ADPOW APTM20DAM08TG

APTM20DAM08TG
Boost chopper
MOSFET Power Module
VDSS = 200V
RDSon = 8mΩ typ @ Tj = 25°C
ID = 208A @ Tc = 25°C
Application
VBUS
NTC2
VBUS SENSE
•
•
•
CR1
AC and DC motor control
Switched Mode Power Supplies
Power Factor Correction
Features
•
Q2
G2
•
•
0/VBU S
NTC1
•
•
G2
S2
VBUS
VBUS
SENSE
0/VBUS
OUT
OUT
S2
NTC2
G2
NTC1
Benefits
•
•
•
•
•
•
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
RoHS compliant
Absolute maximum ratings
Symbol
VDSS
ID
IDM
VGS
RDSon
PD
IAR
EAR
EAS
Parameter
Drain - Source Breakdown Voltage
Tc= 25°C
Tc = 80°C
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
Tc = 25°C
Max ratings
200
208
155
832
±30
10
781
100
50
3000
Unit
V
A
November, 2005
S2
Power MOS 7® MOSFETs
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
Internal thermistor for temperature monitoring
High level of integration
V
mΩ
W
A
mJ
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
APT website – http://www.advancedpower.com
1–6
APTM20DAM08TG – Rev 3
OUT
APTM20DAM08TG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
RDS(on)
VGS(th)
IGSS
Test Conditions
Zero Gate Voltage Drain Current
Drain – Source on Resistance
Gate Threshold Voltage
Gate – Source Leakage Current
Dynamic Characteristics
Symbol
Ciss
Coss
Crss
Qg
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total gate Charge
Qgs
Gate – Source Charge
Qgd
Gate – Drain Charge
Td(on)
Turn-on Delay Time
Tr
Td(off)
Turn-off Delay Time
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Tj = 25°C
VGS = 0V,VDS = 160V
T j = 125°C
VGS = 10V, ID = 104A
VGS = VDS, ID = 5mA
VGS = ±30 V, VDS = 0V
Test Conditions
VGS = 0V
VDS = 25V
f = 1MHz
Min
VGS = 10V
VBus = 100V
ID = 208A
IF
DC Forward Current
VF
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
VR=200V
IF = 180A
IF = 360A
IF = 180A
IF = 180A
VR = 133V
di/dt = 600A/µs
Unit
Max
Unit
µA
mΩ
V
nA
nF
nC
134
32
64
116
1698
1872
µJ
1972
Typ
Max
500
750
Tj = 125°C
180
1.1
1.4
0.9
Tj = 25°C
31
Tj = 125°C
60
Tj = 25°C
180
Tj = 125°C
750
APT website – http://www.advancedpower.com
µJ
1858
Min
200
Tj = 25°C
Tj = 125°C
Tc = 80°C
ns
88
Inductive switching @ 125°C
VGS = 15V, VBus = 133V
ID = 208A, R G = 2.5Ω
Maximum Reverse Leakage Current
Typ
14.4
4.66
0.29
280
Max
150
750
10
5
±150
106
Chopper diode ratings and characteristics
IRM
8
Inductive switching @ 25°C
VGS = 15V, VBus = 133V
ID = 208A, R G = 2.5Ω
Symbol Characteristic
VRRM Maximum Peak Repetitive Reverse Voltage
Typ
3
Inductive switching @ 125°C
VGS = 15V
VBus = 133V
ID = 208A
R G = 2.5Ω
Rise Time
Tf
Min
VGS = 0V,VDS = 200V
Unit
V
µA
A
1.15
V
November, 2005
IDSS
Characteristic
ns
nC
2–6
APTM20DAM08TG – Rev 3
Symbol
APTM20DAM08TG
Thermal and package characteristics
Symbol Characteristic
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Min
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Typ
Transistor
Diode
To Heatsink
M5
Max
0.16
0.32
2500
-40
-40
-40
1.5
RT =
Min
R 25
°C/W
V
150
125
100
4.7
160
Temperature sensor NTC (see application note APT0406 on www.advancedpower.com for more information).
Symbol Characteristic
R25
Resistance @ 25°C
B 25/85 T25 = 298.15 K
Unit
Typ
50
3952
Max
°C
N.m
g
Unit
kΩ
K
T: Thermistor temperature

 1 1  RT : Thermistor value at T
exp B 25 / 85 
− 
 T25 T 

ALL DIMENSIONS MARKED " * " ARE TOLERENCED AS :
APT website – http://www.advancedpower.com
3–6
APTM20DAM08TG – Rev 3
November, 2005
SP4 Package outline (dimensions in mm)
APTM20DAM08TG
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
0.18
0.16
0.9
0.14
0.7
0.12
0.1
0.5
0.08
0.06
0.3
0.04
Single Pulse
0.1
0.02
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
Low Voltage Output Characteristics
1400
Transfert Characteristics
600
1000
9V
800
8.5V
600
8V
7.5V
400
7V
200
V DS > ID(on)xRDS(on)MAX
250µs pulse test @ < 0.5 duty cycle
500
400
300
200
TJ=25°C
100
T J=125°C
6.5V
0
0
4
8
12
16
20
24
28
0
VDS , Drain to Source Voltage (V)
1.2
Normalized to
V GS=10V @ 104A
1.1
1 2 3 4 5 6 7 8 9 10
VGS, Gate to Source Voltage (V)
DC Drain Current vs Case Temperature
250
RDS(on) vs Drain Current
ID, DC Drain Current (A)
VGS=10V
1
VGS=20V
0.9
0.8
200
150
100
50
0
0
50
100
150
200
ID, Drain Current (A)
250
300
25
50
75
100
125
November, 2005
RDS(on) Drain to Source ON Resistance
TJ=-55°C
0
150
TC, Case Temperature (°C)
APT website – http://www.advancedpower.com
4–6
APTM20DAM08TG – Rev 3
ID, Drain Current (A)
10V
ID, Drain Current (A)
VGS=15V
1200
1.10
1.05
1.00
0.95
0.90
-50 -25
0
25 50 75 100 125 150
TJ, Junction Temperature (°C)
1.1
1.0
0.9
0.8
0.7
VGS=10V
ID= 104A
2.0
1.5
1.0
0.5
0.0
-50 -25
25
50
75 100 125 150
Maximum Safe Operating Area
0.6
limited by
RDSon
100µs
100
1ms
10ms
10
100ms
Single pulse
TJ=150°C
1
0
25 50 75 100 125 150
1
Capacitance vs Drain to Source Voltage
100000
Ciss
10000
Coss
1000
Crss
100
0
10
20
30
40
50
VDS, Drain to Source Voltage (V)
VGS, Gate to Source Voltage (V)
TC, Case Temperature (°C)
10
100
1000
VDS, Drain to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
14
I D=208A
V DS=40V
12
TJ =25°C
VDS=100V
10
8
VDS=160V
6
4
2
0
0
40
APT website – http://www.advancedpower.com
80 120 160 200 240 280 320
November, 2005
-50 -25
C, Capacitance (pF)
0
TJ, Junction Temperature (°C)
1000
ID, Drain Current (A)
VGS(TH), Threshold Voltage
(Normalized)
Threshold Voltage vs Temperature
1.2
ON resistance vs Temperature
2.5
Gate Charge (nC)
5–6
APTM20DAM08TG – Rev 3
BVDSS, Drain to Source Breakdown
Voltage (Normalized)
Breakdown Voltage vs Temperature
1.15
RDS(on), Drain to Source ON resistance
(Normalized)
APTM20DAM08TG
APTM20DAM08TG
Delay Times vs Current
Rise and Fall times vs Current
160
120
60
120
t d(on)
40
tr and tf (ns)
100
80
tr
60
40
20
0
0
0
50
100 150 200 250 300 350
I D, Drain Current (A)
0
50
6
Eoff
Eon
2
1
Switching Energy (mJ)
VDS=133V
RG=2.5Ω
TJ=125°C
L=100µH
3
VDS=133V
ID=208A
TJ=125°C
L=100µH
5
4
3
Eon
2
1
50
100 150 200 250 300 350
0
5
I D, Drain Current (A)
Operating Frequency vs Drain Current
300
250
ZVS
200
50
V DS=133V
D=50%
R G=2.5Ω
T J=125°C
T C=75°C
ZCS
Hard
switching
0
25
50
75
100 125 150 175 200
I D, Drain Current (A)
15
20
25
Source to Drain Diode Forward Voltage
IDR, Reverse Drain Current (A)
350
10
Gate Resistance (Ohms)
1000
TJ =150°C
100
TJ =25°C
10
1
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
November, 2005
0
100
Eoff
Eoff
0
150
100 150 200 250 300 350
ID, Drain Current (A)
Switching Energy vs Gate Resistance
Switching Energy vs Current
4
Frequency (kHz)
tf
VSD, Source to Drain Voltage (V)
APT reserves the right to change, without notice, the specifications and information contained herein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
APT website – http://www.advancedpower.com
6–6
APTM20DAM08TG – Rev 3
t d(on) and td(off) (ns)
t d(off)
VDS=133V
RG=2.5Ω
T J=125°C
L=100µH
80
20
Eon and Eoff (mJ)
V DS=133V
R G=2.5Ω
T J=125°C
L=100µH
140
100