ONSEMI NCN1154

NCN1154
DP3T USB 2.0 High Speed /
Audio Switch with Negative
Swing Capability
The NCN1154 is a DP3T switch for combined true−ground audio,
USB 2.0 high speed data, and UART applications. It allows portable
systems to use a single port to pass either USB data or audio signals
from an external headset. The switch is capable of passing signals with
negative voltages as low as 2 V below ground.
The NCN1154 features shunt resistors on the audio ports. These
resistors are switched in when the audio channel is off and provide a
safe path to ground for any charge that may build up on the audio lines.
This reduces Pop & Click noise in the audio system. The device has an
extended VCC range which can operate off VCC up to 4.2 V while
passing true ground audio signals down to −2 V.
http://onsemi.com
MARKING
DIAGRAM
1
AC = Specific Device Code
M = Date Code
G
= Pb−Free Package
Features
480 Mbps High Speed USB Capable
Capable of Passing Negative Swing Signals Down to −2 V
1.8 V Compatible Control Pins for 2.7 V v VCC v 4.2 V
High USB Path Bandwidth (850 MHz)
USB/Audio/UART
Audio Channel Shunt Resistors for Pop & Click Noise Reduction
Ultra Low THD in Audio Mode: 0.01% into 16 W Load
5.25 V Tolerant Common Pins
This is a Pb−Free Device
APPLICATION DIAGRAM
NCN1154
D+
D−
USB
Connector
•
•
•
•
•
•
•
•
•
ACM
G
UQFN12
MU SUFFIX
CASE 523AE
COM+
Rx
COM−
Tx
Typical Applications
R
• Shared USB/UART/Audio Connector
• Mobile Phones
• Portable Devices
UART
XCVR
True
GND
Audio
L
IN1, IN2
HS USB
XCVR
From Baseband
ORDERING INFORMATION
Device
NCN1154MUTAG
Package
Shipping†
UQFN12 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
June, 2010 − Rev. 1
1
Publication Order Number:
NCN1154/D
NCN1154
VCC
D+
COM+
D−
TX
L
RX
L
COM−
IN1
D+
1
Tx
2
10
COM+
VCC
3
9
GND
Rx
4
8
COM−
D−
5
7
IN2
12
11
R
IN1
Control Logic
6
R
GND
(Top View)
IN2
Figure 1. Functional Block Diagram
Figure 2. Pinout Diagram
PIN DESCRIPTIONS
Pin #
Name
Direction
Description
1
D+
I/O
Positive Data Line for USB Signals
Transmit Data Line for UART Signals
2
Tx
I/O
3
VCC
Power
4
Rx
I/O
Receive Data Line for UART Signals
5
D−
I/O
Negative Data Line for USB Signals
6
R
I/O
Right Line for Audio Signals
7
IN2
Input
8
COM−
I/O
9
GND
Power
10
COM+
I/O
11
IN1
Input
12
L
I/O
Power Supply
Control Input Select Line
Right Audio / Negative Data Common Line
Ground
Left Audio / Positive Data Common Line
Control Input Select Line
Right Line for Audio Signals
TRUTH TABLE
IN1
IN2
D+, D−
RX/TX
L, R
L, R SHUNT
0
0
Hi Z
Hi Z
Hi Z
ON
0
1
ON
Hi Z
Hi Z
ON
1
0
Hi Z
Hi Z
ON
OFF
1
1
Hi Z
ON
Hi Z
ON
http://onsemi.com
2
NCN1154
OPERATING CONDITIONS
MAXIMUM RATINGS
Symbol
Pins
VCC
VCC
VIS
D+ to COM+, D− to COM−
Parameter
Value
Unit
Positive DC Supply Voltage
−0.5 to +6.0
V
Analog Signal Voltage
−0.5 to +6.0
V
L to COM+, R to COM−
−2.5 to VCC + 0.5
Tx to COM+, Rx to COM−
−2.5 to VCC + 0.5
VIS
COM+, COM−
VIN
IN1, IN2
ICC
VCC
TS
DC Signal Voltage Tolerance (<24 hours)
Control Input Voltage
5.25
V
−0.5 to +6.0
V
Positive DC Supply Current
Storage Temperature
50
mA
−65 to +150
°C
IIS_CON
COM+, COM−, R, L, D+, D−, Rx, Tx
Analog Signal Continuous Current−Closed Switch
$100
mA
IIS_PK
COM+, COM−, R, L, D+, D−, Rx, Tx
Analog Signal Continuous Current 10% Duty Cycle
$500
mA
1.0
mA
IIN
IN1, IN2
Control Input Current
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: These devices have limited built−in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage.
RECOMMENDED OPERATING CONDITIONS
Symbol
Pins
VCC
VCC
VIS
D+ to COM+, D− to COM−
VIN
Min
Max
Unit
2.7
5.0
V
GND
VCC
V
L to COM+, R to COM−
−2.0
VCC
Tx to COM+, Rx to COM−
GND
VCC
GND
VCC
V
−40
+85
°C
IN1, IN2
TA
Parameter
Positive DC Supply Voltage
Analog Signal Voltage
Control Input Voltage
Operating Temperature
Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for section, where applicable. These
conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions.
DC ELECTRICAL CHARACTERISTICS
CONTROL INPUT Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values
are referenced to TA = +25°C, VCC = 3.3 V.
−40°C to +85°C
Symbol
VIH
Pins
IN1, IN2
Parameter
Control Input HIGH Voltage
VIL
IN1, IN2
Control Input LOW Voltage
IIN
IN1, IN2
Current Input Leakage
Current
Test Conditions
0 ≤ VIS ≤ VCC
http://onsemi.com
3
VCC (V)
2.7
3.3
4.2
Min
Typ
Max
1.3
1.4
1.5
−
−
2.7
3.3
4.2
−
−
0.4
0.4
0.4
V
−
−
±50
nA
Unit
V
NCN1154
SUPPLY CURRENT AND LEAKAGE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise
noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V.
−40°C to +85°C
Symbol
INC,NO(OFF)
Pins
D+, D−
R, L
Tx, Rx
Parameter
OFF State Leakage
Test Conditions
VCOM−, VCOM+ = 0 V, 4.2 V
VD+, VD− = 4.2 V, 0 V or float
VL, VR = float or 4.2 V, 0 V
VCC (V)
4.2
ICOM(ON)
COM−,
COM+
ON State Leakage
VCOM−, VCOM+ = 0 V, 4.2 V
VD+, VD− = 4.2 V, 0 V or float
VL, VR = float or 4.2 V, 0 V
4.2
ICC
IOFF
VCC
COM−,
COM+
Quiescent Supply
Power OFF Leakage
VIS = GND to VCC; ID = 0 A
0 ≤ VIS ≤ 5.0 V
4.2
0
Min
Typ
21
Max
±80
Unit
nA
±100
nA
35
50
mA
mA
USB ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical
values are referenced to TA = +25°C, VCC = 3.3 V.
−40°C to +85°C
Min
Typ
Max
5.5
5.5
5.5
7.5
7.5
7.5
Symbol
RON
Pins
D+ to COM+
D− to COM−
Parameter
On−Resistance
Test Conditions
ION = 10 mA
VIS = 0 V to VCC
RFLAT
D+ to COM+
D− to COM−
On−Resistance Flatness
ION = 10 mA
VIS = 0 V to VCC
2.7
3.3
4.2
0.08
0.08
0.08
W
DRON
D+ to COM+
D− to COM−
On−Resistance Matching
ION = 10 mA
VIS = 0 V to VCC
2.7
3.3
4.2
0.03
0.03
0.03
W
VCC (V)
2.7
3.3
4.2
Unit
W
AUDIO ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical
values are referenced to TA = +25°C, VCC = 3.3 V.
−40°C to +85°C
Symbol
Typ
Max
3.0
3.0
3.0
4.7
4.7
4.7
RON
Pins
R to COM+
L to COM−
Parameter
On−Resistance
Test Conditions
ION = 10 mA
VIS = −1.5 to 1.5
RFLAT
R to COM+
L to COM−
On−Resistance Flatness
ION = 10 mA
VIS = −1.5 to 1.5
2.7
3.3
4.2
0.11
0.11
0.11
W
DRON
R to COM+
L to COM−
On−Resistance Matching
ION = 10 mA
VIS = −1.5 to 1.5
2.7
3.3
4.2
0.03
0.03
0.03
W
Shunt Resistance
(Resistor + Switch)
ION = 10 mA
2.7 − 4.2
118
RSH
L, R
VCC (V)
2.7
3.3
4.2
Min
160
Unit
W
W
UART ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical
values are referenced to TA = +25°C, VCC = 3.3 V.
−40°C to +85°C
Min
Typ
Max
5.5
5.5
5.5
7.5
7.5
7.5
Symbol
RON
Pins
Tx to COM+
Rx to COM−
Parameter
On−Resistance
Test Conditions
ION = 10 mA
VIS = 0 V to VCC
RFLAT
Tx to COM+
Rx to COM−
On−Resistance Flatness
ION = 10 mA
VIS = 0 V to VCC
2.7
3.3
4.2
0.08
0.08
0.08
W
DRON
Tx to COM+
Rx to COM−
On−Resistance Matching
ION = 10 mA
VIS = 0 V to VCC
2.7
3.3
4.2
0.03
0.03
0.03
W
http://onsemi.com
4
VCC (V)
2.7
3.3
4.2
Unit
W
NCN1154
AC ELECTRICAL CHARACTERISTICS
TIMING/FREQUENCY Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values
are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 35 pF, f = 1 MHz.
−405C to +855C
Symbol
Pins
Parameter
Test Conditions
VCC (V)
Min
Typ
Max
Unit
tON
Turn−ON Time (Closed to Open)
15
ms
tOFF
Turn−OFF Time (Closed to
Open)
67
ns
TBBM
BW
Break−Before−Make Time
D+ to COM+ −3 dB Bandwidth
D− to COM−
CL = 5 pF
RS = 50 W
11
ms
850
MHz
ISOLATION Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are
referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 5 pF.
−405C to +855C
Symbol
Pins
OIRR
Open
XTALK
COM+ to
COM−
Parameter
Test Conditions
VCC (V)
Min
Typ
Max
Unit
OFF−Isolation
f = 100 kHz,
RS = 50 W
−81
dB
Non−Adjacent Channel
Crosstalk
f = 100 kHz,
RS = 50 W
−93
dB
THD+N
Total Harmonic Distortion +
Noise
IN1, IN2 = 3.0 V
f = 20 Hz to 20 kHz
VCOM = 0.5 Vpp
RL = 600 W
3.0
0.001
%
PSRR
Power Supply Rejection Ratio
f = 10 kHz
RCOM = 50 W
3.0
60
dB
CAPACITANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are
referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 5 pF, f = 1 MHz.
−405C to +855C
Symbol
CIN
CON
Pins
IN1, IN2
Parameter
Test Conditions
Control Pin Input Capacitance
VCC = 0 V
R to COM+
L to COM−
COFF
D+, D−
Tx, Rx
Typ
Max
Unit
2.0
pF
9.0
pF
Audio ON Capacitance
8.5
pF
USB, UART OFF Capacitance
3.5
pF
D+, Tx to COM+ USB, UART ON Capacitance
D−, Rx to COM−
CON
Min
http://onsemi.com
5
NCN1154
TABLE OF GRAPHS
Symbol
Parameter
Figure
NE
Near End Signaling Eye Diagram
3, 4, 5, 6
FE
Far End Signaling Eye Diagram
7, 8, 9, 10
Figure 3. Reference Near End Eye Diagram
(Path Trough Dedicated Line, Temp = 255C)
Figure 4. USB Switch Near End Eye Diagram
(VCC = 3.6 V, IN1 = 0, IN2 = 1, Temp = 255C)
Figure 5. UART Switch Near End Eye Diagram
(VCC = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C)
Figure 6. Audio Switch Near End Eye Diagram
(VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C)
http://onsemi.com
6
NCN1154
Figure 7. Reference Far End Eye Diagram
(Path Trough Dedicated Line, Temp = 255C)
Figure 8. USB Switch Far End Eye Diagram
(VCC = 3.6V, IN1 = 0, IN2 = 1, Temp = 255C)
Figure 9. UART Switch Far End Eye Diagram
(Vcc = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C)
Figure 10. Audio Switch Far End Eye Diagram
(VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C)
http://onsemi.com
7
NCN1154
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE−01
ISSUE A
ÉÉ
ÉÉ
ÉÉ
D
PIN 1 REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
L1
DETAIL A
E
NOTE 5
TOP VIEW
DIM
A
A1
A3
b
D
E
e
K
L
L1
L2
DETAIL B
A
0.05 C
12X
0.05 C
A1
A3
8X
C
SIDE VIEW
SEATING
PLANE
K
5
7
DETAIL A
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
e
1
12X
DETAIL B
OPTIONAL
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.70 BSC
2.00 BSC
0.40 BSC
0.20
---0.45
0.55
0.00
0.03
0.15 REF
11
L
2.00
12X
L2
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
1
NOTE 3
0.32
2.30
0.40
PITCH
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCN1154/D