GA15IDDJT22-FR4 - GeneSiC Semiconductor

Non-Isolated Gate Driver
Gate Driver for SiC SJT with
Signal Isolation
VISO,SIG
PDRIVE
fmax
Features
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GA15IDDJT22-FR4
=
=
=
5000 V
27 W
350 kHz
Product Image
Requires single 12 V voltage supply
Pin Out compatible with MOSFET driver boards
Multiple internal voltage level topology for low drive losses
Point-of-load (POL), non-isolated design
5000 V Signal Isolation (up to 10 s)
Capable of high gate currents with 27 W maximum power
RoHS Compliant
Section I: Introduction
The GA15IDDJT22-FR4 provides an optimized gate drive solution for 10 and 20 mΩ SiC Junction Transistors (SJT). The board utilizes DC/DC
converters and FOD3182 signal opto-isolation as well as totem-pole gate driver ICs providing fast switching and customizable continuous gate
currents necessary for any SJT device. Its footprint and 12 V supply voltage make it a plug-in replacement for existing SiC MOSFET gate drive
solutions.
Figure 1: Simplified GA15IDDJT22-FR4 Gate Drive Board Block Diagram
Section II: Compatibility with SiC SJTs
The GA15IDDJT22-FR4 has an installed gate resistance (RG) of 0.7 Ω on-board which may need to be modified by the user for safe operation
of certain SJT parts. Please see the table below and Section VI for more information.
Table 1: GA15IDDJT22-FR4 – SiC SJT Compatibility Information Table
SJT Part Number
GA03JT12-247
GA05JT12-247/263
GA06JT12-247
GA10JT12-247/263
GA20JT12-247/263
GA50JT12-247
GA100JT12-227
GA04JT17-247
GA16JT17-247
GA50JT17-247
GA100JT17-227
GA50SICP12-227
GA100SICP12-227
Sept. 2015
Compatible
Notes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Driver GA03IDDJT30-FR4 Recommended
Driver GA03IDDJT30-FR4 Recommended
Driver GA03IDDJT30-FR4 Recommended
Driver GA03IDDJT30-FR4 Recommended
Driver GA03IDDJT30-FR4 Recommended
Reduction of RG values recommended (Section VI)
Driver GA03IDDJT30-FR4 Recommended
Driver GA03IDDJT30-FR4 Recommended
Reduction of RG values recommended (Section VI)
Reduction of RG values recommended (Section VI)
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Section III: Operational Characteristics
Parameter
Symbol
Input Supply Voltage
Input Signal Voltage, Off
Input Signal Voltage, On
Input Signal Current, On
Propagation Delay, Signal Turn On
Propagation Delay, Signal Turn Off
Output Gate Current, Peak
Output Gate Current, Continuous
Output Gate Voltage Rise Time
Output Gate Voltage Fall Time
Operating Frequency
Power Dissipation
SJT Drain – Source Voltage
Isolation Voltage, Signal
Storage Temperature
Product Weight
VCC
Vsig, OFF
Vsig, ON
Isig, ON
td,ON
td,OFF
IG,ON
IG,steady
tr
tf
fsw
Ptot
VDS
VISO-SIG
T
Conditions
Min.
10.8
-5
3.2
20
VCC High, VCC Low
f < 350 kHz
Cload = 50 nF
Cload = 50 nF
Value
Typical
12
0
5.0
36
160
187
7
2.0
40
25
Dependant on installed CG values
25.0 W (VGL) + 2.0 W (VGH + VEE)
On driven power transistor
-55
Max.
13.2
0.8
6.4
50
270
270
15
5
70
60
350
27.0
1700
±5000
100
30
Unit
Notes
V
V
V
mA
ns
ns
A
A
ns
ns
kHz
W
V
V
°C
g
Section IV: Pin Out Description
VCC Low RTN
VCC Low
Signal RTN
Signal
VCC High RTN
VCC High
Source
Source
Source
Gate
Gate
Gate
Figure 2: Gate Drive Board Top View
Header
JP1
JP1
JP1
JP1
JP1
JP1
Gate
Gate
Gate
Source
Source
Source
Sept. 2015
Table 2: GA15IDDJT22-FR4 Pin Out Connections
Pin Label
Suggested Connection
VCC High
VCC High RTN
Signal
Signal RTN
VCC Low
VCC Low RTN
Gate
Gate
Gate
Source
Source
Source
+ 12 V, > 30 W Supply
Analog Ground
Gate Drive Control Signal
Analog Ground
+ 12 V, > 30 W Supply
Analog Ground
SJT Gate Pin
SJT Gate Pin
SJT Gate Pin
SJT Source/GR Pin
SJT Source/GR Pin
SJT Source/GR Pin
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Section V: SJT Gate Driving Theory of Operation
The SJT transistor is a current controlled transistor which requires a positive gate current for turn-on as well as to remain in on-state. An ideal
gate current waveform for ultra-fast switching of the SJT, while maintaining low gate drive losses, is shown in Figure 3. This is similar to what
the GA15IDDJT22-FR4 provides.
An SJT is rapidly switched on when the necessary gate charge, QG, for turn-on is supplied by a burst of high gate current, IG,on, until the gatesource capacitance, CGS, and gate-drain capacitance, CGD, are fully charged.
,
The IG,pon pulse should ideally terminate, when the drain voltage falls to its on-state value, in order to avoid unnecessary drive losses during
the steady on-state. In practice, the rise time of the IG,on pulse is affected by the parasitic inductances, Lpar in the device package and drive
circuit. A voltage developed across the parasitic inductance in the source path, Ls, can de-bias the gate-source junction, when high drain
currents begin to flow through the device. The applied gate voltage should be maintained high enough, above the VGS,ON level to counter
these effects.
After the SJT is turned on, IG may be lowered to IG,steady for reducing unnecessary gate drive power losses. The minimum IG,steady is determined
by noting the DC current gain, hFE, of the device from its datasheet. The desired IG,steady is determined by the peak device junction temperature
TJ during operation, drain current ID, DC current gain hFE, and a 50 % safety margin to ensure operating the device in the saturation region with
low on-state voltage drop by the equation:
,
,
1.5
For SJT turn -off, a high negative peak current, -IG,off at the start of the turn-off transition rapidly sweeps out charge from the gate. While
satisfactory turn off can be achieved with VGS = 0 V, a negative gate voltage VGS may be used in order to speed up the turn-off transition. The
GA15IDDJT22-FR4 provides a negative bias of -8.7 V during off state.
Figure 3: Idealized SJT Gate Current Waveform
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Section VI: Gate Driver Implementation
The GA15IDDJT22-FR4 is a gate driver circuit which can be used to drive an SJT transistor by supplying the required gate drive current IG in a
low-power gate drive solution. This configuration features a gate capacitor CG (CG1 and CG2 in parallel) which creates a brief current peak
IG,ON during device turn-on and IG,OFF during turn-off for fast switching and a gate resistor RG (RG1 and RG2 in parallel) to set the continuous
gate current IG,steady required for an SJT to operate. This configuration is shown in the Figure 6 circuit diagram as well as in Figure 4 below with
further details provided below. This section provides detail on selecting optimal CG and RG values based on the SJT, drain current, and
temperature.
Figure 4: Primary gate drive circuit passive components with series gate resistance Schottky rectifier.
Symbol
RG
CG
R4
D1
Table 3: Passive Output Component List
Values
Parameter
Range
Default
Gate Resistor, On Board
0 – 2.0
0.7
Gate Capacitor, On Board
5 – 50
22
Charging Resistor
500 – 10k
1k
Schottky Diode of Gate Resistor
---
Units
Ω
nF
Ω
A: Gate Resistor RG Modification
The GA15IDDJT22-FR4 on board gate resistors RG (RGx) control the continuous current IG,steady during steady on-state. The gate current is
determined according to:
,
,
0.04Ω
4.5
,
,
0.04Ω
Where VGL is the internal, low-level drive voltage (5 V), VGS,sat is the driven SJT saturated gate-source voltage obtained from the individual
device datasheets, VD is the Schottky diode voltage drop (approximately 0.5 V), and 0.04 Ω is added from internal GA15IDDJT22-FR4 drive
components.
It is necessary for the user to reduce RG from its pre-install value of 0.7 Ω for several SiC SJTs for safe operation with the GA15IDDJT22-FR4
under high drain current conditions. The location of RG on the circuit board is shown in Figure 5. The maximum allowable value of RG for each
device across all rated drain currents can be found in the Gate Drive section of each individual device datasheets. RG may also be calculated
from the following equation, where hFE is the SJT DC current gain and VGS,sat is the gate-source saturation voltage. Both of these values may
be taken from individual device datasheets.
4.5
,
,
,
1.5
0.04
For some devices and drain currents it may be desired for the user to install a very low value of RG or to short RG (RG = 0 Ω) to increase the
gate current output. This is acceptable, but may limit the duty cycle D during operation. Please see section VII:B for more information.
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Figure 5: Location of RG (RG1 and RG2 in parallel) on GA15IDDJT22-FR4 driver for substitution
B: Gate Capacitor CG Modification
An external gate capacitor CG connected directly to the device gate pin delivers the positive current peak IG,ON during device turn-on and the
negative current peak IG,OFF during turn-off. A high value resistor R4 in parallel with CG sets the SJT gate pin to a defined potential -VEE (-8.7 V)
during steady off-state.
At device turn-on, CG is pulled to the GA15IDDJT22-FR4 internal voltage level VGH (15 V) which produces a transient peak of gate voltage and
current. This current peak rapidly charges the internal SJT CGS and CGD capacitances. A Schottky diode, D1, in series with RG blocks any CG
induced current from draining out through RG and ensures that all of the charge within CG flows only into the device gate, allowing for an ultrafast device turn-on. During steady on-state, a potential of VGH - VGS = VGH – 3 V is across CG. When the device is turned off, CG is pulled to
negative VEE and VGS is pulled to a transient peak of VGS,turn-off = VEE – (VGH – 3 V), this induces the negative current peak IG,off out of the gate
which discharges the SJT internal capacitances.
C: Voltage Supply Selection
The GA15IDDJT22-FR4 gate drive design features three internal supply voltages VGH, VGL, and VEE (listed in Table 4) supplied through two
DC/DC converters. During device turn-on, VGH charges the capacitor CG thereby delivering the narrow width, high current pulse IG,ON to the SJT
gate and charges the SJT’s internal terminal capacitances CGD and CGS. For a given level of parasitic inductance in the gate circuit and SJT
package, the rise time of IG,ON is controlled by the value of VGH and CG. During the steady on-state, VGL in combination with the internal and
external gate resistances provides a continuous gate current for the SJT to remain on. The VEE supply controls the gate negative voltage
during turn-off and steady off-state for faster switching and to avoid spurious turn-on which may be caused by external circuit noise. The
power rating of the provided voltage supplies are adequate to meet the gate drive power requirements as determined by
,
,
1
2
1
2
,
,
Table 4: GA15IDDJT22-FR4 Gate Drive Voltage Supply Component List
Values
Symbol
Parameter
Range
Default
VGH
Supply Voltage, Gate Capacitor
13 – 20
+ 15.0
VGL
Supply Voltage, Gate Resistor
4.5 – 6.0
+ 5.0
VEE
Negative Supply Voltage
-10 – GND
- 8.7
D: Signal Isolation
The gate supply signal is suggested to be isolated to twice the working VDS on the SJT during off-state to provide adequate protection to
circuitry external to the gate drive circuit. This may be done using opto or galvanic isolation techniques.
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Section VII: Detailed Schematic and Bill of Materials
Figure 6: Gate Drive Board Detailed Block Diagram
Table 5: Gate Drive Board Bill of Materials
# ITEM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Designator
Description
CAP CER 0.1UF 50V 10% X7R
1206
CAP CER 22UF 25V 10% X5R
1206
CAP CER 47UF 25V 20% X5R
1206
CAP CER 100UF 16V 20% X5R
1210
RES 100 OHM 1/4W 1% 1206
SMD
RES SMD 10 OHM 1% 1/4W
1206
RES SMD 7.5 OHM 5% 1/4W
1206
RES SMD 3.3 OHM 5% 1/4W
1206
RES SMD 1K OHM 1/4W 1%
1206
RES SMD 1.47K R 0.1% 1/4W
1206
CONN HDR BRKWAY .100
3POS VERT
CONN HEADER VERT 6POS
.100 TIN
DIODE SCHOTTKY 40V 4A
DO214AA
IC GATE DVR 4A DIFF 8-SOIC
IC GATE DVR 9A NON-INV 8SOIC
MOSFET N/P-CH 30V 6A/5.5A
8SOIC
OPTOISO 5KV GATE DRIVER
8SMT
DC/DC CONVERTER 15V -8.7V
2W
Sept. 2015
Package (Metric)
Manufacturer Part
Number
Manufacturer
Quantity
/Board
C6, C9, C10
3216
Murata
GRM319R71H104KA01D
3
C1, C2, C7
3216
Murata
GRM31CR61E226KE15L
3
C4, C5, C21
3216
TDK
C3216X5R1E476M160AC 3
C8
3225
Taiyo Yuden
EMK325ABJ107MM-T
1
R1
3216
Yageo
RC1206FR-07100RL
1
R2
3216
Panasonic
ERJ-8ENF10R0V
1
R3
3216
Yageo
RC1206JR-077R5L
1
R4
3216
Yageo
RC1206JR-073R3L
1
R5
3216
Yageo
RC1206FR-071KL
1
R6
3216
Panasonic
ERA-8AEB1471V
1
GATE, SOURCE
3POS HEADER
TE Connectivity 5-146274-3
2
JP1
6POS HEADER
TE Connectivity 3-644456-6
1
D1
SMB
U1
8-SOIC
Micro
Commercial
IXYS
U2
8-SOIC
IXYS
U3
8-SOIC
Alpha & Omega AO4629
1
U4
8-SMT
Fairchild
FOD3182S
1
X1
7-SIP
CUI
VQA-S12-D15-SIP
1
SK44BL-TP
1
IXDF604SIA
1
IXDN609SI
1
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19
20
21
22
DC-DC CONVRT 0.7525-5.5V
5A 5SIP
CAP CER 0.022UF 200V X7R
1812
RES SMD 2.2 OHM 5% 2W
2512
RES SMD 1 OHM 5% 2W 2512
Sept. 2015
GA15IDDJT22-FR4
X2
7-SIP
Murata
OKX-T/5-D12N-C
1
CG1
4532
Kemet
C1812C223K2RACTU
1
RG1
6332
Bourns
CRM2512-JW-2R2ELF
1
RG2
6332
Bourns
CRM2512-JW-1R0ELF
1
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0.45
0.35
0.40
1.475
Section VIII: Mechanical Drawing
Figure 7: Gate Drive Board Mechanical Drawing
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Revision History
Date
Revision
Comments
2014/09/09
0
Initial release
Supersedes
Published by
GeneSiC Semiconductor, Inc.
43670 Trade Center Place Suite 155
Dulles, VA 20166
GeneSiC Semiconductor, Inc. reserves right to make changes to the product specifications and data in this document without notice.
GeneSiC disclaims all and any warranty and liability arising out of use or application of any product. No license, express or implied to any
intellectual property rights is granted by this document.
Unless otherwise expressly indicated, GeneSiC products are not designed, tested or authorized for use in life-saving, medical, aircraft
navigation, communication, air traffic control and weapons systems, nor in applications where their failure may result in death, personal
injury and/or property damage.
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