TOSHIBA TLP785

TLP785_TLP785F
TOSHIBA Photocoupler
GaAs IRED & Photo−Transistor
TLP785,TLP785F
Office Equipment
Household Appliances
Solid State Relays
Switching Power Supplies
Various Controllers
Signal Transmission Between Different Voltage
Circuits
The TOSHIBA TLP785 consists of a silicone phototransistor optically
coupled to a gallium arsenide (GaAs) infrared emitting diode in a four
lead plastic DIP (DIP4) with having high isolation voltage
(AC: 5kVRMS (min)).
TLP785F is a lead forming type for the long creepage surface mounting
of TLP785.
TLP785
Unit: mm
TOSHIBA
11-5L1
Weight: 0.32 g (typ.)
TLP785: 7.62mm pitch type DIP4
TLP785F
TLP785F: 10.16mm pitch type DIP4
Unit: mm
Collector-emitter voltage: 80V (min.)
Current transfer ratio: 50% (min.)
Rank GB: 100% (min.)
Isolation voltage: 5000Vrms (min.)
UL approved: UL1577, file No. E67349
BSI under application: BS EN60065:2002
BS EN60950-1:2006
SEMKO under application:EN60065:2002
EN60950-1:2001, EN60335-1:2002
Option(D4)type
VDE approved: DIN EN60747-5-2
(Note): When an EN60747-5-2 approved type is needed,
Please designate “Option (D4)”
TOSHIBA
11-5L102
Weight: 0.32g (typ.)
.
Construction mechanical rating
7.80mm Pitch
Standard Type
10.16mm Pitch
TLPxxxF Type
Creepage distance
7.0mm(min)
8.0mm(min)
Clearance
7.0mm(min)
8.0mm(min)
Insulation thickness
0.4mm(min)
0.4mm(min)
Inner creepage distance
4.0mm(min)
4.0mm(min)
Pin Configurations
(top view)
1
4
2
3
1 : Anode
2 : Cathode
3 : Emitter
4 : Collector
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Current Transfer Ratio
Type
TLP785
Classification
(Note 1)
Current Transfer Ratio (%)
(IC / IF)
IF = 5mA, VCE = 5V, Ta = 25°C
Min
Max
Marking of Classification
None
50
600
Blank,
Rank Y
50
150
YE
Rank GR
100
300
GR
Rank BL
200
600
BL
Rank GB
100
600
GB
Rank YH
75
150
Y+
Rank GRL
100
200
G
Rank GRH
150
300
G+
Rank BLL
200
400
B
(Note 1): Ex. rank GB: TLP785 (GB)
(Note 2): Application type name for certification test, please use standard product type name, i. e.
TLP785 (GB): TLP785
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
IF
60
mA
ΔIF / °C
−0.7
mA / °C
IFP
1
A
PD
90
mW
ΔPD / °C
−0.9
mW / °C
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Collector−emitter voltage
VCEO
80
V
Emitter−collector voltage
VECO
7
V
Collector current
IC
50
mA
Power dissipation (single circuit)
PC
150
mW
ΔPC / °C
−1.5
mW / °C
Tj
125
°C
Operating temperature range
Topr
−55 to 110
°C
Storage temperature range
Tstg
−55 to 125
°C
Lead soldering temperature (10s)
Tsol
260
°C
Total package power dissipation
PT
240
mW
ΔPT / °C
−2.4
mW / °C
BVS
5000
Vrms
Forward current
Forward current derating (Ta ≥ 39°C)
LED
Pulse forward current
(Note 3)
Power dissipation
Detector
Power dissipation derating
Power dissipation derating
(Ta ≥ 25°C)
Junction temperature
Total package power dissipation derating
(Ta ≥ 25°C)
Isolation voltage
(Note 4)
(Note): Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 3): 100 μs pulse, 100 Hz frequency
(Note 4): AC, 1 min., R.H.≤ 60%. Apply voltage to LED pin and detector pin together.
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TLP785_TLP785F
Recommended Operating Conditions(Note)
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
VCC
―
5
24
V
Forward current
IF
―
16
25
mA
Collector current
IC
―
1
10
mA
Topr
−25
―
85
°C
Operating temperature
(Note): Recommended operating conditions are given as a design guideline
to obtain expected performance of the device.
Additionally, each item is an independent guideline respectively.
In developing designs using this product, please confirm
specified characteristics shown in this document.
Individual Electrical Characteristics (Ta = 25°C)
Detector
LED
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Forward voltage
VF
IF = 10 mA
1.0
1.15
1.3
V
Reverse current
IR
VR = 5 V
―
―
10
μA
Capacitance
CT
V = 0, f = 1 MHz
―
30
―
pF
Collector−emitter
breakdown voltage
V(BR) CEO
IC = 0.5 mA
80
―
―
V
Emitter−collector
breakdown voltage
V(BR) ECO
IE = 0.1 mA
7
―
―
V
VCE = 24 V
―
0.01
0.1
μA
VCE = 24 V ,Ta = 85°C
―
0.6
50
μA
V = 0, f = 1 MHz
―
6
―
pF
Min
Typ.
Max
Unit
50
―
600
100
―
600
―
60
―
30
―
―
―
―
0.4
―
0.2
―
―
―
0.4
Min
Typ.
Max
Unit
―
0.8
―
pF
10
―
Ω
5000
―
―
AC, 1 second, in oil
―
10000
―
DC, 1 minute, in oil
―
10000
―
Collector dark current
Capacitance
(collector to emitter)
ID(ICEO)
CCE
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Current transfer ratio
Saturated CTR
Symbol
IC / IF
IC / IF (sat)
Test Condition
IF = 5 mA, VCE = 5 V
IF = 1 mA, VCE = 0.4 V
Rank GB
Rank GB
IC = 2.4 mA, IF = 8 mA
Collector−emitter saturation
voltage
VCE (sat)
IC = 0.2 mA, IF = 1 mA
Rank GB
%
%
V
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Capacitance
(input to output)
CS
VS = 0, f = 1 MHz
Isolation resistance
RS
VS = 500 V
AC, 1 minute
Isolation voltage
BVS
3
12
1×10
14
Vrms
Vdc
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TLP785_TLP785F
Switching Characteristics (Ta = 25°C)
Characteristics
Symbol
Rise time
tr
Fall time
tf
Turn−on time
ton
Test Condition
VCC = 10 V, IC = 2 mA
RL = 100Ω
Min
Typ.
Max
―
2
―
―
3
―
―
3
―
Turn−off time
toff
―
3
―
Turn−on time
tON
―
2
―
―
15
―
―
25
―
Storage time
ts
Turn−off time
tOFF
RL = 1.9 kΩ
VCC = 5 V, IF = 16 mA
(fig. 1)
Unit
μs
μs
IF
IF
RL
VCC
ts
VCE
VCC
4.5V
VCE
tON
0.5V
tOFF
(fig. 1): Switching time test circuit
Surface-Mount Lead Form Options
TLP785(LF6)
TOSHIBA
TLP78F(LF7)
Unit in mm
11-5L106
TOSHIBA
Weight : 0.31g (typ.)
Unit in mm
11-5L107
Weight : 0.31g (typ.)
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TLP785_TLP785F
Option: Specifications for Embossed-Tape Packing; (TP6/TP7)
1. Applicable Package
Package Name
Product Type
DIP4LF6
TLP785
DIP4LF7
TLP785F
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example1)
TLP785 (BL−TP6,Ｆ
[[G]]/RoHS COMPATIBLE
Tape type
CTR Rank
Device name
(Example2)
TLP785F (BL−TP7,Ｆ
[[G]]/RoHS COMPATIBLE
Tape type
CTR Rank
Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
P785
Figure1 Device Orientation
3.2 Tape Packing Quantity:2000 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table1 Empty Device Recesses
Occurrences of 2 or more
successive empty device
recesses
Single
empty
recesses
device
Standard
Remarks
0
Within any given 40-mm section of
tape, not including leader and trailer
6 devices (max.) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes.
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TLP785_TLP785F
3.5 Tape Specification
[1] TLP785(TP6) / TLP785F(TP7)
(1)Tape material: Plastic
(2)Dimensions: The tape dimensions are as shown in Figure 2.
F
W
B
A
φ1.5min
T
A
B
W
F
T
TP6 Type
5.1±0.1
10.6±0.1
16.0±0.3
7.5±0.1
4.2±0.15
TP7Type
5.05±0.1
12.35
24.0±0.3
11.5±0.1
4.4±0.1
Figure 2 Tape Forms
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TLP785_TLP785F
3.6 Reel Specification
[1] TLP785(TP6) / TLP785F(TP7)
(1)Material: Plastic
(2)Dimensions: The reel dimensions are as shown in Figure 4.
4.0±0.5
2.0±0.5
W2
φ330 max
φ100±1.5
φ13.0±0.5
W1
W1
W2
TP6 Type
16.5ｔｙｐ
23max
TP7 Type
24.4typ
30.4max
Unit: mm
Figure 4 Reel Forms
4. Packing
Two reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the
quantity, the lot number and the Toshiba company name.
6. Ordering Information
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as
shown in the following example.
(Example)
TLP785(BL−TP6,F
4000pcs.
Quantity (must be a multiple of 4000)
[[G]]/RoHS COMPATIBLE
Tape type
CTR Rank
Device name
(Note): The order code may be suffixed with a letter or a digit.
Please contact your nearest Toshiba sales representative for more details.
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TLP785_TLP785F
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
∙Temperature profile example of lead (Pb) solders
(°C)
This profile is based on the devices
maximum heat resistance guaranteed value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type used
by the customer within the described profile.
Package surface temperature
240
210
160
140
less than 30s
60 to 120s
Time
(s)
∙Temperature profile example of using lead (Pb)-free solders
(°C)
Package surface temperature
260
This profile is based on the devices
maximum heat resistance guaranteed value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type used
by the customer within the described profile.
230
190
180
60 to 120s
30 to 50s
Time
(s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
Please preheat it at 150°C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin
may be heated at most once.
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TLP785_TLP785F
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP785_TLP785F
EN60747-5-2 ‘Option: (D4)’
Attachment: Specification for EN60747-5-2 option: (D4)
Types: TLP785, TLP785F
Type designations for ‘option: (D4) ’, which are tested under EN60747 requirements.
Ex.: TLP785(D4-GR-LF6,F
D4: EN60747 option
GR: CTR rank name
LF6: standard lead bend name
F: [[G]]/RoHS COMPATIBLE
Note: Use TOSHIBA standard type number for safety standard application.
Ex. TLP785(D4-GR-LF6,F
TLP785
EN60747 Isolation Characteristics
Description
Symbol
Rating
Unit
Application classification
for rated mains voltage ≤ 300 Vrms
for rated mains voltage ≤ 600 Vrms
Climatic classification
Pollution degree
Maximum operating insulation voltage
―
I−IV
I−III
TLP785
TLP785F
Input to output test voltage,
Vpr = 1.5×V IORM, type and sample test
tp = 10s, partial discharge < 5pC
TLP785
Input to output test voltage,
Vpr = 1.875×V IORM, 100% production test
tp = 1s, partial discharge < 5pC
TLP785
TLP785F
TLP785F
Highest permissible overvoltage
(transient overvoltage, tpr = 60s)
VIORM
Vpr
Vpr
55 / 115 / 21
―
2
―
890
1140
1335
Vpk
Vpk
1710
1670
Vpk
2140
VTR
8000
Vpk
Safety limiting values (max. permissible ratings in case of
fault)
current (input current IF, Psi = 0)
power (output or total power dissipation)
temperature
Isi
Psi
Tsi
400
700
175
mA
mW
°C
Insulation resistance,
Rsi
V IO = 500V,Ta=25°C
10
12
≥10
Ω
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TLP785_TLP785F
Insulation Related Specifications
7.62mm pitch
TLPxxx type
10.16mm pitch
TLPxxxF type
Minimum creepage distance
Cr
7.0mm
8.0mm
Minimum clearance
Cl
7.0mm
8.0mm
Minimum insulation thickness
ti
0.4 mm
CTI
175
Comparative tracking index
(1)
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this
value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible,
the user shall take suitable measures.
(2)
This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
VDE test sign: Marking on product
for EN60747
4
Marking on packing
for EN60747
Marking Example: TLP785, TLP785F
P
Lot No.
Device Name
CTR Rank Marking
4: Mark for option (D4)
1pin indication
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TLP785_TLP785F
Figure
1 Partial discharge measurement procedure according to EN60747
Destructive test for qualification and sampling tests.
Method A
(for type and sampling tests,
destructive tests)
t1, t2
t3, t4
tp(Measuring time for
partial discharge)
tb
tini
Figure
VINITIAL(8kV)
V
Vpr(1335V for TLP785)
(1710V for TLP785F)
= 1 to 10 s
=1s
= 10 s
= 12 s
= 60 s
VIORM(890V for TLP785)
(1140V for TLP785F)
0
t1
tini
t3
tP
t2
tb
2 Partial discharge measurement procedure according to EN60747
Non-destructive test for100% inspection.
Method B
t3, t4
tp(Measuring time for
partial discharge)
tb
Vpr(1670V for TLP785)
(2140V for TLP785F)
V
(for sample test,nondestructive test)
VIORM(890V for TLP785)
(1140V for TLP785F)
= 0.1 s
=1s
= 1.2 s
Isi
(mA)
t
tP
t3
Figure
t
t4
tb
t4
3 Dependency of maximum safety ratings on ambient temperature
500
1000
400
800
Psi
(mW)
600
300
Isi
400
200
Psi
100
0
0
25
50
75
100
200
125
150
0
175
Ta (°C)
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TLP785_TLP785F
PC―Ta
IF―Ta
Allowable collector
60
40
20
power dissipation PC (mW)
200
80
IF (mA)
Allowance ｆorward current
100
160
120
80
40
0
0
-20
0
20
40
60
80
100
-20
120
Ambient temperature Ta （℃）
0
20
40
80
100
120
Ambient tenperature Ta (℃)
IF―VF
ΔVF/ΔTa―IF
100
-3
Forward current IF (mA)
-2.6
-2.2
-1.8
-1.4
-1
-0.6
10
1
0.1
0.1
1
10
Forward current IF (mA)
100
0.4
0.9
1.4
1.9
Forward voltage VF (V)
IFP ―VFP
1000
Pulse forward current IFP (mA)
Forward voltage temperature
cofficient ΔVF/ΔTa (mV/℃)
60
Pulse width≦10us
Repeative frequency=100Hz
Ta=25℃
100
10
1
0
0.4
0.8
1.2
1.6
2
2.4
Pulse forward voltage VFP (V)
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TLP785_TLP785F
ID―Ta
IC―VCE
80
Collector current IC (mA)
Collector dark current ID ( A)
10
1
0.1
0.01
0.001
50
60
30
20
15
40
10
20
5
IF=2mA
0
0.0001
0
20
40
60
80
0
100
2
4
8
10
Collector-emitter voltage VCE (V)
Ambient temperature Ta (℃)
IC―IF
IC―VCE
100
40
50
30
30
20
15
20
10
10
5
10
IF=2mA
0
0
0.2
0.4
0.6
0.8
1
1.2
Collector-emitter voltage VCE (V)
Collector current IC (mA)
Collector current IC (mA)
6
1
0.1
IC/IF ― IF
Ta=25℃
VCE=5V
Current transfer ratio IC/IF (%)
1000
VCE=0.4V
0.01
0.1
1
10
100
Forward current IF (mA)
100
10
Ta=25℃
VCE=5V
V CE=0.4V
1
0.1
1
10
100
Forward current IF (mA)
*: The above graphs show typical characteristics.
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TLP785_TLP785F
VCE(sat)―Ta
IC―Ta
0.2
VCE=5V
20mA
Collector-emitter saturation
voltage VCE(sat) (V)
Collector current IC (mA)
100
10mA
5mA
10
1mA
1
IF=0.5mA
0.1
IF =5 ｍA
IC=1m A
0.16
0.12
0.08
0.04
0
-40
-20
0
20
40
60
80
100
Ambient temperature Ta (℃)
-40
-20
0
20
40
60
80
100
Ambient temperature Ta (℃)
Switching Time―RL
1000
Ta=25 ℃
IF=16ｍA
VCE=5V
Switching time ( s)
ｔOFF
100
tS
10
tON
1
1
10
100
Load resistance RL (kΩ)
*: The above graphs show typical characteristics.
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TLP785_TLP785F
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
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FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2011-12-22