PHILIPS BLF7G22L-130N

BLF7G22L-130N
Power LDMOS transistor
Rev. 1 — 25 February 2011
Product data sheet
1. Product profile
1.1 General description
130 W LDMOS power transistor for base station applications at frequencies from
2000 MHz to 2200 MHz.
Table 1.
Typical performance
Typical RF performance at Tcase = 25 °C in a common source class-AB production test circuit.
IDq
VDS
PL(AV)
ηD
ACPR
(dB)
(%)
(dBc)
18.5
32
−32[1]
33
−39[2]
Mode of operation
f
Gp
(MHz)
(mA)
(V)
(W)
2-carrier W-CDMA
2110 to 2170
950
28
30
1-carrier W-CDMA
2110 to 2170
950
28
33
18.5
[1]
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 8.4 dB at 0.01 % probability on CCDF;
carrier spacing 5 MHz.
[2]
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7.2 dB at 0.01 % probability on CCDF.
1.2 Features and benefits
„
„
„
„
„
„
„
„
„
Excellent ruggedness
High efficiency
Low Rth providing excellent thermal stability
Designed for broadband operation (2000 MHz to 2200 MHz)
Lower output capacitance for improved performance in Doherty applications
Designed for low memory effects providing excellent digital pre-distortion capability
Internally matched for ease of use
Integrated ESD protection
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
„ RF power amplifiers for W-CDMA base stations and multi carrier applications in the
2000 MHz to 2200 MHz frequency range
BLF7G22L-130N
NXP Semiconductors
Power LDMOS transistor
2. Pinning information
Table 2.
Pinning
Pin
Description
1
drain
2
gate
3
source
Simplified outline
Graphic symbol
1
1
3
[1]
2
2
3
sym112
[1]
Connected to flange.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name Description
Version
BLF7G22L-130N
-
SOT502A
flanged LDMOST ceramic package; 2 mounting holes;
2 leads
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VDS
drain-source voltage
Conditions
-
65
V
VGS
gate-source voltage
−0.5
+13
V
ID
drain current
-
28
A
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
225
°C
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-c)
thermal resistance from junction to case
Tcase = 80 °C; PL = 30 W
0.35 K/W
6. Characteristics
Table 6.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
V(BR)DSS drain-source breakdown voltage
BLF7G22L-130N
Product data sheet
Conditions
Min Typ
Max Unit
VGS = 0 V; ID = 1.5 mA
65
-
-
V
VGS(th)
gate-source threshold voltage
VDS = 10 V; ID = 150 mA
1.3
1.8
2.3
V
IDSS
drain leakage current
VGS = 0 V; VDS = 28 V
-
-
5
μA
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Power LDMOS transistor
Table 6.
Characteristics …continued
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ
Max Unit
IDSX
drain cut-off current
VGS = VGS(th) + 3.75 V;
VDS = 10 V
25
29.5 -
IGSS
gate leakage current
VGS = 11 V; VDS = 0 V
-
-
450
nA
gfs
forward transconductance
VDS = 10 V; ID = 7.5 A
-
10
11
S
RDS(on)
drain-source on-state resistance
VGS = VGS(th) + 3.75 V;
ID = 5.25 A
-
0.1
0.16 Ω
A
7. Test information
Table 7.
Functional test information
Mode of operation: 2-carrier W-CDMA; PAR = 8.4 dB at 0.01 % probability on the CCDF; 3GPP test
model 1; 64 DPCH; f1 = 2112.5 MHz; f2 = 2117.5 MHz; f3 = 2162.5 MHz; f4 = 2167.5 MHz;
RF performance at VDS = 28 V; IDq = 950 mA; Tcase = 25 °C; unless otherwise specified; in a
class-AB production test circuit.
Symbol
Parameter
PL(AV)
average output power
Conditions
Gp
power gain
RLin
input return loss
Min
Typ Max
Unit
-
30
-
W
PL(AV) = 30 W
17
18.5 -
dB
PL(AV) = 30 W
-
−15
−9
dB
ηD
drain efficiency
PL(AV) = 30 W
29
32
-
%
ACPR
adjacent channel power ratio
PL(AV) = 30 W
-
−31
−28
dBc
7.1 Ruggedness in class-AB operation
The BLF7G22L-130N is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V;
IDq = 950 mA; PL = 130 W (CW); f = 2110 MHz.
7.2 Impedance information
Table 8.
Typical impedance information
IDq = 950 mA; main transistor VDS = 28 V. ZS and ZL defined in Figure 1.
f
(MHz)
ZS
(Ω)
ZL
(Ω)
2050
1.3 − j3.6
2.2 − j2.6
2140
1.9 − j4.2
2.0 − j2.6
2230
3.1 − j4.7
1.9 − j2.8
drain
ZL
gate
ZS
001aaf059
Fig 1.
BLF7G22L-130N
Product data sheet
Definition of transistor impedance
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Power LDMOS transistor
7.3 1 Tone CW
001aal341
19
001aal342
60
Gp
(dB)
ηD
(%)
18
(1)
(1)
(2)
(2)
40
(3)
(3)
17
16
20
15
14
0
0
40
80
120
160
0
40
80
PL (W)
160
PL (W)
VDS = 28 V; IDq = 950 mA.
VDS = 28 V; IDq = 950 mA.
(1) f = 2110 MHz
(1) f = 2110 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2170 MHz
(3) f = 2170 MHz
Fig 2.
120
Power gain as a function of load power;
typical values
Fig 3.
Drain efficiency as a function of load power;
typical values
001aal352
0
RLin
(dB)
−10
(1)
(2)
−20
(3)
−30
0
10
20
30
40
50
60
PL (W)
70
VDS = 28 V; IDq = 950 mA.
(1) f = 2110 MHz
(2) f = 2140 MHz
(3) f = 2170 MHz
Fig 4.
Input return loss as a function of load power; typical values
BLF7G22L-130N
Product data sheet
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Power LDMOS transistor
7.4 1-carrier W-CDMA
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7.2 dB at 0.01 % probability on CCDF.
001aal345
20
Gp
(dB)
19
001aal346
60
ηD
(%)
(3)
(2)
(1)
40
18
(1)
(2)
17
(3)
20
16
15
0
0
30
60
90
0
30
60
PL (W)
VDS = 28 V; IDq = 950 mA.
VDS = 28 V; IDq = 950 mA.
(1) f = 2112.5 MHz
(1) f = 2112.5 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2167.5 MHz
(3) f = 2167.5 MHz
Fig 5.
90
PL (W)
Power gain as a function of load power;
typical values
Fig 6.
001aal348
0
Drain efficiency as a function of load power;
typical values
001aal347
8
PAR
(dB)
ACPR5M
(dBc)
(1)
(2)
6
(3)
−20
(1)
4
(2)
(3)
−40
2
−60
0
0
30
60
90
0
30
PL (W)
VDS = 28 V; IDq = 950 mA.
VDS = 28 V; IDq = 950 mA.
(1) f = 2112.5 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2167.5 MHz
(3) f = 2167.5 MHz
Adjacent channel power ratio (5 MHz) as a
function of load power; typical values
BLF7G22L-130N
Product data sheet
90
PL (W)
(1) f = 2112.5 MHz
Fig 7.
60
Fig 8.
Peak-to-average power ratio as a function of
load power; typical values
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Power LDMOS transistor
7.5 2-carrier W-CDMA (5 MHz carrier spacing)
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 8.4 dB at 0.01 % probability on CCDF.
001aal351
20
001aal353
50
ηD
(%)
Gp
(dB)
(3)
(2)
(1)
19
40
(1)
18
(2)
30
(3)
17
20
16
10
15
0
0
10
20
30
40
50
60
PL (W)
0
70
VDS = 28 V; IDq = 950 mA; carrier spacing 5 MHz.
10
20
40
50
60
PL (W)
70
VDS = 28 V; IDq = 950 mA; carrier spacing 5 MHz.
(1) f = 2115 MHz
(1) f = 2115 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2165 MHz
(3) f = 2165 MHz
Fig 9.
30
Power gain as a function of load power;
typical values
Fig 10. drain efficiency as a function of load power;
typical values
001aal354
0
ACPR5M
(dBc)
−20
(1)
(2)
(3)
−40
−60
0
10
20
30
40
50
60
PL (W)
70
VDS = 28 V; IDq = 950 mA; carrier spacing 5 MHz.
(1) f = 2115 MHz
(2) f = 2140 MHz
(3) f = 2165 MHz
Fig 11. Adjacent channel power ratio (5 MHz) as a function of load power; typical values
BLF7G22L-130N
Product data sheet
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Power LDMOS transistor
7.6 2-carrier W-CDMA (10 MHz carrier spacing)
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 8.4 dB at 0.01 % probability on CCDF.
001aal355
20
001aal356
50
ηD
(%)
Gp
(dB)
(3)
(2)
(1)
19
40
(1)
18
(2)
30
(3)
17
20
16
10
15
0
0
10
20
30
40
50
60
PL (W)
0
70
VDS = 28 V; IDq = 950 mA; carrier spacing 10 MHz.
10
20
30
(1) f = 2117.5 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2162.5 MHz
(3) f = 2162.5 MHz
001aal357
0
ACPR5M
(dBc)
60
PL (W)
70
Fig 13. Drain efficiency as a function of load power;
typical values
001aal358
0
ACPR10M
(dBc)
−20
−20
(1)
(2)
(1)
(3)
−40
−60
50
VDS = 28 V; IDq = 950 mA; carrier spacing 10 MHz.
(1) f = 2117.5 MHz
Fig 12. Power gain as a function of load power;
typical values
40
(2)
(3)
−40
0
10
20
30
40
50
60
PL (W)
70
VDS = 28 V; IDq = 950 mA; carrier spacing 10 MHz.
−60
0
10
20
(1) f = 2117.5 MHz
(2) f = 2140 MHz
(2) f = 2140 MHz
(3) f = 2162.5 MHz
(3) f = 2162.5 MHz
BLF7G22L-130N
Product data sheet
40
50
60
PL (W)
70
VDS = 28 V; IDq = 950 mA; carrier spacing 10 MHz.
(1) f = 2117.5 MHz
Fig 14. Adjacent channel power ratio (5 MHz) as a
function of load power; typical values
30
Fig 15. Adjacent channel power ratio (10 MHz) as a
function of load power; typical values
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7.7 Test circuit
C3
C6
R1
C8 C9
C11
C2
C1
C5
BLF7G22LS-130 OUTPUT V1
RO4350 30MIL RSN
BLF7G22LS-130 INPUT V1
RO4350 30MIL RSN
C4
C7 C10
001aal359
See Table 9 for list of components. The drawing is not to scale.
Fig 16. Component layout
Table 9.
List of components
See Figure 16 for component layout.
BLF7G22L-130N
Product data sheet
Component
Description
Value
Remarks
C1, C2, C3, C4, C5
multilayer ceramic chip capacitor
9.1 pF
ATC100B
C6, C7
multilayer ceramic chip capacitor
220 nF
AVX1206
C8, C9, C10
multilayer ceramic chip capacitor
4.7 μF; 50 V
Kemet
C11
electrolytic capacitor
220 μF; 63 V
BC
R1
SMD resistor
6.2 Ω
Philips 1206
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Power LDMOS transistor
8. Package outline
Flanged LDMOST ceramic package; 2 mounting holes; 2 leads
SOT502A
D
A
F
3
D1
U1
B
q
c
C
1
H
L
E1
p
U2
E
w1 M A M B M
A
2
w2 M C M
b
0
5
Q
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
b
c
mm
4.72
3.43
12.83
12.57
0.15
0.08
inches
0.186
0.135
0.505 0.006
0.495 0.003
OUTLINE
VERSION
E
E1
F
H
L
p
Q
q
U1
U2
w1
w2
20.02 19.96
19.61 19.66
9.50
9.30
9.53
9.25
1.14
0.89
19.94
18.92
5.33
4.32
3.38
3.12
1.70
1.45
27.94
34.16
33.91
9.91
9.65
0.25
0.51
0.788 0.786
0.772 0.774
0.374 0.375
0.366 0.364
0.067
1.100
0.057
1.345
1.335
0.390
0.380
0.01
0.02
D
D1
0.045 0.785
0.035 0.745
0.210 0.133
0.170 0.123
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-28
03-01-10
SOT502A
Fig 17. Package outline SOT502A
BLF7G22L-130N
Product data sheet
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9. Abbreviations
Table 10.
Abbreviations
Acronym
Description
3GPP
Third Generation Partnership Project
CCDF
Complementary Cumulative Distribution Function
CW
Continuous Wave
DPCH
Dedicated Physical CHannel
ESD
ElectroStatic Discharge
LDMOS
Laterally Diffused Metal Oxide Semiconductor
LDMOST
Laterally Diffused Metal Oxide Semiconductor Transistor
PAR
Peak-to-Average power Ratio
RF
Radio Frequency
SMD
Surface Mounted Device
VSWR
Voltage Standing Wave Ratio
W-CDMA
Wideband Code Division Multiple Access
10. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BLF7G22L-130N v.1
20110225
Product data sheet
-
-
BLF7G22L-130N
Product data sheet
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© NXP B.V. 2011. All rights reserved.
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11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
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Product data sheet
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ruggedness in class-AB operation . . . . . . . . . 3
Impedance information . . . . . . . . . . . . . . . . . . . 3
1 Tone CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1-carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 5
2-carrier W-CDMA (5 MHz carrier spacing) . . . 6
2-carrier W-CDMA (10 MHz carrier spacing) . . 7
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 February 2011
Document identifier: BLF7G22L-130N