EMIF02-MIC06F3 2-line IPAD™ EMI filter and ESD protection Features ■ 2-line symmetrical low-pass filter ■ Lead-free package ■ Very low PCB space consuming: < 1.5 mm2 ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression IEC 61000-4-2 level 4 ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Lead-free Flip-Chip package (8 bumps) Figure 1. Pin configuration (bump side) Complies with the following standards ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Application ■ Mobile phones (differential microphone filtering and ESD protection) 3 2 1 MIC Bias ECI Op n Gnd Mic2p B On A Gnd Mic2n C A Description The EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering. The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. That's why EMIF02-MIC06F3 is a very small device. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. TM: IPAD is a trademark of STMicroelectronics. September 2011 Doc ID 15195 Rev 4 1/8 www.st.com 8 Characteristics 1 EMIF02-MIC06F3 Characteristics Figure 2. Configuration ECI A2 GND GND Mic Bias A3 C11 B1 GND C21 R11 R31 R21 B3 Mic2p to ASIC Mic2n R22 C1 C12 GND GND C3 R12 GND C22 GND B2 and C2 are ground pins ECI pin connection The ECI pin (enhancement control interface) is an input pin for the audio pre-amplifier chip which detects the voltage of the microphone line MIC2P in case the user presses the onhook/off-hook button on the headset. When the user selects off-hook using the headset button, the MIC2P is shorted to MIC2N which is grounded. If your design does not support the ECI feature, the ECI pin must be left open (not connected). Table 1. Symbol VPP 2/8 Absolute ratings (limiting values) Parameter and test conditions Pins B1 and C1: ESD discharge IEC 61000-4-2, level 4 air discharge contact discharge Pins A2, A3, B2, B3, C2, C3: ESD discharge IEC 61000-4-2, level 1 air discharge contact discharge Value 15 8 Unit kV 2 2 PD Power dissipation at Tamb = 25 °C 60 mW Tj Maximum junction temperature 125 °C Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to + 150 °C Doc ID 15195 Rev 4 EMIF02-MIC06F3 Figure 3. Characteristics Electrical characteristics (definitions) I Symbol VBR = IRM = Parameter Breakdown voltage Leakage current @ VRM RI/O = Series resistance between input and output Line capacitance Cline = Table 2. IR IRM IRM IR VRM VBR V Electrical characteristics - values (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V per line Min. Typ. Max. Unit 14 V 100 nA R11 1.9 2 2.1 kΩ R12 0.8 1 1.2 kΩ R21, R22 1.76 2.2 2.64 kΩ R31 20 25 30 Ω 0.8 1 nF C11, C12 VR = 0 V C21, C22 VR = 0 V Figure 4. 0 VBR VRM 1 Attenuation simulation with 1 kΩ input and 10 kΩ output Figure 5. db 0.00 1.25 nF Analog crosstalk measurement db -10.00 -10 -20.00 -20 -30.00 -30 50Ω measurements -40.00 -40 -50.00 -50 Input: 1 k Ω Output: 10 kΩ AC simulation -60 -70 -60.00 50Ω simulations -70.00 -80.00 -80 -90.00 -90 F (Hz) F (Hz) -100.00 -100 10 100 1k 10k 100k 1M 10M 100M 1G Doc ID 15195 Rev 4 100.0k 1.0M Mic2p-On 10.0M 100.0M Mic2n-Op 1.0G 3/8 Characteristics Figure 6. EMIF02-MIC06F3 ESD response to IEC 61000-4-2 (+15 kV air discharge) on Mic2p Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on Mic2p 10 V/div 10 V/div Input Input 5 V/div 5 V/div Output Output 500 ns/div 500 ns/div Figure 8. ESD response to IEC 61000-4-2 (+15 kV air discharge) on Mic2n Figure 9. ESD response to IEC 61000-4-2 (-15 kV air discharge) on Mic2n 10 V/div 10 V/div Input Input 2 V/div 2 V/div Output Output 200 ns/div 200 ns/div Figure 10. Line capacitance versus applied voltage CLINE (pF) 1 200.00 1 000.00 800.00 F = 1 Mhz VOSC = 30 mV rms Tj = 25 °C 600.00 400.00 200.00 VLINE (V) 0.00 0 4/8 0.5 1 1.5 Doc ID 15195 Rev 4 2 2.5 3 EMIF02-MIC06F3 2 Ordering information scheme Ordering information scheme Figure 11. Ordering information scheme EMIF yy - xxx zz Fx EMI filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 µm Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. Flip Chip package dimensions 400 µm ± 40 605 µm ± 55 255 µm ± 40 1.20 mm ± 30 µm 400 µm ± 40 200 µm 1.20 mm ± 30 µm 200 µm 3 Doc ID 15195 Rev 4 5/8 Ordering information EMIF02-MIC06F3 Figure 13. Footprint recommendations Figure 14. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year Copper pad Diameter: 220µm recommended 260µm maximum Solder mask opening: 300µm minimum x x z y ww Solder stencil opening : 220µm recommended Figure 15. Flip Chip tape and reel specification Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 xxz yww ST xxz yww ST xxz yww ST 8.0 3.5 1.30 1.75 0.22 4.0 1.30 0.69 All dimensions are typical values in mm 4 Ordering information Table 3. Note: 6/8 User direction of unreeling Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-MIC06F3 JB Flip Chip 1.8 mg 5000 Tape and reel 7” More information is available in the application notes AN2348: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” Doc ID 15195 Rev 4 EMIF02-MIC06F3 5 Revision history Revision history Table 4. Document revision history Date Revision Changes 21-Nov-2008 1 Initial release 05-Mar-2009 2 Updated Figure 4 and Figure 12. 07-Apr-2010 3 Updated tolerance Figure 12. 23-Sep-2011 4 Added ECI pin connection on page 2. Doc ID 15195 Rev 4 7/8 EMIF02-MIC06F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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