NPN-Silizium-Fototransistor im SMT SIDELED®-Gehäuse Silicon NPN Phototransistor in SMT SIDELED®-Package SFH 325 SFH 325 FA SFH 325 SFH 325 FA Wesentliche Merkmale Features • Speziell geeignet für Anwendungen im Bereich von 380 nm bis 1150 nm (SFH 325) und bei 880 nm (SFH 325 FA) • Hohe Linearität • P-LCC-2 Gehäuse • Gruppiert lieferbar • Nur für Reflow IR-Lötung geeignet. • Especially suitable for applications from 380 nm to 1150 nm (SFH 325) and of 880 nm (SFH 325 FA) • High linearity • P-LCC-2 package • Available in groups • Suitable only for reflow IR soldering. Anwendungen Applications • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb • Lochstreifenleser • Industrieelektronik • „Messen/Steuern/Regeln“ • • • • Typ Type Bestellnummer Ordering Code Typ Type Bestellnummer Ordering Code SFH 325 Q61)2702-P1638 SFH 325 FA Q62702-P1639 SFH 325-3 Q62702-P1610 SFH 325 FA-3 Q62702-P1724 SFH 325-3/-4 Q62702-P3604 SFH 325 FA-3/-4 Q62702-P3603 SFH 325-4 Q62702-P1611 SFH 325 FA-4 Q62702-P1615 1) 2001-09-12 1 Miniature photointerrupters Punched tape readers Industrial electronics For control and drive circuits SFH 325, SFH 325 FA Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Kollektor-Emitterspannung Collector-emitter voltage VCE 35 V Kollektorstrom Collector current IC 15 mA Kollektorspitzenstrom, τ < 10 µs Collector surge current ICS 75 mA Verlustleistung, TA = 25 °C Total power dissipation Ptot 165 mW Wärmewiderstand für Montage auf PC-Board Thermal resistance for mounting on pcb RthJA 450 K/W 2001-09-12 2 SFH 325, SFH 325 FA Kennwerte (TA = 25 °C, λ = 950 nm) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value SFH 325 SFH 325 FA Einheit Unit Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity λS max 860 900 nm Spektraler Bereich der Fotoempfindlichkeit S = 10% von Smax Spectral range of sensitivity S = 10% of Smax λ 380 … 1150 730 … 1120 nm Bestrahlungsempfindliche Fläche (∅ 220 µm) Radiant sensitive area A 0.038 0.038 mm2 Abmessung der Chipfläche Dimensions of chip area L×B L×W 0.45 × 0.45 0.45 × 0.45 mm × mm Abstand Chipoberfläche zu Gehäuseoberfläche Distance chip front to case surface H 0.5 … 0.7 0.5 … 0.7 mm Halbwinkel Half angle ϕ ± 60 ± 60 Grad deg. Kapazität, VCE = 0 V, f = 1 MHz, E = 0 Capacitance CCE 5.0 5.0 pF Dunkelstrom Dark current VCE = 25 V, E = 0 ICEO 1 (≤ 200) 1 (≤ 200) nA 2001-09-12 3 SFH 325, SFH 325 FA Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern gekennzeichnet. The phototransistors are grouped according to their spectral sensitivity and distinguished by arabian figures. Bezeichnung Parameter Symbol Symbol Wert Value SFH 325 -2 /FA Fotostrom, λ = 950 nm Photocurrent Ee = 0.1 mW/cm2, VCE = 5 V IPCE SFH 325: Ev = 1000 Ix, Normlicht/standard light A, IPCE VCE = 5 V -3 Einheit Unit -4 ≥ 16 16 … 32 25 … 50 40 … 80 µA – 420 650 1000 µA Anstiegszeit/Abfallzeit Rise and fall time IC = 1 mA, VCC = 5 V, RL = 1 kΩ tr, tf 7 6 7 8 µs Kollektor-Emitter-Sättigungsspannung Collector-emitter saturation voltage IC = IPCEmin1) × 0.3, Ee = 0.1 mW/cm2 VCEsat 150 150 150 150 mV 1) IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe. 1) IPCEmin is the min. photocurrent of the specified group. Directional Characteristics Srel = f (ϕ) 40 30 20 10 ϕ 0 OHF01402 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2001-09-12 0.8 0.6 0.4 0 20 40 60 80 100 4 120 SFH 325, SFH 325 FA Relative Spectral Sensitivity, SFH 325 Srel = f (λ) Relative Spectral Sensitivity, SFH 325 FA Srel = f (λ) Photocurrent IPCE = f (Ee), VCE = 5 V OHF01121 100 OHF01924 10 3 µA Ι PCE S rel % 80 10 2 60 4 3 2 10 1 40 10 0 20 0 400 600 800 Total Power Dissipation OHF00871 200 10 0 Dark Current ICEO = f (VCE), E = 0 OHF01529 10 0 mA Ι PCE mW mW/cm 2 10 -2 Ee Photocurrent IPCE = f (VCE), Ee = Parameter Ptot = f (TA) P tot 10 -1 -3 10 1000 nm 1200 λ 160 120 1 mW cm 2 0.5 mW cm 2 0.25 mW cm 2 OHF01527 10 1 nA Ι CEO 10 0 10 -1 10 -1 mW 0.1 2 cm 80 10 -2 40 0 10 -2 0 20 40 60 80 ˚C 100 TA Dark Current ICEO = f (TA), VCE = 5 V, E = 0 OHF01530 10 3 nA Ι CEO 0 5 10 15 20 25 Capacitance CCE = f (VCE), f = 1 MHz, E = 0 OHF01528 5.0 10 -3 30 V 35 V CE 0 5 10 15 20 25 30 V 35 V CE Photocurrent IPCE/IPCE25o = f (TA), VCE = 5 V Ι PCE OHF01524 1.6 Ι PCE 25 C CE pF 1.4 4.0 10 2 1.2 3.5 1.0 3.0 10 1 2.5 0.8 2.0 0.6 1.5 10 0 0.4 1.0 0.2 0.5 10 -1 -25 2001-09-12 0 25 50 75 ˚C 100 TA 0 10 -2 10 -1 10 0 5 10 1 V 10 2 V CE 0 -25 0 25 50 75 C 100 TA SFH 325, SFH 325 FA Maßzeichnung Package Outlines 1.1 (0.043) Emitter (1.4 (0.055)) (R1) 4.2 (0.165) 3.8 (0.150) 3.8 (0.150) 3.4 (0.134) (2.9 (0.114)) Collector marking (2.85 (0.112)) 0.9 (0.035) (0.3 (0.012)) Collector 2.54 (0.100) spacing 0.7 (0.028) 4.2 (0.165) 3.8 (0.150) 2.4 (0.094) 2.8 (0.110) (2.4 (0.094)) GPLY6068 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2001-09-12 6 SFH 325, SFH 325 FA Löthinweise Soldering Conditions Bauform Types SIDELED Tauch-, Schwall- und Schlepplötung Dip, Wave and Drag Soldering Reflowlötung Reflow Soldering Lötbadtemperatur Maximal zulässige Lötzeit Abstand Lötstelle – Gehäuse Lötzonentemperatur Maximale Durchlaufzeit Temperature of the Soldering Bath Max. Perm. Soldering Time Distance between Solder Joint and Case Temperature of Soldering Zone Max. Transit Time – – – 245 °C 10 s Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage. For additional information on general soldering conditions please contact us. Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2001-09-12 7