SSM3J304T TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type SSM3J304T ○ Power Management Switch Applications ○ High-Speed Switching Applications • 1.8-V drive • Low ON-resistance: Unit: mm RDS(ON) = 297 mΩ (max) (@VGS = -1.8 V) RDS(ON) = 168 mΩ (max) (@VGS = -2.5 V) RDS(ON) = 127 mΩ (max) (@VGS = -4.0 V) Absolute Maximum Ratings (Ta = 25˚C) Characteristic Symbol Rating Unit Drain-source voltage VDS -20 V Gate-source voltage VGSS ±8 V DC ID -2.3 Pulse IDP -4.6 PD (Note 1) 700 Drain current Power dissipation A mW Channel temperature Tch 150 °C Storage temperature Tstg −55 to 150 °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). JEDEC ― JEITA ― TOSHIBA 2-3S1A Weight: 10 mg (typ.) Note 1: Mounted on an FR4 board 2 (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm ) Marking Equivalent Circuit (top view) 3 3 JJ2 1 2 1 2 1 2010-01-26 SSM3J304T Electrical Characteristics (Ta = 25°C) Characteristic Symbol Drain-source breakdown voltage Min Typ. Max Unit V (BR) DSS ID = -1 mA, VGS = 0 -20 ⎯ ⎯ V (BR) DSX ID = -1 mA, VGS = +8 V -12 ⎯ ⎯ VDS = -20 V, VGS = 0 ⎯ ⎯ -10 μA Drain cutoff current IDSS Gate leakage current IGSS Gate threshold voltage Vth Forward transfer admittance ⏐Yfs⏐ Drain-source ON-resistance RDS (ON) Input capacitance Ciss Output capacitance Coss Reverse transfer capacitance Crss Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Switching time Test Condition Turn-on time ton Turn-off time toff Drain-source forward voltage VDSF VGS = ±8 V, VDS = 0 V ⎯ ⎯ ±1 μA -0.3 ⎯ -1.0 V (Note 2) 2.4 4 ⎯ S ID = -1.0 A, VGS = -4 V (Note 2) ⎯ 88 127 ID = -0.5 A, VGS = -2.5 V (Note 2) ⎯ 120 168 ID = -0.2 A, VGS = -1.8 V (Note 2) ⎯ 172 297 ⎯ 335 ⎯ ⎯ 70 ⎯ ⎯ 56 ⎯ ⎯ 6.1 ⎯ ⎯ 4.4 ⎯ VDS = -3 V, ID = -1 mA VDS = -3 V, ID = -1 A VDS = -10 V, VGS = 0, f = 1 MHz VDS = -16 V, IDS = - 2.3 A, VGS = - 4 V ⎯ 1.7 ⎯ VDD = -10 V, ID = -1A, ⎯ 20 ⎯ VGS = 0 to -2.5 V, RG = 4.7 Ω ⎯ 20 ⎯ ⎯ 0.85 1.2 ID = 2.3 A, VGS = 0 (Note 2) mΩ pF nC ns V Note 2: Pulse test Switching Time Test Circuit (a) Test circuit −2.5 V OUT 0V IN RG 0 (b) VIN RL VDD× VDD = − 10 V RG = 4.7 Ω Duty ≤ 1% VIN: tr, tf < 5 ns Common Source Ta = 25°C 90% 10% -2.5 V (c) VOUT VDS (ON) 90% 10% VDD tf tr ton to Notice on Usage Vth can be expressed as the voltage between gate and source when the low operating current value is ID = -1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).) Take this into consideration when using the device. ) Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. 2 2010-01-26 SSM3J304T ID - VGS ID - VDS -5 -10 -10 -4 -4 Common Common Source Source VDS VDS == -3 V Common Source Common Source Ta = 25 Ta=25°C℃ -2.5 Pulse test -1 -3 Drain Current ID (A) Drain Current ID (A) Pulse test -1.8 -2 -0.1 25℃ -25℃ Ta = 85℃ -0.01 -1.5 -1 -0.001 VGS = -1.2 V -0.0001 0 0 -0.2 -0.4 -0.6 -0.8 0 -1 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 Gate-Source Voltage VGS (V) Drain-Source Voltage VDS (V) RDS (ON) - Ta RDS (ON) - VGS 300 300 Common CommonSource Source = 25℃ TaTa=25°C -0.5 A Common CommonSource Source Pulse test Pulse test -1.8 V,-0.2 A 250 Drain-Source ON-Resistance RDS (ON) (ｍΩ) Drain-Source ON-Resistance RDS (ON) (mΩ) ID = -1 A -0.2 A 200 100 200 -2.5 V,-0.5 A 150 100 VGS = -4 V,ID = -1 A 50 0 0 0 1 2 3 4 5 6 7 8 9 -60 10 -35 -10 15 65 90 115 140 Ambient Temperature Ta (℃ ) Gate-Source Voltage VGS (V) Vth - Ta RDS (ON) - ID -1.4 300 CommonSource Source Common Ta = 25℃ Ta=25°C Pulse test 250 200 -2.5 V 150 -4 V 100 Common Source ID = -1 mA VDS = -3 V -1.2 Gate Threshold Voltage Vth (V) VGS = -1.8 V Drain-Source ON-Resistance RDS (ON) (mΩ) 40 50 -1 -0.8 -0.6 -0.4 -0.2 -0 0 0 -1 -2 -3 -4 -25 -5 0 25 50 75 100 125 150 Ambient Temperature Ta (℃ ) Drain Current ID (A) 3 2010-01-26 SSM3J304T |Yfs| - ID IDR - VDS 10 10 Common CommonSource Source VDS VDS== -3 -3 V V Ta = 25℃ Ta=25°C Ta = 85℃ Drain Reverse Current IDR (A) Pulse test Forward Transfer Admittance |Yfs| (S) CommonSource Source Common VGS= =0 0 VGS Ta=25°C TaPulse = 25℃ test 25℃ -25℃ 1 25℃ 1 -25℃ 0.1 Ta = 85℃ 0.01 0.001 0.1 -0.01 -0.1 -1 0 -10 0.2 0.4 0.8 1 1.2 1.4 t - ID C - VDS 1000 1000 Switching Time t (ns) 100 Coss Crss Common Source VGS = 0 V f = 1 MHz Ta = 25℃ 10 -0.1 -1 -10 Common Source Common Source VDD = -10 V VDD=-10V VGS = 0 ～ VGS=0 to 2.5V-2.5 V Ta = 25 Ta=25℃ ℃ toff Ciss 100 tf ton 10 tr 1 0.01 -100 0.1 1 10 Drain Current ID (A) Drain-Source Voltage VDS (V) Dynamic Input Characteristic −10 VGS (V) Common Source Gate-Source voltage Capacitance C (pF) 0.6 Drain-Source Voltage VDS (V) Drain Current ID (A) ID = −2.3A −8 Ta = 25°C −6 VDD=−16V −4 −2 0 0 2 4 6 8 10 Total Gate Charge 12 Qg 14 16 (nC) 4 2010-01-26 SSM3J304T rth PD – Ta – tw 1000 b 100 a Single Pulse 10 a: Mounted on FR4 board (25.4mm × 25.4mm × 1.6mm , Cu Pad : 645 mm2) b: Mounted on FR4 board (25.4mm × 25.4mm × 1.6mm , Cu Pad : 0.8 mm2×3) 1 0.001 0.01 0.1 1 Pulse width 10 tw 100 Power dissipation PD (mW) Transient thermal impedance rth (°C/W) 1000 a: Mounted on FR4 board (25.4mm × 25.4mm × 1.6mm , Cu Pad : 645 mm2) b: Mounted on FR4 board (25.4mm × 25.4mm × 1.6mm , 2 Cu Pad : 0.8 mm ×3) 800 a 600 400 b 200 0 -40 1000 -20 0 20 40 60 80 Ambient temperature (s) 5 100 120 140 160 Ta (°C) 2010-01-26 SSM3J304T RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2010-01-26