FAIRCHILD FDP3651U

FDP3651U
N-Channel PowerTrench® MOSFET
100V, 80A, 15mΩ
Features
Applications
• rDS(on)=13 mΩ(Typ.), VGS = 10V, ID = 40A
• DC/DC converters and Off-Line UPS
• Qg(TOT)=49 nc(Typ.), VGS = 10 V
• Distributed Power Architectures and VRMs
• Low Miller Charge
• Primary Switch for 24V and 48V Systems
• Low Qrr Body Diode
• High Voltage Synchronous Rectifier
• UIS Capability (Single Pulse/Repetitive Pulse)
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
TO-220AB
FDP SERIES
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VDSS
Drain to Source Voltage
Parameter
Ratings
100
Units
V
VGSS
Gate to Source Voltage
±20
V
Drain Current -Continuous
ID
80
-Pulsed
PD
Power Dissipation
EAS
Single Pulsed Avalanche Energy
TJ, TSTG
Operating and Storage Temperature
TL
Maximum lead temperature soldering purposes,
1/8” from case for 5 seconds
A
(Note 1)
220
255
W
(Note 2)
266
mJ
-55 to 175
°C
300
°C
62
°C/W
0.59
°C/W
Thermal Characteristics
RθJA
Thermal Resistance , Junction to Ambient
RθJC
Thermal Resistance , Junction to Case
Package Marking and Ordering Information
Device Marking
FDP3651U
Device
FDP3651U
©2006 Fairchild Semiconductor Corporation
FDP3651U Rev. A
Reel Size
Tube
1
Tape Width
N/A
Quantity
50 units
www.fairchildsemi.com
FDP3651U N-Channel PowerTrench® MOSFET
July 2006
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
100
-
-
V
-
-
1
µA
-
-
250
µA
-
-
±100
nA
V
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250µA, VGS = 0V
IDSS
Zero Gate Voltage Drain Current
VDS = 80V
VGS = 0V
IGSS
Gate to Source Leakage Current
VGS = ±20V
TC=150°C
On Characteristics
VGS(th)
rDS(on)
Gate to Source Threshold Voltage
Drain to Source On Resistance
VGS = VDS, ID = -250µA
3.5
4.5
5.5
VGS = 10V , ID = 80A
-
15
18
VGS = 10V , ID = 40A
-
13
15
-
32
37
-
4152
5522
pF
-
485
728
pF
-
89
118
pF
-
49
69
nC
-
7
9.8
nC
-
23
-
nC
-
16
-
nC
VGS=10V, ID=40A,TJ=175oC
mΩ
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Qg(TOT)
Total Gate Charge
VGS = 0V to 10V
Qg(TH)
Threshold Gate Charge
VGS = 0V to 2V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain Charge
VDS = 25V,VGS = 0V
f=1MHz
VDD = 50V
ID = 80A
Resistive Switching Characteristics
t(on)
Turn-On Time
-
-
64
ns
td(on)
Turn-On Delay Time
-
15
27
ns
tr
Rise Time
-
16
29
ns
td(off)
Turn-Off Delay Time
-
32
52
ns
tf
Fall Time
-
14
26
ns
t(off)
Turn-Off Time
-
-
78
ns
ISD = 80A
-
0.99
1.25
V
ISD = 40A
-
0.88
1.0
V
-
70
105
ns
-
202
303
nC
VDD = 50V, ID = 80A
VGS = 10V, RGS = 5.0Ω
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Is = 40 A, di/dt = 100A/µs
Notes:
1. Pulse Test:Pulse Width<300us,Duty Cycle<2.0%
2. L=0.13mH, IAS = 64A, VDD=50V, RG=25 Ω , Starting TJ=25oC
2
FDP3651U Rev. A
www.fairchildsemi.com
FDP3651U N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
VGS = 20V
100
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
ID, DRAIN CURRENT (A)
120
VGS = 10V
80
VGS = 8V
60
40
VGS = 7V
20
0
0
1
2
3
4
VDS, DRAIN TO SOURCE VOLTAGE (V)
5
4
VGS = 8V
3
2
VGS = 10V
1
VGS = 20V
0
0
40
60
80
100
120
60
2.4
RDS(on), ON-RESISTANCE (mΩ)
ID = 80A
VGS = 10V
2.0
1.6
1.2
0.8
0.4
-80
-40
0
40
80
120
160
ID = 80A
50
TJ = 175oC
30
20
TJ = 25oC
10
0
200
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
40
8
TJ, JUNCTION TEMPERATURE (oC)
10
12
14
16
18
20
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. Normalized On Resistance vs Junction
Temperature
Figure 4. On-Resistance vs Gate to Source
Voltage
1000
IS, REVERSE DRAIN CURRENT (A)
120
ID, DRAIN CURRENT (A)
20
Figure 2. Normalized On-Resistance vs Drain
Current and Gate Voltage
2.8
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
100
80
TJ = 175oC
60
40
TJ = 25oC
20
TJ = -55oC
0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
VGS = 7V
ID, DRAIN CURRENT(A)
Figure 1. On Region Characteristics
NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
5
2
4
6
8
VGS, GATE TO SOURCE VOLTAGE (V)
10
100
TJ = 175oC
10
1
TJ = 25oC
0.1
TJ = -55oC
0.01
1E-3
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward
Voltage vs Source Current
3
FDP3651U Rev. A
VGS = 0V
www.fairchildsemi.com
FDP3651U N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
10000
VGS, GATE TO SOURCE VOLTAGE(V)
10
Ciss
VDD = 45V
VDD = 50V
8
CAPACITANCE (pF)
VDD = 55V
6
4
2
0
Coss
1000
Crss
100
f = 1MHz
VGS = 0V
0
10
20
30
40
50
10
0.1
60
Qg, GATE CHARGE(nC)
Figure 7. Gate Charge Characteristics
ID, DRAIN CURRENT (A)
IAS, AVALANCHE CURRENT(A)
100
TJ = 25oC
10
TJ = 150oC
1
-3
10
-2
10
-1
0
1
2
100
PACKAGE MAY LIMIT
CURRENT IN THIS REGION
80
VGS=10V
60
VGS=8V
40
20
0
25
3
10
10
10
10
tAV, TIME IN AVALANCHE(ms)
10
Figure 9. Unclamped Inductive Switching
Capability
50
75
100
125
150
TC, CASE TEMPERATURE (oC)
175
Figure 10. Maximum Continuous Drain Current vs
Ambient Temperature
5
500
10
P(PK), PEAK TRANSIENT POWER (W)
10us
100
ID, DRAIN CURRENT (A)
10
Figure 8. Capacitance vs Drain to Source Voltage
100
OPERATION IN THIS
AREA MAY BE
LIMITED BY RDS(ON)
10
100us
1ms
1
0.1
1
VDS, DRAIN TO SOURCE VOLTAGE (V)
10ms
SINGLE PULSE
TJ=MAX RATED
Tc=25oC
1
DC
10
100 200
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
4
10
175 – T c
----------------------150
I = I25
3
10
SINGLE PULSE
2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
t, PULSE WIDTH (s)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe Operating Area
Figure 12. Single Pulse Maximum Power
Dissipation
4
FDP3651U Rev. A
TC = 25oC
VGS = 10V
www.fairchildsemi.com
FDP3651U N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
NORMALIZED THERMAL
IMPEDANCE, ZθJA
2
1
0.1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
PDM
t1
0.01
SINGLE PULSE
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJc x RθJc + Tc
1E-3
-5
10
-4
10
-3
-2
-1
10
10
10
t, RECTANGULAR PULSE DURATION(s)
0
10
1
10
Figure 13. Transient Thermal Response Curve
5
FDP3651U Rev. A
www.fairchildsemi.com
FDP3651U N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
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(a) are intended for surgical implant into the body, or (b) support or
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accordance with instructions for use provided in the labeling, can be
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I20