BAS16TT1G Silicon Switching Diode Features These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com MAXIMUM RATINGS (TA = 25C) Symbol Max Unit Continuous Reverse Voltage VR 75 V Recurrent Peak Forward Current IF 200 mA IFM(surge) 500 mA Rating Peak Forward Surge Current Pulse Width = 10 ms 3 CATHODE 1 ANODE MARKING DIAGRAM THERMAL CHARACTERISTICS Characteristic Total Device Dissipation, FR--4 Board (Note 1) TA = 25C Derated above 25C Thermal Resistance, Junction--to--Ambient (Note 1) Total Device Dissipation, FR--4 Board (Note 2) TA = 25C Derated above 25C Thermal Resistance, Junction--to--Ambient (Note 2) Junction and Storage Temperature Range Symbol PD RθJA PD Max Unit 225 mW 1.8 mW/C 555 C/W October, 2010 -- Rev. 3 1 2 360 mW 2.9 mW/C RθJA 345 C/W TJ, Tstg --55 to +150 C XX M A6 MG G = Specific Device Code = Date Code = Pb--Free Package ORDERING INFORMATION Device BAS16TT1G 1 CASE 463 SOT--416 STYLE 2 1 G Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR--4 @ Minimum Pad 2. FR--4 @ 1.0 1.0 Inch Pad Semiconductor Components Industries, LLC, 2010 3 Package Shipping† SOT--416 (Pb--Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: BAS16TT1/D BAS16TT1G ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Characteristic Min Max ----- 715 866 1000 1250 ---- 1.0 50 30 Unit Forward Voltage (IF = 1.0 mA) (IF = 10 mA) (IF = 50 mA) (IF = 150 mA) VF Reverse Current (VR = 75 V) (VR = 75 V, TJ = 150C) (VR = 25 V, TJ = 150C) IR Capacitance (VR = 0, f = 1.0 MHz) CD -- 2.0 pF Reverse Recovery Time (IF = IR = 10 mA, RL = 50 Ω) (Figure 1) trr -- 6.0 ns Stored Charge (IF = 10 mA to VR = 6.0 V, RL = 500 Ω) (Figure 2) QS -- 45 PC Forward Recovery Voltage (IF = 10 mA, tr = 20 ns) (Figure 3) VFR -- 1.75 V http://onsemi.com 2 mV mA BAS16TT1G 1 ns MAX 10% DUT 500 Ω t trr tif 50 Ω DUTY CYCLE = 2% 90% VF Irr 100 ns Figure 1. Reverse Recovery Time Equivalent Test Circuit OSCILLOSCOPE R 10 MΩ C 7 pF VC 500 Ω DUT VCM 20 ns MAX D1 t 10% VCM = Qa C 243 pF 100 KΩ DUTY CYCLE = 2% t 90% Vf BAW62 400 ns Figure 2. Stored Charge Equivalent Test Circuit V 120 ns 1 KΩ V 450 Ω 90% DUT Vfr t 10% DUTY CYCLE = 2% 2 ns MAX Figure 3. Forward Recovery Voltage Equivalent Test Circuit http://onsemi.com 3 50 Ω BAS16TT1G 10 IR , REVERSE CURRENT (A) IF, FORWARD CURRENT (mA) 100 10 TA = 85C TA = 25C 1.0 TA = -- 40C 0.1 0.2 0.4 0.6 0.8 1.0 VF, FORWARD VOLTAGE (VOLTS) TA = 125C 1.0 TA = 85C 0.1 TA = 55C 0.01 0.001 1.2 TA = 150C TA = 25C 10 0 Figure 4. Forward Voltage 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50 Figure 5. Leakage Current CD , DIODE CAPACITANCE (pF) 0.68 0.64 0.60 0.56 0.52 2 0 4 6 8 VR, REVERSE VOLTAGE (VOLTS) r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE Figure 6. Capacitance 1.0 0.1 D = 0.5 0.2 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.00001 0.0001 0.001 0.01 0.1 1.0 t, TIME (s) Figure 7. Normalized Thermal Response http://onsemi.com 4 10 100 1000 BAS16TT1G PACKAGE DIMENSIONS SC--75/SOT--416 CASE 463--01 ISSUE F --E-- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 2 3 b 3 PL 0.20 (0.008) e --D-- DIM A A1 b C D E e L HE 1 M D 0.20 (0.008) E HE C INCHES NOM MAX 0.031 0.035 0.002 0.004 0.008 0.012 0.006 0.010 0.063 0.067 0.031 0.035 0.04 BSC 0.004 0.006 0.008 0.061 0.063 0.065 MIN 0.027 0.000 0.006 0.004 0.059 0.027 STYLE 2: PIN 1. ANODE 2. N/C 3. CATHODE A L MILLIMETERS MIN NOM MAX 0.70 0.80 0.90 0.00 0.05 0.10 0.15 0.20 0.30 0.10 0.15 0.25 1.55 1.60 1.65 0.70 0.80 0.90 1.00 BSC 0.10 0.15 0.20 1.50 1.60 1.70 A1 SOLDERING FOOTPRINT* 0.356 0.014 1.803 0.071 0.787 0.031 0.508 0.020 1.000 0.039 SCALE 10:1 mm inches *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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