bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 1.1A, Single-Input 5-V Power Supply IC for Wireless Power Applications Check for Samples: bq25046 FEATURES 1 • • • • • • • • 30V Input Rating, with 15V Over-Voltage Protection (OVP) Threshold Integrated Charge Current Sense for Wireless Power Transfer Efficiency Monitoring 3.3V, 15mA integrated Low Dropout Linear Regulator (VDD3.3) Supplies Power to MSP430BQ1010 Directly 2% Output Voltage Regulation Pin Selectable 100mA and 400mA Current Limit Enables Robust Communication in Wireless Power Systems at any Output Current Level Soft-Start Feature to Reduce Inrush Current Status Indication – Power Good (PG) and Output Enabled (CHG) Available in Small 2mm × 3mm DFN-10 Package APPLICATIONS • • • • • DESCRIPTION The bq25046 is a highly integrated linear power supply IC targeted at both wired and wireless power applications. With an accurate 5-V regulated output and integrated 3.3-V LDO, the bq25046 is an ideal solution for wireless power supply solutions up to 5 W. The bq25046 integrates several functions which enable a wireless charging solution within a small area and low component count. These include a 3.3-V LDO which drives an MSP430BQ1010 wireless controller, high-accuracy current sense for calculating receiver-side power usage, 100mA/400mA current limits enable robust communication at all load current levels, and integrated pass FET acts as load disconnect switch and 5-V regulator to protect downstream circuitry. In addition, the bq25046 has an absolute maximum input voltage of 30 V and an OVP threshold of 15 V, which enables safe and robust operation in inductive power transfer systems that use either resistive or capacitive load modulation. Wireless Power Applications Smart Phones PDAs MP3 Players Low-Power Handheld Devices APPLICATION SCHEMATIC RX Coil Resonant Caps Discrete Rectifier 20 mF IN OUT ISET EN1 VDD3.3 EN2 5-V Output BQ25046 EN1 ISET_SCALE EN2 VIN_DIV DISABLE_ COMM_ILIM HI LO COMM MSP430BQ1010 Communication Modulator 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated bq25046 SLUSA83 – SEPTEMBER 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PART NUMBER (1) (1) VOUT(REG) VOVP VVDD3.3 MARKING bq25046DQCR 5.0 V 15 V 3.3 V OFS bq25046DQCT 5.0 V 15 V 3.3 V OFS For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX Input Voltage IN (with respect to VSS) –0.3 V 30 V Output Voltage OUT, VDD3.3, CHG, PG (with respect to VSS) –0.3 V 7V Input voltage EN1, EN2, ISET (with respect to VSS) –0.3 V 7V Input Current IN 1.5 A Output Current (Continuous) OUT 1.5 A Output Sink Current CHG, PG VDD3.3 100 mA 15 mA Junction temperature, TJ Storage temperature, TSTG ESD protection (1) –40 °C 150 °C –65 °C 150 °C HBM 2 kV CDM 500 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. THERMAL INFORMATION bq25046 THERMAL METRIC (1) DFN UNITS 10 PINS qJA Junction-to-ambient thermal resistance 71.9 qJCtop Junction-to-case (top) thermal resistance 65.2 qJB Junction-to-board thermal resistance 85.2 yJT Junction-to-top characterization parameter 0.6 yJB Junction-to-board characterization parameter 29.6 qJCbot Junction-to-case (bottom) thermal resistance 5.1 (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS VIN MIN MAX IN voltage range 3.3 26 IN operating voltage range 3.3 9 UNIT V IIN Input current, IN pin 1.5 IOUT Current, OUT pin 1.5 A TJ Junction Temperature –40 125 ºC RISET Current limit programming resistor 470 5360 Ω 2 Submit Documentation Feedback A Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT VUVLO Under-voltage lock-out VIN: 0V → 4 V 3.15 3.30 3.45 V VHYS-UVLO Hysteresis on UVLO VIN: 4V → 0 V 200 260 320 mV VOVP Input over-voltage protection threshold VIN: 13V → 17 V 14.5 15.0 15.5 VHYS-OVP Hysteresis on OVP VIN: 17V → 13 V tBLK(OVP) Input over-voltage blanking time tREC(OVP) mV 115 ms 500 ms Input over-voltage recovery time Time measured from VIN: 17V → 13V 1ms fall-time to CHG = LO, VOUT = 3.5 V USB input I-Limit 100mA USB100 programmed by EN1/EN2, RISET < 1.1 kΩ 85 91 96 USB input I-Limit 400mA USB500 programmed by EN1/EN2, RISET < 1.1 kΩ 360 400 440 RISET: 500 ≥ 200, IC latches off after tDGL-SHORT 300 IIN-USB-CL V 150 mA ISET SHORT CIRCUIT TEST RISET Continuous Monitor tDGL-SHORT Deglitch time transition from ISET to IC latched off ILIM-ISET-SHRT Current limit with ISET shorted 460 1.5 ISET = 0V, IC latches off after tDGL-SHORT 1.5 Ω ms 1.9 2.2 A 1 mA QUIESCENT CURRENT IOUT(PDWN) Quiescent current into OUT IIN(STDBY) Standby current into IN pin ICC Active supply current, IN pin VIN = 0V VIN ≤ 10V, EN1=EN2=Hi 400 VIN < 16V, EN1=EN2=Hi 800 VIN = 6V, no load on OUT pin, VOUT > VOUT(REG), IC enabled 3 mA mA OUT VOUT(REG) Output voltage 4.9 5.0 5.1 IOUT Programmed Output current limit range VOUT(REG) > VOUT > VLOWV, VIN = 5V, RISET = 470 to 7.5 kΩ, User Programmable set by EN1/EN2 VDO(IN-OUT) VIN – VOUT VIN = 4.9V and IOUT = 1 A IOUT Output current limit formula VOUT(REG) > VOUT > VLOWV, VIN = 5V, User Programmable set by EN1/EN2 KISET Current limit factor 480 530 580 VVDD3.3 VDD3.3 Output Voltage 3.2 3.3 3.4 IVDD3.3(Max) VDD3.3 Maximum Output Current 15 100 280 V 1100 mA 512 mV KISET/RI SET A AΩ VDD3.3 V mA THERMAL REGULATION TJ(REG) Temperature Regulation Limit TJ(OFF) Thermal shutdown temperature TJ(OFF-HYS) Thermal shutdown hysteresis 115 125 135 °C 155 °C 20 °C LOGIC LEVELS ON EN1, EN2 VIL Logic LOW input voltage VIH Logic HIGH input voltage RPULLDOWN Pulldown resistor for EN1 and EN2 0.4 1.4 V V 260 kΩ LOGIC LEVELS ON CHG AND PG VOL Output LOW voltage ISINK = 5 mA IIH Leakage current V/CHG = V/PG =5 V 0.4 5 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 V mA 3 bq25046 SLUSA83 – SEPTEMBER 2010 www.ti.com PIN CONFIGURATION IN 1 10 BAT ISET 2 9 PG VSS 3 8 CHG bq25046 VDD3.3 4 7 EN2 VSS 5 6 EN1 10-pin 3mm x 3mm DFN PIN FUNCTIONS PIN NAME NO. I/O DESCRIPTION IN 1 I Input power supply. IN is connected to the external DC supply (AC adapter or USB port) or wireless rectifier. Bypass IN to VSS with at least a 1mF ceramic capacitor for wired applications and 10 mF typical for wireless power applications. ISET 2 I Current programming input. Connect a resistor from ISET to VSS to program the current limit when the user programmable mode is selected by EN1 and EN2. The resistor range is between 470Ω and 5360Ω to set the current between 100mA and 1.1A. VSS 3, 5 – Ground terminal. Connect to the thermal pad and the ground plane of the circuit. VDD3.3 4 O 3.3V output. VDD3.3 is regulated to 3.3V and drives up to 15mA. Bypass VDD3.3 to VSS with at least a 0.1mF ceramic capacitor. VDD3.3 is enabled when VIN is above the UVLO voltage. EN1 6 I EN2 7 I Current Limit Selection inputs. EN1 and EN2 are used to select the current limit and enable/disable the device. See Table 1 for current limit settings. CHG 8 O IC Enabled output. CHG is pulled to VSS when the bq25046 is enabled. CHG is high impedance when the IC is disabled. PG 9 O Power good output. PG is an open-drain output that pulls to VSS when the input power is above the UVLO and below the OVP threshold. PG is high impedance when outside this range. OUT 10 O 5V LDO output. Connect OUT to the system input. OUT regulates to 5.0V. Bypass OUT to VSS with at least a 1mF ceramic capacitor. – There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. Thermal Pad Table 1. EN1 and EN2 Input Table EN1 4 EN2 CURRENT LIMIT Low Low 100 mA Low High 400 mA High Low ISET High High IC Off Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 BLOCK DIAGRAM Q1 Q2 OUT VIN Charge Pump TJ(REG) + TJ ISET USB Enable Min Current Selector + 2V USB Sense Element + VOUT(REG) Charge Pump VOVP + VIN CHG EN1 260k DIGITAL CONTROL Q3 PG EN2 260k Q4 Q5 VDD3.3 VIN VSS + Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 5 bq25046 SLUSA83 – SEPTEMBER 2010 www.ti.com TYPICAL APPLICATION CIRCUIT 1 IN C1 20µF 9 8 CHG Rectified Wireless Power Input PG R4 1 kW R3 1 kW OUT C2 1µF VSS ISET bq25046 2 To Mobile Device 10 EN1 6 EN2 6 VDD3.3 Wireless Power Control Including MSP430BQ1010 4 3,5 R1 470 W C3 1µF DETAILED FUNCTIONAL DESCRIPTION INPUT OVER VOLTAGE PROTECTION The bq25046 contains an input over voltage protection circuit that disables the OUT output when the input voltage rises above VOVP. This prevents damage from faulty adapters or open loop rectifiers. The OVP circuitry contains a 150 ms deglitch that prevents ringing on the input from line transients from tripping the OVP circuitry falsely. If an adapter with an output greater than VOVP is plugged in, the IC completes powers up and but does not enable the output. The VDD3.3 output remains on to maintain power and protect the MSP430BQ1010 circuit. The OUT LDO remains disabled until the input voltage falls below VOVP. CURRENT LIMIT (ISET, EN1, EN2) The current limit is programmed using the EN1, EN2 and ISET inputs. The EN1 and EN2 inputs allow the user to select USB100 mode, USB400 mode, or the user programmable current limit set by ISET. The user programmable current is set by connecting a resistor from ISET to VSS. The value of the resistor is determined by: K RISET1 = ISET ILIMIT (1) Where KISET = 375 and the current limit (ILIMIT) must be programmed between 100mA and 1.1A. 15mA LDO (VDD3.3) The VDD3.3 output of the bq25046 is a low dropout linear regulator (VDD3.3) that supplies up to 15mA while regulating to VVDD3.3. The VDD3.3 is active whenever the input voltage is above VUVLO. It is not affected by the EN1 and EN2 inputs or OVP. The VDD3.3 output is used to power circuitry such as MSP430BQ1010. 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 OUT STATUS (/CHG) The bq25046 contains an open drain CHG output that indicates when the bq25046 device in enabled. CHG output is pulled to ground when the input voltage is above UVLO and less than OVP and the device is enabled. CHG goes high impedance to signal that the OUT output is not available. Connect CHG to the required logic level voltage through a 1kΩ to 100kΩ resistor to use the signal with a microprocessor. Additionally, CHG may be used to drive an LED for a visual charging status signal. I/CHG must be below 15mA. UNDER VOLTAGE LOCKOUT The bq25046 remains in power down mode when the input voltage is below the undervoltage lockout threshold (VUVLO). During this mode, the control inputs (EN1 and EN2) are ignored. The FET connected between IN and OUT is off, VDD3.3 is off and the status outputs (CHG and PG) are high impedance. Once the input voltage rises above VUVLO, the internal circuitry is turned on and the normal operating procedures are followed. Power Good (/PG) The bq25046 contains a PG signal that indicates when a valid input source is connected. The PG output goes low when an input source between VUVLO and VOVP is connected. PG transitions after the deglitch times out. The deglitch depends on the state of the bq25046 and the condition. Table 2 shows the deglitch for different conditions. Table 2. Deglitch for Different Conditions CONDITION PG Deglitch (Measured from Event to PG High or Low) bq25046 ENABLED bq25046 DISABLED (EN1=EN2=0) Entering OVP (VIN = 5.5 V→11 V) 100 µs 0 Leaving OVP (VIN = 11 V→5.5 V) 450 µs 500 µs Entering UVLO (VIN = 5.5 V→2.5 V) 0 0 Leaving UVLO (VIN = 2.5 V→5.5 V) 230 µs 230 µs PG may be pulled up to any voltage rail less than the maximum rating on the PG output. Another option is to pull up PG to the LDO output. THERMAL REGULATION AND THERMAL SHUTDOWN The bq25046 contains a thermal regulation loop that monitors the die temperature continuously. If the temperature exceeds TJ(REG), the device automatically reduces the input current limit to prevent the die temperature from increasing further. In some cases, the die temperature continues to rise despite the operation of the thermal loop, particularly under high VIN conditions. If the die temperature increases to TJ(OFF), the IC is turned off. Once the device die temperature cools by TJ(OFF-HYS), the device turns on and returns to thermal regulation. Continuous over-temperature conditions result in the pulsing of the load current. If the junction temperature of the device exceeds TJ(OFF), the FET is turned off. The FET is turned back on when the junction temperature falls below TJ(OFF) – TJ(OFF-HYS). Note that these features monitor the die temperature of the bq25046. This is not synonymous with ambient temperature. Self heating exists due to the power dissipated in the IC because of the linear nature of the regulation algorithm. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 7 bq25046 SLUSA83 – SEPTEMBER 2010 www.ti.com APPLICATION INFORMATION Figure 1. Wireless Power System GENERAL OVERVIEW OF A WIRELESS POWER SYSTEM Figure 1 presents a block diagram of a wireless power system, which consists of a transmitter and receiver. The transmitter consists of an AC-DC power stage, followed by a transmitter coil driver, coil voltage and coil current sensing block, and a wireless power controller (BQ500110). The receiver consists of a receiver coil, rectifier, BQ25046 voltage regulation circuit, and MSP430BQ1010 wireless power controller. The output of the system is the BQ25046 5-V regulated output voltage which is used as a power supply to the charger in a cellular phone or other mobile device. The system shown in Figure 2 implements wireless power transfer via inductive coupling between the transmitter and receiver. In this system the transmitter drives a transmit coil with a frequency between 100 and 200 kHz and the receiver coil, which is in close proximity to the transmitter coil, rectifies the received voltage to power the BQ25046. In addition, the receiver continuously monitors its operating point (coil voltage and coil current) and communicates correction packets to the transmitter via backscatter modulation. Utilizing BQ25046 in a Wireless Power System Figure 2 shows the BQ25046 used in a wireless power receiver solution. In this application a receiver coil connects to a half-synchronous rectifier which includes a rectifier filter capacitor. The rectifier voltage is connected directly to the IN pin of the BQ25046 and the BQ25046 generates a 3.3 V LDO output that is used to power an MSP430BQ1010 wireless power supply controller. The MSP430BQ1010 monitors the rectifier voltage and output current and communicates to the transmitter via the communication modulator to optimize the power delivered to a mobile device. The OUT pin of the BQ25046 delivers 5-V to a mobile device at power levels up to 5W. 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 Figure 2. bq25046 Used in a Contactless Power Receiver When used in conjunction with the MSP430BQ1010 wireless power controller, the BQ25046 is an ideal solution for wireless power systems. The key features of the BQ25046 for wireless power include 30-V input protection and 15-V OVP to enable safe operation in the case of a load dump or parasitic magnetic field, 3.3-V LDO that can be connected directly to the MSP430BQ1010, 5-V output regulation voltage can interface to a wide array of mobile devices, integrated current sensing can be used to monitor power usage, and EN1/EN2 control interface provides a simple means to enable and disable BQ25046 and also implement current limiting. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 9 bq25046 SLUSA83 – SEPTEMBER 2010 www.ti.com Figure 3 shows typical waveforms for BQ25046 used in the wireless power system shown in Figure 2. In this plot the BQ25046 IN voltage is blue, OUT voltage is red, PG voltage is green, and CHG voltage is magenta. As you can see at the initial ping (i.e., beginning of power transfer) the IN voltage rises to 5 V and then the MSP430BQ1010 begins to communicate to the transmitter via load modulation. After sending several messages to establish communication with the transmitter, the BQ25046 OUT voltage is enabled and then the CHG pin is pulled low. From this point forward the MSP430BQ1010 periodically communicates with the transmitter, and a 5-V regulated DC output voltage is present at the BQ25046 OUT pin. Figure 3. Power-Up In a Wireless Power Application 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 Figure 4 shows how the internal current limits on BQ25046 can be used in a wireless power application. If the Disable_Comm_Ilimit pin on the MSP430BQ1010 is pulled low, then the USB current limit on the BQ25046 will be enabled during communication. In Figure 4 it can be seen that during every communication packet the BQ25046 EN1 pin is pulled low, which will limit the BQ25046 OUT current to 100mA during communication. In some applications this will improve the robustness of the communication by limiting load modulation due to dynamic loading. Figure 4. Utilizing Internal bq25046 Current Limit In a Wireless Power Application If load modulation during communication is not a concern then Disable_Comm_llim can be pulled high and the BQ25046 will always deliver full rated current based on the ISET programming resistor. Figure 5 presents an example of a wireless power application where EN1 is always high so that the ISET current limit is always used. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 11 bq25046 SLUSA83 – SEPTEMBER 2010 www.ti.com Figure 5. Wireless Power Application in ISET Mode SELECTION OF INPUT/OUTPUT CAPACITORS For wireless power applications a rectifier filter capacitor is required between the IN pin and ground to minimize ripple at the BQ25046 input. For applications with output current greater than 500 mA, a ceramic capacitor of at least 20 mF is required to minimize ripple. In addition, board trace resistance between the IN pin, rectifier capacitor, and ground should be minimized. For wired applications a 1mF capacitor placed in close proximity between the IN pin and GND is generally sufficient The linear regulator in the bq25046 requires a capacitor from OUT to GND for loop stability. Connect a 1mF ceramic capacitor from OUT to GND close to the pins for best results. More output capacitance may be required to minimize the output droop during large load transients. The VDD3.3 also requires an output capacitor for loop stability. Connect at least a 1mF ceramic capacitor from VDD3.3 to GND close to the pins. For improved transient response, this capacitor may be increased. THERMAL CONSIDERATIONS The bq25046 is packaged in a thermally enhanced QFN package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB). Full PCB design guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment Application Note (SLUA271). 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 bq25046 www.ti.com SLUSA83 – SEPTEMBER 2010 The most common measure of package thermal performance is thermal impedance (qJA) measured (or modeled) from the chip junction to the air surrounding the package surface (ambient). The mathematical expression for qJA is: T - TA JJA = J PD (2) Where: TJ = chip junction temperature TA = ambient temperature PD = device power dissipation Factors that can greatly influence the measurement and calculation of qJA include: • Whether or not the device is board mounted • Trace size, composition, thickness, and geometry • Orientation of the device (horizontal or vertical) • Volume of the ambient air surrounding the device under test and airflow • Whether other surfaces are in close proximity to the device being tested The device power dissipation, PD, is a function of the current and the voltage drop across the internal PowerFET. It can be calculated from Equation 3: PD = (VIN - VOUT ) ´ IOUT (3) If the board thermal design is not adequate the programmed current limit may not be achieved under maximum input voltage, as the thermal loop can be active, effectively reducing the current limit to avoid excessive IC junction temperature PCB LAYOUT CONSIDERATIONS It is important to pay special attention to the PCB layout. The following provides some guidelines: • To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq25046, with short trace runs to both IN, OUT and GND (thermal pad). • All low-current GND connections should be kept separate from the high-current paths. • Use a single-point ground technique incorporating both the small signal ground path and the power ground path. • The high current paths into IN pin and from the OUT pin must be sized appropriately for the maximum current in order to avoid voltage drops in these traces. • The bq25046 is packaged in a thermally enhanced QFN package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full PCB design guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment Application Note (SLUA271). Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25046 13 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) BQ25046DQCR ACTIVE WSON DQC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples BQ25046DQCT ACTIVE WSON DQC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Dec-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ25046DQCR WSON DQC 10 3000 179.0 8.4 2.3 3.2 1.0 4.0 8.0 Q1 BQ25046DQCT WSON DQC 10 250 179.0 8.4 2.3 3.2 1.0 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Dec-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25046DQCR WSON DQC 10 3000 195.0 200.0 45.0 BQ25046DQCT WSON DQC 10 250 195.0 200.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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