PANASONIC 2SK3318

Power MOSFETs
2SK3318
Silicon N-channel power MOSFET
Unit: mm
15.0±0.3
(0.7)
For switching
■ Absolute Maximum Ratings TC = 25°C
Parameter
Symbol
Rating
Unit
Drain-source surrender voltage
VDSS
600
V
Gate-source surrender voltage
VGSS
±30
V
ID
±15
A
Drain current
IDP
±60
A
EAS
112.5
mJ
PD
100
W
Peak drain current
Avalanche energy capability *
Ta = 25°C
φ 3.2±0.1
15.0±0.2
21.0±0.5
16.2±0.5
• Avalanche energy capability guaranteed
• High-speed switching
• Low ON resistance Ron
• No secondary breakdown
(3.2)
11.0±0.2
(3.5)
Solder Dip
■ Features
Power
dissipation
5.0±0.2
2.0±0.2
2.0±0.1
0.6±0.2
1.1±0.1
5.45±0.3
10.9±0.5
1
2
3
1: Gate
2: Drain
3: Source
TOP-3F-A1 Package
Internal Connection
D
3
Channel temperature
Tch
150
°C
Storage temperature
Tstg
−55 to +150
°C
G
Note) *: L = 1 mH, IL = 15 A, 1 pulse
S
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter
Symbol
Conditions
Gate-drain surrender voltage
VDSS
ID = 1 mA, VGS = 0
Diode forward voltage
VDSF
IDR = 15 A, VGS = 0
Gate threshold voltage
Vth
VDS = 25 V, ID = 1 mA
Drain-source cutoff current
IDSS
VDS = 480 V, VGS = 0
Gate-source cutoff currentt
IGSS
VGS = ±30 V, VDS = 0
Drain-source on resistance
RDS(on)
VGS = 10 V, ID = 7.5 A
Forward transfer admittance
Yfs
VDS = 25 V, ID = 7.5 A
Min
Typ
Max
600
V
−1.5
2
0.33
V
4
V
10
µA
±1
µA
0.46
Ω
10
S
3 500
pF
Coss
340
pF
Reverse transfer capacitance
(Common-source)
Crss
50
pF
Turn-on delay time
td(on)
VDD = 150 V, ID = 7.5 A
40
ns
tr
RL = 20 Ω, VGS = 10 V
Short-circuit forward transfer capacitance
(Common-source)
Ciss
Short-circuit output capacitance
(Common-source)
Rise time
Turn-off delay time
Fall time
VDS = 20 V, VGS = 0, f = 1 MHz
6
Unit
55
ns
td(off)
310
ns
tf
70
ns
Channel-case heat resistance
Rth(ch-c)
1.25
°C/W
Channel-atmosphere heat resistance
Rth(ch-a)
41.7
°C/W
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: November 2004
SJG00040AED
1
2SK3318
PD  Ta
Safe operation area
103
120
Non repetitive pulse
TC = 25°C
Power dissipation PD (W)
Drain current ID (A)
100
102 I
DP
t = 100 µs
ID
10
RDS(on) Limited
1 ms
1
10 ms
(1) TC = Ta
(2) Without heat sink
PD = 3 W
(1)
80
60
40
20
100 ms
DC
(2)
10−1
1
10
102
Drain-source voltage VDS (V)
2
103
0
0
50
100
Ambient temperature Ta (°C)
SJG00040AED
150
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and semiconductors described in this material
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Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
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(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
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2003 SEP