STMICROELECTRONICS EMIF02

EMIF02-USB04F3
3-line IPAD™, EMI filter including ESD protection
Features
■
EMI symmetrical (I/O) low-pass filter
■
high efficiency in EMI/ESD protection
■
lead-free package
■
very thin package
■
high reliability offered by monolithic integration
■
high reduction of parasitic elements through
integration and wafer level packaging
Lead-free Flip-Chip package
(9 bumps)
Complies with the following standards
■
■
IEC 61000-4-2 level 4 (on external pins B1 and
C1):
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Figure 1.
Pin configuration (bump side)
3
2
1
A
IEC 61000-4-2 level 1 (on internal pins):
– ±2 kV (air discharge)
– ±2 kV (contact discharge)
B
Applications
C
Where EMI filtering in ESD sensitive equipment is
required:
■
mobile phones and communication systems
■
computers, printers and MCU boards
Figure 2.
Configuration
A2
R5
C2
R4
B3
R3
R2
C1
Description
C3
R1
B1
The EMIF02-USB04F3 chip is a highly integrated
audio filter device designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference.
A3
A1
B2
Cline = 20 pF max
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
subjected to ESD surges up to 15 kV.
TM: IPAD is a trademark of STMicroelectronics.
October 2010
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www.st.com
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Electrical characteristics
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EMIF02-USB04F3
Electrical characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
Internal pins (A2, A3, B2, B3, C2, C3):
ESD discharge IEC 61000-4-2, level 1, air discharge
ESD discharge IEC 61000-4-2, level 1, contact discharge
External pins (A1, B1, C1):
ESD discharge IEC 61000-4-2, level 4, air discharge
ESD discharge IEC 61000-4-2, level 4, contact discharge
±15
±8
Pd
Line resistance power dissipation at 70 °C
60
mW
Top
Operating temperature range
- 40 to + 85
°C
Tstg
Storage temperature range
- 55 to 150
°C
VPP
Figure 3.
±2
±2
kV
Electrical characteristics (definitions)
I
Symbol
VBR
IRM
Cline
RI/O
Table 2.
=
=
=
=
Parameter
Breakdown voltage
Leakage current @ VRM
Line capacitance
Series resistance between Input and Output
IR
IRM
V
IRM
IR
VRM
VBR
Electrical characteristics (Tamb = 25 °C)
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3 V per line
Min.
Typ.
Max.
7
Unit
V
100
nA
R1, R2
Tolerance ± 5%
33
Ω
R4, R5
Tolerance ± 20%
18.5
kΩ
R3
Cline
2/7
VBR VRM
1425
Vline = 0 V, Vosc = 30 mV, F = 1 MHz
(measured under zero light conditions)
Doc ID 18144 Rev 1
1490
1560
Ω
20
pF
EMIF02-USB04F3
Figure 4.
Electrical characteristics
S21 (dB) attenuation measurement Figure 5.
on C3-C1 and A3-B1
dB
0.00
Analog crosstalk measurements on
C3 - A1
XTalk(dB)
0.00
VBIAS = 0 V
VBIAS = 0 V
- 10.00
- 10.00
D+
D-
- 20.00
- 20.00
- 30.00
- 30.00
- 40.00
S21(dB)
S21(dB)
F = 900 Mhz F = 1.8 Ghz
- 50.00
D+
D+
DD-
- 60.00
1.0M
Figure 6.
D-OUT
-12.3
-12.0
3.0M
-20.4
-19.5
10.0M
D+/D
-
- 40.00
FC = 335 MHz
30.0M
- 50.00
XTalk (dB)
300 kHz < F < 3 GHz >-12
f/Hz
100.0M 300.0M
f/Hz
- 60.00
1.0G
3.0G
Digital crosstalk measurement on
C3-B1 in 50 environment
1.0M
Figure 7.
3.0M
10.0M
30.0M
100.0M 300.0M
1.0G
3.0G
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
V(in) and on one output V(out)
20 V/Div.
100 mV/Div.
INPUT
C2
D+IN
C2
100 ns/Div
10 ns/Div.
10 V/Div.
OUTPUT
C1
1 V/Div.
Figure 8.
10 ns/Div.
C3
100 ns/Div
ESD response to IEC 61000-4-2
Figure 9.
(-15 kV air discharge) on one input
V(in) and on one output V(out)
18
C2
20 V/Div.
INPUT
Line capacitance versus applied
voltage (typical values, line C1-B2)
C (pF)
16
14
12
100 ns/Div
C3
10 V/Div.
10
8
OUTPUT
6
4
100 ns/Div
2
VR(V)
0
0
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Ordering information scheme
2
EMIF02-USB04F3
Ordering information scheme
Figure 10. Ordering information scheme
EMIF
EMI filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: lead-free, pitch = 400 µm
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yy
-
xxx zz
Fx
EMIF02-USB04F3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
400 µm ± 40
500 µm ± 50
1.14 mm ± 30 µm
400 µm ± 40
255 µm ± 40
170 µm ± 10
170 µm ± 10
1.14 mm ± 30 µm
Figure 12. Footprint
Figure 13. Marking
Copper pad Diameter:
220 µm recommended
260 µm maximum
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening:
300 µm minimum
ECOPAK grade
Solder stencil opening:
220 µm recommended
x x z
y ww
Figure 14. Flip Chip tape and reel specification
Ø 1.5 ± 0.1
1.75 ± 0.1
4.0 ± 0.1
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
1.24
2.0 ± 0.05
3.5 ±- 0.1
Dot identifying Pin A1 location
8.0 ± 0.3
3
Package information
1.24
4.0 ± 0.1
0.69 ± 0.05
All dimensions in mm
User direction of unreeling
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Ordering information
4
EMIF02-USB04F3
Ordering information
Table 3.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF02-USB04F3
JM
Flip Chip
1.4 mg
5000
Tape and reel (7")
Note:
More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: package description and
recommendation for use”
AN1751: "EMI filters: recommendations and measurements"
5
Revision history
Table 4.
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Document revision history
Date
Revision
21-Oct-2010
1
Changes
First issue.
Doc ID 18144 Rev 1
EMIF02-USB04F3
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