CYPRESS CY8CLED02

CY8CLED02
EZ-Color™ HB LED Controller
Features
■
HB LED Controller
❐ Configurable Dimmers Support up to 2
Independent LED Channels
❐ 8-32 Bits of Resolution per Channel
❐ Dynamic Reconfiguration Enables LED Controller plus other
Features; Battery Charging, Motor Control
■
Visual Embedded Design
❐ LED-Based Drivers
• Binning Compensation
• Temperature Feedback
• Optical Feedback
• DMX512
■
PrISM Modulation Technology
❐ Reduces Radiated EMI
❐ Reduces Low Frequency Blinking
■
Powerful Harvard Architecture Processor
❐ M8C Processor Speeds to 24 MHz
❐ 3.0 to 5.25V Operating Voltage
❐ Operating Voltages down to 1.0V using
On-Chip Switch Mode Pump (SMP)
❐ Industrial Temperature Range: -40°C to +85°C
■
■
■
Programmable Pin Configurations
❐ 25 mA Sink, 10 mA Source on all GPIO
❐ Pull up, Pull down, High Z, Strong, or Open Drain Drive
Modes on all GPIO
❐ Up to 12 Analog Inputs on GPIO
❐ Four 30 mA Analog Outputs on GPIO
❐ Configurable Interrupt on all GPIO
■
Complete Development Tools
❐ Free Development Software
• PSoC Designer™
❐ Full featured, In-Circuit Emulator and Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128 KBytes Trace Memory
Logic Block Diagram
Port 1
Port 0
PSoC
CORE
System Bus
Flexible On-Chip Memory
❐ 4K Flash Program Storage 50,000 Erase/Write Cycles
❐ 256 Bytes SRAM Data Storage
❐ In-System Serial Programming (ISSP)
❐ Partial Flash Updates
❐ Flexible Protection Modes
❐ EEPROM Emulation in Flash
Global Digital Interconnect
Global Analog Interconnect
SROM
SRAM
Flash
CPU Core
(M8C)
Interrupt
Controller
Sleep and
Watchdog
Clock Sources
(Includes IMO and ILO)
Advanced Peripherals (PSoC Blocks)
❐ 4 Digital PSoC Blocks Provide:
• 8 to 32-Bit Timers, Counters, and PWMs
• Full-Duplex UART
• Multiple SPI Masters or Slaves
• Connectable to all GPIO Pins
❐ 4 Rail-to-Rail Analog PSoC Blocks Provide:
• Up to 14-Bit ADCs
• Up to 9-Bit DACs
• Programmable Gain Amplifiers
• Programmable Filters and Comparators
❐ Complex Peripherals by Combining Blocks
DIGITAL SYSTEM
Digital
PSoC Block
Array
Digital
Clocks
ANALOG SYSTEM
Analog
PSoC Block
Array
POR and LVD
I2C
System Resets
Switch
Mode
Pump
Analog
Ref.
Internal
Voltage
Ref.
SYSTEM RESOURCES
Cypress Semiconductor Corporation
Document Number: 001-13704 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 15, 2010
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CY8CLED02
Contents
EZ-Color™ Functional Overview........................................ 3
Target Applications......................................................... 3
The PSoC Core .............................................................. 3
The Digital System ......................................................... 3
The Analog System ........................................................ 4
Additional System Resources ........................................ 4
EZ-Color Device Characteristics .................................... 5
Getting Started..................................................................... 5
Development Kits ........................................................... 5
Technical Training Modules ........................................... 5
Consultants .................................................................... 5
Technical Support .......................................................... 5
Application Notes ........................................................... 5
Development Tools ............................................................. 6
PSoC Designer Software Subsystems........................... 6
In-Circuit Emulator.......................................................... 6
Document Conventions ...................................................... 7
Acronyms Used .............................................................. 7
Units of Measure ............................................................ 7
Numeric Naming............................................................. 7
Pin Information .................................................................... 8
Pinouts ........................................................................... 8
Register Reference............................................................ 10
Register Conventions ................................................... 10
Register Mapping Tables ............................................. 10
Register Map Bank 1.................................................... 11
Document Number: 001-13704 Rev. *C
Electrical Specifications ...................................................
Absolute Maximum Ratings..........................................
Operating Temperature ................................................
DC Electrical Characteristics........................................
AC Electrical Characteristics ........................................
Packaging Information......................................................
Packaging Dimensions.................................................
Thermal Impedances....................................................
Solder Reflow Peak Temperature ................................
Development Tool Selection ............................................
Software Tools .............................................................
Hardware Tools ............................................................
Evaluation Tools...........................................................
Device Programmers....................................................
Accessories (Emulation and Programming) .................
Third Party Tools ..........................................................
Build a PSoC Emulator into Your Board.......................
Ordering Information.........................................................
Key Device Features ....................................................
Ordering Code Definitions ............................................
Document History Page ....................................................
Sales, Solutions, and Legal Information .........................
Worldwide Sales and Design Support..........................
Products .......................................................................
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CY8CLED02
EZ-Color™ Functional Overview
Cypress's EZ-Color family of devices offers the ideal control
solution for High Brightness LED applications requiring intelligent dimming control. EZ-Color devices combine the power and
flexibility of PSoC (Programmable System-on-Chip™); with
Cypress' PrISM (precise illumination signal modulation) drive
technology providing lighting designers a fully customizable and
integrated lighting solution platform.
The EZ-Color family supports a range of independent LED
channels from 4 channels at 32 bits of resolution each, up to 16
channels at 8 bits of resolution each. This enables lighting
designers the flexibility to choose the LED array size and color
quality. PSoC Designer software, with lighting specific drivers,
can significantly cut development time and simplify implementation of fixed color points through temperature, optical, and LED
binning compensation. EZ-Color's virtually limitless analog and
digital customization enables the simple integration of features
in addition to intelligent lighting, such as Battery Charging, Image
Stabilization, and Motor Control during the development
process. These features, along with Cypress's best-in-class
quality and design support, make EZ-Color the ideal choice for
intelligent HB LED control applications.
Target Applications
The Analog System consists of four analog blocks, supporting
comparators, and analog-to-digital conversion up to 10 bits of
precision.
The Digital System
The Digital System is composed of four digital PSoC blocks.
Each block is an 8-bit resource that can be used alone or
combined with other blocks to form 8, 16, 24, and 32-bit peripherals, which are called user module references. Digital peripheral
configurations include those listed below.
■
PrISM (8 to 32 bit)
■
PWMs (8 to 32 bit)
■
PWMs with dead band (8 to 32 bit)
■
Counters (8 to 32 bit)
■
Timers (8 to 32 bit)
■
UART 8 bit with selectable parity
■
SPI master and slave
■
I2C slave, master, multi-master (1 available as a System
Resource)
■
Cyclical redundancy checker/generator (8 to 32 bit)
■
LCD Backlight
■
IrDA (up to 4)
■
Large Signs
■
Generators (8 to 32 bit)
■
General Lighting
■
Architectural Lighting
■
Camera/Cell Phone Flash
■
Flashlights
Connect the digital blocks to any GPIO through a series of global
busses that can route any signal to any pin. The busses also
allow for signal multiplexing and for performing logic operations.
This configurability frees your designs from the constraints of a
fixed peripheral controller.
The PSoC Core
The PSoC Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and an IMO
(internal main oscillator) and an ILO (internal low speed oscillator). The CPU core, called the M8C, is a powerful, four MIPS,
8-bit Harvard architecture microprocessor with speeds up to 24
MHz.
Digital blocks are provided in rows of four, where the number of
blocks varies by device family. This allows you the optimum
choice of system resources for your application. Family
resources are shown in the table titled EZ-Color Device Characteristics.
Figure 1. Digital System Block Diagram
Port 1
Port 0
System Resources provide additional capability, such as digital
clocks to increase the flexibility of the PSoC; I2C functionality for
implementing an I2C master, slave, or multi-master; an internal
voltage reference that provides an absolute value of 1.3V to a
number of PSoC subsystems; a switch mode pump (SMP) that
generates normal operating voltages off a single battery cell; and
various system resets supported by the M8C.
DIGITAL SYSTEM
Row Input
Configuration
Digital PSoC Block Array
Row 0
DBB00
DBB01
DCB02
4
DCB03
4
8
8
8
8
GIE[7:0]
GIO[7:0]
Document Number: 001-13704 Rev. *C
To Analog
System
Row Output
Configuration
The Digital System is composed of an array of digital blocks,
which can be configured into any number of digital peripherals.
The digital blocks can be connected to the GPIO through a series
of global busses that can route any signal to any pin, freeing
designers from the constraints of a fixed peripheral controller.
To System Bus
Digital Clocks
From Core
Global Digital
Interconnect
GOE[7:0]
GOO[7:0]
Page 3 of 39
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CY8CLED02
The Analog System
Additional System Resources
The analog system is composed of four configurable blocks that
enable creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific
application requirements. Some of the more common EZ-Color
analog functions (most available as user modules) are listed
below.
System resources, some of which have been previously listed,
provide additional capability useful to complete systems.
Additional resources include:
■
Analog-to-digital converters (single or dual, with 10-bit
resolution)
■
Pin-to-pin comparators (1)
■
Single-ended comparators (up to 2) with absolute (1.3V)
reference or 8-bit DAC reference
■
■
Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks can be routed
to both the digital and analog systems. Additional clocks can
be generated using digital blocks as clock dividers.
■
The I2C module provides 100 and 400 kHz communication over
two wires. Slave, master, and multi-master modes are all
supported.
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power
On Reset) circuit eliminates the need for a system supervisor.
■
An internal 1.3 voltage reference provides an absolute
reference for the analog system, including ADCs and DACs.
■
An integrated switch mode pump (SMP) generates normal
operating voltages from a single 1.2V battery cell, providing a
low cost boost converter.
1.3V reference (as a System Resource)
In most PSoC based devices, analog blocks are provided in
columns of three, which includes one CT (continuous time) and
two SC (switched capacitor) blocks. This particular EZ-Color
device provides limited functionality Type “E” analog blocks.
Each column contains one CT block and one SC block.
Figure 2. Analog System Block Diagram
Array Input
Configuration
ACI0[1:0]
ACI1[1:0]
ACOL1MUX
Array
ACE00
ACE01
ASE10
ASE11
Document Number: 001-13704 Rev. *C
Page 4 of 39
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CY8CLED02
EZ-Color Device Characteristics
Depending on your EZ-Color device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4
analog blocks. The following table lists the resources available for specific EZ-Color device groups. The device covered by this data
sheet is shown in the highlighted row of the table
Digital
Rows
Digital
Blocks
Analog
Inputs
Analog
Outputs
Analog
Columns
Analog
Blocks
SRAM
Size
Flash
Size
CapSense
CY8CLED02
CY8CLED04
CY8CLED08
CY8CLED16
Digital
I/O
Part Number
LED
Channels
Table 1. EZ-Color Device Characteristics
2
4
8
16
16
56
44
44
1
1
2
4
4
4
8
16
8
48
12
12
0
2
4
4
2
2
4
4
4
6
12
12
256 Bytes
1K
256 Bytes
2K
4K
16K
16K
32K
No
Yes
No
No
Getting Started
The quickest path to understanding the EZ-Color silicon is by
reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview
of the EZ-Color integrated circuit and presents specific pin,
register, and electrical specifications.
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest device data sheets on the web
at http://www.cypress.com/ez-color.
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
contains development kits, C compilers, and all accessories for
PSoC development. Go to the Cypress Online Store web site at
http://www.cypress.com/store, click Lighting & Power Control to
view a current list of available items.
Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to http://www.cypress.com, click on Design
Support located at the center of the web page, and select
CYPros Consultants.
Technical Support
Application engineers take pride in fast and accurate response.
They can be reached with a 4-hour guaranteed response at
http://www.cypress.com/support.
Application Notes
A long list of application notes will assist you in every aspect of
your design effort. To view the application notes, go to the
http://www.cypress.com web site and select Application Notes
under the Documentation tab.
Technical Training Modules
Free PSoC technical training modules are available for users
new to PSoC. Training modules cover designing, debugging,
advanced analog and CapSense. Go to
http://www.cypress.com/techtrain.
Document Number: 001-13704 Rev. *C
Page 5 of 39
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CY8CLED02
Development Tools
PSoC Designer is a Microsoft® Windows-based, integrated
development
environment
for
the
Programmable
System-on-Chip (PSoC) devices. The PSoC Designer IDE runs
on Windows XP or Windows Vista.
This system provides design database management by project,
an integrated debugger with In-Circuit Emulator, in-system
programming support, and built-in support for third-party
assemblers and C compilers.
PSoC Designer also supports C language compilers developed
specifically for the devices in the PSoC family.
PSoC Designer Software Subsystems
System-Level View
A drag-and-drop visual embedded system design environment
based on PSoC Designer. In the system level view you create a
model of your system inputs, outputs, and communication interfaces. You define when and how an output device changes state
based upon any or all other system devices. Based upon the
design, PSoC Designer automatically selects one or more PSoC
Mixed-Signal Controllers that match your system requirements.
PSoC Designer generates all embedded code, then compiles
and links it into a programming file for a specific PSoC device.
Chip-Level View
The chip-level view is a more traditional Integrated Development
Environment (IDE) based on PSoC Designer. Choose a base
device to work with and then select different onboard analog and
digital components called user modules that use the PSoC
blocks. Examples of user modules are ADCs, DACs, Amplifiers,
and Filters. Configure the user modules for your chosen
application and connect them to each other and to the proper
pins. Then generate your project. This prepopulates your project
with APIs and libraries that you can use to program your
application.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic
configuration allows for changing configurations at run time.
Hybrid Designs
You can begin in the system-level view, allow it to choose and
configure your user modules, routing, and generate code, then
switch to the chip-level view to gain complete control over
on-chip resources. All views of the project share a common code
editor, builder, and common debug, emulation, and programming
tools.
Document Number: 001-13704 Rev. *C
Code Generation Tools
PSoC Designer supports multiple third party C compilers and
assemblers. The code generation tools work seamlessly within
the PSoC Designer interface and have been tested with a full
range of debugging tools. The choice is yours.
Assemblers. The assemblers allow assembly code to merge
seamlessly with C code. Link libraries automatically use absolute
addressing or are compiled in relative mode, and linked with
other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices.
The optimizing C compilers provide all the features of C tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing you to test the program in a physical
system while providing an internal view of the PSoC device.
Debugger commands allow the designer to read and program
and read and write data memory, read and write I/O registers,
read and write CPU registers, set and clear breakpoints, and
provide program run, halt, and step control. The debugger also
allows the designer to create a trace buffer of registers and
memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
In-Circuit Emulator
A low cost, high functionality In-Circuit Emulator (ICE) is
available for development support. This hardware has the
capability to program single devices.
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full speed (24
MHz) operation.
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CY8CLED02
Document Conventions
Units of Measure
Acronyms Used
A units of measure table is located in the Electrical Specifications
section. Table 9 on page 13 lists all the abbreviations used to
measure the devices.
The following table lists the acronyms that are used in this
document.
Table 2. Acronyms
Acronym
AC
ADC
API
CPU
CT
DAC
DC
EEPROM
FSR
GPIO
I/O
IPOR
LSb
LVD
MSb
PC
POR
PPOR
PSoC®
PWM
ROM
SC
SMP
SRAM
Description
alternating current
analog-to-digital converter
application programming interface
central processing unit
continuous time
digital-to-analog converter
direct current
electrically erasable programmable read-only
memory
full scale range
general purpose I/O
input/output
imprecise power on reset
least-significant bit
low voltage detect
most-significant bit
program counter
power on reset
precision power on reset
Programmable System-on-Chip
pulse width modulator
read only memory
switched capacitor
switch mode pump
static random access memory
Document Number: 001-13704 Rev. *C
Numeric Naming
Hexadecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Page 7 of 39
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CY8CLED02
Pin Information
Pinouts
This section describes, lists, and illustrates the CY8CLED02 EZ-Color device pins and pinout configurations. The CY8CLED02 device
is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a “P”) is capable
of Digital I/O. However, Vss, Vdd, SMP, and XRES are not capable of Digital I/O.
8-Pin Part Pinout
Table 3. 8-Pin Part Pinout (SOIC)
Type
Pin
Pin
Description
No. Digital Analog Name
1
I/O
I
P0[5] Analog column mux input.
2
I/O
I
P0[3] Analog column mux input.
3
I/O
P1[1] I2C Serial Clock (SCL), ISSP-SCLK.
4
Power
Vss Ground connection.
5
I/O
P1[0] I2C Serial Data (SDA), ISSP-SDATA.
6
I/O
I
P0[2] Analog column mux input.
7
I/O
I
P0[4] Analog column mux input.
8
Power
Vdd Supply voltage.
Figure 3. 8-Pin EZ-Color Device
A, I, P0[5]
A, I, P0[3]
I2C SCL, P1[1]
Vss
1
8
2
7
SOIC
3
6
4
5
Vdd
P0[4], A, I
P0[2], A, I
P1[0], I2C SDA
LEGEND: A = Analog, I = Input, and O = Output.
16-Pin Part Pinout
Table 4. 16-Pin Part Pinout (SOIC)
Type
Pin
No. Digital Analog
1
I/O
I
2
I/O
I
3
I/O
I
4
I/O
I
5
Power
6
7
8
9
10
11
Power
I/O
Power
I/O
I/O
I/O
12
13
14
15
16
I/O
I/O
I/O
I/O
Power
I
I
I
I
Name
P0[7]
P0[5]
P0[3]
P0[1]
SMP
Description
Analog column mux input.
Analog column mux input.
Analog column mux input.
Analog column mux input.
Switch Mode Pump (SMP) connection
to required external components.
Vss Ground connection.
P1[1] I2C Serial Clock (SCL), ISSP-SCLK.
Vss Ground connection.
P1[0] I2C Serial Data (SDA), ISSP-SDATA.
P1[2]
P1[4] Optional External Clock Input
(EXTCLK).
P0[0] Analog column mux input.
P0[2] Analog column mux input.
P0[4] Analog column mux input.
P0[6] Analog column mux input.
Vdd Supply voltage.
Figure 4. 16-Pin EZ-Color Device
A, I, P0[7]
A, I, P0[5]
A, I, P0[3]
A, I, P0[1]
SMP
Vss
I2C SCL, P1[1]
Vss
1
2
3
4
5
6
7
8
SOIC
16
15
14
13
12
11
10
9
Vdd
P0[6], A, I
P0[4], A, I
P0[2], A, I
P0[0], A, I
P1[4], EXTCLK
P1[2]
P1[0], I2C SDA
LEGEND A = Analog, I = Input, and O = Output.
Document Number: 001-13704 Rev. *C
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CY8CLED02
24-Pin Part Pinout
Table 5. 24-Pin Part Pinout (QFN)[2]
13
14
15
16
17
18
19
20
21
22
23
24
Power
I/O
I/O
I/O
I/O
P1[6]
XRES
Input
I/O
I/O
I/O
I/O
I
I
I
I
Power
Power
I/O
I/O
I/O
I
I
I
NC
P0[0]
P0[2]
P0[4]
P0[6]
Vdd
Vss
P0[7]
P0[5]
P0[3]
Optional External Clock Input
(EXTCLK).
Vdd
P0[6], A, I
19
20
21
22
P0[3], A, I
P0[5], A, I
P0[7], A, I
Vss
23
1
18
17
2
QFN
3
16
14
6
13
12
5
11
(Top View ) 15
9
4
10
I2C Serial Clock (SCL), ISSP-SCLK[1].
No connection.
Ground connection.
I2C Serial Data (SDA), ISSP-SDATA[1].
A, I, P0[1]
SMP
Vss
I2C SCL, P1[7]
I2C SDA, P1[5]
P1[3]
24
Vss
P1[7]
P1[5]
P1[3]
P1[1]
NC
Vss
P1[0]
P1[2]
P1[4]
8
Power
I/O
I/O
I/O
I/O
Analog column mux input.
Switch Mode Pump (SMP) connection
to required external components.
Ground connection.
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
Figure 5. 24-Pin EZ-Color Device
7
3
4
5
6
7
8
9
10
11
12
Description
P0[4], A, I
P0[2], A, I
P0[0], A, I
NC
XRES
P1[6]
I2C SCL, P1[1]
NC
Vss
I2C SDA, P1[0]
P1[2]
EXTCLK,P1[4]
Type
Pin
No. Digital Analog Name
1
I/O
I
P0[1]
2
Power
SMP
Active high external reset with internal
pull down.
No connection.
Analog column mux input.
Analog column mux input.
Analog column mux input.
Analog column mux input.
Supply voltage.
Ground connection.
Analog column mux input.
Analog column mux input.
Analog column mux input.
LEGEND A = Analog, I = Input, and O = Output.
Notes
1. These are the ISSP pins, which are not High Z at POR (Power On Reset).
2. The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
Document Number: 001-13704 Rev. *C
Page 9 of 39
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CY8CLED02
Register Reference
Register Conventions
Register Mapping Tables
This section lists the registers of the CY8CLED02 EZ-Color
device.
The device has a total register address space of 512 bytes. The
register space is referred to as I/O space and is divided into two
banks. The XOI bit in the Flag register (CPU_F) determines
which bank the user is currently in. When the XOI bit is set the
user is in Bank 1.
The register conventions specific to this section are listed in the
following table.
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
Table 6. Register Conventions
Convention
R
W
L
C
#
Description
Read register or bit(s)
Write register or bit(s)
Logical register or bit(s)
Clearable register or bit(s)
Access is bit specific
Table 7. Register Map Bank 0: User Space
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
I2C_CFG
D6
I2C_SCR
D7
I2C_DR
D8
I2C_MSCR D9
INT_CLR0 DA
INT_CLR1 DB
DC
INT_CLR3 DD
INT_MSK3 DE
DF
INT_MSK0 E0
INT_MSK1 E1
Access
RW
Addr
(0,Hex)
RW
Name
Document Number: 001-13704 Rev. *C
ASE11CR0
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
Access
Blank fields are Reserved and should not be accessed.
ASE10CR0
RW
Addr
(0,Hex)
AMX_IN
Name
#
W
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
Access
RW
RW
RW
RW
RW
RW
RW
RW
Addr
(0,Hex)
Name
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
DBB00DR0 20
DBB00DR1 21
Access
Addr
(0,Hex)
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
RW
#
RW
#
RW
RW
RW
RW
RW
RW
# Access is bit specific.
Page 10 of 39
[+] Feedback
CY8CLED02
Table 7. Register Map Bank 0: User Space (continued)
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
Blank fields are Reserved and should not be accessed.
RDI0RI
RDI0SYN
RDI0IS
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
INT_VC
RES_WDT
RW
RW
RW
RW
RW
RW
RW
E2
E3
E4
E5
DEC_CR0 E6
DEC_CR1 E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
CPU_F
F7
F8
F9
FA
FB
FC
FD
CPU_SCR1 FE
CPU_SCR0 FF
Access
ACE01CR1
ACE01CR2
#
Addr
(0,Hex)
ACE00CR1
ACE00CR2
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
Name
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
RW
Access
ADC0_CR
ADC1_CR
Addr
(0,Hex)
CMP_CR1
Name
CMP_CR0
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
PWM_CR
Addr
(0,Hex)
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
Name
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
Access
Addr
(0,Hex)
Name
DBB00DR2
DBB00CR0
DBB01DR0
DBB01DR1
DBB01DR2
DBB01CR0
DCB02DR0
DCB02DR1
DCB02DR2
DCB02CR0
DCB03DR0
DCB03DR1
DCB03DR2
DCB03CR0
RC
W
RW
RW
RL
#
#
# Access is bit specific.
Register Map Bank 1
Table 8. Register Map Bank 1: Configuration Space
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
RW
RW
RW
RW
RW
RW
RW
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
81
82
83
ASE11CR0 84
85
86
87
88
89
8A
8B
8C
8D
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
Blank fields are Reserved and should not be accessed.
Document Number: 001-13704 Rev. *C
80
RW
RW
Access
ASE10CR
0
Addr
(1,Hex)
40
Name
RW
Access
Addr
(1,Hex)
Name
Access
Addr
(1,Hex)
Name
Access
Addr
(1,Hex)
Name
PRT0DM0 00
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
# Access is bit specific.
Page 11 of 39
[+] Feedback
CY8CLED02
Table 8. Register Map Bank 1: Configuration Space (continued)
Blank fields are Reserved and should not be accessed.
Document Number: 001-13704 Rev. *C
RW
RW
OSC_GO_EN
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
VLT_CMP
ADC0_TR
ADC1_TR
IMO_TR
ILO_TR
BDG_TR
ECO_TR
RW
RW
RW
RW
RW
RW
RW
CPU_F
FLS_PR1
CPU_SCR1
CPU_SCR0
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
ACE01CR1
ACE01CR2
RW
RW
RDI0RI
RDI0SYN
RDI0IS
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
GDI_O_IN
GDI_E_IN
GDI_O_OU
GDI_E_OU
Addr
(1,Hex)
ACE00CR1
ACE00CR2
RW
RW
RW
RW
RW
Name
CLK_CR3
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
RW
RW
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
Access
RW
RW
RW
RW
RW
RW
RW
RW
Addr
(1,Hex)
RW
RW
RW
Name
AMD_CR1
ALT_CR0
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
CLK_CR0
CLK_CR1
ABF_CR0
AMD_CR0
CMP_GO_EN
Addr
(1,Hex)
DCB03FN
DCB03IN
DCB03OU
RW
RW
RW
Name
DCB02FN
DCB02IN
DCB02OU
Access
DBB01FN
DBB01IN
DBB01OU
Addr
(1,Hex)
Name
DBB00FN
DBB00IN
DBB00OU
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
RW
RW
W
W
RW
W
RL
RW
#
#
# Access is bit specific.
Page 12 of 39
[+] Feedback
CY8CLED02
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8CLED02 EZ-Color device. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/ez-color.
Specifications are valid for -40oC ≤ TA ≤ 85oC and TJ ≤ 100oC, except where noted.
Refer to Table 22 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode.
Figure 6. Voltage versus CPU Frequency, and Voltage versus IMO Frequency
5.25
SLIMO Mode = 0
5.25
SLIMO
Mode=1
4.75
Vdd Voltage
Vdd Voltage
lid g
Va ratin n
pe io
O Reg
4.75
3.60
3.00
3.00
2.40
2.40
93 kHz
12 MHz
3 MHz
24 MHz
SLIMO
Mode=0
SLIMO
SLIMO
Mode=1
Mode=0
SLIMO SLIMO
Mode=1 Mode=1
93 kHz
6 MHz
12 MHz
24 MHz
IMOFrequency
CPU Frequency
The following table lists the units of measure that are used in this data sheet.
Table 9. Units of Measure
Symbol
oC
dB
fF
Hz
KB
Kbit
kHz
kΩ
MHz
MΩ
μA
μF
μH
μs
μV
μVrms
Unit of Measure
degree Celsius
decibels
femto farad
hertz
1024 bytes
1024 bits
kilohertz
kilohm
megahertz
megaohm
microampere
microfarad
microhenry
microsecond
microvolts
microvolts root-mean-square
Document Number: 001-13704 Rev. *C
Symbol
μW
mA
ms
mV
nA
ns
nV
Ω
pA
pF
pp
ppm
ps
sps
σ
V
Unit of Measure
microwatts
milli-ampere
milli-second
milli-volts
nanoampere
nanosecond
nanovolts
ohm
picoampere
picofarad
peak-to-peak
parts per million
picosecond
samples per second
sigma: one standard deviation
volts
Page 13 of 39
[+] Feedback
CY8CLED02
Absolute Maximum Ratings
Table 10. Absolute Maximum Ratings
Symbol
Description
TSTG
Storage Temperature
TA
Vdd
VIO
VIOZ
IMIO
ESD
LU
Min
-55
Ambient Temperature with Power Applied
-40
Supply Voltage on Vdd Relative to Vss
-0.5
DC Input Voltage
Vss - 0.5
DC Voltage Applied to Tri-state
Vss - 0.5
Maximum Current into any Port Pin
-25
Electro Static Discharge Voltage
2000
Latch up Current
–
Typ
25
Max
+100
Units
oC
–
–
–
–
–
–
–
+85
+6.0
Vdd + 0.5
Vdd + 0.5
+50
–
200
oC
V
V
V
mA
V
mA
Typ
–
–
Max
+85
+100
Units
oC
oC
Notes
Higher storage temperatures will reduce
data retention time. Recommended
storage temperature is +25oC ± 25oC.
Extended duration storage temperatures above 65oC will degrade reliability.
Human Body Model ESD.
Operating Temperature
Table 11. Operating Temperature
Symbol
Description
TA
Ambient Temperature
TJ
Junction Temperature
Document Number: 001-13704 Rev. *C
Min
-40
-40
Notes
The temperature rise from ambient to
junction is package specific. See
“Thermal Impedances” on page 33. The
user must limit the power consumption to
comply with this requirement.
Page 14 of 39
[+] Feedback
CY8CLED02
DC Electrical Characteristics
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 12. DC Chip-Level Specifications
Symbol
Description
Vdd
Supply Voltage
Min
2.40
Typ
–
Max
5.25
Units
Notes
V
See DC POR and LVD specifications,
Table 20 on page 20.
mA Conditions are Vdd = 5.0V, 25oC, CPU
= 3 MHz, SYSCLK doubler disabled.
VC1 = 1.5 MHz, VC2 = 93.75 kHz,
VC3 = 0.366 kHz.
mA Conditions are Vdd = 3.3V, 25oC,
CPU = 3 MHz, clock doubler disabled.
VC1 = 375 kHz, VC2 = 23.4 kHz,
VC3 = 0.091 kHz.
mA Conditions are Vdd = 2.55V, 25oC,
CPU = 3 MHz, clock doubler disabled.
VC1 = 375 kHz, VC2 = 23.4 kHz,
VC3 = 0.091 kHz.
μA Vdd = 2.55V, 0oC to 40oC.
IDD
Supply Current, IMO = 24 MHz
–
3
4
IDD3
Supply Current, IMO = 6 MHz
–
1.2
2
IDD27
Supply Current, IMO = 6 MHz
–
1.1
1.5
ISB27
–
2.6
4
–
2.8
5
μA
Vdd = 3.3V, -40oC ≤ TA ≤ 85oC.
VREF
Sleep (Mode) Current with POR, LVD, Sleep
Timer, WDT, and internal slow oscillator
active. Mid temperature range.
Sleep (Mode) Current with POR, LVD, Sleep
Timer, WDT, and internal slow oscillator
active.
Reference Voltage (Bandgap)
1.28
1.30
1.32
V
VREF27
Reference Voltage (Bandgap)
1.16
1.30
1.330
V
Trimmed for appropriate Vdd.
Vdd = 3.0V to 5.25V.
Trimmed for appropriate Vdd.
Vdd = 2.4V to 3.0V.
AGND
Analog Ground
VREF
- 0.003
VREF
VREF
+ 0.003
V
ISB
Document Number: 001-13704 Rev. *C
Page 15 of 39
[+] Feedback
CY8CLED02
DC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25°C and
are for design guidance only.
Table 13. 5V and 3.3V DC GPIO Specifications
Symbol
Description
RPU
Pull up Resistor
Pull down Resistor
RPD
High Output Level
VOH
Min
4
4
Vdd - 1.0
Typ
5.6
5.6
–
Max
8
8
–
Units
kΩ
kΩ
V
VOL
Low Output Level
–
–
0.75
V
IOH
High Level Source Current
10
–
–
mA
IOL
Low Level Sink Current
25
–
–
mA
VIL
VIH
VH
IIL
CIN
Input Low Level
Input High Level
Input Hysteresis
Input Leakage (Absolute Value)
Capacitive Load on Pins as Input
–
2.1
–
–
–
–
–
60
1
3.5
0.8
–
–
10
V
V
mV
nA
pF
COUT
Capacitive Load on Pins as Output
–
3.5
10
pF
Document Number: 001-13704 Rev. *C
Notes
IOH = 10 mA, Vdd = 4.75 to 5.25V (8
total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])). 80 mA
maximum combined IOH budget.
IOL = 25 mA, Vdd = 4.75 to 5.25V (8
total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])). 150
mA maximum combined IOL budget.
VOH = Vdd-1.0V. See the limitations of
the total current in the Note for VOH.
VOL = 0.75V. See the limitations of the
total current in the Note for VOL.
Vdd = 3.0 to 5.25.
Vdd = 3.0 to 5.25.
Gross tested to 1 μA.
Package and pin dependent. Temp =
25oC.
Package and pin dependent. Temp =
25oC.
Page 16 of 39
[+] Feedback
CY8CLED02
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 2.4V to 3.0V and
-40°C ≤ TA ≤ 85°C. Typical parameters apply to 2.7V at 25°C and are for design guidance only.
Table 14. 2.7V DC GPIO Specifications
Symbol
RPU
RPD
VOH
Description
Pull up Resistor
Pull down Resistor
High Output Level
Min
4
4
Vdd - 0.4
Typ
5.6
5.6
–
Max
8
8
–
Units
kΩ
kΩ
V
VOL
Low Output Level
–
–
0.75
V
IOH
High Level Source Current
2.5
–
–
mA
IOL
Low Level Sink Current
10
–
–
mA
VIL
VIH
VH
IIL
CIN
COUT
Input Low Level
Input High Level
Input Hysteresis
Input Leakage (Absolute Value)
Capacitive Load on Pins as Input
Capacitive Load on Pins as Output
–
2.0
–
–
–
–
–
–
60
1
3.5
3.5
0.75
–
–
–
10
10
V
V
mV
nA
pF
pF
Notes
IOH = 2.5 mA (6.25 typical), Vdd = 2.4 to
3.0V (16 mA maximum, 50 mA typical
combined IOH budget).
IOL = 10 mA, Vdd = 2.4 to 3.0V (90 mA
maximum combined IOL budget).
VOH = Vdd-0.4V. See the limitations of the
total current in the Note for VOH.
VOL = 0.75V. See the limitations of the total
current in the Note for VOL.
Vdd = 2.4 to 3.0.
Vdd = 2.4 to 3.0.
Gross tested to 1 μA.
Package and pin dependent. Temp = 25oC.
Package and pin dependent. Temp = 25oC.
DC Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 15. 5V DC Amplifier Specifications
Symbol
Description
VOSOA
Input Offset Voltage (absolute value)
TCVOSOA Average Input Offset Voltage Drift
Input Leakage Current (Port 0 Analog
IEBOA
Pins)
CINOA
Input Capacitance (Port 0 Analog
Pins)
VCMOA
Common Mode Voltage Range
Open Loop Gain
GOLOA
Amplifier Supply Current
ISOA
Min
–
–
–
Typ
2.5
10
200
Max
15
–
–
Units
mV
μV/oC
pA
–
4.5
9.5
pF
0.0
80
–
–
–
10
Vdd - 1
–
30
V
dB
μA
Description
Min
Typ
Max
Units
Input Offset Voltage (absolute value)
Notes
Gross tested to 1 μA.
Package and pin dependent. Temp = 25oC.
Table 16. 3.3V DC Amplifier Specifications
Symbol
VOSOA
Notes
–
2.5
15
mV
TCVOSOA Average Input Offset Voltage Drift
–
10
–
μV/oC
IEBOA
Input Leakage Current (Port 0 Analog
Pins)
–
200
–
pA
Gross tested to 1 μA.
CINOA
Input Capacitance (Port 0 Analog
Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
Document Number: 001-13704 Rev. *C
Page 17 of 39
[+] Feedback
CY8CLED02
Table 16. 3.3V DC Amplifier Specifications (continued)
VCMOA
Common Mode Voltage Range
0
–
Vdd - 1
V
GOLOA
Open Loop Gain
80
–
–
dB
ISOA
Amplifier Supply Current
–
10
30
μA
Table 17. 2.7V DC Amplifier Specifications
Symbol
Min
Typ
Max
Units
–
2.5
15
mV
TCVOSOA Average Input Offset Voltage Drift
–
10
–
μV/oC
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
200
–
pA
Gross tested to 1 μA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent.
Temp = 25oC.
VCMOA
Common Mode Voltage Range
0
–
Vdd - 1
V
GOLOA
Open Loop Gain
80
–
–
dB
ISOA
Amplifier Supply Current
–
10
30
μA
VOSOA
Description
Input Offset Voltage (absolute value)
Notes
DC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V at 25°C and are for design guidance only.
Table 18. DC Low Power Comparator Specifications
Symbol
VREFLPC
ISLPC
VOSLPC
Description
Low power comparator (LPC) reference voltage
range
LPC supply current
LPC voltage offset
Document Number: 001-13704 Rev. *C
Min
0.2
Typ
–
Max
Vdd - 1
Units
V
–
–
10
2.5
40
30
μA
mV
Notes
Page 18 of 39
[+] Feedback
CY8CLED02
DC Switch Mode Pump Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 19. DC Switch Mode Pump (SMP) Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
VPUMP5V
5V Output Voltage from Pump
4.75
5.0
5.25
V
Configuration of footnote.[3] Average,
neglecting ripple. SMP trip voltage is set
to 5.0V.
VPUMP3V
3.3V Output Voltage from Pump
3.00
3.25
3.60
V
Configuration of footnote.[3] Average,
neglecting ripple. SMP trip voltage is set
to 3.25V.
VPUMP2V
2.6V Output Voltage from Pump
2.45
2.55
2.80
V
Configuration of footnote.[3] Average,
neglecting ripple. SMP trip voltage is set
to 2.55V.
IPUMP
Available Output Current
VBAT = 1.8V, VPUMP = 5.0V
VBAT = 1.5V, VPUMP = 3.25V
VBAT = 1.3V, VPUMP = 2.55V
VBAT5V
Configuration of footnote.[3]
SMP trip voltage is set to 5.0V.
SMP trip voltage is set to 3.25V.
SMP trip voltage is set to 2.55V.
5
8
8
–
–
–
–
–
–
mA
mA
mA
Input Voltage Range from Battery
1.8
–
5.0
V
Configuration of footnote.[3] SMP trip
voltage is set to 5.0V.
VBAT3V
Input Voltage Range from Battery
1.0
–
3.3
V
Configuration of footnote.[3] SMP trip
voltage is set to 3.25V.
VBAT2V
Input Voltage Range from Battery
1.0
–
2.8
V
Configuration of footnote.[3] SMP trip
voltage is set to 2.55V.
VBATSTART
Minimum Input Voltage from Battery to
Start Pump
1.2
–
–
V
Configuration of footnote.[3] 0oC ≤ TA ≤
100. 1.25V at TA = -40oC.
ΔVPUMP_Line
Line Regulation (over Vi range)
–
5
–
%VO
Configuration of footnote.[3] VO is the
“Vdd Value for PUMP Trip” specified by
the VM[2:0] setting in the DC POR and
LVD Specification, Table 20 on page 20.
ΔVPUMP_Load
Load Regulation
–
5
–
%VO
Configuration of footnote.[3] VO is the
“Vdd Value for PUMP Trip” specified by
the VM[2:0] setting in the DC POR and
LVD Specification, Table 20 on page 20.
ΔVPUMP_Ripple Output Voltage Ripple (depends on
cap/load)
–
100
–
mVpp
Configuration of footnote.[3] Load is 5
mA.
E3
Efficiency
35
50
–
%
Configuration of footnote.[3] Load is 5
mA. SMP trip voltage is set to 3.25V.
E2
Efficiency
35
80
–
%
For I load = 1mA, VPUMP = 2.55V, VBAT
= 1.3V, 10 µH inductor, 1 µF capacitor,
and Schottky diode.
FPUMP
Switching Frequency
–
1.3
–
MHz
DCPUMP
Switching Duty Cycle
–
50
–
%
Note
3. L1 = 2 mH inductor, C1 = 10 mF capacitor, D1 = Schottky diode. See Figure 7 on page 20.
Document Number: 001-13704 Rev. *C
Page 19 of 39
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Figure 7. Basic Switch Mode Pump Circuit
D1
Vdd
L1
VBAT
+
VPUMP
C1
SMP
Battery
EZ-Color
Vss
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 20. DC POR and LVD Specifications
Symbol
VPPOR0
VPPOR1
VPPOR2
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
VPUMP0
VPUMP1
VPUMP2
VPUMP3
VPUMP4
VPUMP5
VPUMP6
VPUMP7
Description
Vdd Value for PPOR Trip
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Vdd Value for PUMP Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Min
Typ
Max
Units
–
2.36
2.82
4.55
2.40
2.95
4.70
V
V
V
2.40
2.85
2.95
3.06
4.37
4.50
4.62
4.71
2.45
2.92
3.02
3.13
4.48
4.64
4.73
4.81
2.51[4]
2.99[5]
3.09
3.20
4.55
4.75
4.83
4.95
V
V
V
V
V
V
V
V
2.45
2.96
3.03
3.18
4.54
4.62
4.71
4.89
2.55
3.02
3.10
3.25
4.64
4.73
4.82
5.00
2.62[6]
3.09
3.16
3.32[7]
4.74
4.83
4.92
5.12
V
V
V
V
V
V
V
V
Notes
Vdd must be greater than or equal
to 2.5V during startup, reset from
the XRES pin, or reset from
Watchdog.
Notes
4. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply.
5. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
6. Always greater than 50 mV above VLVD0.
7. Always greater than 50 mV above VLVD3.
Document Number: 001-13704 Rev. *C
Page 20 of 39
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DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 21. DC Programming Specifications
Symbol
VddIWRITE
IDDP
VILP
FlashENPB
Description
Supply Voltage for Flash Write Operations
Supply Current During Programming or Verify
Input Low Voltage During Programming or
Verify
Input High Voltage During Programming or
Verify
Input Current when Applying Vilp to P1[0] or
P1[1] During Programming or Verify
Input Current when Applying Vihp to P1[0] or
P1[1] During Programming or Verify
Output Low Voltage During Programming or
Verify
Output High Voltage During Programming or
Verify
Flash Endurance (per block)
FlashENT
Flash Endurance (total)[9]
FlashDR
Flash Data Retention
VIHP
IILP
IIHP
VOLV
VOHV
Min
2.70
–
–
Typ
–
5
–
Max
–
25
0.8
Units
V
mA
V
2.2
–
–
V
–
–
0.2
mA
–
–
1.5
mA
–
–
Vss + 0.75
V
Vdd - 1.0
–
Vdd
V
50,000[8]
–
–
–
1,800,000
–0
–0
–0
10
–
–
Years
0
Notes
Driving internal pull down
resistor.
Driving internal pull down
resistor.
Erase/write cycles per
block.
Erase/write cycles.0
Notes
8. The 50,000 cycle Flash endurance per block will only be guaranteed if the Flash is operating within one voltage range. Voltage ranges are 2.4V to 3.0V, 3.0V to
3.6V, and 4.75V to 5.25V.
9. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2
blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block
ever sees more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
Document Number: 001-13704 Rev. *C
Page 21 of 39
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CY8CLED02
AC Electrical Characteristics
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 22. 5V and 3.3V AC Chip-Level Specifications
Symbol
FIMO24
Description
Internal Main Oscillator Frequency for 24
MHz
Min
23.4
Typ
24
Max
24.610,11,12
Units
MHz
FIMO6
Internal Main Oscillator Frequency for 6
MHz
5.5
6
6.510,11,12
MHz
FCPU1
FCPU2
FBLK5
CPU Frequency (5V Nominal)
CPU Frequency (3.3V Nominal)
Digital PSoC Block Frequency0(5V
Nominal)
Digital PSoC Block Frequency (3.3V
Nominal)
Internal Low Speed Oscillator Frequency
Internal Low Speed Oscillator Untrimmed
Frequency
0.093
0.093
0
24
12
48
24.610,11
12.311,12
49.210,11,13
MHz
MHz
MHz
0
24
24.611,13
MHz
15
5
32
–
64
–
kHz
kHz
DCILO
Jitter32k
Jitter32k
TXRST
DC24M
Step24M
Fout48M
Internal Low Speed Oscillator Duty Cycle
32 kHz RMS Period Jitter
32 kHz Peak-to-Peak Period Jitter
External Reset Pulse Width
24 MHz Duty Cycle
24 MHz Trim Step Size
48 MHz Output Frequency
20
–
–
10
40
–
46.8
50
100
1400
–
50
50
48.0
80
200
–
–
60
–
49.29,11
%
ns
ns
μs
%
kHz
MHz
Jitter24M1
FMAX
24 MHz Peak-to-Peak Period Jitter (IMO)
Maximum frequency of signal on row input
or row output.
Power Supply Slew Rate
–
–
300
–
12.3
ps
MHz
–
–
250
V/ms
Time from End of POR to CPU Executing
Code
–
16
100
ms
FBLK33
F32K1
F32K_U
SRPOWER_
Notes
Trimmed for 5V or 3.3V operation
using factory trim values. See
Figure 6 on page 13. SLIMO
mode = 0.
Trimmed for 3.3V operation using
factory trim values. See Figure 6
on page 13. SLIMO mode = 1.
24 MHz only for SLIMO mode = 0.
Refer to the AC Digital Block
Specifications below.
After a reset and before the m8c
starts to run, the ILO is not
trimmed. See the System Resets
section of the PSoC Technical
Reference Manual for details on
timing this.
Trimmed. Utilizing factory trim
values.
Vdd slew rate during power up.
UP
TPOWERUP
Document Number: 001-13704 Rev. *C
Power up from 0V. See the
System Resets section of the
PSoC Technical Reference
Manual.
Page 22 of 39
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Table 23. 2.7V AC Chip-Level Specifications
Symbol
FIMO12
Description
Internal Main Oscillator Frequency for 12
MHz
Min
11.5
Typ
120
Max
12.710,11,12
Units
MHz
FIMO6
Internal Main Oscillator Frequency for 6
MHz
5.5
6
6.510,11,12
MHz
FCPU1
FBLK27
CPU Frequency (2.7V Nominal)
Digital PSoC Block Frequency (2.7V
Nominal)
Internal Low Speed Oscillator Frequency
Internal Low Speed Oscillator Untrimmed
Frequency
0.093
0
3
12
3.1510,11
12.510,11,12
MHz
MHz
8
5
32
–
96
–
kHz
kHz
Internal Low Speed Oscillator Duty Cycle
32 kHz RMS Period Jitter
32 kHz Peak-to-Peak Period Jitter
External Reset Pulse Width
Maximum frequency of signal on row input
or row output.
Power Supply Slew Rate
20
–
–
10
–
50
150
1400
–
–
80
200
–
–
12.3
%
ns
ns
μs
MHz
–
–
250
V/ms
Time from End of POR to CPU Executing
Code
–
16
100
ms
F32K1
F32K_U
DCILO
Jitter32k
Jitter32k
TXRST
FMAX
SRPOWER_
Notes
Trimmed for 2.7V operation using
factory trim values. See Figure 6
on page 13. SLIMO mode = 1.
Trimmed for 2.7V operation using
factory trim values. See Figure 6
on page 13. SLIMO mode = 1.
24 MHz only for SLIMO mode = 0.
Refer to the AC Digital Block
Specifications below.
After a reset and before the m8c
starts to run, the ILO is not
trimmed. See the System
Resets section of the PSoC
Technical Reference Manual for
details on timing this.
Vdd slew rate during power up.
UP
TPOWERUP
Power up from 0V. See the System
Resets section of the PSoC
Technical Reference Manual.
Figure 8. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter24M1
F24M
Figure 9. 32 kHz Period Jitter (ILO) Timing Diagram
Jitter32k
F32K1
Notes
10. 4.75V < Vdd < 5.25V.
11. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
12. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation
at 3.3V.
13. See the individual user module data sheets for information on maximum frequencies for user modules.
Document Number: 001-13704 Rev. *C
Page 23 of 39
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AC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 24. 5V and 3.3V AC GPIO Specifications
Symbol
FGPIO
TRiseF
TFallF
TRiseS
TFallS
Description
GPIO Operating Frequency
Rise Time, Normal Strong Mode, Cload = 50 pF
Fall Time, Normal Strong Mode, Cload = 50 pF
Rise Time, Slow Strong Mode, Cload = 50 pF
Fall Time, Slow Strong Mode, Cload = 50 pF
Min
0
3
2
10
10
Typ
–
–
–
27
22
Max
12
18
18
–
–
Units
MHz
ns
ns
ns
ns
Notes
Normal Strong Mode
Vdd = 4.5 to 5.25V, 10% - 90%
Vdd = 4.5 to 5.25V, 10% - 90%
Vdd = 3 to 5.25V, 10% - 90%
Vdd = 3 to 5.25V, 10% - 90%
Min
0
6
6
18
18
Typ
–
–
–
40
40
Max
3
50
50
120
120
Units
MHz
ns
ns
ns
ns
Notes
Normal Strong Mode
Vdd = 2.4 to 3.0V, 10% - 90%
Vdd = 2.4 to 3.0V, 10% - 90%
Vdd = 2.4 to 3.0V, 10% - 90%
Vdd = 2.4 to 3.0V, 10% - 90%
Table 25. 2.7V AC GPIO Specifications
Symbol
FGPIO
TRiseF
TFallF
TRiseS
TFallS
Description
GPIO Operating Frequency
Rise Time, Normal Strong Mode, Cload = 50 pF
Fall Time, Normal Strong Mode, Cload = 50 pF
Rise Time, Slow Strong Mode, Cload = 50 pF
Fall Time, Slow Strong Mode, Cload = 50 pF
Figure 10. GPIO Timing Diagram
90%
GPIO
Pin
10%
TRiseF
TRiseS
TFallF
TFallS
AC Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.Settling times, slew rates, and gain bandwidth are based on the
Analog Continuous Time PSoC block.
Table 26. 5V and 3.3V AC Amplifier Specifications
Symbol
TCOMP1
TCOMP2
Description
Comparator Mode Response Time, 50 mVpp
Signal Centered on Reference
Comparator Mode Response Time, 2.5V Input,
0.5V Overdrive
Document Number: 001-13704 Rev. *C
Min
Typ
Max
100
Units
ns
300
ns
Notes
Page 24 of 39
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Table 27. 2.7V AC Amplifier Specifications
Symbol
TCOMP1
TCOMP2
Description
Comparator Mode Response Time, 50 mVpp
Signal Centered on Ref
Comparator Mode Response Time, 1.5V Input,
0.5V Overdrive
Min
Typ
Max
600
Units
ns
300
ns
Notes
AC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V at 25°C and are for design guidance only.
Table 28. AC Low Power Comparator Specifications
Symbol
TRLPC
Description
LPC response time
Document Number: 001-13704 Rev. *C
Min
–
Typ
–
Max
50
Units
μs
Notes
≥ 50 mV overdrive comparator
reference set within VREFLPC.
Page 25 of 39
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CY8CLED02
AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 29. 5V and 3.3V AC Digital Block Specifications
Function
All
Functions
Timer
Counter
Dead Band
CRCPRS
(PRS Mode)
CRCPRS
(CRC Mode)
SPIM
SPIS
Transmitter
Receiver
Description
Maximum Block Clocking Frequency
(> 4.75V)
Maximum Block Clocking Frequency
(< 4.75V)
Capture Pulse Width
Maximum Frequency, No Capture
Maximum Frequency, With or Without
Capture
Enable Pulse Width
Maximum Frequency, No Enable Input
Maximum Frequency, Enable Input
Kill Pulse Width:
Asynchronous Restart Mode
Synchronous Restart Mode
Disable Mode
Maximum Frequency
Maximum Input Clock Frequency
Min
Typ
Max
49.2
Units
MHz
Notes
4.75V < Vdd < 5.25V.
24.6
MHz
3.0V < Vdd < 4.75V.
50[14]
–
–
–
–
–
–
49.2
24.6
ns
MHz
MHz
4.75V < Vdd < 5.25V.
50
–
–
–
–
–
–
49.2
24.6
ns
MHz
MHz
4.75V < Vdd < 5.25V.
20
50
50
–
–
–
–
–
–
–
–
–
–
49.2
49.2
ns
ns
ns
MHz
MHz
Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum Input Clock Frequency
–
–
8.2
MHz
Maximum Input Clock Frequency
–
Width of SS_ Negated Between Trans- 50
missions
Maximum Input Clock Frequency
–
–
–
4.1
–
MHz
ns
–
24.6
MHz
Maximum Input Clock Frequency with –
Vdd ≥ 4.75V, 2 Stop Bits
–
49.2
MHz
Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum Input Clock Frequency with –
Vdd ≥ 4.75V, 2 Stop Bits
–
49.2
MHz
4.75V < Vdd < 5.25V.
4.75V < Vdd < 5.25V.
Maximum data rate at 4.1 MHz due to
2 x over clocking.
Maximum data rate at 3.08 MHz due to
8 x over clocking.
Maximum data rate at 6.15 MHz due to
8 x over clocking.
Maximum data rate at 3.08 MHz due to
8 x over clocking.
Maximum data rate at 6.15 MHz due to
8 x over clocking.
Note
14. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document Number: 001-13704 Rev. *C
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CY8CLED02
Table 30. 2.7V AC Digital Block Specifications
Function
Description
All
Functions
Maximum Block Clocking Frequency
Timer
Capture Pulse Width
Counter
Dead Band
Min
Typ
Max
Units
12.7
MHz
100[15] –
–
ns
Maximum Frequency, With or Without Capture
–
–
12.7
MHz
Enable Pulse Width
100
–
–
ns
Maximum Frequency, No Enable Input
–
–
12.7
MHz
Maximum Frequency, Enable Input
–
–
12.7
MHz
Asynchronous Restart Mode
20
–
–
ns
Synchronous Restart Mode
100
–
–
ns
Disable Mode
100
–
–
ns
Notes
2.4V < Vdd < 3.0V.
Kill Pulse Width:
Maximum Frequency
–
–
12.7
MHz
CRCPRS
(PRS
Mode)
Maximum Input Clock Frequency
–
–
12.7
MHz
CRCPRS
(CRC
Mode)
Maximum Input Clock Frequency
–
–
12.7
MHz
SPIM
Maximum Input Clock Frequency
–
–
6.35
MHz
SPIS
Maximum Input Clock Frequency
–
–
4.1
MHz
Width of SS_ Negated Between Transmissions
Maximum data rate at 3.17
MHz due to 2 x over clocking.
100
–
–
ns
Transmitter Maximum Input Clock Frequency
–
–
12.7
MHz
Maximum data rate at 1.59
MHz due to 8 x over clocking.
Receiver
–
–
12.7
MHz
Maximum data rate at 1.59
MHz due to 8 x over clocking.
Maximum Input Clock Frequency
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25°C
and are for design guidance only.
Table 31. 5V AC External Clock SpecificationsC
Symbol
Description
Min
Typ
Max
Units
FOSCEXT
Frequency
0.093
–
24.6
MHz
–
High Period
20.6
–
5300
ns
–
Low Period
20.6
–
–
ns
–
Power Up IMO to Switch
150
–
–
μs
Notes
Note
15. 100 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
Document Number: 001-13704 Rev. *C
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CY8CLED02
Table 32. 3.3V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.093
–
12.3
MHz
Maximum CPU frequency is 12 MHz
at 3.3V. With the CPU clock divider
set to 1, the external clock must
adhere to the maximum frequency
and duty cycle requirements.
FOSCEXT
Frequency with CPU Clock divide by 2 or
greater
0.186
–
24.6
MHz
If the frequency of the external clock
is greater than 12 MHz, the CPU clock
divider must be set to 2 or greater. In
this case, the CPU clock divider will
ensure that the fifty percent duty cycle
requirement is met.
–
High Period with CPU Clock divide by 1
41.7
–
5300
ns
–
Low Period with CPU Clock divide by 1
41.7
–
–
ns
–
Power Up IMO to Switch
150
–
–
μs
Table 33. 2.7V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.093
–
6.060
MHz
Maximum CPU frequency is 3 MHz at
2.7V. With the CPU clock divider set
to 1, the external clock must adhere to
the maximum frequency and duty
cycle requirements.
FOSCEXT
Frequency with CPU Clock divide by 2 or
greater
0.186
–
12.12
MHz
If the frequency of the external clock
is greater than 3 MHz, the CPU clock
divider must be set to 2 or greater. In
this case, the CPU clock divider will
ensure that the fifty percent duty cycle
requirement is met.
–
High Period with CPU Clock divide by 1
83.4
–
5300
ns
–
Low Period with CPU Clock divide by 1
83.4
–
–
ns
–
Power Up IMO to Switch
150
–
–
μs
Document Number: 001-13704 Rev. *C
Page 28 of 39
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CY8CLED02
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25°C
and are for design guidance only.
Table 34. AC Programming Specifications
Symbol
TRSCLK
TFSCLK
TSSCLK
THSCLK
FSCLK
TERASEB
TWRITE
TDSCLK3
TDSCLK2
TERASEA
Description
Rise Time of SCLK
Fall Time of SCLK
Data Set up Time to Falling Edge of SCLK
Data Hold Time from Falling Edge of SCLK
Frequency of SCLK
Flash Erase Time (Block)
Flash Block Write Time
Data Out Delay from Falling Edge of SCLK
Data Out Delay from Falling Edge of SCLK
Flash Erase Time (Bulk)
Min
1
1
40
40
0
–
–
–
–
–
Typ
–
–
–
–
–
10
80
–
–
20
Max
20
20
–
–
8
–
–
50
70
–
Units
ns
ns
ns
ns
MHz
ms
ms
ns
ns
ms
–
–
180[16] ms
3.0 ≤ Vdd ≤ 3.6
2.4 ≤ Vdd ≤ 3.0
Erase all blocks and
protection fields at once.
0°C ≤ TJ ≤ 100°C
–
–
360[16] ms
-40°C ≤ TJ ≤ 0°C
LL
TPROGRA Flash Block Erase + Flash Block Write Time
Notes
M_HOT
TPROGRA Flash Block Erase + Flash Block Write Time
M_COLD
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 35. AC Characteristics of the I2C SDA and SCL Pins for Vcc . 3.0V
Symbol
FSCLI2C
THDSTAI2C
TLOWI2C
THIGHI2C
TSUSTAI2C
THDDATI2C
TSUDATI2C
TSUSTOI2C
TBUFI2C
TSPI2C
Standard-Mode
Fast-Mode
Min
Max
Min
Max
SCL Clock Frequency
0
100
0
400
Hold Time (repeated) START Condition. After 4.0
–
0.6
–
this period, the first clock pulse is generated.
LOW Period of the SCL Clock
4.7
–
1.3
–
HIGH Period of the SCL Clock
4.0
–
0.6
–
Set-up Time for a Repeated START Condition 4.7
–
0.6
–
Data Hold Time
0
–
0
–
Data Set-up Time0
2500
–0
100[17] –0
Set-up Time for STOP Condition
4.0
–
0.6
–
Bus Free Time Between a STOP and START 4.7
–
1.3
–
Condition
Pulse Width of spikes are suppressed by the –
–
0
50
input filter.
Description
Units
Notes
kHz
μs
μs
μs
μs
μs
ns0
μs
μs
ns
Note
16. For the full industrial range, the user must employ a Temperature Sensor User Module (FlashTemp) and feed the result to the temperature argument before writing.
Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
Document Number: 001-13704 Rev. *C
Page 29 of 39
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CY8CLED02
Table 36. 2.7V AC Characteristics of the I2C SDA and SCL Pins (Fast-Mode not Supported)
Symbol
FSCLI2C
THDSTAI2C
TLOWI2C
THIGHI2C
TSUSTAI2C
THDDATI2C
TSUDATI2C
TSUSTOI2C
TBUFI2C
TSPI2C
Standard-Mode
Fast-Mode
Min
Max
Min
Max
SCL Clock Frequency
0
100
–
–
Hold Time (repeated) START Condition. After 4.0
–
–
–
this period, the first clock pulse is generated.
LOW Period of the SCL Clock
4.7
–
–
–
HIGH Period of the SCL Clock
4.0
–
–
–
Set-up Time for a Repeated START Condition 4.7
–
–
–
Data Hold Time
0
–
–
–
Data Set-up Time
250
–
–
–
Set-up Time for STOP Condition
4.0
–
–
–
Bus Free Time Between a STOP and START 4.7
–
–
–
Condition
Pulse Width of spikes are suppressed by the –
–
–
–
input filter.
Description
Units
Notes
kHz
μs
μs
μs
μs
μs
ns
μs
μs
ns
Figure 11. Definition for Timing for Fast-/Standard-Mode on the I2C Bus
SDA
TLOWI2C
TSPI2C
TSUDATI2C
THDSTAI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Note
17. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be
the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data
bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-13704 Rev. *C
Page 30 of 39
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CY8CLED02
Packaging Information
Packaging Dimensions
This section illustrates the packaging specifications for the CY8CLED02 EZ-Color device, along with the thermal impedances for each
package and minimum solder reflow peak temperature.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Figure 12. 8-Pin (150-Mil) SOIC
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.150[3.810]
0.157[3.987]
3. REFERENCE JEDEC MS-012
0.230[5.842]
0.244[6.197]
4. PACKAGE WEIGHT 0.07gms
PART #
S08.15 STANDARD PKG.
5
SZ08.15 LEAD FREE PKG.
8
0.189[4.800]
0.196[4.978]
0.010[0.254]
0.016[0.406]
SEATING PLANE
X 45°
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.050[1.270]
BSC
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
Document Number: 001-13704 Rev. *C
0°~8°
0.0075[0.190]
0.0098[0.249]
0.016[0.406]
0.035[0.889]
51-85066 *C
Page 31 of 39
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CY8CLED02
Figure 13. 16-Pin (150-Mil) SOIC
51-85068 *B
51-85068 *C
Document Number: 001-13704 Rev. *C
Page 32 of 39
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CY8CLED02
Figure 14. 24-Pin (4x4) QFN
51-85203 *B
Important Note For information about the preferred dimensions for mounting the QFN packages, see the following Application Note
at http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Important Note Pinned vias for thermal conduction are not required for the low-power 24-, 32-, and 48-pin QFN EZ-Color devices.
Thermal Impedances
Solder Reflow Peak Temperature
Table 37. Thermal Impedances per Package
Following is the minimum solder reflow peak temperature to
achieve good solderability.
Package
Typical θJA[18]
8 SOIC
186 oC/W
16 SOIC
125 oC/W
Package
Minimum Peak
Temperature[20]
Maximum Peak
Temperature
24 QFN[19]
40 oC/W
8 SOIC
240oC
260oC
16 SOIC
240oC
260oC
24 QFN
240oC
260oC
Table 38. Solder Reflow Peak Temperature
Notes
18. TJ = TA + POWER x θJA
19. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
20. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications
Document Number: 001-13704 Rev. *C
Page 33 of 39
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CY8CLED02
Development Tool Selection
This section presents the development tools available for all
current PSoC based devices including the CY8CLED02
EZ-Color family.
Software Tools
PSoC Designer
At the core of the PSoC development software suite is PSoC
Designer, used to generate PSoC firmware applications. PSoC
Designer is available free of charge at
http://www.cypress.com/psocdesigner and includes a free C
compiler.
PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC programmer is available free ofcharge at
http://www.cypress.com/psocprogrammer.
Evaluation Tools
All evaluation tools can be purchased from the Cypress Online
Store.
CY3261A-RGB EZ-Color RGB Kit
The CY3261A-RGB board is a preprogrammed HB LED color
mix board with seven pre-set colors using the CY8CLED16
EZ-Color HB LED Controller. The board is accompanied by a CD
containing the color selector software application, PSoC
Designer, PSoC Programmer, and a suite of documents,
schematics, and firmware examples. The color selector software
application can be installed on a host PC and is used to control
the EZ-Color HB LED controller using the included USB cable.
The application enables you to select colors via a CIE 1931 chart
or by entering coordinates. The kit includes:
■ Training Board (CY8CLED16)
■ One mini-A to mini-B USB Cable
■
■
PSoC Designer CD-ROM
Design Files and Application Installation CD-ROM
To program and tune this kit via PSoC Designer you must use a
Mini Programmer Unit (CY3217 Kit) and a CY3240-I2CUSB kit.
CY3263-ColorLock Evaluation Kit
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is
available for development support. This hardware has the
capability to program single devices.
The emulator consists of a base unit that connects to the PC by
way of the USB port. The base unit is universal and will operate
with all PSoC based devices. Emulation pods for each device
family are available separately. The emulation pod takes the
place of the device on the target board and performs full speed
(24 MHz) operation.
The CY3263-ColorLock evaluation board demonstrates the
ability of the EZ-Color device to use real-time optical feedback to
control three primary, high brightness LEDs and create accurate,
mixed-color output. The kit includes:
■
CY3263-ColorLock Evaluation Board
■
Tools CD, which includes:
❐ PSoC Programmer
❐ .NET Framework 2.0 (for Windows 2000 and Windows XP)
❐ PSoC Designer
❐ ColorLock Express Pack
❐ CY3263-ColorLock EZ-Color Kit CD
❐ ColorLock Monitor Application
❐ Kit Documents (Quick Start, Kit Guide, Release Note, Application Note, Data Sheets, Schematics, and Layouts)
❐ Firmware
■
Retractable USB Cable (A to Mini-B)
■
PSoC MiniProg Programmer
■
Power Supply Adapter
I2C to USB Bridge
The I2C to USB Bridge is a quick and easy link from any design
or application’s I2C bus to a PC via USB for design testing,
debugging and communication.
PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC programmer is available free ofcharge at
http://www.cypress.com/psocprogrammer.
Document Number: 001-13704 Rev. *C
Page 34 of 39
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CY8CLED02
CY3265-RGB EZ-Color Evaluation Kit
CY3210-PSoCEval1
The CY3265-RGB evaluation board demonstrates the ability of
the EZ-Color device to use real-time temperature feedback to
control three primary, high brightness LEDs and create accurate,
mixed-color output. There are three variations of the kit available,
depending on the LED manufacturer of the LEDs on the board:
CY3265C-RGB (Cree LEDs), CY3265N-RGB (Nichia LEDs), or
CY3265O-RGB (OSRAM LEDs). The kit includes:
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
CY3265C-RGB Evaluation Board
■
Tools CD, which includes:
❐ PSoC Programmer
❐ PSoC Designer
❐ .NET Framework 2.0 (Windows XP 32 bit)
■
Evaluation Board with LCD Module
■
MiniProg Programming Unit
■
28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2)
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
■
Kit Documents (Quick Start, Kit Guide, Release Note, Application Note, Data Sheets, Schematics, and Layouts) Firmware
■
Blue PCA Enclosure/Case
Device Programmers
■
12V 1A Power Supply
All device programmers can be purchased from the Cypress
Online Store.
■
Retractable USB Cable (A to Mini-B)
■
PSoC MiniProg Programmer
■
Quick Start Guide
CY3210-MiniProg1
The CY3210-MiniProg1 kit allows a user to program PSoC
based devices via the MiniProg1 programming unit. The
MiniProg is a small, compact prototyping programmer that
connects to the PC via a provided USB 2.0 cable. The kit
includes:
CY3216 Modular Programmer
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■
Modular Programmer Base
■
3 Programming Module Cards
■
MiniProg Programming Unit
■
MiniProg Programming Unit
■
PSoC Designer Software CD
■
MiniEval Socket Programming and Evaluation Board
■
Getting Started Guide
■
28-Pin CY8C29466-24PXI PDIP PSoC Device Sample
■
USB 2.0 Cable
■
28-Pin CY8C27443-24PXI PDIP PSoC Device Sample
CY3207ISSP In-System Serial Programmer (ISSP)
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note CY3207ISSP needs special software and is not compatible
with PSoC Programmer. The kit includes:
Document Number: 001-13704 Rev. *C
■
CY3207 Programmer Unit
■
PSoC ISSP Software CD
■
110 ~ 240V Power Supply, Euro-Plug Adapter
■
USB 2.0 Cable
Page 35 of 39
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CY8CLED02
Accessories (Emulation and Programming)
Table 39. Emulation and Programming Accessories
Part #
Pin
Package
Flex-Pod Kit[21]
Foot Kit[22]
CY8CLED02-8SXI
8 SOIC
CY3250-LED02
CY3250-8SOIC-FK
CY8CLED02-16SXI
16 SOIC
CY3250-LED02
CY3250-16SOIC-FK
CY8CLED02-24LFXI
24 QFN
CY3250-LED02QFN
CY3250-24QFN-FK
Adapter[23]
Adapters can be found at
http://www.emulation.com.
Third Party Tools
Build a PSoC Emulator into Your Board
Several tools have been specially designed by the following
third-party vendors to accompany PSoC devices during development and production. Specific details for each of these tools
can be found at http://www.cypress.com under Design Support
>> Development Kits/Boards.
For details on how to emulate your circuit before going to volume
production using an on-chip debug (OCD) non-production PSoC
device, see Application Note “Debugging - Build a PSoC
Emulator into Your Board - AN2323”. Table 40 on page 37 lists
the CY8CLED08 EZ-Color devices’ key package features and
ordering codes.
Notes
21. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
22. Foot kit includes surface mount feet that can be soldered to the target PCB.
23. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at
http://www.emulation.com.
Document Number: 001-13704 Rev. *C
Page 36 of 39
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CY8CLED02
Ordering Information
Key Device Features
The following table lists the CY8CLED02 EZ-Color devices’ key package features and ordering codes.
RAM
(Bytes)
Switch Mode
Pump
Temperature
Range
Digital
Blocks
Analog
Blocks
Digital I/O
Pins
Analog
Inputs
Analog
Outputs
XRES Pin
8 Pin (150-Mil) SOIC
CY8CLED02-8SXI
4K
256
No
-40°C to +85°C
4
4
6
4
0
No
8 Pin (150-Mil) SOIC
(Tape and Reel)
CY8CLED02-8SXIT
4K
256
No
-40°C to +85°C
4
4
6
4
0
No
16 Pin (150-Mil) SOIC
CY8CLED02-16SXI
4K
256
Yes
-40°C to +85°C
4
4
12
8
0
No
16 Pin (150-Mil) SOIC
(Tape and Reel)
CY8CLED02-16SXIT
4K
256
Yes
-40°C to +85°C
4
4
12
8
0
No
24 Pin (4x4) QFN
CY8CLED02-24LFXI
4K
256
Yes
-40°C to +85°C
4
4
16
8
0
Yes
24 Pin (4x4) QFN
(Tape and Reel)
CY8CLED02-24LFXIT
4K
256
Yes
-40°C to +85°C
4
4
16
8
0
Yes
Package
Ordering
Code
Flash
(Bytes)
Table 40. Device Key Features and Ordering Information
Ordering Code Definitions
CY 8 C LED
xx - xx xxxx
Package Type:
Thermal Rating:
PX = PDIP Pb-Free
C = Commercial
SX = SOIC Pb-Free
I = Industrial
PVX = SSOP Pb-Free
E = Extended
LFX/LKX = QFN Pb-Free
AX = TQFP Pb-Free
Pin Count
Part Number
LED Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Company ID: CY = Cypress
Document Number: 001-13704 Rev. *C
Page 37 of 39
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CY8CLED02
Document History Page
Document Title: CY8CLED02 EZ-ColorTM HB LED Controller
Document Number: 001-13704
Revision
ECN #
Submission
Date
**
1383443
See ECN
*A
2732564
07/09/2009
CGX
Converted from Preliminary to Final
*B
2794355
10/28/2009
XBM
Added “Contents” on page 2
Updated “Development Tools” on page 6.
Corrected FCPU1 and FCPU2 parameters in Table 22, “5V and 3.3V
AC Chip-Level Specifications,” on page 22 and Table 23, “2.7V AC
Chip-Level Specifications,” on page 23
*C
2850593
01/14/2010
FRE
Updated DC GPIO, AC Chip-Level, and AC Programming Specifications
as follows:
Modified FIMO6 and TWRITE specifications.
Replaced TRAMP (time) specification with SRPOWER_UP (slew rate)
specification.
Added note to Flash Endurance specification.
Added IOH, IOL, DCILO, F32K_U, TPOWERUP, TERASEALL,
TPROGRAM_HOT, and TPROGRAM_COLD specifications.
Corrected the Pod Kit part numbers.
Updated Development Tool Selection.
Updated copyright and Sales, Solutions, and Legal Information URLs.
Updated 24-Pin QFN package diagram.
Document Number: 001-13704 Rev. *C
Origin of
Change
Description of Change
SFVTMP3/AESA New document
Page 38 of 39
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CY8CLED02
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
cypress.com/go/interface
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
PSoC
Touch Sensing
USB Controllers
Wireless/RF
cypress.com/go/memory
cypress.com/go/image
cypress.com/go/psoc
cypress.com/go/touch
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2007-2009, 2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products
for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-13704 Rev. *C
Revised January 15, 2010
Page 39 of 39
PSoC Designer™ and EZ-Color™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corporation.
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided
that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.
All products and company names mentioned in this document may be the trademarks of their respective holders.
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