VISHAY SI1470DH-T1-E3

Si1470DH
Vishay Siliconix
New Product
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (Ω)
ID (A)
0.066 at VGS = 4.5 V
4.0a
0.095 at VGS = 2.5 V
4.0
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
Qg (Typ)
4.85
RoHS
APPLICATIONS
COMPLIANT
• Load Switch
SOT-363
SC-70 (6-LEADS)
D
1
D
6
D
D
G
5
2
3
4
D
AK
XX
YY
Marking Code
G
Lot Traceability
and Date Code
S
Part # Code
S
Top View
N-Channel MOSFET
Ordering Information: Si1470DH-T1-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)a
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energy
Continuous Source-Drain Diode Current
Maximum Power Dissipationa
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
L = 0.1 mH
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
IS
PD
Unit
V
3.8b, c
3.1b, c
12
10
5
2.3
IDM
IAS
EAS
TJ, Tstg
Operating Junction and Storage Temperature Range
Limit
30
± 12
5.1
4.0
A
mJ
A
1.3b, c
2.8
1.8
W
1.5b, c
1.0b, c
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
t ≤ 5 sec
Steady State
Symbol
RthJA
RthJF
Typical
60
34
Maximum
80
45
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 sec.
d. Maximum under Steady State conditions is 125 °C/W.
Document Number: 74277
S-62443–Rev. A, 27-Nov-06
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Si1470DH
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
VDS
VGS = 0 V, ID = 250 µA
30
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
ΔVGS(th)/
TJ
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 12 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Forward Transconductance
gfs
V
27.41
ID = 250 µA
mV/°C
- 3.83
0.6
1.6
V
± 100
nA
VDS = 30 V, VGS = 0 V
1
nA
VDS = 30 V, VGS = 0 V, TJ = 85 °C
10
µA
VDS = ≥ 5 V, VGS = 4.5 V
VGS = 4.5 V, ID = 3.8 A
12
A
0.055
0.066
VGS = 2.5 V, ID = 3.1 A
0.079
0.095
VDS = 15 V, ID = 3.8 A
11.2
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
510
VDS = 15 V, VGS = 0 V, f = 1 MHz
VDS = 15 V, VGS = 5 V, ID = 3.8 A
VDS = 15 V, VGS = 4.5 V, ID = 3.8 A
tr
Rise Time
td(off)
Turn-Off DelayTime
VDD = 15 V, RL = 5.0 Ω
ID ≅ 3.0 A, VGEN = 4.5 V, Rg = 1 Ω
tf
Fall Time
pF
5
7.5
4.85
7.3
1.35
nC
1.26
f = 1 MHz
td(on)
Turn-On Delay Time
66
39
7.3
10.95
9.0
15
51
77
18
27
7.1
10.65
Ω
ns
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
Pulse Diode Forward
Body Diode Voltage
Currenta
IS
TC = 25 °C
2.3
ISM
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
12
IS = 1.8 A
IF = 2.3 A, di/dt = 100 A/µs
A
0.8
1.2
V
11.5
17.25
nC
5.2
7.8
7.7
ns
3.8
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 74277
S-62443–Rev. A, 27-Nov-06
Si1470DH
Vishay Siliconix
TYPICAL CHARACTERISTICS
TA = 25 °C, unless otherwise noted
12
3.0
VGS = 5 thru 3 V
I D – Drain Current (A)
I D – Drain Current (A)
2.5
9
VGS = 2.5 V
6
3
2.0
1.5
TC = 125 °C
1.0
V GS = 2 V
TC = 25 °C
0.5
V GS = 1.5 V
0
0.0
0.5
1.0
1.5
2.0
TC = - 55 °C
0.0
0.0
2.5
0.5
VDS – Drain-to-Source Voltage (V)
1.5
2.0
2.5
VGS – Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics curves vs. Temp
0.15
800
0.12
VGS = 2.5 V
C – Capacitance (pF)
rDS(on) – On-Resistance (Ω)
1.0
0.09
VGS = 4.5 V
0.06
600
Ciss
400
200
0.03
Coss
0.00
Crss
0
0
3
6
9
12
0
6
12
18
24
ID – Drain Current (A)
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
5
30
1.6
VDS = 15 V
4
VGS = 4.5 V
ID = 3.7 A, 4.1 A
1.4
3
rDS(on) – On-Resistance
(Normalized)
V GS – Gate-to-Source Voltage (V)
ID = 3.7 A
VDS = 24 V
2
1
VGS = 2.5 V
ID = 3.1 A
1.2
1.0
0.8
0
0
2
4
Qg – Total Gate Charge (nC)
Qg - Gate Charge
Document Number: 74277
S-62443–Rev. A, 27-Nov-06
6
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ – Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si1470DH
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
0.16
rDS(on) – Drain-to-Source On-Resistance (Ω)
I S – Source Current (A)
10
TJ = 150 °C
1
TJ = 25 °C
0.1
0.01
ID = 3.7 A
0.12
TA = 125 °C
0.08
TA = 25 °C
0.04
0.00
0
0.2
0.4
0.6
0.8
1
0
1.2
1
VSD – Source-to-Drain Voltage (V)
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
rDS(on) vs VGS vs Temperature
1.5
30
25
1.3
20
Power (W)
VGS(th) (V)
ID = 250 µA
1.1
0.9
15
10
0.7
0.5
- 50
5
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
TJ – Temperature (°C)
Time (sec)
Threshold Voltage
Single Pulse Power
100
100
600
*Limited by rDS(on)
I D – Drain Current (A)
10
10 ms
1
100 ms
1s
10 s
0.1
dc
0.01
TA = 25 °C
Single Pulse
0.001
0.1
1
*VGS
10
100
VDS – Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 74277
S-62443–Rev. A, 27-Nov-06
Si1470DH
Vishay Siliconix
TA = 25 °C, unless otherwise noted
6
3.6
5
3.0
4
Power (W)
ID – Drain Current (A)
TYPICAL CHARACTERISTICS
Package Limited
3
2.4
1.8
2
1.2
1
0.6
0
0.0
0
25
50
75
100
125
150
0
25
50
75
100
TC – Case Temperature (°C)
TC – Case Temperature (°C)
Current Derating*
Power Derating
125
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 74277
S-62443–Rev. A, 27-Nov-06
www.vishay.com
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Si1470DH
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 100 °C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?74277.
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Document Number: 74277
S-62443–Rev. A, 27-Nov-06
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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