vs. SUPPLY VOLTAGE SUPPLY CURRENT vs. TEMPERATURE MAX16010 toc03 SUPPLY CURRENT vs. SUPPLY VOLTAGE 45 55 SUPPLY VOLTAGE (V) 65 75 -40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (°C) 5 15 25 35 45 55 65 75 SUPPLY VOLTAGE (V) _______________________________________________________________________________________ 3 MAX16010–MAX16014 ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (VIN = 14V, TA = +25°C, unless otherwise noted.) INA+/INB-/SET THRESHOLD vs. TEMPERATURE 5.2 5.1 5.0 RISING 4.9 4.8 4.7 4.6 FALLING 4.5 INA+/INB-/SET RISING EN = VCC 1.29 10.0 1.28 1.27 9.9 1.26 1.25 1.24 MAX16013/MAX16014 SET = GND, EN = VCC 9.8 (VCC - VGATE) (V) 5.3 1.30 MAX16010 toc05 INA+/INB-/SET = GND EN = VCC INA+/INB-/SET THRESHOLD (V) 5.4 MAX16010 toc04 5.5 GATE VOLTAGE vs. TEMPERATURE 9.7 9.6 9.5 9.4 1.23 9.3 1.22 9.2 1.21 9.1 1.20 9.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C) STARTUP WAVEFORM (ROUT = 100Ω, CIN = 10µF, COUT = 10nF) STARTUP WAVEFORM (ROUT = 100Ω, CIN = 10µF, COUT = 10nF) MAX16010 toc07 MAX16010 toc08 VCC 1V/div VCC 10V/div VGATE 10V/div VGATE 5V/div VOUT 10V/div VOUT 10V/div VEN = 0 TO 2V 200µs/div 20µs/div OVERVOLTAGE SWITCH FAULT (ROUT = 100Ω, CIN = 80µF, COUT = 10nF) OVERVOLTAGE LIMIT (ROUT = 100Ω, CIN = 80µF, COUT = 10nF) MAX16010 toc09 MAX16010 toc10 VCC 20V/div VCC 20V/div VGATE 20V/div VGATE 20V/div VOUT 20V/div VIN = 12V TO 40V, TRIP THRESHOLD = 28V 1ms/div 4 MAX16010 toc06 UVLO THRESHOLD vs. TEMPERATURE UVLO THRESHOLD (V) MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/ Detection Circuits VOUT 20V/div VIN = 12V TO 40V TRIP THRESHOLD = 28V 1ms/div _______________________________________________________________________________________ Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010 MAX16011 MAX16012 MAX16013 MAX16014 PIN 1 1 1 1 VCC Positive-Supply Input Voltage. Connect VCC to a 5.5V to 72V supply. 2 2 2 2 GND Ground 3 — — — EN NAME 4 4 — — OUTB 5 5 — — INB- FUNCTION Active-Low Enable Input. Drive EN low to turn on the voltage detectors. Drive EN high to force the OUTA and OUTB outputs low. EN is internally pulled up to VCC. Connect EN to GND if not used. Open-Drain Monitor B Output. Connect a pullup resistor from OUTB to VCC. OUTB goes low when INB- exceeds VTH+ and goes high when INB- drops below VTH- (with LOGIC connected to GND for the MAX16011). Drive LOGIC high to reverse OUTB’s logic state. OUTB is usually used as an overvoltage output. OUTB goes low (LOGIC = low) or high (LOGIC = high) when VCC drops below the UVLO threshold voltage. Adjustable Voltage Monitor Threshold Input Active-High ENABLE Input. For the MAX16010/MAX16011, drive EN high to turn on the voltage detectors. Drive EN low to force OUTA low and OUTB low (LOGIC = low) or high (LOGIC = high). For the MAX16013/MAX16014, drive EN high to enhance the p-channel MOSFET (P2), and drive EN low to turn off the MOSFET. EN is internally pulled down to GND. Connect EN to VCC if not used. 6 6 — 5 EN 7 7 — — OUTA Open-Drain Monitor A Output. Connect a pullup resistor from OUTA to VCC. OUTA goes low when INA+ drops below VTH- and goes high when INA+ exceeds VTH+. OUTA is usually used as an undervoltage output. OUTA also goes low when VCC drops below the UVLO threshold voltage. 8 8 — — INA+ Adjustable Voltage Monitor Threshold Input — 3 — — LOGIC — — 3 — OUT — — 4 — IN- Inverting Comparator Input — — 5 — REF Internal 1.30V Reference Output. Connect REF to IN+ for active-low output. Connect REF to IN- for active-high output. REF can source and sink up to 1µA. Leave REF floating if not used. REF output is stable with capacitive loads from 0 to 50pF. — — 6 — IN+ Noninverting Comparator Input OUTB Logic-Select Input. Connect LOGIC to GND or VCC to configure the OUTB logic. See the MAX16011 output logic table. Open-Drain Comparator Output. Connect a pullup resistor from OUT to VCC. OUT goes low when IN+ drops below IN-. OUT goes high when IN+ exceeds IN-. Gate-Driver Output. Connect GATE2 to the gate of an external p-channel MOSFET pass switch. GATE2 is driven low to the higher of VCC - 10V or GND during normal operations and quickly shorted GATE2 to VCC during an overvoltage condition (SET above the internal threshold). GATE2 is shorted to VCC when the supply voltage goes below the UVLO threshold voltage. GATE2 is shorted to VCC when EN is low. — — — 3 — — — 4 SET — — — 6 GATE1 — — — — EP Device Overvoltage Threshold Adjustment Input. Connect SET to an external resistive divider network to adjust the desired overvoltage disable or overvoltage limit threshold (see the Typical Application Circuit and Overvoltage Limiter section). Gate-Driver Output. Connect GATE1 to the gate of an external p-channel MOSFET to provide low drop reverse voltage protection. Exposed Pad. Connect EP to GND. _______________________________________________________________________________________ 5 MAX16010–MAX16014 Pin Description MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/ Detection Circuits Voltage Monitoring +48V R1 EN INA+ VCC OUTA OUTB R2 EN IN DC-DC REGULATOR MAX16010 INBR3 GND EN The MAX16010/MAX16011 include undervoltage and overvoltage comparators for window detection (see Figure 1). OUT_ asserts high when the monitored voltage is within the selected “window.” OUTB asserts low when the monitored voltage falls below the lower (VTRIPLOW) limit of the window, or OUTA asserts low if the monitored voltage exceeds the upper limit (VTRIPHIGH). The application in Figure 1 shows OUT_ enabling the DC-DC converter when the monitored voltage is in the selected window. The resistor values R1, R2, and R3 can be calculated as follows: ⎛ R ⎞ VTRIPLOW = VTH − ⎜ TOTAL ⎟ ⎝ R2 + R 3 ⎠ Figure 1. MAX16010 Monitor Circuit Detailed Description The MAX16010–MAX16014 is a family of ultra-small, lowpower, overvoltage protection circuits for high-voltage, high-transient systems such as those found in automotive, telecom, and industrial applications. These devices operate over a wide 5.5V to 72V supply voltage range, making them also suitable for other applications such as battery stacks, notebook computers, and servers. The MAX16010 and MAX16011 offer two independent comparators for monitoring both undervoltage and overvoltage conditions. These comparators offer opendrain outputs capable of handling voltages up to 72V. The MAX16010 features complementary enable inputs (EN/EN), while the MAX16011 features an active-high enable input and a selectable active-high/low OUTB output. The MAX16012 offers a single comparator and an independent reference output. The reference output can be directly connected to either the inverting or noninverting input to select the comparator output logic. The MAX16013 and MAX16014 are overvoltage protection circuits that are capable of driving two p-channel MOSFETs to prevent reverse battery and overvoltage conditions. One MOSFET (P1) eliminates the need for external diodes, thus minimizing the input voltage drop. While the second MOSFET (P2) isolates the load or regulates the output voltage during an overvoltage condition. The MAX16014 keeps the MOSFET (P2) latched off until the input power is cycled. 6 ⎛R ⎞ VTRIPHIGH = VTH + ⎜ TOTAL ⎟ ⎝ R3 ⎠ where RTOTAL = R1 + R2 + R3. Use the following steps to determine the values for R1, R2, and R3. 1) Choose a value for RTOTAL, the sum of R1, R2, and R3. Because the MAX16010/MAX16011 have very high input impedance, RTOTAL can be up to 5MΩ. 2) Calculate R3 based on R TOTAL and the desired upper trip point: R3 = VTH + × R TOTAL VTRIPHIGH 3) Calculate R2 based on RTOTAL, R3, and the desired lower trip point: R2 = VTH − × R TOTAL − R3 VTRIPLOW 4) Calculate R1 based on RTOTAL, R3, and R2: R1 = RTOTAL - R2 - R3 The MAX16012 has both inputs of the comparator available with an integrated 1.30V reference (REF). When the voltage at IN+ is greater than the voltage at IN- then OUT goes high. When the voltage at IN- is greater than the voltage at IN+ then OUT goes low. Connect REF to IN+ or IN- to set the reference voltage value. Use an external resistive divider to set the monitored voltage threshold. _______________________________________________________________________________________ Ultra-Small, Overvoltage Protection/ Detection Circuits P1 VCC R1 P2 VBATT RPULLUP IN+ VCC GATE1 GATE2 R2 REF MAX16012 OUT OUT R1 MAX16013 SET IN- R2 GND GND Figure 2. Typical Operating Circuit for the MAX16012 Figure 3. Overvoltage Limiter Protection The MAX16013/MAX16014 can be configured as an overvoltage switch controller to turn on/off a load (see the Typical Application Circuit). When the programmed overvoltage threshold is tripped, the internal fast comparator turns off the external p-channel MOSFET (P2), pulling GATE2 to VCC to disconnect the power source from the load. When the monitored voltage goes below the adjusted overvoltage threshold, the MAX16013 enhances GATE2, reconnecting the load to the power source (toggle ENABLE on the MAX16014 to reconnect the load). The MAX16013 can be configured as an overvoltage limiter switch by connecting the resistive divider to the load instead of VCC (Figure 3). See the Overvoltage Limiter section. Supply Voltage Connect a 5.5V to 72V supply to VCC for proper operation. For noisy environments, bypass VCC to GND with a 0.1µF or greater capacitor. When VCC falls below the UVLO voltage the following states are present (Table 1). Hysteresis Hysteresis adds noise immunity to the voltage monitors and prevents oscillation due to repeated triggering when the monitored voltage is near the threshold trip voltage. The hysteresis in a comparator creates two trip points: one for the rising input voltage (VTH+) and one for the falling input voltage (VTH-). These thresholds are shown in Figure 4. Enable Inputs (EN or EN) The MAX16011 offers an active-high enable input (EN), while the MAX16010 offers both an active-high enable input (EN) and active-low enable input (EN). For the MAX16010, drive EN low or EN high to force the output low. When the device is enabled (EN = high and EN = low) the state of OUTA and OUTB depends on INA+ and INB- logic states. VHYST Table 1. UVLO State (VCC < VUVLO) PART OUTA MAX16010 Low MAX16011 MAX16012 MAX16013 MAX16014 OUTB VTH+ OUT GATE2 Low — — Low Low, LOGIC = low High, LOGIC = high — — — — Low — VIN+ VTH- VCC VOUT tPROP tPROP tPROP 0V — — — High Figure 4. Input and Output Waveforms _______________________________________________________________________________________ 7 MAX16010–MAX16014 VBATT MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/ Detection Circuits Input Transients Clamping Table 2. MAX16011 Output Logic LOGIC INA+ INB- OUTA OUTB Low > VTH+ > VTH+ High Impedance Low Low < VTH- < VTH- Low High Impedance High > VTH+ > VTH+ High Impedance High Impedance High < VTH- < VTH- Low Low For the MAX16011, drive EN low to force OUTA low, OUTB low when LOGIC = low, and OUTB high when LOGIC = high. When the device is enabled (EN = high) the state of OUTA and OUTB depends on the INA+, INB-, and LOGIC input (see Table 2). For the MAX16013/MAX16014, drive EN low to pull GATE2 to VCC, turning off the p-channel MOSFET (P2). When the device is enabled (EN = high), GATE2 is pulled to the greater of (VCC - 10V) or GND turning on the external MOSFET (P2). Applications Information Load Dump Most automotive applications are powered by a multicell, 12V lead-acid battery with a voltage between 9V and 16V (depending on load current, charging status, temperature, battery age, etc.). The battery voltage is distributed throughout the automobile and is locally regulated down to voltages required by the different system modules. Load dump occurs when the alternator is charging the battery and the battery becomes disconnected. Power in the alternator inductance flows into the distributed power system and elevates the voltage seen at each module. The voltage spikes have rise times typically greater than 5ms and decays within several hundred milliseconds but can extend out to 1s or more depending on the characteristics of the charging system. These transients are capable of destroying sensitive electronic equipment on the first fault event. The MAX16013/MAX16014 provide the ability to disconnect the load from the charging system during an overvoltage condition to protect the module. In addition, the MAX16013 can be configured in a voltage-limiting mode. This allows continuous operation while providing overvoltage protection. See the Overvoltage Limiter section. 8 When the external MOSFET is turned off during an overvoltage occurrence, stray inductance in the power path may cause voltage ringing to exceed the MAX16013/MAX16014 absolute maximum input (VCC) supply rating. The following techniques are recommended to reduce the effect of transients: • Minimize stray inductance in the power path using wide traces, and minimize loop area including the power traces and the return ground path. • Add a zener diode or transient voltage suppresser (TVS) rated below VCC absolute maximum rating (Figure 3). Overvoltage Limiter When operating in overvoltage-limiter mode, the MAX16013 drives the external p-channel MOSFET (P2), resulting in the external MOSFET operating as a voltage regulator. During normal operation, GATE2 is pulled to the greater of (VCC - 10V) or GND. The external MOSFET’s drain voltage is monitored through a resistor-divider between the P2 output and SET. When the output voltage rises above the adjusted overvoltage threshold, an internal comparator pulls GATE2 to VCC. When the monitored voltage goes below the overvoltage threshold, the p-channel MOSFET (P2) is turned on again. This process continues to keep the voltage at the output regulated to within approximately a 5% window. The output voltage is regulated during the overvoltage transients and the MOSFET (P2) continues to conduct during the overvoltage event, operating in switched-linear mode. Caution must be exercised when operating the MAX16013 in voltage-limiting mode for long durations due to the MOSFET’s power dissipation consideration (see the MOSFET Selection and Operation section). MOSFET Selection and Operation (MAX16013 and MAX16014) Most battery-powered applications must include reverse voltage protection. Many times this is implemented with a diode in series with the battery. The disadvantage in using a diode is the forward voltage drop of the diode, which reduces the operating voltage available to downstream circuits (V LOAD = V BATTERY - V DIODE ). The MAX16013 and MAX16014 include high-voltage GATE1 drive circuitry allowing users to replace the high-voltagedrop series diode with a low-voltage-drop MOSFET device (as shown in the Typical Operating Circuit and Figure 3). The forward voltage drop is reduced to ILOAD x RDS-ON of P1. With a suitably chosen MOSFET, the voltage drop can be reduced to millivolts. _______________________________________________________________________________________ Ultra-Small, Overvoltage Protection/ Detection Circuits P1 = ILOAD2 x RDS-ON During reverse-battery applications, GATE1 is limited to GND and the P1 gate-source junction is reverse biased. P1 is turned off and neither the MAX16013/ MAX16014 nor the load circuitry is exposed to the reverse-battery voltage. Care should be taken to place P1 (and its internal drain-to-source diode) in the correct orientation for proper reverse battery operation. P2 protects the load from input overvoltage conditions. During normal operating modes (the monitored voltage is below the adjusted overvoltage threshold), internal GATE2 output circuitry enhances P2 to a 10V gate-tosource (VGS) for 11V < VCC < 72V. The constant 10V enhancement ensures P2 operates in a low R DS-ON mode but the gate-to-source junction is not overstressed during high-battery-voltage applications (many pFET devices specify a ±20V VGS absolute maximum). As VCC drops below 10V, GATE2 is limited to GND, reducing P2 VGS to VCC - GND. In normal operation, the P2 power dissipation is very low: P2 = ILOAD2 x RDS-ON During overvoltage conditions, P2 is either turned completely off (overvoltage-switch mode) or cycled off-onoff (voltage-limiter mode). Care should be taken to place P2 (and its internal drain-to-source diode) in the correct orientation for proper overvoltage protection operation. During voltage-limiter mode, the drain of P2 is limited to the adjusted overvoltage threshold, while the battery (VCC) voltage rises. During prolonged overvoltage events, P2 temperature can increase rapidly due to the high power dissipation. The power dissipated by P2 is: P2 = VDS-P2 x ILOAD = (VCC - VOV-ADJUSTED) x ILOAD where VCC ~ VBATTERY and VOV-ADJUSTED is the desired load limit voltage. For prolonged overvoltage events with high P2 power dissipation, proper heatsinking is required. Adding External Pullup Resistors It may be necessary to add an external resistor from V CC to GATE1 to provide enough additional pullup capability when the GATE1 input goes high. The GATE_ output can only source up to 1µA current. If the source current is less than 1µA, no external resistor may be necessary. However, to improve the pullup capability of the GATE_ output when it goes high, connect an external resistor between VCC and the GATE_. The application shows a 2MΩ resistor, which is large enough not to impact the sinking capability of the GATE_ (during normal operation) while providing enough pullup during an overvoltage event. With an 11V (worst case) VCC -to-gate clamp voltage and a sinking current of 75µA, the smallest resistor should be 11V/75µA, or about 147kΩ. However, since the GATE_ is typically low most of the time, a higher value should be used to reduce overall power consumption. _______________________________________________________________________________________ 9 MAX16010–MAX16014 In normal operating mode, internal GATE1 output circuitry enhances P1 to a 10V gate-to-source (VGS) for 11V < V CC < 72V. The constant 10V enhancement ensures P1 operates in a low RDS-ON mode, but the gate-source junction is not overstressed during highbattery-voltage application or transients (many MOSFET devices specify a ±20V VGS absolute maximum). As VCC drops below 10V GATE1 is limited to GND, reducing P1 VGS to VCC - GND. In normal operation the P1 power dissipation is very low: Ultra-Small, Overvoltage Protection/ Detection Circuits MAX16010–MAX16014 Functional Diagrams VCC REGULATOR VCC REGULATOR ~4V ~4V MAX16010 MAX16011 OUTA INA+ OUTA INA+ HYST HYST OUTB INB- OUTB INB- HYST HYST 1.23V 1.23V GND ENABLE CIRCUITRY EN ENABLE CIRCUITRY EN GND Figure 5. MAX16010 Functional Diagram Figure 6. MAX16011 Functional Diagram VCC ~4V SET MAX16012 GATE2 OUT IN- HYST 1.23V IN+ REF GATE1 1.30V MAX16013 MAX16014 ENABLE CIRCUITRY LATCH CLEAR GND GND Figure 7. MAX16012 Functional Diagram 10 LOGIC EN VCC REGULATOR OUTB LOGIC EN Figure 8. MAX16013/MAX16014 Functional Diagram ______________________________________________________________________________________ Ultra-Small, Overvoltage Protection/ Detection Circuits TOP VIEW INA+ OUTA EN INB- INA+ OUTA EN INB- 8 7 6 5 8 7 6 5 MAX16010 MAX16011 1 2 3 4 VCC GND EN OUTB TDFN (3mm x 3mm) 1 VCC 2 3 4 GND LOGIC OUTB TDFN (3mm x 3mm) IN+ REF IN- GATE1 EN SET 6 5 4 6 5 4 MAX16012 MAX16013 MAX16014 1 2 3 VCC GND OUT TDFN (3mm x 3mm) 1 2 3 VCC GND GATE2 TDFN (3mm x 3mm) Chip Information PROCESS: BiCMOS ______________________________________________________________________________________ 11 MAX16010–MAX16014 Pin Configurations Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 6, 8, &10L, DFN THIN.EPS MAX16010–MAX16014 Ultra-Small, Overvoltage Protection/ Detection Circuits PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm 21-0137 COMMON DIMENSIONS H 1 2 PACKAGE VARIATIONS SYMBOL MIN. MAX. PKG. CODE N D2 E2 e JEDEC SPEC b A 0.70 0.80 T633-1 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF D 2.90 3.10 T633-2 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF [(N/2)-1] x e E 2.90 3.10 T833-1 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF A1 0.00 0.05 T833-2 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF L 0.20 0.40 T833-3 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05 2.00 REF 2.00 REF k 0.25 MIN. T1033-1 10 1.50±0.10 A2 0.20 REF. T1033-2 10 1.50±0.10 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05 T1433-1 14 1.70±0.10 2.30±0.10 0.40 BSC ---- 0.20±0.05 2.40 REF T1433-2 14 1.70±0.10 2.30±0.10 0.40 BSC ---- 0.20±0.05 2.40 REF PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm -DRAWING NOT TO SCALE- 21-0137 H 2 2 Revision History Pages changed at Rev 2: 1, 10, 12 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.