MITSUBISHI MGFC5218

MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
PRELIMINARY
MGFC5218
Notice : This is not a final specification
Some parametric limits are subject to change.
K-Band 2-Stage Power Amplifier
DESCRIPTION
BLOCK DIAGRAM
The MGFC5218 is a GaAs MMIC chip especially
designed for 18.0 ~ 19.0 GHz band High
Power Amplifier (MPA) .
Vg1 Vg2 Vd1 Vd2
FEATURES
RF frequency : 18.0 to 19.0 GHz
P1dB
: ≥ 29.0 dBm(min.) @ 18.0 to 19.0 GHz
In
Out
Vd1
Vg1 Vg2 Vd1 Vd2
Chip size: 1940 µm x 2000 µm
TARGET SPECIFICATIONS (Ta=25˚C)
Symbol
Parameter
IDSS1
Drain Saturation Current
IDSS2
Drain Saturation Current
Test Conditions
Min.
Vd=3.0V
Limits
Typ.
Max.
Unit
mA
720
mA
1440
Vd=3.0V,Id=0.6mA
-2.0
-1.0
V
Pinch Off Voltage
Vd=3.0V,Id=1.2mA
-2.0
-1.0
V
P1dB
Output Power at 1 dB
Compression Point
f=18 - 20 GHz,
Vd1=Vd2=6.0V ,
Id1=360mA*,
29.0
Gain
Gain
Vp1
Vp2
Pinch Off Voltage
Id2=720mA*
Input Return Loss Input Return Loss
Output Return Loss
IM3
Output Return Loss
Inter Modulation Level
f=18 - 20 GHz,
Vd1=Vd2=6.0V ,
Id1=360mA*,
Id2=720mA*
Pout=TBD
TBD
dBm
15.0
dB
8.0
dB
8.0
dB
dBc
*:Ids at RF off
MITSUBISHI
ELECTRIC
as of July '98
MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
PRELIMINARY
MGFC5218
Notice : This is not a final specification
Some parametric limits are subject to change.
K-Band 2-Stage Power Amplifier
DIE SIZE AND BOND PAD LOCATION(UNIT : µM)
Vg2 (-0.2 to -1.0 V) Vd1
Vg1
(-0.2 to -1.0 V)
GND
GND
RF-in
Vd1
GND
Vg1
Vd2
RF-out
GND
Vd1
Vg2
Vd2
130
275
990
975
1535
1940
MITSUBISHI
ELECTRIC
as of July '98
MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
PRELIMINARY
MGFC5218
Notice : This is not a final specification
Some parametric limits are subject to change.
K-Band 2-Stage Power Amplifier
TYPICAL CHARACTERISTICS
S-Parameter vs. Frequency
(Vd = 5 V)
15
S21
10
5
0
-5
-10
S11
S22
-15
-20
14
16
18
20
Frequency [GHz]
22
24
Output Power Performances
(Vd = 5 V)
34
33
32
31
30
29
28
27
26
14
16
18
20
Frequency [GHz]
MITSUBISHI
ELECTRIC
22
24
as of July '98