TSC TSM1N60SCTB0

TSM1N60S
600V N-Channel Power MOSFET
TO-92
PRODUCT SUMMARY
Pin Definition:
1. Gate
2. Drain
3. Source
VDS (V)
RDS(on)(Ω)
ID (A)
600
11 @ VGS =10V
0.3
General Description
The TSM1N60S is used an advanced termination scheme to provide enhanced voltage-blocking capability without
degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in
avalanche and commutation modes. The new energy efficient design also offers a drain- to-source diode with a fast
recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM
motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe
operating areas are critical and offer additional and safety margin against unexpected voltage transients.
Features
●
●
●
●
●
Block Diagram
Robust high voltage termination
Avalanche energy specified
Diode is characterized for use in bridge circuits
Source to Drain diode recovery time comparable to a
discrete fast recovery diode.
IDSS and VDS(on) specified at elevated temperature
Ordering Information
Part No.
Package
Packing
TSM1N60SCT B0
TO-92
1Kpcs / Bulk
TSM1N60SCT A3
TO-92
2Kpcs / Ammo
N-Channel MOSFET
Absolute Maximum Rating (Ta = 25oC unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
600
±30
V
V
Continuous Drain Current
Pulsed Drain Current
ID
IDM
0.3
1.2
A
A
IS
1
A
EAS
50
mJ
PDTOT
TJ
3
+150
TJ, TSTG
TL
-55 to +150
10
a,b
Continuous Source Current (Diode Conduction)
Single Pulse Drain to Source Avalanche Energy
(VDD = 100V, VGS=10V, IAS=2A, L=10mH, RG=25Ω)
o
Total Power Dissipation @TC = 25 C
Operating Junction Temperature
Operating Junction and Storage Temperature Range
Lead Temperature (1/8” from case)
1/8
W
C
o
o
C
S
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Thermal Performance
Parameter
Thermal Resistance - Junction to Ambient
Thermal Resistance - Junction to Case
Symbol
Limit
RӨJA
125
o
C/W
50
o
C/W
40
o
C/W
RӨJC
Thermal Resistance - Junction to Lead
Notes: Surface mounted on FR4 board t ≤ 10sec
RӨJL
Unit
Electrical Specifications (Ta=25oC, unless otherwise noted)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250uA
BVDSS
600
--
--
V
Drain-Source On-State Resistance
VGS = 10V, ID = 0.3A
RDS(ON)
--
11
13
Ω
Gate Threshold Voltage
VDS = VGS, ID = 250uA
VGS(TH)
2.0
--
4.0
V
Zero Gate Voltage Drain Current
VDS = 600V, VGS = 0V
IDSS
--
--
10
uA
Gate Body Leakage
VGS = ±20V, VDS = 0V
IGSS
--
--
± 100
nA
Forward Transconductance
VDS ≧50V, ID = 0.3A
gfs
--
5
--
S
Diode Forward Voltage
IS = 1A, VGS = 0V
VSD
--
--
1.5
V
Qg
--
4.5
6
Qgs
--
1.1
--
Qgd
--
2
--
Ciss
--
155
200
Coss
--
20
26
Crss
--
3
4
td(on)
--
10
30
tr
--
20
50
td(off)
--
25
45
--
24
60
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
VDS = 400V, ID = 1A,
VGS = 10V
VDS = 25V, VGS = 0V,
f = 1.0MHz
c
Turn-On Delay Time
Turn-On Rise Time
VGS = 10V, ID = 1A,
Turn-Off Delay Time
VDS = 300V, RG = 6Ω
Turn-Off Fall Time
tf
Notes:
a. Pulse test: pulse width <=300uS, duty cycle <=2%
b. For design reference only, not subject to production testing.
c. Switching time is essentially independent of operating temperature.
2/8
nC
pF
nS
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
3/8
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
Maximum Safe Operating Area
Normalized Thermal Transient Impedance, Junction-to-Ambient
4/8
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveform
EAS Test Circuit & Waveform
5/8
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Diode Reverse Recovery Time Test Circuit & Waveform
6/8
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
TO-92 Mechanical Drawing
DIM
A
B
C
D
E
F
G
H
TO-92 DIMENSION
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
4.30
4.70
0.169
0.185
4.30
4.70
0.169
0.185
13.53 (typ)
0.532 (typ)
0.39
0.49
0.015
0.019
1.18
1.28
0.046
0.050
3.30
3.70
0.130
0.146
1.27
1.31
0.050
0.051
0.33
0.43
0.013
0.017
Marking Diagram
Y = Year Code
M = Month Code
(A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug, I=Sep,
J=Oct, K=Nov, L=Dec)
L = Lot Code
7/8
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Notice
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assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to any
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and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability,
or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers
using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for
any damages resulting from such improper use or sale.
8/8
Version: C07