VISHAY VSMY7850X01-GS08

VSMY7850X01
www.vishay.com
Vishay Semiconductors
High Power Infrared Emitting Diode, 850 nm,
Surface Emitter Technology
FEATURES
•
•
•
•
•
•
•
•
•
•
21783
•
•
•
•
•
DESCRIPTION
VSMY7850X01 is an infrared, 850 nm emitting diode based
on surface emitter technology with high radiant power and
high speed, molded in low thermal resistance Little Star
package. A 42 mil chip provides outstanding low forward
voltage and allows DC operation of the device up to 1 A.
Package type: surface mount
Package form: Little Star®
Dimensions (L x W x H in mm): 6.0 x 7.0 x 1.5
Peak wavelength: p = 850 nm
High reliability
High radiant power
High radiant intensity
Angle of half intensity:  = ± 60°
Low forward voltage
Designed for high drive currents: up to 1 A DC and up to
5 A pulses
Low thermal resistance: RthJP = 10 K/W
Floor life: 4 weeks, MSL 2a, acc. J-STD-020
Lead (Pb)-free reflow soldering
AEC-Q101 qualified
Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
•
•
•
•
Infrared illumination for CMOS cameras (CCTV)
Driver assistance systems
Machine vision IR data transmission
3D TV
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
p (nm)
tr (ns)
VSMY7850X01
170
± 60
850
20
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMY7850X01-GS08
Tape and reel
MOQ: 2000 pcs, 2000 pcs/reel
Little Star
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
SYMBOL
VALUE
Reverse voltage
PARAMETER
TEST CONDITION
VR
5
UNIT
V
Forward current
IF
1
A
2
A
Peak forward current
tp/T = 0.5, tp  100 μs
IFM
Surge forward current
tp = 100 μs
IFSM
5
A
PV
2.5
W
Power dissipation
Junction temperature
Tj
125
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
Acc. figure 7, J-STD-20
Tsd
260
°C
Acc. J-STD-051, soldered on PCB
RthJP
10
K/W
Soldering temperature
Thermal resistance junction/pin
Rev. 1.0, 27-Jun-11
1
Document Number: 81145
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY7850X01
Vishay Semiconductors
3
1.2
2.5
1.0
IF - Forward Current (A)
PV - Power Dissipation (W)
www.vishay.com
2
1.5
1
RthJP = 10 K/W
0.5
0.8
0.6
0.4
RthJP = 10 K/W
0.2
0
0
0
20
40
60
80
100
0
120
20
Tamb - Ambient Temperature (°C)
40
60
80
100
120
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
TYP.
MAX.
UNIT
IF = 1 A, tp = 20 ms
VF
2.0
2.5
V
IF = 5 A, tp = 100 μs
VF
3.5
V
Temperature coefficient of VF
IF = 1 A
TKVF
- 0.2
mV/K
Reverse current
VR = 5 V
IR
not designed for reverse operation
μA
Forward voltage
Radiant intensity
Radiant power
Temperature coefficient of e
MIN.
IF = 1 A, tp = 20 ms
Ie
IF = 5 A, tp = 100 μs
Ie
780
mW/sr
IF = 1 A, tp = 20 ms
e
520
mW
IF = 1 A
TKe
- 0.5
%/K

± 60
deg
p
850
nm
Angle of half intensity
130
170
390
mW/sr
Peak wavelength
IF = 1 A
Spectral bandwidth
IF = 1 A

30
nm
Temperature coefficient of p
IF = 1 A
TKp
0.2
nm/K
Rise time
IF = 1 A
tr
15
ns
Fall time
IF = 1 A
tf
18
ns
Rev. 1.0, 27-Jun-11
2
Document Number: 81145
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY7850X01
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
0°
10
20°
1
0.1
0.01
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
Ie, rel - Relative Radiant Intensity
IF - Forward Current (A)
10°
30°
tp = 100 µs
80°
0.001
0
1
2
3
4
0.6
VF - Forward Voltage (V)
0.4
0.2
0
94 8013
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
Fig. 3 - Forward Current vs. Forward Voltage
Ie - Radiant Intensity (mW/sr)
1000
tp = 100 µs
100
10
1
0.01
0.1
1
10
IF - Forward Current (A)
Fig. 4 - Radiant Intensity vs. Forward Current
Φe, rel - Relative Radiant Power
1
0.75
0.5
0.25
0
650
750
850
950
λ- Wavelength (nm)
21776
Fig. 5 - Relative Radiant Power vs. Wavelength
Rev. 1.0, 27-Jun-11
3
Document Number: 81145
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY7850X01
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters
20846
Rev. 1.0, 27-Jun-11
4
Document Number: 81145
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY7850X01
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
20848
Rev. 1.0, 27-Jun-11
5
Document Number: 81145
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY7850X01
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
FLOOR LIFE
200
max. 30 s
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
max. 100 s
Floor life: 4 weeks
150
max. 120 s
100
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020B
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
DRYING
0
0
19841
50
100
150
200
250
300
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Time (s)
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 for
Preconditioning acc. to JEDEC, Level 2a
Rev. 1.0, 27-Jun-11
6
Document Number: 81145
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Revision: 12-Mar-12
1
Document Number: 91000