NCN1154 DP3T USB 2.0 High Speed / Audio Switch with Negative Swing Capability The NCN1154 is a DP3T switch for combined true−ground audio, USB 2.0 high speed data, and UART applications. It allows portable systems to use a single port to pass either USB data or audio signals from an external headset. The switch is capable of passing signals with negative voltages as low as 2 V below ground. The NCN1154 features shunt resistors on the audio ports. These resistors are switched in when the audio channel is off and provide a safe path to ground for any charge that may build up on the audio lines. This reduces Pop & Click noise in the audio system. The device has an extended VCC range which can operate off VCC up to 4.2 V while passing true ground audio signals down to −2 V. http://onsemi.com MARKING DIAGRAM 1 AC = Specific Device Code M = Date Code G = Pb−Free Package Features 480 Mbps High Speed USB Capable Capable of Passing Negative Swing Signals Down to −2 V 1.8 V Compatible Control Pins for 2.7 V v VCC v 4.2 V High USB Path Bandwidth (850 MHz) USB/Audio/UART Audio Channel Shunt Resistors for Pop & Click Noise Reduction Ultra Low THD in Audio Mode: 0.01% into 16 W Load 5.25 V Tolerant Common Pins This is a Pb−Free Device APPLICATION DIAGRAM NCN1154 D+ D− USB Connector • • • • • • • • • ACM G UQFN12 MU SUFFIX CASE 523AE COM+ Rx COM− Tx Typical Applications R • Shared USB/UART/Audio Connector • Mobile Phones • Portable Devices UART XCVR True GND Audio L IN1, IN2 HS USB XCVR From Baseband ORDERING INFORMATION Device NCN1154MUTAG Package Shipping† UQFN12 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2010 June, 2010 − Rev. 1 1 Publication Order Number: NCN1154/D NCN1154 VCC D+ COM+ D− TX L RX L COM− IN1 D+ 1 Tx 2 10 COM+ VCC 3 9 GND Rx 4 8 COM− D− 5 7 IN2 12 11 R IN1 Control Logic 6 R GND (Top View) IN2 Figure 1. Functional Block Diagram Figure 2. Pinout Diagram PIN DESCRIPTIONS Pin # Name Direction Description 1 D+ I/O Positive Data Line for USB Signals Transmit Data Line for UART Signals 2 Tx I/O 3 VCC Power 4 Rx I/O Receive Data Line for UART Signals 5 D− I/O Negative Data Line for USB Signals 6 R I/O Right Line for Audio Signals 7 IN2 Input 8 COM− I/O 9 GND Power 10 COM+ I/O 11 IN1 Input 12 L I/O Power Supply Control Input Select Line Right Audio / Negative Data Common Line Ground Left Audio / Positive Data Common Line Control Input Select Line Right Line for Audio Signals TRUTH TABLE IN1 IN2 D+, D− RX/TX L, R L, R SHUNT 0 0 Hi Z Hi Z Hi Z ON 0 1 ON Hi Z Hi Z ON 1 0 Hi Z Hi Z ON OFF 1 1 Hi Z ON Hi Z ON http://onsemi.com 2 NCN1154 OPERATING CONDITIONS MAXIMUM RATINGS Symbol Pins VCC VCC VIS D+ to COM+, D− to COM− Parameter Value Unit Positive DC Supply Voltage −0.5 to +6.0 V Analog Signal Voltage −0.5 to +6.0 V L to COM+, R to COM− −2.5 to VCC + 0.5 Tx to COM+, Rx to COM− −2.5 to VCC + 0.5 VIS COM+, COM− VIN IN1, IN2 ICC VCC TS DC Signal Voltage Tolerance (<24 hours) Control Input Voltage 5.25 V −0.5 to +6.0 V Positive DC Supply Current Storage Temperature 50 mA −65 to +150 °C IIS_CON COM+, COM−, R, L, D+, D−, Rx, Tx Analog Signal Continuous Current−Closed Switch $100 mA IIS_PK COM+, COM−, R, L, D+, D−, Rx, Tx Analog Signal Continuous Current 10% Duty Cycle $500 mA 1.0 mA IIN IN1, IN2 Control Input Current Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: These devices have limited built−in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage. RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VCC VIS D+ to COM+, D− to COM− VIN Min Max Unit 2.7 5.0 V GND VCC V L to COM+, R to COM− −2.0 VCC Tx to COM+, Rx to COM− GND VCC GND VCC V −40 +85 °C IN1, IN2 TA Parameter Positive DC Supply Voltage Analog Signal Voltage Control Input Voltage Operating Temperature Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. DC ELECTRICAL CHARACTERISTICS CONTROL INPUT Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Symbol VIH Pins IN1, IN2 Parameter Control Input HIGH Voltage VIL IN1, IN2 Control Input LOW Voltage IIN IN1, IN2 Current Input Leakage Current Test Conditions 0 ≤ VIS ≤ VCC http://onsemi.com 3 VCC (V) 2.7 3.3 4.2 Min Typ Max 1.3 1.4 1.5 − − 2.7 3.3 4.2 − − 0.4 0.4 0.4 V − − ±50 nA Unit V NCN1154 SUPPLY CURRENT AND LEAKAGE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Symbol INC,NO(OFF) Pins D+, D− R, L Tx, Rx Parameter OFF State Leakage Test Conditions VCOM−, VCOM+ = 0 V, 4.2 V VD+, VD− = 4.2 V, 0 V or float VL, VR = float or 4.2 V, 0 V VCC (V) 4.2 ICOM(ON) COM−, COM+ ON State Leakage VCOM−, VCOM+ = 0 V, 4.2 V VD+, VD− = 4.2 V, 0 V or float VL, VR = float or 4.2 V, 0 V 4.2 ICC IOFF VCC COM−, COM+ Quiescent Supply Power OFF Leakage VIS = GND to VCC; ID = 0 A 0 ≤ VIS ≤ 5.0 V 4.2 0 Min Typ 21 Max ±80 Unit nA ±100 nA 35 50 mA mA USB ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Min Typ Max 5.5 5.5 5.5 7.5 7.5 7.5 Symbol RON Pins D+ to COM+ D− to COM− Parameter On−Resistance Test Conditions ION = 10 mA VIS = 0 V to VCC RFLAT D+ to COM+ D− to COM− On−Resistance Flatness ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.08 0.08 0.08 W DRON D+ to COM+ D− to COM− On−Resistance Matching ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.03 0.03 0.03 W VCC (V) 2.7 3.3 4.2 Unit W AUDIO ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Symbol Typ Max 3.0 3.0 3.0 4.7 4.7 4.7 RON Pins R to COM+ L to COM− Parameter On−Resistance Test Conditions ION = 10 mA VIS = −1.5 to 1.5 RFLAT R to COM+ L to COM− On−Resistance Flatness ION = 10 mA VIS = −1.5 to 1.5 2.7 3.3 4.2 0.11 0.11 0.11 W DRON R to COM+ L to COM− On−Resistance Matching ION = 10 mA VIS = −1.5 to 1.5 2.7 3.3 4.2 0.03 0.03 0.03 W Shunt Resistance (Resistor + Switch) ION = 10 mA 2.7 − 4.2 118 RSH L, R VCC (V) 2.7 3.3 4.2 Min 160 Unit W W UART ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Min Typ Max 5.5 5.5 5.5 7.5 7.5 7.5 Symbol RON Pins Tx to COM+ Rx to COM− Parameter On−Resistance Test Conditions ION = 10 mA VIS = 0 V to VCC RFLAT Tx to COM+ Rx to COM− On−Resistance Flatness ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.08 0.08 0.08 W DRON Tx to COM+ Rx to COM− On−Resistance Matching ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.03 0.03 0.03 W http://onsemi.com 4 VCC (V) 2.7 3.3 4.2 Unit W NCN1154 AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 35 pF, f = 1 MHz. −405C to +855C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit tON Turn−ON Time (Closed to Open) 15 ms tOFF Turn−OFF Time (Closed to Open) 67 ns TBBM BW Break−Before−Make Time D+ to COM+ −3 dB Bandwidth D− to COM− CL = 5 pF RS = 50 W 11 ms 850 MHz ISOLATION Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 5 pF. −405C to +855C Symbol Pins OIRR Open XTALK COM+ to COM− Parameter Test Conditions VCC (V) Min Typ Max Unit OFF−Isolation f = 100 kHz, RS = 50 W −81 dB Non−Adjacent Channel Crosstalk f = 100 kHz, RS = 50 W −93 dB THD+N Total Harmonic Distortion + Noise IN1, IN2 = 3.0 V f = 20 Hz to 20 kHz VCOM = 0.5 Vpp RL = 600 W 3.0 0.001 % PSRR Power Supply Rejection Ratio f = 10 kHz RCOM = 50 W 3.0 60 dB CAPACITANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 5 pF, f = 1 MHz. −405C to +855C Symbol CIN CON Pins IN1, IN2 Parameter Test Conditions Control Pin Input Capacitance VCC = 0 V R to COM+ L to COM− COFF D+, D− Tx, Rx Typ Max Unit 2.0 pF 9.0 pF Audio ON Capacitance 8.5 pF USB, UART OFF Capacitance 3.5 pF D+, Tx to COM+ USB, UART ON Capacitance D−, Rx to COM− CON Min http://onsemi.com 5 NCN1154 TABLE OF GRAPHS Symbol Parameter Figure NE Near End Signaling Eye Diagram 3, 4, 5, 6 FE Far End Signaling Eye Diagram 7, 8, 9, 10 Figure 3. Reference Near End Eye Diagram (Path Trough Dedicated Line, Temp = 255C) Figure 4. USB Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 0, IN2 = 1, Temp = 255C) Figure 5. UART Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C) Figure 6. Audio Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C) http://onsemi.com 6 NCN1154 Figure 7. Reference Far End Eye Diagram (Path Trough Dedicated Line, Temp = 255C) Figure 8. USB Switch Far End Eye Diagram (VCC = 3.6V, IN1 = 0, IN2 = 1, Temp = 255C) Figure 9. UART Switch Far End Eye Diagram (Vcc = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C) Figure 10. Audio Switch Far End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C) http://onsemi.com 7 NCN1154 PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE−01 ISSUE A ÉÉ ÉÉ ÉÉ D PIN 1 REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B L1 DETAIL A E NOTE 5 TOP VIEW DIM A A1 A3 b D E e K L L1 L2 DETAIL B A 0.05 C 12X 0.05 C A1 A3 8X C SIDE VIEW SEATING PLANE K 5 7 DETAIL A MOUNTING FOOTPRINT SOLDERMASK DEFINED e 1 12X DETAIL B OPTIONAL CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF 11 L 2.00 12X L2 BOTTOM VIEW b 0.10 M C A B 0.05 M C 1 NOTE 3 0.32 2.30 0.40 PITCH 11X 0.22 12X 0.69 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCN1154/D