19-3242; Rev 0; 4/04 150Mbps Automotive VCSEL Driver Features The MAX3905 150Mbps automotive VCSEL driver implements low-cost transmitters operating from 8Mbps to 150Mbps at junction temperatures up to +140°C. The device accepts single-ended TTL, differential PECL or LVDS input data, and provides bias and modulation currents for driving a VCSEL. The output is DC-coupled to the VCSEL to minimize component count. ♦ -40°C to +140°C Operating Junction Temperature Range ♦ +3.0V to +5.25V Supply Voltage ♦ TTL/CMOS-, LVDS-, or PECL-Compatible Data Input ♦ Compatible with SP1 Automotive Network Interface The driver provides temperature compensation to VCSEL high and low currents. Adjustments of the bias current, modulation current, bias-current temperature coefficient, and center of the temperature-stable bias current region are all programmable by wirebond options. The power-reduction feature decreases output modulation by approximately 50%. The data squelch feature disables the VCSEL current when no data is present. The MAX3905 is available in die form and operates from -40°C to +140°C junction temperature, over a +3.0V to +5.25V supply range. ♦ Wirebond-Adjustable VCSEL Low and High Currents ♦ Optical Power-Reduction Feature ♦ Output Squelch Ordering Information PART MAX3905E/D TEMP RANGE -40°C to +140°C PIN-PACKAGE Dice* *Dice are designed to operate from TJ = -40°C to +140°C, but are tested and guaranteed at TA = +49°C only. Applications Optical Transmitters for Automotive Networks Polymer-Clad Silica Fiber-Based Networks Typical Application Circuits +5V AUTOMOTIVE TRANSMITTER (TTL NETWORK CHIP INTERFACE, DATA RATE < 50Mbps) VCC = +5V MODULATION CONTROL VCC TRANSMIT OPTICAL SUBASSEMBLY (TOSA) DRIVER TO SET SUPPLY FILTER RGAIN GAIN TX TTL OUTPUT DATA (SP1 AUTOMOTIVE NETWORK INTERFACE) 3DB MOD1 MOD2 DT01 DT02 VCC IN_TTL OUT IN+ VCSEL MAX3905 IN- OUT SQEN DIFF LOW1 LOW2 TC1 TC2 TC3 VEE GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION Typical Application Circuits continued at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX3905 General Description MAX3905 150Mbps Automotive VCSEL Driver ABSOLUTE MAXIMUM RATINGS Supply Voltage, (VCC - VEE) ..................................-0.5V to +6.0V Voltage at 3DB, IN+, IN-, IN_TTL, DIFF, OUT, OUT, MOD1, MOD2, DT01, DT02, SQEN, TEMPSENS ..............................................-0.5V to (VCC + 0.5V) Voltage at LOW1, LOW2, TC1, TC2, TC3.................-0.5V to +2V Differential Input Voltage |IN+ - IN-|.......................................VCC Current into OUT...............................................................+12mA Storage Ambient Temperature Range...............-65°C to +150°C Operating Junction Temperature Range ...........-40°C to +150°C Electrostatic Discharge (ESD) (Human Body Model, tested per JES D22-A114) ...............2kV (Machine Model, tested per JES D22-A115) ..................+400V Die Attach Temperature...................................................+400°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +3.0V to +5.25V, TJ = -40°C to +140°C. Typical values are at VCC = +5.0V and TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS OPERATING CONDITIONS Voltage at OUT VOUT Data Rate TTL Data Input-Edge Transition Time 0.9 V With TTL input 8 50 With differential input 40 150 One-pole response, 10% to 90% Mbps 0.23 UI 25 mA POWER SUPPLY Supply Current Supply Current While Data is Squelched ICC Excludes IOUT and IOUT 14 ISTDBY Excludes IOUT and IOUT 14 mA CURRENT GENERATOR Low Current (TJ = DT0) Low-Current Positive Temperature Coefficient (TJ > DT0) Low-Current Negative Temperature Coefficient (TJ < DT0) Width of Temperature-Stable Low-Current Region IDT0 TCLOW+ TCLOW- LOW1 open, LOW2 open 1.69 1.8 1.91 LOW1 GND, LOW2 open 2.02 2.17 2.28 LOW1 open, LOW2 GND 2.35 2.53 2.65 LOW1 GND, LOW2 GND 2.68 2.90 3.02 TC1 open, TC2 open, TC3 open 12 16 18 TC1 GND, TC2 open, TC3 open 16 21 24 TC1 GND, TC2 GND, TC3 open 24 32 36 TC1 GND, TC2 GND, TC3 GND 36 48 54 TC1 open, TC2 open, TC3 open -18 -16 -12 TC1 GND, TC2 open, TC3 open -24 -21 -16 TC1 GND, TC2 GND, TC3 open -36 -32 -24 TC1 GND, TC2 GND, TC3 GND -54 -47 -36 38 45 52 31.5 36 41.5 TW DT01 open, DT02 open Center of Temperature-Stable Low-Current Region Modulation-Current Temperature Coefficient 2 DT0 TCMOD DT01 VCC, DT02 open 44 49 54 DT01 open, DT02 VCC 56 61 66 DT01 VCC, DT02 VCC 68.5 74 78.5 Relative to IMOD at TJ = +25°C 0.311 0.38 0.471 _______________________________________________________________________________________ mA µA/°C µA/°C °C °C %/°C 150Mbps Automotive VCSEL Driver MAX3905 ELECTRICAL CHARACTERISTICS (continued) (VCC = +3.0V to +5.25V, TJ = -40°C to +140°C. Typical values are at VCC = +5.0V and TA = +25°C, unless otherwise noted.) PARAMETER Modulation Current at TJ = +25°C Modulation Current in Low-Power Mode SYMBOL IMOD CONDITIONS MIN TYP MAX UNITS MOD1 open, MOD2 open 2.84 3.01 3.22 MOD1 VCC, MOD2 open 3.44 3.65 3.88 MOD1 open, MOD2 VCC 4.03 4.28 4.55 MOD1 VCC, MOD2 VCC 4.62 4.91 5.22 40 50 60 % 0.5 ns mA ILP Relative to programmed nominal, TJ = +25°C Modulation Switching Time tr, tf 20% to 80% (Note 1) Pulse-Width Variation PWV (Notes 1, 2) 0.97 1.03 UI Pulse-Width Distortion PWD (Notes 1, 2) -0.02 +0.02 UI Data-Dependent Jitter DDJ (Notes 1, 2) Uncorrelated Jitter UJ (Notes 1, 2) Deterministic Jitter DJ K28.5 pattern at 125Mbps (Notes 1, 3) Random Jitter RJ 1-0 pattern differential input (Note 1) 0.2 0.004 0.01 UI 0.001 UI 85 200 psP-P 3 11 psRMS +0.80 V IN_TTL DATA INPUT Input Low VINL -0.03 Input High VINH 2.0 Input Resistance 4 Input Capacitance (Note 1) VCC + 0.3 5.75 V kΩ 0.3 2 pF 25 200 mVP-P DIFFERENTIAL DATA INPUT Differential-Input Sensitivity Differential-Input Overload 1860 Differential-Input Resistance mVP-P 8 kΩ 1.5 V 3DB INPUT Input Threshold Voltage Normal mode 3DB Input Voltage 2.0 Low-power mode Diagnostic Resistor RGAINN VCC > 4.75V, normal mode RGAINL VCC > 4.75V, low-power mode 0.8 16 29 V kΩ DATA SQUELCH Output Current While Squelched IOFF No input data Time to Squelch tSQ (Note 1) Time to Resume from Squelch State tRS (Note 1) 1 3 50 µA 8 25 µs 0.1 5 µs ESD PROTECTION IN+, IN-, TTL_IN, 3DB Human Body Model Machine Model ±4 kV ±400 V Note 1: These specifications are guaranteed by design and characterization. Note 2: Pulse-width variation, pulse-width distortion, data-dependent jitter, and uncorrelated jitter are measured at 45Mbps per MOST specification of physical Layer (revision 1.1). Note 3: Deterministic jitter is measured with a K28.5 pattern (0011 1110 1011 0000 0101). Deterministic jitter is the peak-to-peak deviation from ideal time crossings, measured at the 50% crossings of the output. Differential data applied to input. _______________________________________________________________________________________ 3 Typical Operating Characteristics (LOW[1, 2] = [GND, open], MOD[1, 2] = [open, VCC], DT0[1, 2] = [open, open], TC[1, 2, 3] = [GND, GND, open], TA = +25°C, unless otherwise noted.) SUPPLY CURRENT vs. JUNCTION TEMPERATURE ELECTRICAL EYE DIAGRAM (45.1Mbps TTL INPUT) ELECTRICAL EYE DIAGRAM (150Mbps DIFFERENTIAL INPUT) MAX3905 toc02 MAX3905 toc01 30 EXCLUDES IOUT AND IOUT 25 SUPPLY CURRETNT (mA) MAX3905 toc03 K28.5 PATTERN VCC = +3.3V K28.5 PATTERN VCC = 5.0V 20 15 10 VCC = 3.3V 5 0 -40 -20 0 20 40 60 80 100 120 140 3.7ns/div 1.12ns/div OPTICAL EYE DIAGRAM (150Mbps DIFFERENTIAL INPUT) BIAS CURRENT vs. JUNCTION TEMPERATURE OPTICAL EYE DIAGRAM (45.1Mbps TTL INPUT) MAX3905 toc04 MAX3905 toc05 6 TC[1, 2, 3] = [GND, GND, OPEN] DT0[1, 2] = [OPEN, OPEN] BIAS CURRETNT (mA) 5 VIN = 5.0V 850nm VCSEL 467MHz LOWPASS FILTER VCC = 3.3V 850nm VCSEL 467MHz LOWPASS FILTER 3.7ns/div LOW[1, 2] = [GND, GND] LOW[1, 2] = [OPEN, GND] 4 3 2 LOW[1, 2] = [GND, OPEN] LOW[1, 2] = [OPEN, OPEN] 1 0 -40 -20 1.12ns/div 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) 4 3 DT0 = +36°C 2 TC[1, 2, 3] = [GND, OPEN, OPEN] TC[1, 2, 3] = [OPEN, OPEN, OPEN] 1 MOD[1, 2] = [VCC, VCC] MOD[1, 2] = [OPEN, VCC] 7 6 5 4 3 2 MOD[1, 2] = [VCC, OPEN] MOD[1, 2] = [OPEN, OPEN] 1 0 0 -40 -20 4 8 MODULATION CURRENT (mA) TC[1, 2, 3] = [GND, GND, GND] TC[1, 2, 3] = [GND, GND, OPEN] 5 MAX3905 toc07 6 LOW[1, 2] = [GND, OPEN] DT0[1, 2] = [OPEN, OPEN] MAX3905 toc08 MODULATION CURRENT vs. JUNCTION TEMPERATURE BIAS CURRENT vs. JUNCTION TEMPERATURE 7 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) MAX3905 toc06 JUNCTION TEMPERATURE (°C) BIAS CURRETNT (mA) MAX3905 150Mbps Automotive VCSEL Driver -40 -20 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) _______________________________________________________________________________________ 150Mbps Automotive VCSEL Driver DETERMINISTIC JITTER vs. JUNCTION TEMPERATURE OUTPUT RESUME FROM SQUELCH MAX3905 toc10 VIN VIN OPTICAL POWER OUTPUT OPTICAL POWER OUTPUT tSQ 120 DETERMINISTIC JITTER (psP-P) MAX3905 toc09 MOD[1, 2] = [OPEN, OPEN] MOD[1, 2] = [VCC, OPEN] 100 MAX3905 toc11 OUTPUT SQUELCH 80 60 MOD[1, 2] = [OPEN, VCC] MOD[1, 2] = [VCC, VCC] 40 20 tRS 150Mbps K28.5 PATTERN 0 2µs/div 40ns/div RANDOM JITTER (psRMS) MAX3905 toc13 MAX3905 toc12 5.5 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) PULSE-WIDTH VARIATION AND AVERAGE PULSE-WIDTH DISTORTION RANDOM JITTER vs. JUNCTION TEMPERATURE 6.0 -40 -20 45.1Mbps TTL BIPHASE-CODED DATA 5.0 4.5 4.0 3.5 3.0 2.5 10ns/div 2.0 -40 -20 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) _______________________________________________________________________________________ 5 MAX3905 Typical Operating Characteristics (continued) (LOW[1, 2] = [GND, open], MOD[1, 2] = [open, VCC], DT0[1, 2] = [open, open], TC[1, 2, 3] = [GND, GND, open], TA = +25°C, unless otherwise noted.) MAX3905 150Mbps Automotive VCSEL Driver Pad Description PAD NAME 1, 20, 26 VEE Circuit Ground 2 DIFF Differential-Input Data Enable. Leave open to enable the TTL data input, or connect to ground to enable the differential data input. 3 IN_TTL 4, 5, 6 N.C. No Connection 7 IN+ Positive Differential-Data Input, PECL- or LVDS-Compatible. This high-impedance input is internally biased to approximately 1.4V and requires an external termination resistor and an AC-coupling capacitor. It is active when DIFF is connected to ground. 8 TEMPSENS Junction Temperature Sensor. Analog output corresponding to the junction temperature of the die. Leave open for normal use. 9 IN- Negative Differential-Data Input, PECL- or LVDS-Compatible. This high-impedance input is internally biased to approximately 1.4V and requires an external termination resistor and an AC-coupling capacitor. It is active when DIFF is connected to ground. 10, 15 VCC Power Supply 11 DT01 Driver T0 Programming Input. Sets the center temperature of lowest bias current. Connect to VCC or leave open. 12 DT02 Driver T0 Programming Input. Sets the center temperature of lowest bias current. Connect to VCC or leave open. 13 MOD2 Modulation-Current Programming Input. Sets the modulation-current amplitude. Connect to VCC or leave open. 14 MOD1 Modulation-Current Programming Input. Sets the modulation-current amplitude. Connect to VCC or leave open. 6 FUNCTION Single-Ended Data Input, TTL. Compatible with SP1 automotive network interface. This input is active when DIFF is left open. 16 OUT Complementary Data Output. Connect to VCC or VCSEL anode. 17 OUT Data Output. Connect to VCSEL cathode. 18 SQEN Squelch Enable Input. Leave open to enable squelch or connect to ground to disable squelch. 19 3DB Power-Reduction Input. Compatible with TTL. When low, 3DB activates a test mode, which reduces output power by 50%. When 3DB is high, the modulation output is normal. See the Detailed Description section. 21 TC1 Low-Current Temperature-Coefficient Programming Input. Sets the temperature coefficient of the bias current. Connect to GND or leave open. Do not connect to VCC. 22 TC2 Low-Current Temperature-Coefficient Programming Input. Sets the temperature coefficient of the bias current. Connect to GND or leave open. Do not connect to VCC. 23 TC3 Low-Current Temperature-Coefficient Programming Input. Sets the temperature coefficient of the bias current. Connect to GND or leave open. Do not connect to VCC. 24 LOW1 Low-Current Programming Input. Sets the VCSEL-low (bias) current at the temperature set by the DT0 pins. Connect to GND or leave open. Do not connect to VCC. 25 LOW2 Low-Current Programming Input. Sets the VCSEL-low (bias) current at the temperature set by the DT0 pins. Connect to GND or leave open. Do not connect to VCC. _______________________________________________________________________________________ 150Mbps Automotive VCSEL Driver MAX3905 VCC INPUT BUFFERS OUT IN+ IN- MAX3905 GND OUT OUTPUT DRIVER OPEN IN_TTL SIGNAL DETECT SQUELCH MODULATION CURRENT GENERATOR VCC DIFF BIAS CURRENT GENERATOR IMOD IMOD IBIAS TEMP SQEN DT0 SET K VEE TEMPSENS IBIAS TEMP 3DB MOD[1, 2] DT0[1, 2] TC[1, 2, 3] LOW[1, 2] Figure 1. Functional Diagram Detailed Description The MAX3905 is comprised of a differential LVDS- or PECL-compatible input buffer, a TTL-compatible input buffer, signal detection, DT0 set block, modulation-current generator, bias-current generator, and output driver (Figure 1). The device implements temperature compensation in the bias and modulation that can be customized to accommodate the variation of VCSEL properties with process and temperature. See Figure 2 and Table 1 for driver current and temperature coefficient definitions. Input Buffers The MAX3905 has two input buffers, one for TTL-compatible DC-coupled input data, and the other for ACcoupled, differential LVDS or PECL input data. The differential input is relatively high impedance. This allows external resistors to be configured in several ways to meet the AC- and DC-termination requirements of LVDS or PECL. The active data input buffer is set by the DIFF input. To select the single-ended TTL input, leave DIFF open. To select the differential input, connect DIFF to ground. When using the differential input buffer, input noise can be sufficient to prevent normal operation of the squelch function. A small offset on the input ensures proper functioning of the squelch feature. A 1MΩ resistor from IN- to ground or VCC creates a 7mV offset. Signal Detection and Data Squelch When no data transitions are present at the input, the signal detection issues a squelch signal to the bias and modulation current, disabling the VCSEL output. This ensures that the receiver IC can easily detect the difference between transmitter on and transmitter off. The squelch function is enabled when SQEN is left unconnected. The squelch function can be disabled by connecting SQEN to ground. With squelch enabled, the delay of the squelch function is suitable for use with biphase-encoded data (maximum of three consecutive identical digits (CIDs)) or 8B-/10Bencoded data (maximum five CIDs). To use the MAX3905 with scrambled data, disable the squelch function. DT0 Set Block Inputs DT01 and DT02 are the 2-bit control of the center of the temperature-stable region, DT0. The temperature set by DT0[1, 2] should correspond to the T0 of the VCSEL. Connect DT01 or DT02 to VCC to set the bit high, or leave open to set the bit low. The typical DT0 can be calculated by: _______________________________________________________________________________________ 7 TCLOW + TCMOD IHIGH TCMOD IMOD = IHIGH - ILOW ILOW DTO TCLOW VCSEL CURRENT OUTPUT CURRENT AMPLITUDE MAX3905 150Mbps Automotive VCSEL Driver IHIGH ILOW TW JUNCTION TEMPERATURE TIME Figure 2. Driver Current and Temperature Coefficient Definitions Table 1. Driver Current and Temperature Coefficient Definitions PARAMETER DESCRIPTION ILOW Total VCSEL current when the data input is logic-low. IHIGH Total VCSEL current when the data input is logic-high. IMOD IHIGH - ILOW. DT0 The center of the temperature-stable lowcurrent region (TW). DT0 roughly corresponds to T0 of the VCSEL. IDT0 ILOW at TJ = DT0. TW The size (in °C) of the region where no temperature coefficient is applied to ILOW. TCMOD The temperature coefficient applied to IMOD. TCLOW The temperature coefficient applied to ILOW. This coefficient is negative below DT0 - TW/2 and positive above DT0 + TW/2. IOFF Total VCSEL current while squelched. DT0 ≈ [36 + 13(DT01) + 25(DT02)]°C where DT0[1, 2] = 1 when bonded to VCC; DT0[1, 2] = 0 when left open. Modulation-Current Generator The modulation-current generator provides wirebondselectable current amplitude with temperature compensation. The temperature coefficient (TCMOD) compensates for the slope-efficiency change of the VCSEL over temperature. The modulation current is set with inputs MOD1 and MOD2. Connect MOD1 or MOD2 to VCC to set the bit high, and leave open to set the bit low. The typical modulation current at +25°C can be calculated by: IMOD ≈ [3.01 + (0.64 x MOD1) + (1.27 x MOD2)]mA where MOD[1, 2] = 1 when bonded to V CC ; MOD [1, 2] = 0 when left open. Power Reduction The power-reduction feature is useful for in-system test and diagnostics. When the 3DB input is low, the modulation current is reduced by 50%. When 3DB is high or VCC, the modulation output is normal. For compatibility with 5V POF transmitters, the power mode can be set by connecting a resistor from 3DB to VCC. A resistor RGAIN < RGAINN sets the normal power mode, while RGAIN > RGAINL sets the low-power mode. Bias-Current Generator The bias-current generator provides a current that closely tracks the VCSEL properties with temperature. This current is summed with the modulation current at the OUT pad. The bias current at T J = DT 0 is 8 _______________________________________________________________________________________ 150Mbps Automotive VCSEL Driver Junction-Temperature Sensing A temperature sensor is incorporated into the MAX3905 to aid in evaluation of thermal performance. The TEMPSENS voltage is proportional to the die junction temperature (approximately -1.39mV per °C). The temperature of the die can be estimated as: T(°C) ≈ 597°C - VTEMPSENS (mV) x 0.72°C 1mV Output Driver The OUT pad connects directly to the VCSEL cathode. The OUT pad must be connected to the VCSEL anode or to VCC. The minimum instantaneous voltage on the OUT pad is 0.9V. Applications Information Additional Design Assistance For more information and design assistance, refer to Maxim Design Note HFDN-32.0: Output Current Calculator for the MAX3905. Layout Considerations Load inductance on OUT and OUT should be matched within 1.5nH to minimize both jitter and supply noise generation. Wire Bonding For high-current density and reliable operation, the MAX3905 uses gold metalization. For best results, use gold-wire ball-bonding techniques. Exercise caution when wedge bonding. Die size is 1.52mm x 1.52mm (60 mils x 60 mils), and die thickness is 300µm (12 mils). The bond-pad passivation opening is 93µm x 93µm and bond-pad metal thickness is 1.2µm. Refer to Maxim Application Note HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size for additional information on bondpad coordinates. Do not attempt to bond to the laser trim target. Laser Safety and IEC 825 Using the MAX3905 VCSEL driver alone does not ensure that a transmitter design is compliant with IEC 825. The entire transmitter circuit and component selections must be considered. Determine the level of fault tolerance required by each application, and recognize that Maxim products are not designed or authorized for use as components in systems intended for surgical implant into the body, for applications intended to support or sustain life, or for any other application where the failure of a Maxim product could create a situation where personal injury or death may occur. _______________________________________________________________________________________ 9 MAX3905 programmed by the LOW1 and LOW2 inputs. Connect LOW1 or LOW2 to ground to set the bit high, and leave open to set the bit low. Do not connect LOW1 or LOW2 to VCC. The typical low current at TJ = DT0 can be calculated by: ILOW ≈ [1.8 + (0.37 x LOW1) + (0.73 x LOW2)]mA where, LOW[1, 2] = 1 when bonded to ground; LOW[1, 2] = 0 when left open. The temperature coefficient of the bias current is programmed by the TC1, TC2, and TC3 inputs. Connect TC1, TC2, or TC3 to ground to set the bit high, and leave open to set the bit low. Do not connect TC1, TC2, or TC3 to VCC. The typical temperature coefficient of the bias current can be calculated by: TCLOW ≈ [16 + (5 x TC1) + (11 x TC2) + (16 x TC3)]µA/°C where, TC[1, 2, 3] = 1 when bonded to ground; TC[1, 2, 3] = 0 when left open. MAX3905 150Mbps Automotive VCSEL Driver VCC VCC MAX3905 MAX3905 OUT OUT 1.5V IN_TTL VEE VEE Figure 3. IN_TTL Equivalent Input Structure Figure 5. OUT/OUT Equivalent Output Structure Chip Information VCC TRANSISTOR COUNT: 985 PROCESS: Silicon Bipolar GST-2 MAX3905 SUBSTRATE: Connected to VEE DIE SIZE: 1.52mm x 1.52mm (60mils x 60mils) DIE THICKNESS: 300µm (12mils) IN+ 5kΩ 1.4V 5kΩ IN- VEE Figure 4. IN+/IN- Equivalent Input Structure 10 ______________________________________________________________________________________ 150Mbps Automotive VCSEL Driver +3.3V AUTOMOTIVE TRANSMITTER (TTL NETWORK CHIP INTERFACE, DATA RATE < 50Mbps) VCC = +3.3V SUPPLY FILTER TRANSMIT OPTICAL SUBASSEMBLY (TOSA) MODULATION CONTROL VCC DRIVER TO SET REDUCE POWER TX TTL OUTPUT DATA (SP1 AUTOMOTIVE NETWORK INTERFACE) 3DB MOD1 MOD2 DT01 DT02 VCC IN_TTL OUT VCSEL IN+ MAX3905 IN- OUT SQEN DIFF LOW1 LOW2 TC1 TC2 VEE TC3 GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION TRANSMITTER WITH DIFFERENTIAL LVDS INTERFACE TRANSMIT OPTICAL SUBASSEMBLY (TOSA) MODULATION CONTROL VCC = +3.0V TO +5.25V DRIVER TO SET SUPPLY FILTER REDUCE POWER 3DB MOD1 MOD2 DT01 DT02 VCC IN_TTL 0.1µF NETWORK CHIP WITH LVDS OUTPUT 50Ω OUT VCSEL IN+ 100Ω MAX3905 50Ω IN- OUT 0.1µF SQEN 1MΩ DIFF LOW1 LOW2 TC1 TC2 TC3 VEE GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION ______________________________________________________________________________________ 11 MAX3905 Typical Application Circuits (continued) 150Mbps Automotive VCSEL Driver MAX3905 Typical Application Circuits (continued) TRANSMITTER WITH DIFFERENTIAL-PECL INTERFACE TRANSMIT OPTICAL SUBASSEMBLY (TOSA) MODULATION CONTROL VCC = +3.0V TO +5.25V DRIVER TO SET SUPPLY FILTER REDUCE POWER 3DB VCCPECL MOD1 MOD2 DT01 DT02 VCC IN_TTL R1 NETWORK CHIP WITH PECL OUTPUT R1 0.1µF OUT 50Ω IN+ 50Ω IN- VCSEL MAX3905 R2 R2 OUT 0.1µF SQEN DIFF 1MΩ LOW1 LOW2 TC1 TC2 TC3 VEE VCCPECL= 3.3V VCCPECL = 5V R1 82Ω 130Ω R2 130Ω 82Ω GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION Bonding Coordinates PAD PAD NAME 1 VEE COORDINATES (µm) COORDINATES (µm) PAD PAD NAME X Y 1285.9 14 MOD1 1285.9 257.2 VCC 1285.9 427.3 594.7 X Y 46.6 2 DIFF 46.6 1134.7 15 3 IN_TTL 46.6 983.5 16 OUT 1285.9 4 N.C. 46.6 832.3 17 OUT 1285.9 759.4 5 N.C 46.6 511 18 SQEN 1285.9 921.4 6 N.C 46.6 359.8 19 3DB 1285.9 1086.1 7 IN+ 46.6 208.6 20 VEE 1285.9 1285.9 8* TEMPSENS 46.6 46.6 21 TC1 1059.1 1285.9 9 IN- 262.6 46.6 22 TC2 902.5 1285.9 10 VCC 791.8 46.6 23 TC3 745.9 1285.9 11 DT01 956.5 46.6 24 LOW1 589.3 1285.9 12 DT02 1121.2 46.6 25 LOW2 432.7 1285.9 13 MOD2 1285.9 46.6 26 VEE 276.1 1285.9 Coordinates are for the center of the pad. Coordinate 0,0 is the lower left corner of the passivation opening for pad 8. *Index pad. Orient the die with this pad in the lower-left corner. 12 ______________________________________________________________________________________ 150Mbps Automotive VCSEL Driver VEE (PAD 26) LOW2 (PAD 25) LOW1 (PAD 24) TC3 (PAD 23) TC2 (PAD 22) TC1 (PAD 21) VEE (PAD 20) VEE (PAD 1) DIFF (PAD 2) 3DB (PAD 19) IN_TTL (PAD 3) SQEN (PAD 18) N.C. (PAD 4) OUT (PAD 17) 60mils 1.52mm OUT (PAD 16) N.C. (PAD 5) VCC (PAD 15) N.C. (PAD 6) MOD1 (PAD 14) IN+ (PAD 7) MOD2 (PAD 13) TEMPSENS (PAD 8) IN(PAD 9) VCC (PAD 10) LASER TRIM TARGET DT01 (PAD 11) DT02 (PAD 12) 60mils 1.52mm Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 © 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX3905 Chip Topography