STMICROELECTRONICS EMIF10

EMIF10-LCD03F3
10-line IPAD™, EMI filter and ESD protection
Features
■
High attenuation in the mobile frequency range
(typically better than -40 dB from 900 MHz to
2 GHz)
■
Very low clamping voltage
■
Low line capacitance (30 pF max) suitable for
high-speed interfaces
■
Maximum rise and fall time: 6 ns (10% - 90%)
■
Compliant with high speed data rate
■
Lead-free Flip Chip package in 400 µm pitch
■
Very thin package: 0.6 mm thickness
Flip Chip
(24 bumps)
Figure 1.
Pin layout (bump side)
5
4
3
2
1
O1
O2
GND
I1
I2
A
O3
O4
I3
I4
B
O5
O6
GND
I5
I6
C
O7
O8
GND
I7
I8
D
O9
O10
GND
I9
I10
E
Benefits
■
High efficiency in EMI filtering
■
High bandwidth: typically 200 MHz at -3 dB
■
80% space saving versus discrete solution
(BOM reduction)
■
High reliability offered by monolithic integration
■
High reduction of parasitic elements through
integration and wafer level packaging
Figure 2.
Device configuration
Low-pass Filter
0000
Input
Output
Complies with the following standards
■
IEC 61000-4-2 level 4 on inputs and outputs
– ±15 kV (air discharge)
– ± 8 kV (contact discharge)
GND
GND
GND
Ri/o = 125 Ω ±20%
Cline = 30 pF max
Applications
Description
Displays and cameras where outstanding EMI
filtering in ESD sensitive equipment is required:
The EMIF10-LCD03F3 is a 10-line highly
integrated LC filter designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference. The EMIF10 Flip Chip package
means the package size is equal to the die size.
■
Mobile phones and PDAs
■
Personal and home entertainment (portable
audio, DVD players, LCD TVs)
■
Portable navigation devices
■
Digital still cameras
■
Portable gaming systems
February 2010
This LC filter includes ESD protection circuitry,
which prevents damage to the protected device
when subjected to ESD surges up ±15 kV.
TM: IPAD is a trademark of STMicroelectronics.
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www.st.com
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Characteristics
1
EMIF10-LCD03F3
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
VPP
Tj
Parameter
Value
Unit
Input and output pins:
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
± 15
± 15
kV
Maximum junction temperature
125
°C
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to 150
°C
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameters
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic impedance
IPP
Peak pulse current
RI/O
Series resistance between Input & Output
Cline
Line capacitance
IF
Symbol
2/7
I
VF
VCL VBR VRM
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3 V per line
RI/O
Tolerance ± 20%
Cline
Vline = 0 V, VOSC = 30 mV, F =1 MHz
V
IRM
IR
IPP
Min
Typ
Max
14
100
Doc ID 14656 Rev 2
Unit
V
125
200
nA
150
Ω
30
pF
EMIF10-LCD03F3
Figure 3.
0.00
Characteristics
S21 measurement (all GND bumps
connected)
Figure 4.
dB
0.00
Analog crosstalk measurements
(all GND bumps connected)
dB
-10.00
-10.00
-20.00
-20.00
-30.00
-40.00
-30.00
-50.00
-40.00
-60.00
-70.00
-50.00
-80.00
-90.00
-60.00
-100.00
-70.00
-110.00
F (Hz)
-120.00
-80.00
100.0k
1.0M
10.0M
100.0M
I1-O1
I3-O3
I5-O5
I7-O7
I9-O9
F (Hz)
-130.00
1.0G
-140.00
I2-O2
I4-O4
I6-O6
I8-O8
I10-O10
100.0k
1.0M
I1-O2
Figure 5.
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one line
Figure 7.
Line capacitance versus applied voltage (typical values)
30
Figure 6.
10.0M
100.0M
I1-O10
1.0G
ESD response to IEC 61000-4-2
(-15 kV air discharge) on one line
Cline (pF)
F=1 MHz
VOSC = 30 mVRMS
TJ = 25° C
25
20
15
10
5
Vline (V)
0
0
1
2
3
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Ordering information scheme
Figure 8.
EMIF10-LCD03F3
Typical rise and fall time: input
voltage
Figure 9.
Typical rise and fall time: output
voltage
OUTPUT VOLTAGE
X: 10ns/DIV
Y: 1V/DIV
Trise10% -90% = 3.45 ns
Tfall 90%-10% = 4.09 ns
INPUT VOLTAGE
X: 10 ns/DIV
Y: 1 V/DIV
2
Ordering information scheme
Figure 10. Ordering information scheme
EMIF
EMI filter
Number of lines
Information
x = resistance value (ohm)
z = capacitance value / 10 (pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
3 = Lead-free, pitch = 400 µm
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Doc ID 14656 Rev 2
yy
-
xxx zz
F3
EMIF10-LCD03F3
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
240 µm ± 10
Figure 12. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
255 µm± 40
605 µm ± 55
2.08 mm ± 30 µm
400 µm ± 40
400 µm ± 40
190 µm ± 10
1.98 mm ± 30 µm
Figure 13. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
x x z
y ww
Solder stencil opening:
220 µm recommended
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Ordering information
EMIF10-LCD03F3
Dot identifying Pin A1 location
Ø 1.55 ± 0.1
4.0 ± 0.1
2.0 ± 0.05
3.5 ± 0.1
2.13
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
8.0 ± 0.3
0.20 ± 0.02
1.75 ± 0.1
Figure 14. Flip Chip tape and reel specification
4.0 ± 0.1
2.22
0.69 ± 0.05
User direction of unreeling
All dimensions in mm
Note:
More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: "EMI Filters: Recommendations and measurements"
4
Ordering information
Table 3.
5
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF10-LCD03F3
HI
Flip Chip
5.3 mg
5000
Tape and reel 7”
Revision history
Table 4.
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Ordering information
Document revision history
Date
Revision
Changes
14-Apr-2008
1
Initial release
19-Feb-2010
2
Updated pocket dimensions in Figure 14.
Doc ID 14656 Rev 2
EMIF10-LCD03F3
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