19-1135; Rev 0; 9/96 B PC ATION EVALU ABLE AVAIL DC-to-Microwave, +5V Low-Noise Amplifier ____________________________Features ♦ Internally Biased ♦ High Gain: 18.3dB at 900MHz ♦ 3.9dB Noise Figure ♦ Single +4.5V to +5.5V Operation ♦ -1dBm Output 1dB Compression Power ♦ Low-Cost Silicon Bipolar Design ♦ Ultra-Small SOT143 Package ________________________Applications Wireless Local Loop ______________Ordering Information Global Positioning Systems (GPS) ISM Radios PART TEMP. RANGE PIN-PACKAGE MAX2650EUS-T -40°C to +85°C 4 SOT143 Special Mobile Radios Wireless Local-Area Networks Cellular Base Stations Set-Top Boxes __________Typical Operating Circuit __________________Pin Configuration TOP VIEW VCC OUT OUT CBLOCK VCC OUT 4 VCC 3 CBYP MAX2650 IN GND MAX2650 IN GND 2 1 IN CBLOCK SOT143 ________________________________________________________________ Maxim Integrated Products 1 For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800 MAX2650 _______________General Description The MAX2650 is a low-noise amplifier for use from DC to microwave frequencies. Operating from a single +5V supply, it has a flat gain response to 900MHz. The MAX2650’s low noise figure and high drive capability make it ideal for a variety of transmit, receive, and buffer applications. The device is internally biased, eliminating the need for external bias resistors or inductors. In a typical application, the only external components needed are input and output blocking capacitors and a V CC bypass capacitor. The MAX2650 comes in a 4-pin SOT143 package, requiring minimal board space. MAX2650 DC-to-Microwave, +5V Low-Noise Amplifier ABSOLUTE MAXIMUM RATINGS VCC to GND ..............................................................-0.3V to +8V Input Power ....................................................................+13dBm Continuous Power Dissipation (TA = +70°C) SOT143-4 (derate 4mW/°C above +70°C)...................320mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10sec) .............................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +5.0V, Z0 = 50Ω, fIN = 900MHz, TA = +25°C, unless otherwise noted.) PARAMETER Operating Temperature Range CONDITIONS (Note 1) Power Gain MIN TYP MAX -40 16.5 18.3 UNITS 85 °C 21 dB Output 1dB Compression Point -1 dBm Output IP3 10 dBm Noise Figure 3.9 dB Maximum Input Voltage Standing-Wave Ratio fIN = 100MHz to 1000MHz 1.5:1 Maximum Output Voltage Standing-Wave Ratio fIN = 800MHz to 1000MHz 1.3:1 Group Delay 300 Supply Voltage Supply Current 4.5 ps 5.5 15.5 17.7 20.0 TA = TMIN to TMAX 13.0 17.7 22.0 VCC = 4.5V to 5.5V 11.0 17.7 24.0 V mA Note 1: Parts are designed to operate over specified temperature range. Specifications are production tested and guaranteed at +25°C. 2 _______________________________________________________________________________________ DC-to-Microwave, +5V Low-Noise Amplifier OUTPUT 1dB COMPRESSION POINT vs. FREQUENCY +5 MAX2650-02 5 MAX2650-01 40 OUTPUT 1dB COMPRESSION POINT vs. FREQUENCY 3 +3 20 P-1 (dBm) P-1 (dBm) +85°C 1 +85°C -1 5.5V +1 5.0V -1 -40°C 4.5V 10 -40°C -3 +25°C -3 +25°C -5 4.5 5.0 -5 0.1 6.0 5.5 0.3 0.5 0.7 0.9 1.1 1.3 1.5 0.1 0.3 0.5 FREQUENCY (GHz) VCC (V) MAX2650-04 25 1.1 1.3 1.5 5.5V 20 GAIN (dB) 15 0.9 GAIN vs. FREQUENCY +85°C 20 0.7 FREQUENCY (GHz) GAIN vs. FREQUENCY 25 GAIN (dB) +25°C -40°C 10 15 4.5V 10 5.0V 5 5 0 0 0.3 0.5 0.7 0.9 1.1 1.3 0.1 1.5 0.3 0.5 0.7 0.9 1.1 1.3 FREQUENCY (GHz) FREQUENCY (GHz) NOISE FIGURE vs. FREQUENCY VOLTAGE STANDING-WAVE RATIO vs. FREQUENCY 5 3.5:1 +85°C 3 3.0:1 +25°C VSWR 4 1.5 MAX2650-06 0.1 MAX2650-07 4.0 MAX2650-05 0 NOISE FIGURE (dB) ICC (mA) 30 MAX2650-03 SUPPLY CURRENT vs. SUPPLY VOLTAGE -40°C 2.5:1 2 2.0:1 1 1.5:1 OUT IN 1.0:1 0 0.1 0.3 0.5 0.7 0.9 1.1 FREQUENCY (GHz) 1.3 1.5 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 FREQUENCY (GHz) _______________________________________________________________________________________ 3 MAX2650 __________________________________________Typical Operating Characteristics (VCC = 5.0V, Z0 = 50Ω, fIN = 900MHz, TA = +25°C, unless otherwise noted.) MAX2650 DC-to-Microwave, +5V Low-Noise Amplifier ______________________________________________________________Pin Description PIN NAME FUNCTION 1 IN Amplifier Input. Use a series blocking capacitor with less than 3Ω reactance at your lowest operating frequency. 2 GND Ground Connection. For optimum performance, provide a low-inductance connection to the ground plane. 3 OUT Amplifier Output. Use a series blocking capacitor with less than 3Ω reactance at your lowest operating frequency. 4 VCC Supply Connection. Bypass directly at the package pin. The value of the bypass capacitor is determined by the lowest operating frequency and is typically the same as the blocking capacitor value. For long VCC lines, additional bypassing may be necessary. Table 1. Typical Scattering Parameters (VCC = +5V, Z0 = 50Ω, TA = +25°C.) FREQUENCY (GHz) 4 S11 (mag) S11 (ang) S21 (dB) S21 (mag) S21 (ang) S12 (dB) S12 (mag) S12 (ang) S22 (mag) S22 (ang) K 0.05 0.17 -3 19.8 9.76 177 -37.8 0.013 8 0.42 -5 3.18 0.10 0.17 -6 19.8 9.72 172 -36.7 0.015 14 0.39 -6 2.92 0.20 0.16 9 19.7 9.69 161 -35.8 0.016 23 0.37 -13 2.70 0.30 0.14 8 19.7 9.70 151 -35.0 0.018 28 0.35 -19 2.54 0.40 0.16 0 19.6 9.52 140 -33.8 0.020 32 0.32 -26 2.31 0.50 0.16 -7 19.5 9.43 129 -33.2 0.022 34 0.28 -34 2.24 0.60 0.17 -17 19.3 9.21 119 -32.3 0.024 37 0.25 -43 2.12 0.70 0.18 -26 19.0 8.93 107 -31.7 0.026 41 0.21 -53 2.09 0.80 0.18 -39 18.6 8.46 95 -31.1 0.028 44 0.17 -62 2.10 0.90 0.20 -54 18.0 7.92 84 -29.5 0.033 48 0.13 -71 1.91 1.00 0.20 -66 17.4 7.40 73 -28.7 0.037 50 0.10 -76 1.88 1.20 0.19 -86 15.7 6.10 51 -26.9 0.045 52 0.05 -49 1.88 1.40 0.16 -86 13.4 4.69 31 -25.5 0.053 51 0.12 -12 2.03 1.60 0.15 -66 10.6 3.40 14 -24.4 0.060 44 0.24 -17 2.32 1.80 0.22 -40 7.4 2.35 5 -24.4 0.060 32 0.35 -27 3.01 2.00 0.33 -36 4.6 1.70 4 -25.3 0.055 22 0.43 -33 3.97 2.20 0.41 -38 3.1 1.43 6 -26.5 0.047 21 0.46 -33 4.85 2.40 0.44 -37 2.5 1.34 6 -28.6 0.037 22 0.49 -29 6.26 2.50 0.44 -37 2.3 1.30 4 -29.5 0.034 22 0.49 -25 7.05 _______________________________________________________________________________________ DC-to-Microwave, +5V Low-Noise Amplifier PC Board Layout Example An example PC board layout is given in Figure 1. It uses FR-4 with 31mil layer thickness between the RF lines and the ground plane. The board satisfies all the above requirements. __________Applications Information External Components As shown in the Typical Operating Circuit , the MAX2650 is easy to use. Input and output series capacitors may be necessary to block DC bias voltages (generated by the MAX2650) from interacting with adjacent circuitry. These capacitors must be large enough to contribute negligible reactance in a 50Ω system at the minimum operating frequency. Use the following equation to calculate their minimum value: CBLOCK = 53,000 RF IN RF OUT (pF) f where f (in MHz) is the minimum operating frequency. The VCC pin must be RF bypassed for correct operation. To accomplish this, connect a capacitor between the VCC pin and ground, as close to the package as is practical. Use the same equation given above (for DC blocking capacitor values) to calculate the minimum capacitor value. If there are long VCC lines on the PC board, additional bypassing may be necessary. This may be done further away from the package, at your discretion. Proper grounding of the GND pin is essential. If the PC board uses a topside RF ground, the GND pin should connect directly to it. For a board where the ground plane is not on the component side, the best technique is to connect the GND pin to it through multiple plated through-holes. MAX2650 VCC EXPANDED VIEW Figure 1. Example PC Board Layout _______________________________________________________________________________________ 5 MAX2650 _______________Detailed Description The MAX2650 is a broadband amplifier with flat gain and 50Ω input and output ports. Its small size and internal bias circuitry make it ideal for applications where board space is limited. MAX2650 DC-to-Microwave, +5V Low-Noise Amplifier +5V Low-Noise Amplifier ________________________________________Tape-and-Reel/Marking Information 4.0 ±0.1 1.0 ±0.1 1.75 ±0.1 2.0 ±0.05 1.5 +0.1/-0.0 DIAMETER A 3.5 ±0.05 8.0 ±0.3 2.2 ±0.1 0.5 RADIUS TYPICAL A0 4.0 ±0.1 1.0 MINIMUM A Bo Ko 0.30 ±0.05 0.8 ±0.05 0.30R MAX. MARKING INFORMATION † LOT SPECIFIC XX XX CODE Ao = 3.1mm ±0.1 Bo = 2.7mm ±0.1 Ko = 1.2mm ±0.1 DH = MAX2650 NOTE: DIMENSIONS ARE IN MM. AND FOLLOW EIA481-1 STANDARD. † ICs MAY ALSO BE MARKED WITH FULL PART NAME: MAX2650 ________________________________________________________Package Information DIM D 0°-8° A C I A1 e1 B A A1 B B1 C D E e e1 H I INCHES MIN MAX 0.031 0.001 0.014 0.030 0.0034 0.105 0.047 0.070 0.071 0.082 0.004 0.047 0.005 0.022 0.038 0.006 0.120 0.055 0.080 0.079 0.098 0.012 MILLIMETERS MAX MIN 0.787 0.025 0.356 0.762 0.086 2.667 1.194 1.778 1.803 2.083 0.102 1.194 0.127 0.559 0.965 0.152 3.048 1.397 2.032 2.007 2.489 0.305 21-0052A E H 4-PIN SOT143 SMALL-OUTLINE TRANSISTOR PACKAGE B1 e Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 6 ___________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600 © 1996 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.