FAIRCHILD 74VHC161284

Revised July 2000
74VHC161284
IEEE 1284 Transceiver
General Description
Features
The VHC161284 contains eight bidirectional data buffers
and eleven control/status buffers to implement a full
IEEE 1284 compliant interface. The device supports the
IEEE 1284 standard and is intended to be used in
Extended Capabilities Port mode (ECP). The pinout allows
for easy connection from the Peripheral (A-side) to the
Host (cable side).
■ Supports IEEE 1284 Level 1 and Level 2 signaling
standards for bidirectional parallel communications
between personal computers and printing peripherals
Outputs on the cable side can be configured to be either
open drain or high drive (± 14 mA). The pull-up and pulldown series termination resistance of these outputs on the
cable side is optimized to drive an external cable. In addition, all inputs (except HLH) and outputs on the cable side
contain internal pull-up resistors connected to the VCC supply to provide proper termination and pull-ups for open
drain mode.
■ Replaces the function of two (2) 74ACT1284 devices
■ All inputs have hysteresis to provide noise margin
■ B and Y output resistance optimized to drive external
cable
■ B and Y outputs in high impedance mode during power
down
■ Inputs and outputs on cable side have internal pull-up
resistors
■ Flow-through pin configuration allows easy interface
between the Peripheral and Host
Outputs on the Peripheral side are standard LOW-drive
CMOS outputs. The DIR input controls data flow on the
A1–A8/B1–B8 transceiver pins.
Ordering Code:
Ordering Number Package Number
Package Description
74VHC161284MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
74VHC161284MTD
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
© 2000 Fairchild Semiconductor Corporation
Connection Diagram
DS500098
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74VHC161284 IEEE 1284 Transceiver
February 1998
74VHC161284
Pin Descriptions
Pin Names
HD
Truth Table
Description
Inputs
HIGH Drive Enable Input (Active HIGH)
DIR
HD
L
L
Outputs
DIR
Direction Control Input
A1–A8
Inputs or Outputs
B1–B8
Inputs or Outputs
C14–C17 Data to A14–A17
A9–A13
Inputs
PLH Open Drain Mode
Y9–Y13
Outputs
A14–A17
Outputs
C14–C17
Inputs
PLHIN
Peripheral Logic HIGH Input
B1–B8 Data to A1–A8, and
A9–A13 Data to Y9–Y13 (Note 1)
L
H
B1–B 8 Data to A1–A8, and
A9–A13 Data to Y9–Y13
C14–C17 Data to A14–A17
H
L
A1–A8 Data to B1–B8 (Note 2)
PLH
Peripheral Logic HIGH Output
HLHIN
Host Logic HIGH Input
A9–A13 Data to Y9–Y13 (Note 1)
C14–C17 Data to A14–A17
HLH
Host Logic HIGH Output
PLH Open Drain Mode
H
H
A1–A8 Data to B1–B8
A9–A13 Data to Y9–Y13
C14–C17 Data to A14–A17
Note 1: Y9–Y13 Open Drain Outputs
Note 2: B1–B8 Open Drain Outputs
Logic Diagram
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2
Recommended Operating
Conditions
Supply Voltage
−0.5V to + 7.0V
VCC
Supply Voltage
Input Voltage (VI) (Note 4)
A1–A 13, PLHIN, DIR, HD
−0.5V to VCC + 0.5V
B1–B8, C14–C17, HLHIN
−0.5V to + 5.5V (DC)
B1–B8, C14–C17, HLHIN
−2.0V to + 7.0V *
4.5V to 5.5V
VCC
DC Input Voltage (VI)
0V to VCC
Open Drain Voltage (VO)
0V to 5.5V
−40°C to + 85°C
Operating Temperature (TA)
*40 ns Transient
Output Voltage (VO)
A1–A8, A14–A17, HLH
−0.5V to VCC + 0.5V
B1–B 8, Y9–Y13, PLH
−0.5V to + 5.5V (DC)
B1–B 8, Y9–Y13, PLH
−2.0V to + 7.0V*
*40 ns Transient
DC Output Current (IO)
A1–A8, HLH
±25 mA
B1–B8, Y9–Y13
±50 mA
PLH (Output LOW)
84 mA
PLH (Output HIGH)
−50 mA
Input Diode Current (IIK) (Note 4)
DIR, HD, A9–A13,
−20 mA
PLH, HLH, C14–C17
Output Diode Current (IOK)
A1–A8, A14–A17, HLH
±50 mA
B1–B8, Y9–Y13, PLH
−50 mA
Note 3: Absolute Maximum continuos ratings are those values beyond
which damage to the device may occur. Exposure to these indicated may
adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
DC Continuous VCC or
±200 mA
Ground Current
−65°C to + 150°C
Storage Temperature
Note 4: Either voltage limit or current limit is sufficient to protect inputs.
ESD (HBM) Last Passing
Voltage
2000V
DC Electrical Characteristics
Symbol
Parameter
VIK
Input Clamp Diode Voltage
VIH
Minimum HIGH Level Input Voltage
VIL
∆VT
VOH
Maximum LOW Level Input Voltage
Minimum Input Hysteresis
Minimum HIGH Level Output Voltage
VCC
TA = −40°C to +85°C
(V)
Guaranteed Limits
3.0
−1.2
An, PLHIN, DIR, HD
4.5 − 5.5
0.7 VCC
Bn
4.5 − 5.5
2.0
Cn
4.5 − 5.5
2.3
HLHIN
4.5 − 5.5
2.6
An, PLHIN, DIR, HD
4.5 − 5.5
0.3 VCC
Bn
4.5 − 5.5
0.8
Cn
4.5 − 5.5
0.8
Units
V
Conditions
II = −18 mA
V
V
HLHIN
4.5 − 5.5
1.6
An, PLHIN, DIR, HD
4.5 − 5.5
0.4
Bn
4.5 − 5.5
0.4
Cn
5.0
0.8
HLHIN
5.0
0.3
VT + –VT−
An, HLH
4.5
4.4
IOH = −50 µA
4.5
3.8
Bn, Yn
4.5
3.73
PLH
4.5
4.45
3
VT + –VT−
V
VT+ –VT−
VT + –VT−
V
IOH = −8 mA
IOH = −14 mA
IOH = −500 µA
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74VHC161284
Absolute Maximum Ratings(Note 3)
74VHC161284
DC Electrical Characteristics
Symbol
VOL
RD
RP
IIH
(Continued)
Parameter
VCC
TA = −40°C to +85°C
(V)
Guaranteed Limits
Units
4.5
0.1
IOL = 50 µA
4.5
0.44
IOL = 8 mA
Bn, Yn
4.5
0.77
PLH
4.5
0.7
Maximum Output Impedance
B1–B8, Y9–Y13
5.0
55
Ω
(Note 5)(Note 6)
Minimum Output Impedance
B1–B8, Y9–Y13
5.0
35
Ω
(Note 5)(Note 6)
Maximum Pull-Up Resistance
B1–B8, Y9–Y13, C14–C17
5.0
1650
Ω
Minimum Pull-Up Resistance
B1–B8, Y9–Y13, C14–C17
5.0
1150
Ω
Maximum Input Current in HIGH State
A9–A13, PLHIN, HD, DIR, HLHIN
5.5
1.0
C14–C17
5.5
100
A9–A13, PLHIN, HD, DIR, HLHIN
5.5
−1.0
µA
VI = 0.0V
mA
VI = 0.0V
Maximum LOW Level Output Voltage
An, HLH
V
IOL = 14 mA
IOL = 84 mA
µA
IIL
Maximum Input Current in LOW State
C14–C17
5.5
−5.0
IOZH
Maximum Output Disable Current
A1—A8
5.5
20
(HIGH)
B1–B8
5.5
100
Maximum Output Disable Current
A1—A8
5.5
−20
µA
IOZL
Conditions
µA
VI = 5.5V
VI = 5.5V
VO = 5.5V
VO = 5.5V
VO = 0.0V
(LOW)
B1–B8
5.5
−5.0
mA
IOFF
Power Down Output Leakage
B1–B8, Y9–Y13, PLH
0.0
100
µA
VO = 5.5V
IOFF
Power Down Input Leakage
C14–C17, HLHIN
0.0
100
µA
VI = 5.5V
IOFF − ICC
Power Down Leakage to VCC
0.0
250
µA
(Note 7)
ICC
Maximum Supply Current
5.5
70
mA
VI = VCC or GND
Note 5: Output impedance is measured with the output active LOW and active HIGH (HD = HIGH).
Note 6: This parameter is guaranteed but not tested, characterized only.
Note 7: Power-down leakage to VCC is tested by simultaneously forcing all pins on the cable-side (B1–B8, Y9–Y13, PLH, C14–C17 and HLHIN to 5.5V and
measuring the resulting ICC.
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4
TA = −40°C to +85°C
Symbol
VCC = 4.5V − 5.5V
Parameter
Units
Figure
Number
Min
Max
tPHL
A1–A8 to B1–B8
2.0
30.0
ns
Figure 1
tPLH
A1–A8 to B1–B8
2.0
30.0
ns
Figure 2
tPHL
B1–B8 to A1–A8
2.0
30.0
ns
Figure 3
tPLH
B1–B8 to A1–A8
2.0
30.0
ns
Figure 3
tPHL
A9–A13 to Y9–Y13
2.0
30.0
ns
Figure 1
tPLH
A9–A13 to Y9–Y13
2.0
30.0
ns
Figure 2
tPHL
C14–C17 to A14–A17
2.0
30.0
ns
Figure 3
tPLH
C14–C17 to A14–A17
2.0
30.0
ns
Figure 3
tSKEW
LH-LH or HL-HL
6.0
ns
(Note 9)
tPHL
PLHIN to PLH
30.0
ns
Figure 1
tPLH
PLHIN to PLH
2.0
30.0
ns
Figure 2
tPHL
HLHIN to HLH
2.0
30.0
ns
Figure 3
tPLH
HLHIN to HLH
2.0
30.0
ns
Figure 3
tPHZ
Output Disable Time
2.0
18.0
tPLZ
DIR to A1–A8
2.0
18.0
ns
Figure 7
tPZH
Output Enable Time
2.0
25.0
tPZL
DIR to A1–A8
2.0
25.0
ns
Figure 8
tPHZ
Output Disable Time
2.0
25.0
tPLZ
DIR to B1–B8
2.0
25.0
ns
Figure 9
tpEN
Output Enable Time
2.0
28.0
ns
Figure 2
2.0
28.0
ns
Figure 2
20.0
ns
2.0
HD to B1–B8, Y9–Y13
tpDis
Output Disable Time
HD to B1–B8, Y9–Y13
tpEn–tpDis
Output Enable-Output Disable
tSLEW
Output Slew Rate
tPLH
B1–B8, Y9–Y13
tPHL
tr, tf
0.05
0.40
0.05
0.40
tRISE and tFALL
120
B1–B8, Y9–Y13 (Note 8)
120
V/ns
ns
Figure 5
Figure 4
Figure 6
(Note 10)
Note 8: Open Drain
Note 9: tSKEW is measured for common edge output transitions and compares the measured propagation delay for a given path type.
(i) A1–A8 to B1–B8, A9–Y13 to Y9–Y13
(ii) B1–B8 to A1–A8
(iii) C14–C17 to A14–A17
Note 10: This parameter is guaranteed but not tested, characterized only.
Capacitance (Note 11)
Typ
Units
Conditions
CIN
Symbol
Input Capacitance
Parameter
5
pF
VCC = 0.0V (HD, DIR, A9—A13, C14—C17, PLHIN and HLHIN)
CI/O
I/O Pin Capacitance
12
pF
VCC = 3.3V
Note 11: Capacitance is measured at frequency = 1 MHz.
5
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74VHC161284
AC Electrical Characteristics
74VHC161284
AC Loading and Waveforms
Pulse Generator for all pulses: Rate ≤ 1.0 MHz; ZO ≤ 50Ω; tf ≤ 2.5 ns, tr ≤ 2.5 ns.
FIGURE 1. tPHL Test Load and Waveforms
A1–A8 to B1–B8
A9–A13 to Y9–Y13
PLHIN to PLH
FIGURE 2. tPLH, tpEn, tpDisTest Load and Waveforms
A1–A8 to B1–B8, A9–A13 to Y9–Y13
PLHIN to PLH, HD to B1–B8, Y9–Y13, PLH
FIGURE 3. tPHL, tPLH Test Load and Waveforms
B1–B8 to A1–A8, C14–C17 to A14–A17, HLHIN to HLH
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74VHC161284
AC Loading and Waveforms
(Continued)
FIGURE 4. tSLEW HL Test Load and Waveforms
A1–A8 to B1–B8
A9–A13 to Y9–Y13
FIGURE 5. tSLEW LH Test Load and Waveforms
A1–A8 to B1–B8
A9–A13 to Y9–Y13
tr = Output Rise Time, Open Drain
tf = Output Fall Time, Open Drain
FIGURE 6. tRISE and tFALL Test Load and Waveforms for Open Drain Outputs
A1–A8 to B1–B8, A9–A13 to Y9–Y13
7
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74VHC161284
AC Loading and Waveforms
(Continued)
FIGURE 7. tPHZ and tPLZ Test Load and Waveforms, DIR to A1–A8
FIGURE 8. tPZH and tPZL Test Load and Waveforms, DIR to A1–A8
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74VHC161284
AC Loading and Waveforms
(Continued)
FIGURE 9. tPHZ and tPLZ Test Load and Waveforms, DIR to B1–B8
9
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74VHC161284
Physical Dimensions inches (millimeters) unless otherwise noted
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Number MS48A
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74VHC161284 IEEE 1284 Transceiver
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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