EMIF10-LCD03F3 10-line IPAD™, EMI filter and ESD protection Features ■ High attenuation in the mobile frequency range (typically better than -40 dB from 900 MHz to 2 GHz) ■ Very low clamping voltage ■ Low line capacitance (30 pF max) suitable for high-speed interfaces ■ Maximum rise and fall time: 6 ns (10% - 90%) ■ Compliant with high speed data rate ■ Lead-free Flip Chip package in 400 µm pitch ■ Very thin package: 0.6 mm thickness Flip Chip (24 bumps) Figure 1. Pin layout (bump side) 5 4 3 2 1 O1 O2 GND I1 I2 A O3 O4 I3 I4 B O5 O6 GND I5 I6 C O7 O8 GND I7 I8 D O9 O10 GND I9 I10 E Benefits ■ High efficiency in EMI filtering ■ High bandwidth: typically 200 MHz at -3 dB ■ 80% space saving versus discrete solution (BOM reduction) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Figure 2. Device configuration Low-pass Filter 0000 Input Output Complies with the following standards ■ IEC 61000-4-2 level 4 on inputs and outputs – ±15 kV (air discharge) – ± 8 kV (contact discharge) GND GND GND Ri/o = 125 Ω ±20% Cline = 30 pF max Applications Description Displays and cameras where outstanding EMI filtering in ESD sensitive equipment is required: The EMIF10-LCD03F3 is a 10-line highly integrated LC filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip Chip package means the package size is equal to the die size. ■ Mobile phones and PDAs ■ Personal and home entertainment (portable audio, DVD players, LCD TVs) ■ Portable navigation devices ■ Digital still cameras ■ Portable gaming systems February 2010 This LC filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up ±15 kV. TM: IPAD is a trademark of STMicroelectronics. Doc ID 14656 Rev 2 1/7 www.st.com 7 Characteristics 1 EMIF10-LCD03F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP Tj Parameter Value Unit Input and output pins: ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge ± 15 ± 15 kV Maximum junction temperature 125 °C Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to 150 °C Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Line capacitance IF Symbol 2/7 I VF VCL VBR VRM Test conditions VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20% Cline Vline = 0 V, VOSC = 30 mV, F =1 MHz V IRM IR IPP Min Typ Max 14 100 Doc ID 14656 Rev 2 Unit V 125 200 nA 150 Ω 30 pF EMIF10-LCD03F3 Figure 3. 0.00 Characteristics S21 measurement (all GND bumps connected) Figure 4. dB 0.00 Analog crosstalk measurements (all GND bumps connected) dB -10.00 -10.00 -20.00 -20.00 -30.00 -40.00 -30.00 -50.00 -40.00 -60.00 -70.00 -50.00 -80.00 -90.00 -60.00 -100.00 -70.00 -110.00 F (Hz) -120.00 -80.00 100.0k 1.0M 10.0M 100.0M I1-O1 I3-O3 I5-O5 I7-O7 I9-O9 F (Hz) -130.00 1.0G -140.00 I2-O2 I4-O4 I6-O6 I8-O8 I10-O10 100.0k 1.0M I1-O2 Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one line Figure 7. Line capacitance versus applied voltage (typical values) 30 Figure 6. 10.0M 100.0M I1-O10 1.0G ESD response to IEC 61000-4-2 (-15 kV air discharge) on one line Cline (pF) F=1 MHz VOSC = 30 mVRMS TJ = 25° C 25 20 15 10 5 Vline (V) 0 0 1 2 3 Doc ID 14656 Rev 2 4 5 3/7 Ordering information scheme Figure 8. EMIF10-LCD03F3 Typical rise and fall time: input voltage Figure 9. Typical rise and fall time: output voltage OUTPUT VOLTAGE X: 10ns/DIV Y: 1V/DIV Trise10% -90% = 3.45 ns Tfall 90%-10% = 4.09 ns INPUT VOLTAGE X: 10 ns/DIV Y: 1 V/DIV 2 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI filter Number of lines Information x = resistance value (ohm) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip 3 = Lead-free, pitch = 400 µm 4/7 Doc ID 14656 Rev 2 yy - xxx zz F3 EMIF10-LCD03F3 3 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package dimensions 240 µm ± 10 Figure 12. Footprint Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum 255 µm± 40 605 µm ± 55 2.08 mm ± 30 µm 400 µm ± 40 400 µm ± 40 190 µm ± 10 1.98 mm ± 30 µm Figure 13. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year x x z y ww Solder stencil opening: 220 µm recommended Doc ID 14656 Rev 2 5/7 Ordering information EMIF10-LCD03F3 Dot identifying Pin A1 location Ø 1.55 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 3.5 ± 0.1 2.13 ST xxz yww ST xxz yww ST xxz yww 8.0 ± 0.3 0.20 ± 0.02 1.75 ± 0.1 Figure 14. Flip Chip tape and reel specification 4.0 ± 0.1 2.22 0.69 ± 0.05 User direction of unreeling All dimensions in mm Note: More information is available in the application notes: AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and recommendation for use” AN1751: "EMI Filters: Recommendations and measurements" 4 Ordering information Table 3. 5 Order code Marking Package Weight Base qty Delivery mode EMIF10-LCD03F3 HI Flip Chip 5.3 mg 5000 Tape and reel 7” Revision history Table 4. 6/7 Ordering information Document revision history Date Revision Changes 14-Apr-2008 1 Initial release 19-Feb-2010 2 Updated pocket dimensions in Figure 14. Doc ID 14656 Rev 2 EMIF10-LCD03F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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