EMIF02-USB04F3 3-line IPAD™, EMI filter including ESD protection Features ■ EMI symmetrical (I/O) low-pass filter ■ high efficiency in EMI/ESD protection ■ lead-free package ■ very thin package ■ high reliability offered by monolithic integration ■ high reduction of parasitic elements through integration and wafer level packaging Lead-free Flip-Chip package (9 bumps) Complies with the following standards ■ ■ IEC 61000-4-2 level 4 (on external pins B1 and C1): – ±15 kV (air discharge) – ±8 kV (contact discharge) Figure 1. Pin configuration (bump side) 3 2 1 A IEC 61000-4-2 level 1 (on internal pins): – ±2 kV (air discharge) – ±2 kV (contact discharge) B Applications C Where EMI filtering in ESD sensitive equipment is required: ■ mobile phones and communication systems ■ computers, printers and MCU boards Figure 2. Configuration A2 R5 C2 R4 B3 R3 R2 C1 Description C3 R1 B1 The EMIF02-USB04F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. A3 A1 B2 Cline = 20 pF max This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. TM: IPAD is a trademark of STMicroelectronics. October 2010 Doc ID 18144 Rev 1 1/7 www.st.com 7 Electrical characteristics 1 EMIF02-USB04F3 Electrical characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Internal pins (A2, A3, B2, B3, C2, C3): ESD discharge IEC 61000-4-2, level 1, air discharge ESD discharge IEC 61000-4-2, level 1, contact discharge External pins (A1, B1, C1): ESD discharge IEC 61000-4-2, level 4, air discharge ESD discharge IEC 61000-4-2, level 4, contact discharge ±15 ±8 Pd Line resistance power dissipation at 70 °C 60 mW Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to 150 °C VPP Figure 3. ±2 ±2 kV Electrical characteristics (definitions) I Symbol VBR IRM Cline RI/O Table 2. = = = = Parameter Breakdown voltage Leakage current @ VRM Line capacitance Series resistance between Input and Output IR IRM V IRM IR VRM VBR Electrical characteristics (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V per line Min. Typ. Max. 7 Unit V 100 nA R1, R2 Tolerance ± 5% 33 Ω R4, R5 Tolerance ± 20% 18.5 kΩ R3 Cline 2/7 VBR VRM 1425 Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions) Doc ID 18144 Rev 1 1490 1560 Ω 20 pF EMIF02-USB04F3 Figure 4. Electrical characteristics S21 (dB) attenuation measurement Figure 5. on C3-C1 and A3-B1 dB 0.00 Analog crosstalk measurements on C3 - A1 XTalk(dB) 0.00 VBIAS = 0 V VBIAS = 0 V - 10.00 - 10.00 D+ D- - 20.00 - 20.00 - 30.00 - 30.00 - 40.00 S21(dB) S21(dB) F = 900 Mhz F = 1.8 Ghz - 50.00 D+ D+ DD- - 60.00 1.0M Figure 6. D-OUT -12.3 -12.0 3.0M -20.4 -19.5 10.0M D+/D - - 40.00 FC = 335 MHz 30.0M - 50.00 XTalk (dB) 300 kHz < F < 3 GHz >-12 f/Hz 100.0M 300.0M f/Hz - 60.00 1.0G 3.0G Digital crosstalk measurement on C3-B1 in 50 environment 1.0M Figure 7. 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input V(in) and on one output V(out) 20 V/Div. 100 mV/Div. INPUT C2 D+IN C2 100 ns/Div 10 ns/Div. 10 V/Div. OUTPUT C1 1 V/Div. Figure 8. 10 ns/Div. C3 100 ns/Div ESD response to IEC 61000-4-2 Figure 9. (-15 kV air discharge) on one input V(in) and on one output V(out) 18 C2 20 V/Div. INPUT Line capacitance versus applied voltage (typical values, line C1-B2) C (pF) 16 14 12 100 ns/Div C3 10 V/Div. 10 8 OUTPUT 6 4 100 ns/Div 2 VR(V) 0 0 Doc ID 18144 Rev 1 1 2 3 4 5 6 3/7 Ordering information scheme 2 EMIF02-USB04F3 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 µm 4/7 Doc ID 18144 Rev 1 yy - xxx zz Fx EMIF02-USB04F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package dimensions 400 µm ± 40 500 µm ± 50 1.14 mm ± 30 µm 400 µm ± 40 255 µm ± 40 170 µm ± 10 170 µm ± 10 1.14 mm ± 30 µm Figure 12. Footprint Figure 13. Marking Copper pad Diameter: 220 µm recommended 260 µm maximum Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum ECOPAK grade Solder stencil opening: 220 µm recommended x x z y ww Figure 14. Flip Chip tape and reel specification Ø 1.5 ± 0.1 1.75 ± 0.1 4.0 ± 0.1 ST xxz yww ST xxz yww ST xxz yww 1.24 2.0 ± 0.05 3.5 ±- 0.1 Dot identifying Pin A1 location 8.0 ± 0.3 3 Package information 1.24 4.0 ± 0.1 0.69 ± 0.05 All dimensions in mm User direction of unreeling Doc ID 18144 Rev 1 5/7 Ordering information 4 EMIF02-USB04F3 Ordering information Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-USB04F3 JM Flip Chip 1.4 mg 5000 Tape and reel (7") Note: More information is available in the application notes: AN2348: “STMicroelectronics 400 micro-metre Flip Chip: package description and recommendation for use” AN1751: "EMI filters: recommendations and measurements" 5 Revision history Table 4. 6/7 Document revision history Date Revision 21-Oct-2010 1 Changes First issue. Doc ID 18144 Rev 1 EMIF02-USB04F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 18144 Rev 1 7/7