This literature was published years prior to the establishment of Agilent Technologies as a company independent from Hewlett-Packard and describes products or services now available through Agilent. It may also refer to products/services no longer supported by Agilent. We regret any inconvenience caused by obsolete information.HEWLETT For the latest information on PACKARD Agilent's test and measurement products go to: www.agilent.com find products Or in the US, call Agilent Technologies at 1-800-452-4844 (8am-8pm EST) An Automated DC Parameter Measurement System for Power Modules and Smart Power ICs Using the HP 4142B Modular DC Source/Monitor Application Note 12 16-2 1. Introduction The HP 4 142B Modular DC Source/ Monitor with one HP 41422A High Current Unit (HCU) and one HP 4 1423A High Voltage Unit (HVU) can source/measure up to lOA/lOOOV. This can be easily extended to 2OAl2OOOVby using two HCUs and two HVUs. Another unique feature of the HP 4142B is its ability to control external relays. The External Relay Control function was designed so you could programmatically change the connections between the measurement units and the test device’s terminals. In addition, the 16-bit control signal can be used as control signal sources for smart power ICs. Figure 1. Example of the External Relay Control These all combine to create an economical and highly automated 20A/20OOV dc parametric system for power devices, power modules, and smart power ICs. 2. External Relay Control Function In addition to controlling the Module Selector (HP 1608719 or HP 16088B Option 300) the HP 4142B Control Unit can output a 16-bit digital TTL level signal. This added capability is extremely useful for controlling external relays under program control. Figure 1 is an illustration of this capability. The relay’s coil should be connected between the appropriate Control Unit pin and an external power supply or VS of HP 41424A Voltage Source/ Voltage Monitor Unit (VS/VMU). A coil suppression diode should be connected across the relay coil. The relay’s contacts should be connected between the device and measurement unit which is best suited for your application. With the HP 4142B you can choose from the HPSMU, MPSMU, HCU, VS/VMU and GNDU. Please refer to the HP 4142B data sheet for module specifications. The 16-bit TTL level digital signal can also be used as input signals for smart power ICs. Even simple digital patterns can be generated. As an added degree of flexibility, you can use the 16-bit digital signal directly from the Control Unit or from the HP 16087A Module Selector. A special cable interconnects the Control Unit and Module Selector. See figure 2 for more information. The Control Unit connector’s pin assignment is depicted in figure 3. Pins 9 through 13 and 22 through 25 are dedicated to the Module Selector. 3. Application Examples Figure The following sections describe how to programmatically evaluate bipolar power transistors and power modules up to 2OA/2OOOVusing the HP 4142B, External Relay Control function, and HP 1608714 Module Selector. A useful example of how to control smart power ICs is also described. In this example, the first HP 4142B mainframe contains two HCUs and the second two HVUs. This combination will allow you to perform automatic measurement up to 2oA/2ooov. Selector Module Control Board (HP parts NO: 16087-66501) Selector Pins I I I 4. Automatic Power Device Measurements to 20A/2000V The HP 4142B can support a maximum of two HPSMUs (HP 41420A Source Monitor Unit), two HCUs (HP 41422A High Current Unit), or two HVUs (HP 41423A High Voltage Unit) at the same time. In addition, multiple HP 4142B mainframes can be used together. 2. Module External Control ; : Relay Pins i ; ; . . I I i I .111114-.-.-1-.1.1‘-.-.-.-.-.-.-.-.-.-”-.-.-~-.-.-.-~ D-SUB Figure 3. Control Unit I I I I I I I I I Connector 23 pins ( ihch-type Pin Assignment Screw, -I Female ) 4-1. Measurement Configuration Figures 4 and 5 illustrate the HP 4142B and module configuration for measurements to 2OA/2OOOV.The components outside the dotted line are standard HP 4 142B measurement modules. A VWVMU is used to drive the external relays and it is necessary to short the common terminals of the GNDUs. Table 1 lists the relays and their specifications used in this example. Figure 6 shows the Module Selector wiring. The digital control signals for the external relays are provided from the Module Selector. Refer to Appendix A for more details on wiring the Module Selector to the test device. HP 1,428 MC”2 .’ .,, ‘, ., ,. .‘.. .‘) ” ; : ‘),’ ,) ‘, :’ .::.,. .’ ..“.( ‘. .’ GNDU : __ : ‘,\,‘. .:, :’ Figure 4.20A/2OOOV Example Figure 5.2OA/2OOOV Equivalent 3 HCU .: : ‘, i-w. ,., HPSMU ,.‘)’ Table 1. Relay Specifications HPSMU “’ ObOU : GtosAl Unit “““2 Unit : HP 41423A High Voltage Unit : HP 41420A SouvCa Monitor : HP 41424A Voltage AFU : HP 41425A Analog Configuration Measurement ,) “. ‘, : HP 41422A High &rrent VSNMU ,, “WI Circuit Unit Source/Voltage Feedback Unit ‘Monitor Unit 4-2. Example Measurements and Results The circuit shown in figure 5 can be used to measure a device’s collector to emitter breakdown voltage and Vc-Ic characteristics. Table 2 illustrates the external relay and Module Selector settings required for each measurement. Refer to Appendix B for the measurement program. 4-2-l. Collector-Emitter Breakdown Voltage (Bvceo) Figure 6. Module Selector Wiring The Bvceo measurement circuit is shown in figure 7. HVU2 is connected to the emitter and set to -lOOOV. HVUl is connected to the collector and is swept over the equivalent measurement range. .: Since the HVU is unipolar, HVUl needs to be set negative and switched positive while passing through OV. By adding 1OOOVto the measurement result of HVU 1, you can obtain the Vc-Ic characteristics and determine the device’s Bvceo (see figure 8). ‘.’ ” ” Figure ,.. 7. Bvceo ,‘, Measurement “, ‘, Circuit Table 2. Relay and Module Selector Settings r-emitter breakdown volta I I I I Note 1) Relays 2-5 are dual relays, Force and Sense lines. Note 2) The direction of the reed relay must be considered. Note 3) A series resistor must be used to prevent exceeding the 18.OV relay coil rating. 4 I I I I The HW has a 1OmA maximum current compliance. ,, 4-2-2. Vc-Ic Characteristics .‘,.‘\,.“’ The Vc-Ic measurement circuit is shown in figure 9. The HCUs are connected in parallel between the collector and emitter. A 2 channel pulsed sweep mode is used to synchronize the HCUs and minimize thermal generation affects. Each HCU is sweep from OA to lOA, the combined current is therefore OA to 20A. ..’ .4 ” :. :, .’ ; ““” : ‘,‘. The Vc-Ic measurement result is shown in figure 10. ,.( ‘,’ .‘.,. ,) .6 : .:,‘. ,’ .o ., Figure 8. Bvceo Measurement Result Figure 9. Vc-Ic Measurement Circuit Figure 10. Vc-Ic Measurement Circuit 1 yg::. I .2 ~)) ‘..,‘: 1.4 ,~j: : 1.6. IxES) : 5. Automatic Measurements on Power Modules The measurement circuit shown in figure 11 can be used to automate your power MOSFET modules measurements. Using the External Relay Control function and Module Selector can greatly simplify your measurements. 6. Automatic Measurements on Smart Power ICs The HP 4142B Control Unit makes controlling smart power ICs a simple task by programmatically varying the input signals in order to get the device into its different states without using external digital sources. Figure 12 is an example of how to connect a motor driver IC and BP 4142B Control Unit. In this application, the TTL outputs are used as inputs to the IC’s control logic. The IC’s outputs can then be monitored by HP 4142B’s measurement units. Figure 11. Power Module Measurement Circuit ‘\’ <:: Figure 6 12. Connecting .: .’ : ‘. \‘: < .\, \, :, ,. ‘\,. ...,\s’, ‘,,, _,.,’ _: .: .\;.\j’ 5 ,.., ‘.,_ ..,., ;. : :. .;. .,:.: ,:;/ . ..’ ‘,: ‘,~ ._:: \ I,\ .\\ I’:. .I\,\. : ,. \” \ ; \\, ‘, ‘.( ‘_ ;< .\ ! ; ” \! ‘\ :. ‘.(_\:_ : \; :h\ ‘./ r_\ *: \ ,,’ ,_ \ ;~ : :_ :..‘I+\\ ‘._, <_ , i..+ 2,‘~_, __ _:_‘\: :: _\?,,,“, \$ :; ‘\ \) :,\ 1 ‘Y.,‘:: .\ :;‘,: ,:\ _\\\ (\\ ..‘. \ ,;\.~\!\ \’ ., ‘._ \ .) : . .. ,. .. ‘. : :. the Control Unit and Motor Driver IC \ .: ‘., ‘,,. ‘. Appendix A In order to obtain maximum measurement performance and safety, care must be taken in wiring the Module Selector to the Test Device: 1. To decrease the chance of oscillation, minimize the cable length between Module Selector and test device. The HCU also used a special twisted pair wiring scheme to minimize inductance. ‘. 7:/...., _-.:. .( .;.<,.;,,, y,:..:.:. :i,.I ...‘.. ,:.. ..,. .... \,._I’ ..\.‘, ., ”‘..\ ..,., \,.’ ; .:\ .,, ‘,,.’ (. ;.., : “‘: ,i ‘j.’ : :“” ‘. ,’ : : ‘.l. ‘, j i ’ .‘. .I :‘.’ :; .I’. y: \,\, y.1‘:,;: : .t . ‘. .,:‘, 0: .,. .’ ‘. : : ,: :.I\’ .,, : ‘.” ,I /AWG 16 Wire 8150- 2. Be sure to use the INTLK terminal and HVU ON/OFF STATUS terminal as shown in figure 13 to reduce the risk of electric shock. Figure 7 A. Connecting the Module Selector and Test Device