EMIF10-LCD02F3 10-line IPAD™, EMI filter and ESD protection for LCD and cameras Features ■ Lead-free package ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ 400 µm pitch ■ Compatible with high speed data rate Lead-free Flip-Chip package (24 bumps) 2 ■ Very low PCB space occupation: < 4 mm ■ Very thin package: 0.60 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Figure 1. Complies with the following standards ■ ■ IEC 61000-4-2 level 4 on inputs and outputs – 15 kV (air discharge) – 8 kV (contact discharge) Pin layout (bump side) 5 4 3 2 1 O1 O2 GND I1 I2 A O3 O4 I3 I4 B O5 O6 GND I5 I6 C O7 O8 GND I7 I8 D O9 O10 GND I9 I10 E MIL STD 883G - Method 3015-6 Class 3 Applications Where EMI filtering in ESD sensitive equipment is required: ■ LCD for mobile phones ■ Computers and printers ■ Communication systems ■ MCU boards Figure 2. Device configuration Low-pass Filter Output Input Description GND GND GND Ri/o = 70Ω Cline = 30pF The EMIF10-LCD02F3 is a 10-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV. November 2009 TM: IPAD is a trademark of STMicroelectronics. Doc ID 11507 Rev 3 1/8 www.st.com 8 Characteristics 1 EMIF10-LCD02F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Tj Parameter and test conditions Value Unit 125 °C Maximum junction temperature Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to 150 °C Figure 3. Symbol VBR VCL IRM VRM IPP IR IPP RI/O Cline Electrical characteristics (definitions) = = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Peak pulse current Breakdown current Forward current Series resistanc between input and output Input capacitance per line I IPP VCL VBR VRM IR IRM IRM IR V VRM VBR VCL IPP Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Min. Typ. Max. Unit 6 8 10 V 200 nA VBR IR = 1 mA IRM VRM = 3 V 50 R2 Tolerance ± 20% 70 Cline 2/8 Test conditions Vline = 0 V, VOSC = 30 mV, F =1 MHz Doc ID 11507 Rev 3 Ω 30 pF EMIF10-LCD02F3 Figure 4. Characteristics S21 all lines attenuation measurement Figure 5. Analog cross talk measurement 0.00 dB -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 100.0k 1.0M 10.0M 100.0M 1.0G f/Hz Xtalk 1/2 Figure 6. ESD response to IEC 61000-4-2 Figure 7. (+15 kV air discharge) on one input and on one output ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input and on one output Input 10V/d Input 10V/d Output 10V/d Output 10V/d 100ns/d 100ns/d Figure 8. Line capacitance versus applied voltage Cline (pF) 30 25 20 15 10 5 Vline (V) 0 0 1 2 3 4 Doc ID 11507 Rev 3 5 6 3/8 Ordering information scheme 2 EMIF10-LCD02F3 Ordering information scheme Figure 9. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip 3 = Lead-free, pitch = 400 µm, bump = 255 µm 4/8 Doc ID 11507 Rev 3 yy - xxx zz F3 EMIF10-LCD02F3 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. Package dimensions 255µm± 40 605µm ± 55 170 µm typ Figure 11. Footprint 1.94 mm ± 30µm 400 µm typ 400 µm typ 170 µm typ 3 Package information 1.94 mm ± 30µm Figure 12. Marking Copper pad Diameter: 220 µm recommended 260 µm maximum Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum E x x z y ww Solder stencil opening: 220 µm recommended Doc ID 11507 Rev 3 5/8 Package information EMIF10-LCD02F3 Figure 13. Flip-Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 xxz yww ST E Note: 2.11 xxz yww All dimensions in mm ST E xxz yww ST E 8 ± 0.3 2.11 0.69 ± 0.05 4 ± 0.1 User direction of unreeling More information is available in the application notes: AN2348: “STMicroelectronics 400 micro-metre Flip-Chip: Package description and recommendation for use” AN1751: "EMI Filters: Recommendations and measurements" 6/8 Doc ID 11507 Rev 3 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 EMIF10-LCD02F3 4 Ordering information Table 3. 5 Ordering information Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF10-LCD02F3 GY Flip-Chip 5.0 mg 5000 Tape and reel 7” Revision history Table 4. Document revision history Date Revision Changes 11-Jul-2005 1 First issue. 28-Apr-2008 2 Updated ECOPACK statement. Updated Figure 9, Figure 10, Figure 11 and Figure 13. Reformatted to current standards. 18-Nov-2009 3 Updated Figure 10 for die dimension reduction. Updated Figure 13 for scaling. Doc ID 11507 Rev 3 7/8 EMIF10-LCD02F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 11507 Rev 3