Selector Guide

V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Small-Signal and Power Diodes
Bare Die Products in Several Versions to
Accommodate a Wide Variety of Assembly
Techniques and Applications
TABLE OF CONTENTS
Introduction To Bare Die..................................................................................................................... 02
Die Portfolio........................................................................................................................................ 03
• Nomenclature............................................................................................................................. 03
• Schottky Diodes......................................................................................................................... 05
• Ultrafast Diodes.......................................................................................................................... 10
–– FRED Pt®............................................................................................................................... 11
–– HEXFRED® Gen 2.................................................................................................................. 13
–– HEXFRED® Gen 3.................................................................................................................. 14
• High Voltage Standard / Soft Recovery Diodes......................................................................... 15
• Thyristors.................................................................................................................................... 17
• TVS............................................................................................................................................. 19
• Zener Diodes.............................................................................................................................. 25
• Switching Diodes........................................................................................................................ 27
• Switching Diodes and ESD Protection....................................................................................... 28
Packing Options................................................................................................................................. 29
Resources
• For technical support contact [email protected]
• For more information contact [email protected], [email protected], or
[email protected]
One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
selector guide
1/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Small-Signal and Power Diodes
Bare Die
Vishay supplies a wide range of small-signal and power diodes in bare die and wafer form:
• Schottky diodes
• Fred Pt® Ultrafast diodes
• HEXFRED® Ultrafast diodes
• TVS diodes
• Zener diodes
• ESD protection diodes
• Switching diodes
• High Voltage Standard/Fast diodes
• Thyristors
Packing Types
Vishay delivers its bare die products in several versions to accommodate a wide variety of assembly techniques and
applications:
• Unsawn wafer: the wafers are delivered in a sealed bag and die are not singulated
• Sawn wafer on film: the wafer is sawn and supplied on blue tape in a plastic frame
• Die in tape and reel: each die is located in a pocket on a continuous antistatic coated reel
• Waffle pack: each die is in a tray
Die Usage Basic Guidelines
Bare die products require careful handling and storage as well as optimized assembly processes and tools to avoid
damage and deviations from expected performance. The following hints are based on Vishay’s many years of experience
in manufacturing and assembling semiconductor devices.
Die Attach
Silicon cannot be joined to copper without the occurrence of thermal shock due to the significant difference in thermal
conductivity between these materials. For this reason, and to ensure optimized electrical conductivity, Vishay wafers are
coated on the back side with two or three metallic solderable layers which are suitable for a wide range of solders, ranging
from solder alloys to conductive epoxies. Fluxes are not recommended for solders because residuals can contaminate
the surface of the die, and cause voids under the die thus compromising heat dissipation and electrical performance. In
general the safest approach is to adopt the same materials Vishay uses in the assembly of die into discrete packaged
parts. Vishay experts can help you choose the best materials for your assembly requirements.
Wire Bonding
Vishay die are typically covered with an aluminum metalization which contains a small percentage of silicon (~1 %) for
ultrasonic bonding or thermosonic bonding depending on whether aluminum or gold wires are adopted. The application
of wires in parallel and stitch bonding provides protection against surge current in the vicinity of soldered chips. Several
platforms are also provided with solderable metalization on the anode side which is suitable for solder attach.
selector guide
2/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Small-Signal and Power Diodes
Bare Die Naming Rules for Schottky, FRED Pt®, HEXFRED® and TVS Diodes
SC
105
Product Type
Chip
size
in
mils
SX = Planar
Schottky Fab1
TY = TMBS®
Schottky Fab1
TV = PAR® TVS
SC = Planar
Schottky Fab2
FD = FRED Pt
Ultrafast
H2 = HEXFRED
Ultrafast Gen2
H3 = HEXFRED
Ultrafast Gen3
H
100
Process
Voltage
For Schottky
R = Tj max. 125 °C
S = Tj max. 150 °C
H = Tj max. 175 °C
T = Gen5 Schottky
For TVS PAR
B = Named as Vbr
T = Named as Vwm
L = Load Dump
Rectifier named
as Vbr
A
5
Surface Metal
Wafer
Diameter
A = Wirebondable
Topside: Ti/Al, Ti/Ni/Al 4 = 4"
or Pure Al
5 = 5"
or Al(1%Si) 6 = 6"
Backside: Ti/Ni/Ag or
CrNiAg
S = Solderable
Topside: Ni/Au or
Ti/Ni/Ag
Backside: Ni/Au or
Ti/Ni/Ag or
CrNiAg
For FRED Pt
This is SPEED code
W = 14 ns to 17 ns
H = 18 ns to 35 ns
U = 36 ns to 50 ns
C = 51 ns to 70 ns
S = 71 ns to 90 ns
L = 91 ns to 120 ns
T = 121 ns to 200 ns
N > 200 ns
P
R
Quality Level
(if defined)
N
Packaging
Passivation
B = Inked probed (valid for®
unsawn wafer FRED Pt only)
(wafer in box) none = SiO2
N = Silicon
P = Probed die in
Nitride
waffle pack
P = Packaged Die
for T1
O = Packaged Die
for T2
N = Non-packaged Die
T = Known Tested Die D = Probed die in
G = Known Good Die
waffle pack
(HEXFRED
only)
Thickness
(valid for Planar
Schottky Fab2
only)
F = Inked probed
sawn wafer
on film
none = standard
14 mils
T = 10 mils
M = Wirebondable for
Medical
Topside: Ti/Al or
Pure Al
Backside: Ti/Ni/Au
R = Probed die in
tape and 13"
reel
T = Probed die in
12 mm tape
and 4 mm
pitch, 7" reel
(for 35~75
mil chip)
Note: Ti(0.12um)/
Ni(0.18um)/
Au(0.05um)
For HEXFRED
H = Gen2
D = Gen3
E = Gen3
U = Probed die in
12 mm tape
and 4 mm
pitch, 7" reel
(for 76~110
mil chip)
V = Probed die in
12 mm tape
and 8 mm
pitch, 7" reel
(for 111~300
mil chip)
C = Probed die in
plastic can
(bulk)
Digit always present
Digit might miss (see legend)
Bare Die Naming Rule for High Voltage Standard / Fast Diodes
VS
Vishay Semiconductor
180
Chip Size in Mils
DM
C
S02
CB
Voltage Code x 100
Surface Metal
Speed Code
Packaging
DM = Standard
Recovery Diode Glassivated Moat
‘06 = 600 V
‘08 = 800 V
‘10 = 1000 V
‘12 = 1200 V
‘16 = 1600 V
C=Wirebondable
Topside: 100% Al
Backside: Cr/Ni/Ag
None=Standard
Recovery
S02=200ns
S05=500ns
CB=Probed Uncut Die (Wafer
In Box)
None=Probed Die in Chip
Carrier
LM = Fast Recovery
Diode- Glassivated
Moat
selector guide
12
Process
3/32
H=Solderable
Topside: Cr/Ni/Ag
Backside: Cr/Ni/Ag
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Small-Signal and Power Diodes
Digit always present
Digit might miss (see legend)
DIODES Bare Die Naming Rule for Thyristors
VS
Vishay Semiconductor
180
Chip Size in Mils
B
G
Passivation Process
B = Wirebondable
Topside: 100% Al
Backside: Cr/Ni/Ag
G = Glassivated Mesa ‘06 = 600 V
‘12 = 1200 V
‘16 = 1600 V
Voltage Code x 100
D
4/32
CB
Metallization
Packaging
D = Wirebondable
Topside: 100% Al
Backside: Cr/Ni/Ag
CB=Probed Uncut Die (Wafer
In Box)
None=Probed Die in Chip
Carrier
H = Solderable
Topside: Cr/Ni/Ag
Backside: Cr/Ni/Ag
S = Solderable
Topside: Cr/Ni/Ag
Backside: Cr/Ni/Ag
selector guide
12
Surface Metal
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Schottky
Schottky Diode Features
Schottky diodes are designed for very fast switching between the forward and the reverse direction of the diode. Their
metal-semiconductor junction provides a low forward voltage drop compared to p-n diodes. Schottky diodes can be used
for general-purpose applications but their low voltage drops at forward biases makes them useful whenever conduction
losses are key to ensure high efficiency and for protection of MOS devices.
Vishay Portfolio
• Vishay offers one of broadest range of Schottky diodes in the market, ranging from 15 V to 200 V
• Maximum junction temperatures from 125 ºC to 175 ºC are available thanks to a variety of proprietary barrier metals
• Vishay technologies include products optimized for low conduction losses as well as products with extreme low
reverse leakage current:
–– TMBS® Trench MOS Barrier Schottky
–– Gen2 (Planar) and Gen5 (Trench)
• Die are available with bondable or solderable metalizations
Typical Applications for Schottky Diodes
1. Bypass Diodes for Solar Cells
2. Reverse Polarity Battery Protection
3. Battery Chargers and Switchmode Power Supplies
2. Reverse Polarity Battery Protection
Typical Circuits
1. Bypass Diodes for Solar Cells
3. Battery Chargers and Switchmode Power Supplies
selector guide
5/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Schottky
Schottky Die / N List
Part Number
Optimized TJ max
for
(°C)
IF(AV)
(A)
VR
(V)
VF at 125 ºC
(V)
Die Size
(mils)
Die
Front Side Back Side
Thickness
Metal
Metal
(mils)
Wafer
Diameter
(inches)
VS-SC036R015S5x
Low VF
125
1
15
0.32
36 x 36
14
Solderable
Solderable
5
VS-SC125R015S5x
Low VF
125
9
15
0.25 at 75 °C
125 x 125
14
Solderable
Solderable
5
VS-SC200R015S5x
Low VF
125
60
15
0.43 at 75 °C
200 x 200
14
Solderable
Solderable
5
VS-SC036S020S5x
Low VF
150
1
20
0.35
36 x 36
14
Solderable
Solderable
5
VS-SC125S020A5x
Low VF
150
15
20
0.51 at 40 A at 25 °C
125 x 125
10
Bondable
Solderable
5
VS-SC036S030A5x
Low VF
150
1
30
0.50
36 x 36
14
Bondable
Solderable
5
VS-SC036S030S5x
Low VF
150
1
30
0.50
36 x 36
10
Solderable
Solderable
5
VS-SC070S030A5x
Low VF
150
5
30
0.49
70 x 92
14
Bondable
Solderable
5
VS-SC105S030A5x
Low VF
150
15
30
0.53
105 x 125
14
Bondable
Solderable
5
VS-SC170S030A5x
Low VF
150
30
30
0.51
115 x 170
14
Bondable
Solderable
5
VS-SC200S030A5x
Low VF
150
60
30
0.58
200 x 200
14
Bondable
Solderable
5
VS-SC200S030S5x
Low VF
150
60
30
0.47
200 x 200
14
Solderable
Solderable
5
VS-SC275S030S5x
Low VF
150
80
30
0.55 at 150 A at 25 °C
275 x 275
14
Solderable
Solderable
5
VS-SC036S045A5x
Low VF
150
1
45
0.56
36 x 36
14
Bondable
Solderable
5
VS-SC036S045S5x
Low VF
150
1
45
0.49
36 x 36
14
Solderable
Solderable
5
VS-SC050H045A5x
Low IR
175
2
45
Not Av.
50 x 50
14
Bondable
Solderable
5
VS-SC060S045A5x
Low VF
150
3
45
0.49 at 3 A
60 x 60
14
Bondable
Solderable
5
VS-SC060S045S5x
Low VF
150
3
45
0.43 at 2 A
60 x 60
14
Solderable
Solderable
5
VS-SC070S045A5x
Low VF
150
5
45
0.65
70 x 92
14
Bondable
Solderable
5
VS-SC070H045A5x
Low IR
175
5
45
0.64
70 x 92
14
Bondable
Solderable
5
SX073H045A6Ox
Low IR
175
7.5
45
0.73 at 25 °C
73 x 73
11
Bondable
Solderable
6
SX073H045S6Px
Low IR
175
7.5
45
0.57 at 25 °C
73 x 73
11
Solderable
Solderable
6
SX085H045S6Px
Low IR
175
10
45
0.75 at 25 °C
85 x 85
11
Solderable
Solderable
6
VS-SC105H045A5x
Low IR
175
15
45
0.68
105 x 125
14
Bondable
Solderable
5
VS-SC105H045S5x
Low IR
175
15
45
0.44
105 x 125
14
Solderable
Solderable
5
VS-SC105S045A5x
Low VF
150
15
45
0.50
105 x 125
14
Bondable
Solderable
5
VS-SC105S045S5x
Low VF
150
15
45
0.42
105 x 125
10 / 14
Solderable
Solderable
5
VS-SC125H045A5x
Low IR
175
15
45
0.62 at 25 °C
125 x 125
14
Bondable
Solderable
5
selector guide
6/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Schottky
Schottky Die / N List
Part Number
Optimized TJ max
for
(°C)
IF(AV)
(A)
VR
(V)
VF at 125 ºC
(V)
Die Size
(mils)
Die
Front Side Back Side
Thickness
Metal
Metal
(mils)
Wafer
Diameter
(inches)
VS-SC125H045S5x
Low IR
175
15
45
0.62 at 25 °C
125 x 125
14
Solderable
Solderable
5
SX110H045A6Ox
Low IR
175
15
45
0.76 at 25 °C
110 x 110
11
Bondable
Solderable
6
SX110H045S6Px
Low IR
175
16
45
0.66 at 25 °C
110 x 110
11
Solderable
Solderable
6
VS-SC170H045A5x
Low IR
175
30
45
0.53
115 x 170
14
Bondable
Solderable
5
VS-SC180H045S5x
Low IR
175
40
45
0.61 at 30 A
150 x 180
14
Solderable
Solderable
5
VS-SC180S045A5x
Low VF
150
40
45
0.56
150 x 180
14
Bondable
Solderable
5
VS-SC200H045S5x
Low IR
175
60
45
0.69
200 x 200
14
Solderable
Solderable
5
VS-SC200S045S5x
Low VF
150
60
45
0.69
200 x 200
14
Solderable
Solderable
5
VS-SC036S060S5x
Low VF
150
1
60
0.57
36 x 36
14
Solderable
Solderable
5
VS-SC060S060A5x
Low VF
150
3
60
0.65 at 6 A
60 x 60
14
Bondable
Solderable
5
VS-SC060S060S5x
Low VF
150
3
60
0.43
60 x 60
14
Solderable
Solderable
5
TY059S060A6Ox
Low VF
150
5
60
0.7 at 25 °C
59 x 59
11
Bondable
Solderable
6
SX073H060A6Ox
Low IR
175
7.5
60
0.73 at 25 °C
73 x 73
11
Bondable
Solderable
6
SX073H060S6Px
Low IR
175
7.5
60
0.73 at 25 °C
73 x 73
11
Solderable
Solderable
6
TY078S060A6Px
Low VF
150
10
60
0.65 at 25 °C
78 x 78
11
Bondable
Solderable
6
VS-SC105S060A5x
Low VF
150
15
60
0.71
105 x 125
14
Bondable
Solderable
5
VS-SC125S060A5x
Low VF
150
15
60
0.60 at 25 °C
125 x 125
10
Bondable
Solderable
5
SX110H060S4Px
Low IR
175
15
60
0.68 at 25 °C
110 x 110
11
Solderable
Solderable
6
TY085S060A6Ox
Low VF
150
15
60
0.7 at 25 °C
85 x 85
11
Bondable
Solderable
6
SX128H060S6Ox
Low IR
175
20
60
0.69 at 25 °C
128 x 128
11
Solderable
Solderable
4
VS-SC180S060A5x
Low VF
150
40
60
0.64
150 x 180
14
Bondable
Solderable
5
BDBAS70-BDx
Small signal
125
0.015
70
1.00 at 25 °C
0.24 mm x
0.24 mm
6
Bondable
Solderable
4
TY056S080A6Ox
Low VF
150
5
80
0.72 at 25 °C
56 x 56
11
Bondable
Solderable
6
TY073S080A6Px
Low VF
150
10
80
0.81 at 25 °C
73 x 73
11
Bondable
Solderable
6
TY085S080A6Ox
Low VF
150
15
80
0.82 at 25 °C
85 x 85
11
Bondable
Solderable
6
TY102S080A6Ox
Low VF
150
15
80
0.95 at 25 °C
102 x 102
11
Bondable
Solderable
6
VS-SC036H100S5x
Low IR
175
1
100
0.68
36 x 36
14
Solderable
Solderable
5
SX050H100S4Px
Low IR
175
1
100
0.77 at 25 °C
50 x 50
11
Solderable
Solderable
4
selector guide
7/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Schottky
Schottky Die / N List
Part Number
Optimized TJ max
for
(°C)
IF(AV)
(A)
VR
(V)
VF at 125 ºC
(V)
Die Size
(mils)
Die
Front Side Back Side
Thickness
Metal
Metal
(mils)
Wafer
Diameter
(inches)
VS-SC050H100A5x
Low IR
175
2
100
0.79
50 x 50
14
Bondable
Solderable
5
SX061H100S4Px
Low IR
175
2
100
0.79 at 25 °C
61 x 61
11
Solderable
Solderable
4
VS-SC060H100A5x
Low IR
175
3
100
0.74 at 6 A
60 x 60
14
Bondable
Solderable
5
VS-SC060H100S5x
Low IR
175
3
100
0.62
60 x 60
14
Solderable
Solderable
5
TY045S100S6Ox
Low VF
150
3
100
0.8 at 25 °C
45 x 45
12
Solderable
Solderable
6
TY054S100S6Ox
Low VF
150
3
100
0.7 at 25 °C
54 x 54
12
Solderable
Solderable
6
VS-SC070H100A5x
Low IR
175
5
100
0.78
70 x 92
14
Bondable
Solderable
5
SX093H100A4Ox
Low IR
175
5
100
0.76 at 25 °C
93 x 93
11
Bondable
Solderable
4
TY066S100A6Ox
Low VF
150
5
100
0.85 at 25 °C
66 x 66
11
Bondable
Solderable
6
SX067H100S4Px
Low IR
175
8
100
0.9 at 25 °C
67 x 67
12
Solderable
Solderable
4
TY080S100S6Px
Low VF
150
8
100
0.68 at 25 °C
80 x 80
12
Solderable
Solderable
6
TY080S100A6Ox
Low VF
150
10
100
0.73 at 25 °C
80 x 80
11
Bondable
Solderable
6
TY093S100S6Px
Low VF
150
10
100
0.68 at 25 °C
93 x 93
12
Solderable
Solderable
6
TY102S100S6Ox
Low VF
150
12
100
0.7 at 25 °C
102 x 102
12
Solderable
Solderable
6
VS-SC105H100A5x
Low IR
175
15
100
0.69
105 x 125
14
Bondable
Solderable
5
VS-SC105H100S5x
Low IR
175
15
100
0.52
105 x 125
14
Solderable
Solderable
5
VS-SC125H100A5x
Low IR
175
15
100
0.86 at 25 °C
125 x 125
14
Bondable
Solderable
5
VS-SC125H100S5x
Low IR
175
15
100
0.86 at 25 °C
125 x 125
14
Solderable
Solderable
5
SX119H100S4Px
Low IR
175
15
100
0.82 at 25 °C
119 x 119
11
Solderable
Solderable
4
TY093S100A6Ox
Low VF
150
15
100
0.8 at 25 °C
93 x 93
11
Bondable
Solderable
6
TY102S100A6Ox
Low VF
150
20
100
0.81 at 25 °C
102 x 102
11
Bondable
Solderable
6
TY119S100A6Ox
Low VF
150
20
100
0.73 at 25 °C
119 x 119
11
Bondable
Solderable
6
VS-SC180H100A5x
Low IR
175
40
100
0.75
150 x 180
14
Bondable
Solderable
5
VS-SC180H100S5x
Low IR
175
40
100
0.75
150 x 180
14
Solderable
Solderable
5
TY144S100A6Ox
Low VF
150
40
100
0.78 at 25 °C
144 x 144
11
Bondable
Solderable
6
VS-SC200H100A5x
Low IR
175
60
100
0.76
200 x 200
14
Bondable
Solderable
5
VS-SC200H100S5x
Low IR
175
60
100
0.79
200 x 200
14
Solderable
Solderable
5
VS-SC275H100S5x
Low IR
175
80
100
0.77 at 60 A at 25 °C
275 x 275
14
Solderable
Solderable
5
selector guide
8/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Schottky
Schottky Die / N List
Part Number
Optimized TJ max
for
(°C)
IF(AV)
(A)
VR
(V)
VF at 125 ºC
(V)
Die Size
(mils)
Die
Front Side Back Side
Thickness
Metal
Metal
(mils)
Wafer
Diameter
(inches)
TY080S120S6Px
Low VF
150
8
120
0.84 at 25 °C
80 x 80
12
Solderable
Solderable
6
TY080S120A6Ox
Low VF
150
10
120
0.9 at 25 °C
80 x 80
11
Bondable
Solderable
6
TY102S120S6Px
Low VF
150
12
120
0.8 at 25 °C
102 x 102
12
Solderable
Solderable
6
TY093S120A6Ox
Low VF
150
15
120
0.97 at 25 °C
93 x 93
11
Bondable
Solderable
6
TY102S120A6Ox
Low VF
150
15
120
1.28 at 25 °C
102 x 102
11
Bondable
Solderable
6
TY119S120A6Ox
Low VF
150
15
120
1.1 at 25 °C
119 x 119
11
Bondable
Solderable
6
VS-SC070H150A5x
Low IR
175
5
150
0.86
70 x 92
14
Bondable
Solderable
5
SX081H150A4Ox
Low IR
175
5
150
0.88 at 25 °C
81 x 81
11
Bondable
Solderable
4
TY056S150A6Ox
Low VF
150
5
150
1.41 at 25 °C
56 x 56
11
Bondable
Solderable
6
TY080S150A6Ox
Low VF
150
10
150
1.2 at 25 °C
80 x 80
11
Bondable
Solderable
6
VS-SC105H150A5x
Low IR
175
15
150
0.77
105 x 125
14
Bondable
Solderable
5
TY093S150A6Ox
Low VF
150
15
150
1.36 at 25 °C
93 x 93
11
Bondable
Solderable
6
TY102S150A6Ox
Low VF
150
20
150
1.43 at 25 °C
102 x 102
11
Bondable
Solderable
6
VS-SC200H150A5x
Low IR
175
60
150
0.85
200 x 200
14
Bondable
Solderable
5
TY045S200S6Ox
Low VF
150
2
200
1.23 at 25 °C
45 x 45
11
Solderable
Solderable
6
TY054S200S6Ox
Low VF
150
3
200
1.4 at 25 °C
54 x 54
11
Solderable
Solderable
6
TY056S200S6Ox
Low VF
150
3
200
1.2 at 25 °C
56 x 56
11
Solderable
Solderable
6
TY066S200A6Ox
Low VF
150
5
200
1.6 at 25 °C
66 x 66
11
Bondable
Solderable
6
TY080S200A6Ox
Low VF
150
10
200
1.7 at 25 °C
80 x 80
11
Bondable
Solderable
6
TY093S200A6Ox
Low VF
150
10
200
1.6 at 25 °C
93 x 93
11
Bondable
Solderable
6
TY119S200A6Ox
Low VF
150
15
200
0.95 at 25 °C
119 x 119
11
Bondable
Solderable
6
selector guide
9/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Ultrafast
Ultrafast Diode Features
These diodes are specifically designed to work in switching operations. Their silicon epitaxial planar technology features
a design optimized for reliable performance. They are the best diodes for coupling with IGBTs in power supply inverter
stages and for boosting the voltage in PFC stage.
Vishay Portfolio
• Vishay offers the industry’s broadest range of Ultrafast diodes in the market, ranging from 200 V to 1200 V
• 150 ºC (HEXFRED®) and 175 ºC (FRED Pt®) maximum junction temperatures are available
• Vishay technologies include products optimized for low conduction losses as well as products for reduced switching
losses, all with optimized softness to reduce EMI generation and reduce/eliminate the need for snubbers
• Our proprietary technology enables several Vf/Trr trade-offs for the same die size, enabling all possible speed
requirements
• Die are available with bondable metalization
Typical Applications for Schottky Diodes
1. High-Voltage High-Frequency Power Management and Battery Chargers
2. Power Supplies
3. Welding
Typical Circuits
1. High-Voltage, HIgh-Frequency Power Management and Battery Charges
2. Power Supplies
3.Welding
selector guide
10/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Ultrafast
FRED Pt® Die P / N List
VF max trr typ
Die
Wafer
Die Size Front Side Back Side Tj Max
Thickness Diameter
at 25 °C at 25 °C
(mils2)
(ºC)
Metal
Metal
(mils) (inches)
(V)
(ns)
Part Number
Optimized for
Gen
IF(AV)
(A)
VR
(V)
VS-FD040H02A6x
Switching-Low QRR
1
1
200
1
22
40 x 40
Bondable
Solderable
175
14
6
VS-FD046H02A6x
Switching-Low QRR
1
2-3
200
1
22
46 x 60
Bondable
Solderable
175
14
6
VS-FD060H02A6x
Switching-Low QRR
1
4
200
1
22
60 x 80
Bondable
Solderable
175
14
6
VS-FD080H02A6x
Switching-Low QRR
1
5
200
0.9
26
80 x 80
Bondable
Solderable
175
14
6
VS-FD087H02A6x
Switching-Low QRR
1
8-10
200
0.975
20
87 x 87
Bondable
Solderable
175
14
6
VS-FD122H02A6x
Switching-Low QRR
1
15-20
200
1.05
22
122 x 122
Bondable
Solderable
175
14
6
VS-FD160H02A6x
Switching-Low QRR
1
30-35
200
1.09
26
160 x 160
Bondable
Solderable
175
14
6
VS-FD170H02A6x
Switching-Low QRR
1
40-50
200
1.02
34
170 x 170
Bondable
Solderable
175
14
6
VS-FD200H02A6x
Switching-Low QRR
1
75
200
1.13
32
200 x 200
Bondable
Solderable
175
14
6
VS-FD100H03A6x
Switching-Low QRR
1
8-10
300
1.25
27
100 x 100 Bondable Solderable
175
14
6
VS-FD110H03A6x
Switching-Low QRR
1
10
300
1.25
31
110 x 110 Bondable Solderable
175
14
6
VS-FD120H03A6x
Switching-Low QRR
1
15-20
300
1.25
32
120 x 120 Bondable Solderable
175
14
6
VS-FD160H03A6x
Switching-Low QRR
1
30-35
300
1.25
38
160 x 160 Bondable Solderable
175
14
6
VS-FD170H03A6x
Switching-Low QRR
1
40-50
300
1.25
34
170 x 170 Bondable Solderable
175
14
6
VS-FD090U4A6x
Sw. / Conduction= 50/50
1
8
400
1.3
43
Bondable Solderable
175
14
6
VS-FD120U04A6x
Sw. / Conduction= 50/50
1
15-20
400
1.25
46
120 x 120 Bondable Solderable
175
14
6
VS-FD160S04A6x
Sw. / Conduction= 50/50
1
30-40
400
1.32
72
160 x 160 Bondable Solderable
175
14
6
VS-FD200S04A6x
Sw. / Conduction= 50/50
1
75
400
1.3
87
200 x 200 Bondable Solderable
175
14
6
VS-FD051H06A6BN
Switching-Low QRR
2
1-2
600
1.5
30
51 x 51
Bondable Solderable
175
14
6
VS-FD056H06A6xN
Switching-Low QRR
2
2-3
600
1.45
28
56 x 56
Bondable Solderable
175
14
6
VS-FD056U06A6xN
Sw. / Conduction= 50/50
2
2-3
600
1.25
37
56 x 56
Bondable Solderable
175
14
6
VS-FD072H06A6xN
Switching-Low QRR
2
4-6
600
2.1
18
72 x 72
Bondable Solderable
175
14
6
VS-FD072T06A6xN
Conduction - Low VF
2
4-6
600
1.2
60
72 x 72
Bondable Solderable
175
14
6
VS-FD072U06A6xN
Sw. / Conduction= 50/50
2
4-6
600
1.5
47
72 x 72
Bondable Solderable
175
14
6
VS-FD083H06A6xN
Switching-Low QRR
2
8
600
2.65
16
83 x 83
Bondable Solderable
175
14
6
VS-FD083T06A6xN
Conduction - Low VF
2
8
600
1.07
65
83 x 83
Bondable Solderable
175
14
6
VS-FD083W06A6xN
Switching-Low QRR
2
8
600
3.4
14
83 x 83
Bondable Solderable
175
14
6
VS-FD097H06a6xN
Switching-Low QRR
2
10
600
2.4
21
97 x 97
Bondable Solderable
175
14
6
VS-FD097W06A6xN
Switching-Low QRR
2
10
600
3
15
97 x 97
Bondable Solderable
175
14
6
VS-FD111H06A6xN
Switching-Low QRR
2
15
600
2.45
21
111 x 111 Bondable Solderable
175
14
6
VS-FD111T06A6xN
Conduction - Low VF
2
15
600
1.07
60
111 x 111 Bondable Solderable
175
14
6
VS-FD111U06A6xN
Sw. / Conduction= 50/50
2
15
600
1.9
24
111 x 111 Bondable Solderable
175
14
6
90 x 90
*For VF max at 25 °C, typ VF at rated I
selector guide
11/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Ultrafast
FRED Pt® Die P / N List
VF max trr typ
Die
Wafer
Die Size Front Side Back Side Tj Max
Thickness Diameter
at 25 °C at 25 °C
(mils2)
(ºC)
Metal
Metal
(mils) (inches)
(V)
(ns)
Part Number
Optimized for
Gen
IF(AV)
(A)
VR
(V)
VS-FD111W06A6xN
Switching-Low QRR
2
15
600
3.4
17
111 X 111 Bondable Solderable
175
14
6
VS-FD117H06A6xN
Switching-Low QRR
2
15-20
600
2.2
22
117 x 117 Bondable Solderable
175
14
6
VS-FD117T06A6xN
Conduction - Low VF
2
15-20
600
1.1
60
117 x 117 Bondable Solderable
175
14
6
VS-FD117W06A6xN
Switching-Low QRR
2
15-20
600
3.2
18
117 x 117 Bondable Solderable
175
14
6
VS-FD145H06A6xN
Switching-Low QRR
2
30
600
2.65
26
145 x 145 Bondable Solderable
175
14
6
VS-FD145U06A6xN
Sw. / Conduction= 50/50
2
30
600
2
30
145 x 145 Bondable Solderable
175
14
6
VS-FD157H06A6x
Switching-Low QRR
2
30-35
600
2.6
31
160 x 160 Bondable Solderable
175
14
6
VS-FD197H06A6xN
Switching-Low QRR
2
75
600
2.6
30
197 x 197 Bondable Solderable
175
14
6
VS-FD197S06A6xN
Sw. / Conduction= 50/50
2
75
600
1.68
34
197 x 197 Bondable Solderable
175
14
6
VS-FD111H07A6BN
Switching-Low QRR
2
15-18
650
1.68
37
111 x 111 Bondable Solderable
175
14
6
VS-FD117H07A6BN
Switching-Low QRR
2
15-18
650
1.52
37
117 x 117 Bondable Solderable
175
14
6
VS-FD145H07A6xN
Switching-Low QRR
2
30
650
1.7
39
145 x 145 Bondable Solderable
175
14
6
VS-FD145W07A6xN
Switching-Low QRR
2
30
650
2.2
26
145 x 145 Bondable Solderable
175
14
6
VS-FD157H07A6xN
Switching-Low QRR
2
35
650
1.7
41
157 x 157 Bondable Solderable
175
14
6
VS-FD184H07A6xN
Switching-Low QRR
2
60
650
1.7
42
184 x 184 Bondable Solderable
175
14
6
VS-FD184W07A6xN
Switching-Low QRR
2
60
650
2.3
38
184 x 184 Bondable Solderable
175
14
6
VS-FD197H07A6xN
Switching-Low QRR
2
75
650
1.65
47
197 x 197 Bondable Solderable
175
14
6
VS-FD310H07A6xN
Switching-Low QRR
2
100-120 650
1.75
54
310 x 190 Bondable Solderable
175
14
6
VS-FD310W07A6xN
Switching-Low QRR
2
100-120 650
2.2
47
310 x 190 Bondable Solderable
175
14
6
VS-FD394H07A6xN
Switching-Low QRR
2
2.2
60
394 x 217 Bondable Solderable
175
14
6
150
650
*For VF max at 25 °C, typ VF at rated I
selector guide
12/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Ultrafast
HEXFRED® Gen 2 Die P / N List
I
Optimized
Gen F(AV)
for
(A)
VR
(V)
VF max
at 25 °C
(V)
trr typ
at 25 °C
(ns)
Die Size
(mils2)
Front Side
Metal
Back Side
Metal
BOOST Diode 2
4
600
1.8
41
66 x 66
Bondable
Solderable
150
14.8
6
2
12
600
1.7
47
85 x 164
Bondable
Solderable
150
14.8
6
VS-H2090H06A6x
BOOST Diode 2
8
600
1.7
41
90 x 90
Bondable
Solderable
150
14.8
6
VS-H2107H12A6x
BOOST Diode 2
6
1200
3
58
107 x 130
Bondable
Solderable
150
14.8
6
VS-H2115H06A6x
BOOST Diode 2
15
600
1.7
47
115 x 155
Bondable
Solderable
150
14.8
6
VS-H2115H12A6x
BOOST Diode 2
8
1200
3.3
59
115 x 155
Bondable
Solderable
150
14.8
6
VS-H2169H06A6x
BOOST Diode 2
25
600
1.7
53
169 x 220
Bondable
Solderable
150
14.8
6
VS-H2169H12A6x
BOOST Diode 2
16
1200
3
69
169 x 220
Bondable
Solderable
150
14.8
6
Part Number
VS-H2066H06A6x
VS-H2085H06A6x
APD
Die
Wafer
Tj Max Thickness Diameter
(mils)
(inches)
VS-H2195H06A6x
APD
2
30
600
1.2 at 12 A
62
195 x 340
Bondable
Solderable
150
14.8
6
VS-H2195H12A6x
APD
2
30
1200
3 at 16 A
78
195 x 340
Bondable
Solderable
150
14.8
6
VS-H2200H04A6x
APD
2
60
400
1.2
57
200 x 200
Bondable
Solderable
150
14.8
6
VS-H2200H06A6x
APD
2
60
600
1.7 at 70 A
52
200 x 200
Bondable
Solderable
150
14.8
6
VS-H2257H06A6x
APD
2
80
600
1.2 at 10 A
62
257 x 257
Bondable
Solderable
150
14.8
6
VS-H2257H12A6x
APD
2
80
1200
3 at 16 A
78
257 x 257
Bondable
Solderable
150
14.8
6
selector guide
13/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Ultrafast
HEXFRED® Gen 3 Die P / N List
Part Number
I
Optimized
Gen F(AV)
for
(A)
VR
(V)
VF max
at 25 °C
(V)
trr typ
at 25 °C
(ns)
Die Size
(mils2)
Front Side
Metal
Back Side
Metal
Die
Wafer
Tj Max Thickness Diameter
(mils)
(inches)
VS-H3051D05A6x
APD
3
1
600
1.75 at 3 A
52
51 x 51
Bondable
Solderable
150
14.8
6
VS-H3065D06A6x
APD
3
3
600
1.35 at 1 A
56
65 x 66
Bondable
Solderable
150
14.8
6
VS-H3075D06A6x
APD
3
5
600
1.1 at 1 A
57
75 x 76
Bondable
Solderable
150
14.8
6
VS-H3085D06A6x
APD
3
15
600
1.15 at 3 A
61
85 x 131
Bondable
Solderable
150
14.8
6
VS-H3090D12A6x
APD
3
5
1200
1.95 at 2 A
50
90 x 91
Bondable
Solderable
150
12
6
VS-H3107D12A6x
APD
3
8
1200 1.58 at 2.5 A
51
107 x 130
Bondable
Solderable
150
12
6
VS-H3115D12A6x
APD
3
15
1200
2 at 5 A
52
115 x 155
Bondable
Solderable
150
12
6
VS-H3135D06A6x
APD
3
30
600
1.2 at 5 A
68
135 x 135
Bondable
Solderable
150
14.8
6
VS-H3169D12A6x
APD
3
25
1200
1.5 at 5 A
60
169 x 220
Bondable
Solderable
150
12
6
VS-H3169E12A6x
APD
3
25
1200
1.8 at 5 A
54
169 x 220
Bondable
Solderable
150
12
6
VS-H3171D06A6x
APD
3
50
600
1.1 at 5 A
69
171 x 171
Bondable
Solderable
150
14.8
6
VS-H3195D12A6x
APD
3
50
1200
1.3 at 5 A
72
195 x 340
Bondable
Solderable
150
12
6
VS-H3230D06A6x
APD
3
100
600
1 at 5 A
73
230 x 231
Bondable
Solderable
150
14.8
6
VS-H3234D12A6x
APD
3
75
1200
1.2 at 5 A
82
234 x 443
Bondable
Solderable
150
12
6
VS-H3257D12A6x
APD
3
50
1200
1.3 at 5 A
74
257 x 257
Bondable
Solderable
150
12
6
VS-H3356D06A6x
APD
3
240
600
1.1 at 5 A
90
356 x 356
Bondable
Solderable
150
14.8
6
VS-H3357D12A6x
APD
3
100
1200
1.2 at 5 A
85
357 x 357
Bondable
Solderable
150
12
6
selector guide
14/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
High Voltage Standard / Soft Recover y Diodes
High Voltage Standard / Soft Recovery Diodes Features
These diodes are specifically designed for high-power applications, such as input rectification and high-frequency welding
applications. Electrical and mechanical optimized glass passivation ensures a high breakdown voltage.
Vishay Portfolio
• Vishay offers standard recovery and fast recovery diodes as bare die, with ratings from 600 V to 1600 V
• Tj max is 150 °C
• Several die sizes are available with current handling to 100 A and beyond
• Available with bondable metalization
Typical Applications For High Voltage Standard / Fast Diodes
1. AC Mains Rectification
2. Blocking Diodes for Solar Cells
3. Alternator Rectification
Typical Circuits
1. AC Mains Rectification
2. Blocking Diodes for Solar Cells
3. Alternator Rectification
selector guide
15/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
High Voltage Standard / Soft Recover y Diodes
High Voltage Standard / Soft Recovery MOAT Diodes Die P / N List
Part Number
Structure
IF(AV)
(A)
VR
(V)
VF max
at 25 °C
(V)
Die Size
(mils2)
Front side
Metal
Back side
Metal
Die Thickness
(mils)
Wafer
Diameter
(inches)
VS-VS080DM12Cx
MOAT Standard
4
1200
1.1
80 x 80
Bondable
Solderable
11.6
4
VS-VS135DM08Cx
MOAT Standard
10
800
1.1
100 x 135
Bondable
Solderable
11.6
4
VS-VS135DM10Cx
MOAT Standard
10
1000
1.1
100 x 135
Bondable
Solderable
11.6
4
VS-VS135DM12Cx
MOAT Standard
10
1200
1.1
100 x 135
Bondable
Solderable
11.6
4
VS-VS135DM16Cx
MOAT Standard
8
1600
1.1
100 x 135
Bondable
Solderable
13.4
4
VS-VS155DM16Cx
MOAT Standard
15
1600
1.1
155 x 155
Bondable
Solderable
13.4
5
VS-VS180DM12Cx
MOAT Standard
20
1200
1.1
180 x 180
Bondable
Solderable
12
5
VS-VS180DM16Cx
MOAT Standard
20
1600
1.1
180 x 180
Bondable
Solderable
13.4
5
VS-VS207DM12Cx
MOAT Standard
20
1200
1.1
157 x 207
Bondable
Solderable
12
5
VS-VS210DM12Cx
MOAT Standard
20
1200
1.15
210 x 210
Bondable
Solderable
13.4
5
VS-VS210DM16Cx
MOAT Standard
20
1600
1.15
210 x 210
Bondable
Solderable
13.4
5
VS-VS230DM12Cx
MOAT Standard
40
1200
1.1
230 x 230
Bondable
Solderable
12
5
VS-VS230DM16Cx
MOAT Standard
40
1600
1.14
230 x 230
Bondable
Solderable
13.4
5
VS-VS340DM12Cx
MOAT Standard
60
1200
1.09
350 x 230
Bondable
Solderable
12
5
VS-VS340DM16Cx
MOAT Standard
60
1600
1.09
230 x 350
Bondable
Solderable
13.4
5
VS-VS350DM16Cx
MOAT Standard
60
1600
1.07 at 60 A
356 x 356
Bondable
Solderable
13.4
5
VS-VS390DM12Cx
MOAT Standard
80
1200
1.17
270 x 390
Bondable
Solderable
13.4
5
VS-VS480DM16Cx
MOAT Standard
100
1600
1.06 at 60 A
480 x 480
Bondable
Solderable
13.4
5
VS-VS590DM12Cx
MOAT Standard
165
1200
1.43
590 x 590
Bondable
Solderable
13.4
5
VS-VS060LM06CS02Cx
MOAT Fast
2
600
1.3
60 x 60
Bondable
Solderable
10.4
4
VS-VS135LM06CS02Cx
MOAT Fast
8
600
1.2
100 x 135
Bondable
Solderable
10.4
4
VS-VS135LM12CS05Cx
MOAT Fast
8
1200
1.3
100 x 135
Bondable
Solderable
10.4
4
VS-VS180LM06CS02Cx
MOAT Fast
20
600
1.3
180 x 180
Bondable
Solderable
10.4
5
VS-VS180LM12CS05Cx
MOAT Fast
20
1200
1.31
180 x 180
Bondable
Solderable
10.4
5
VS-VS207LM06CS02Cx
MOAT Fast
20
600
1.3
157 x 207
Bondable
Solderable
10.4
5
VS-VS230LM06CS02Cx
MOAT Fast
40
600
1.25
230 x 230
Bondable
Solderable
10.4
5
VS-VS230LM12CS05Cx
MOAT Fast
40
1200
1.4
230 x 230
Bondable
Solderable
10.4
5
VS-VS340LM06CS02Cx
MOAT Fast
60
600
1.3
230 x 350
Bondable
Solderable
10.4
5
VS-VS340LM12CS05Cx
MOAT Fast
60
1200
1.4
230 x 350
Bondable
Solderable
10.4
5
VS-VS390LM06CS02Cx
MOAT Fast
80
600
1.25
270 x 390
Bondable
Solderable
10.4
5
VS-VS390LM12CS05Cx
MOAT Fast
80
1200
1.35
270 x 390
Bondable
Solderable
10.4
5
selector guide
16/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Thyristors
Thyristor (SCR) Features
These are p-n-p-n devices typically utilized for switching high levels of power. Much more capable than a mechanical
switch, SCRs can be switched more than 10 000 time per second and widely adopted for motor speed controllers and
inverters.
Vishay Portfolio
• Vishay offers SCRs with ratings from 600 V to 1600 V
• Tj max is 125 °C
• Vishay technology includes glass passivated high voltage termination
• Die are available with bondable and solderable metalization
• Contact Vishay for specific requirements on Gate Position options (Center / Corner)
Typical Applications For Standard / Fast Diodes
1. AC Mains Rectification
2. Crowbar Protection
3. AC Bypass Switch
Typical Circuits
1. AC Mains Rectification
2.Crowbar Protection
3. AC Bypass Switch
selector guide
17/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Thyristors
Thyristors Die P / N List
Die Thickness
(mils)
Wafer
Diameter
(inches)
Solderable
11.8
4
Solderable
13.8
5
Solderable
Solderable
13.8
5
Solderable
Solderable
13.8
5
Bondable
Solderable
13.8
5
185 x 185
Bondable
Solderable
15.9
5
210 x 210
Solderable
Solderable
14.6
5
1.1 at 25 A
210 x 210
Solderable
Solderable
14.6
5
1.1 at 25 A
210 x 210
Solderable
Solderable
14.6
5
600
1.1 at 25 A
230 x 230
Solderable
Solderable
14.6
5
1200
1.1 at 25 A
230 x 230
Solderable
Solderable
14.6
5
800
1.1 at 25 A
250 x 250
Bondable
Solderable
14.6
5
1200
1.1 at 25 A
250 x 250
Bondable
Solderable
14.6
5
1.05 at 25 A
250 x 250
Bondable
Solderable
15.9
5
1200
1.1 at 25 A
250 x 250
Solderable
Solderable
14.6
5
600
1.05 at 25 A
250 x 250
Solderable
Solderable
13
5
40
1200
1.05 at 25 A
250 x 250
Solderable
Solderable
13
5
40
1600
1.05 at 25 A
250 x 250
Solderable
Solderable
15.9
5
VS-VS343SG12Hx
50
1200
0.9 at 25 A
343 x 343
Solderable
Solderable
13
5
VS-VS350SG10Hx
50
1000
0.9 at 25 A
350 x 350
Solderable
Solderable
14.6
5
IT(AV)
(A)
VR
(V)
VTM max
at 25 °C
(V)
Die Size
(mils2)
VS-VS110BG12Dx
8
1200
.95 at 6.5 A
110 x 110
Bondable
VS-VS155BG12Dx
15
1200
1 at 10 A
150 x 150
Bondable
VS-VS180SG06Hx
25
600
1.00 at 16 A
180 x 180
VS-VS180SG12Hx
25
1200
1.00 at 16 A
180 x 180
VS-VS185BG12Dx
16
1200
1.00 at 16 A
185 x 185
VS-VS185BG14Dx
16
1400
1.00 at 16 A
VS-VS210SG06Hx
25
600
1.1 at 25 A
VS-VS210SG10Hx
25
1000
VS-VS210SG12Hx
25
1200
VS-VS230SG06Hx
25
VS-VS230SG12Hx
25
VS-VS250BG08Dx
40
VS-VS250GB12Dx
40
VS-VS250GB14Dx
40
1400
VS-VS250SG12Hx
40
VS-VS255SG06Hx
40
VS-VS255SG12Hx
VS-VS255SG16Hx
Part Number
Front Side Metal Back Side Metal
VS-VS350SG12Hx
50
1200
0.9 at 25 A
350 x 350
Solderable
Solderable
14.6
5
VS-VS370GB08Dx
70
800
0.91 at 25 A
370 x 370
Bondable
Solderable
14.6
5
VS-VS370GB12Dx
70
1200
0.91 at 25 A
370 x 370
Bondable
Solderable
14.6
5
VS-VS370SG12Hx
70
1200
0.91 at 25 A
370 x 370
Solderable
Solderable
14.6
5
VS-VS370SG16Hx
70
1600
0.93 at 25 A
370 x 370
Solderable
Solderable
15.9
5
VS-VS480BG12Dx
110
1200
0.95 at 25 A
480 x 480
Bondable
Solderable
14.6
5
VS-VS480SG06Hx
110
600
0.95 at 25 A
480 x 480
Solderable
Solderable
14.6
5
VS-VS480SG10Hx
110
1000
0.95 at 25 A
480 x 480
Solderable
Solderable
14.6
5
VS-VS480SG12Hx
110
1200
0.95 at 25 A
480 x 480
Solderable
Solderable
14.6
5
VS-VS480SG16Hx
110
1600
0.95 at 25 A
480 x 480
Solderable
Solderable
15.9
5
VS-VS590SG04Hx
180
400
0.9 at 25 A
590 x 590
Solderable
Solderable
11.8
5
VS-VS590SG06Hx
180
600
0.9 at 25 A
590 x 590
Solderable
Solderable
11.8
5
VS-VS590SG08Hx
180
800
0.9 at 25 A
590 x 590
Solderable
Solderable
11.8
5
VS-VS590SG10Hx
180
1000
0.9 at 25 A
590 x 590
Solderable
Solderable
11.8
5
VS-VS590SG12Hx
180
1200
0.9 at 25 A
590 x 590
Solderable
Solderable
14.6
5
selector guide
18/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
T VS
TVS Diode Features
Transit Voltage Suppressors (TVS) are devices used to protect vulnerable circuits from electrical overstress such as that
caused by electrostatic discharge, inductive load switching, and induced lightning. Within the TVS device, damaging
voltage spikes are limited by clamping or avalanche action of a rugged silicon pn junction, which reduces the amplitude of
the transient to a nondestructive level.
Vishay Portfolio
• Vishay offers PAR® TVS as bare die, unidirectional polarity only
• Tj max is 150 °C
• VBR ranging from 6.8 V to 47 V with peak pulse power capability from 300 W to 6.6 kW
• Die are available with solderable metalization for optimum surge capability
Typical Applications For Standard / Fast Diodes
1. General Purpose Surge Protection — lightning, Inductive load, ESD…
2. Automotive Load Dump Protection
Typical Circuits
1. General Purpose Surge Protection — lightning, Inductive load, ESD…
Clamped
Transient
+
Protected
Load
Transient
Current
TVS
–
2. Automotive Load Dump Protection
12 V Load
Signal
Input
High Voltage Load
Signal Line
Protection
Battery
and
Alternator
DC/DC
Converter
Micro
Processor
Drive
Circuit
Load
Load
Dump
selector guide
Secondary
Protection
19/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
T VS
TVS Die P / N List
VBR
VBR
at IT
at IT
max
min (V)
(V)
Part Number
Die Size
(mils)
Package
Product
Family
TV050B010S4PT
50 x 50
Tape and Reel
TVS Solderable
9.5
TV050B011S4PT
50 x 50
Tape and Reel
TVS Solderable
TV050B012S4PT
50 x 50
Tape and Reel
TV050B013S4PT
50 x 50
TV050B015S4PT
Power
IQ Finished Good
Rating
(µA) Part Number
(W)
TJ Max.
(ºC)
Package
Style
400
185
MPG06
TMPG06-11A
400
185
MPG06
1
TMPG06-12A
400
185
MPG06
11.1
1
TMPG06-13A
400
185
MPG06
1
12.8
1
TMPG06-15A
400
185
MPG06
16.8
1
13.6
1
TMPG06-16A
400
185
MPG06
17.1
18.9
1
15.3
1
TMPG06-18A
400
185
MPG06
TVS Solderable
19
21
1
17
1
TMPG06-20A
400
185
MPG06
Tape and Reel
TVS Solderable
20.9
23.1
1
18.8
1
TMPG06-22A
400
185
MPG06
50 x 50
Tape and Reel
TVS Solderable
22.8
25.2
1
20.5
1
TMPG06-24A
400
185
MPG06
TV050B027S4PT
50 x 50
Tape and Reel
TVS Solderable
25.7
28.4
1
23.1
1
TMPG06-27A
400
185
MPG06
TV050B030S4PT
50 x 50
Tape and Reel
TVS Solderable
28.5
31.5
1
25.6
1
TMPG06-30A
400
185
MPG06
TV050B033S4PT
50 x 50
Tape and Reel
TVS Solderable
31.4
34.7
1
28.2
1
TMPG06-33A
400
185
MPG06
TV050B036S4PT
50 x 50
Tape and Reel
TVS Solderable
34.2
37.8
1
30.8
1
TMPG06-36A
400
185
MPG06
TV050B039S4PT
50 x 50
Tape and Reel
TVS Solderable
37.1
41
1
33.3
1
TMPG06-39A
400
185
MPG06
TV050B043S4PT
50 x 50
Tape and Reel
TVS Solderable
40.9
45.2
1
36.8
1
TMPG06-43A
400
185
MPG06
TV050B6P8S4PT
50 x 50
Tape and Reel
TVS Solderable
6.45
7.14
10
5.8
300
TMPG06-6.8A
400
185
MPG06
TV050B7P5S4PT
50 x 50
Tape and Reel
TVS Solderable
7.13
7.88
10
6.4
150
TMPG06-7.5A
400
185
MPG06
TV050B8P2S4PT
50 x 50
Tape and Reel
TVS Solderable
7.79
8.61
10
7.02
50
TMPG06-8.2A
400
185
MPG06
TV050B9P1S4PT
50 x 50
Tape and Reel
TVS Solderable
8.65
9.55
1
7.78
10
TMPG06-9.1A
400
185
MPG06
TV060B6P8S4PT
60 x 60
Tape and Reel
TVS Solderable
6.45
7.14
10
5.8
300
TPSMA6.8A
400
185
DO-214AC
TV060B7P5S4PT
60 x 60
Tape and Reel
TVS Solderable
7.13
7.88
10
6.4
150
TPSMA7.5A
400
185
DO-214AC
TV060B8P2S4PT
60 x 60
Tape and Reel
TVS Solderable
7.79
8.61
10
7.02
50
TPSMA8.2A
400
185
DO-214AC
TV060B9P1S4PT
60 x 60
Tape and Reel
TVS Solderable
8.65
9.55
1
7.78
10
TPSMA9.1A
400
185
DO-214AC
TV070B010S4PT
70 x 70
Tape and Reel
TVS Solderable
9.5
10.5
1
8.55
5
TPSMA10A
400
185
DO-214AC
TV070B011S4PT
70 x 70
Tape and Reel
TVS Solderable
10.5
11.6
1
9.4
2
TPSMA11A
400
185
DO-214AC
TV070B012S4PT
70 x 70
Tape and Reel
TVS Solderable
11.4
12.6
1
10.2
2
TPSMA12A
400
185
DO-214AC
TV070B013S4PT
70 x 70
Tape and Reel
TVS Solderable
12.4
13.7
1
11.1
2
TPSMA13A
400
185
DO-214AC
TV070B015S4PT
70 x 70
Tape and Reel
TVS Solderable
14.3
15.8
1
12.8
1
TPSMA15A
400
185
DO-214AC
TV070B016S4PT
70 x 70
Tape and Reel
TVS Solderable
15.2
16.8
1
13.6
1
TPSMA16A
400
185
DO-214AC
TV070B018S4PT
70 x 70
Tape and Reel
TVS Solderable
17.1
18.9
1
15.3
1
TPSMA18A
400
185
DO-214AC
TV070B020S4PT
70 x 70
Tape and Reel
TVS Solderable
19
21
1
17.1
1
TPSMA20A
400
185
DO-214AC
IT
(mA)
VWM
(V)
10.5
1
8.55
5
TMPG06-10A
10.5
11.6
1
9.4
2
TVS Solderable
11.4
12.6
1
10.2
Tape and Reel
TVS Solderable
12.4
13.7
1
50 x 50
Tape and Reel
TVS Solderable
14.3
15.8
TV050B016S4PT
50 x 50
Tape and Reel
TVS Solderable
15.2
TV050B018S4PT
50 x 50
Tape and Reel
TVS Solderable
TV050B020S4PT
50 x 50
Tape and Reel
TV050B022S4PT
50 x 50
TV050B024S4PT
selector guide
20/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
T VS
TVS Die P / N List
VBR
VBR
at IT
at IT
max
min (V)
(V)
Part Number
Die Size
(mils)
Package
Product
Family
TV070B022S4PT
70 x 70
Tape and Reel
TVS Solderable
20.9
TV070B024S4PT
70 x 70
Tape and Reel
TVS Solderable
TV070B027S4PT
70 x 70
Tape and Reel
TV070B030S4PT
70 x 70
TV070B033S4PT
Power
IQ Finished Good
Rating
(µA) Part Number
(W)
TJ Max.
(ºC)
Package
Style
400
185
DO-214AC
TPSMA24A
400
185
DO-214AC
1
TPSMA27A
400
185
DO-214AC
25.6
1
TPSMA30A
400
185
DO-214AC
1
28.2
1
TPSMA33A
400
185
DO-214AC
37.8
1
30.8
1
TPSMA36A
400
185
DO-214AC
37.1
41
1
33.3
1
TPSMA39A
400
185
DO-214AC
TVS Solderable
40.9
45.2
1
36.8
1
TPSMA43A
400
185
DO-214AC
Tape and Reel
TVS Solderable
6.45
7.14
10
5.8
500
TPSMA6.8A
400
185
DO-214AC
70 x 70
Tape and Reel
TVS Solderable
7.13
7.88
10
6.4
250
TPSMA7.5A
400
185
DO-214AC
TV070B8P2S4PT
70 x 70
Tape and Reel
TVS Solderable
7.79
8.61
10
7.02
100
TPSMA8.2A
400
185
DO-214AC
TV070B9P1S4PT
70 x 70
Tape and Reel
TVS Solderable
8.65
9.55
1
7.78
25
TPSMA9.1A
400
185
DO-214AC
TV110B010S4PU
110 x 110 Tape and Reel
TVS Solderable
9.5
10.5
1
8.55
20
TPSMC10A
1500
185
DO-214AB
TV110B011S4PU
110 x 110 Tape and Reel
TVS Solderable
10.5
11.6
1
9.4
5
TPSMC11A
1500
185
DO-214AB
TV110B012S4PU
110 x 110 Tape and Reel
TVS Solderable
11.4
12.6
1
10.2
2
TPSMC12A
1500
185
DO-214AB
TV110B013S4PU
110 x 110 Tape and Reel
TVS Solderable
12.4
13.7
1
11.1
2
TPSMC13A
1500
185
DO-214AB
TV110B015S4PU
110 x 110 Tape and Reel
TVS Solderable
14.3
15.8
1
12.8
1
TPSMC15A
1500
185
DO-214AB
TV110B016S4PU
110 x 110 Tape and Reel
TVS Solderable
15.2
16.8
1
13.6
1
TPSMC16A
1500
185
DO-214AB
TV110B018S4PU
110 x 110 Tape and Reel
TVS Solderable
17.1
18.9
1
15.3
1
TPSMC18A
1500
185
DO-214AB
TV110B020S4PU
110 x 110 Tape and Reel
TVS Solderable
19
21
1
17.1
1
TPSMC20A
1500
185
DO-214AB
TV110B022S4PU
110 x 110 Tape and Reel
TVS Solderable
20.9
23.1
1
18.8
1
TPSMC22A
1500
185
DO-214AB
TV110B024S4PU
110 x 110 Tape and Reel
TVS Solderable
22.8
25.2
1
20.5
1
TPSMC24A
1500
185
DO-214AB
TV110B027S4PU
110 x 110 Tape and Reel
TVS Solderable
25.7
28.4
1
23.1
1
TPSMC27A
1500
185
DO-214AB
TV110B030S4PU
110 x 110 Tape and Reel
TVS Solderable
28.5
31.5
1
25.6
1
TPSMC30A
1500
185
DO-214AB
TV110B033S4PU
110 x 110 Tape and Reel
TVS Solderable
31.4
34.7
1
28.2
1
TPSMC33A
1500
185
DO-214AB
TV110B036S4PU
110 x 110 Tape and Reel
TVS Solderable
34.2
37.8
1
30.8
1
TPSMC36A
1500
185
DO-214AB
TV110B039S4PU
110 x 110 Tape and Reel
TVS Solderable
37.1
41
1
33.3
1
TPSMC39A
1500
185
DO-214AB
TV110B043S4PU
110 x 110 Tape and Reel
TVS Solderable
40.9
45.2
1
36.8
1
TPSMC43A
1500
185
DO-214AB
TV110B047S4PU
110 x 110 Tape and Reel
TVS Solderable
44.7
49.4
1
40.2
1
TPSMC47A
1500
185
DO-214AB
TV110B6P8S4PU
110 x 110 Tape and Reel
TVS Solderable
6.45
7.14
10
5.8
1000
TPSMC6.8A
1500
185
DO-214AB
TV110B7P4S4PU
110 x 110 Tape and Reel
TVS Solderable
7.13
7.88
10
6.4
500
TPSMC7.5A
1500
185
DO-214AB
TV110B8P2S4PU
110 x 110 Tape and Reel
TVS Solderable
7.79
8.61
10
7.02
200
TPSMC8.2A
1500
185
DO-214AB
IT
(mA)
VWM
(V)
23.1
1
18.8
1
TPSMA22A
22.8
25.2
1
20.5
1
TVS Solderable
25.7
28.4
1
23.1
Tape and Reel
TVS Solderable
28.5
31.5
1
70 x 70
Tape and Reel
TVS Solderable
31.4
34.7
TV070B036S4PT
70 x 70
Tape and Reel
TVS Solderable
34.2
TV070B039S4PT
70 x 70
Tape and Reel
TVS Solderable
TV070B043S4PT
70 x 70
Tape and Reel
TV070B6P8S4PT
70 x 70
TV070B7P5S4PT
selector guide
21/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
T VS
TVS Die P / N List
Part Number
Die Size
(mils)
Package
Product
Family
VBR
VBR
at IT
at IT
max
min (V)
(V)
IT
(mA)
VWM
(V)
Power
IQ Finished Good
Rating
(µA) Part Number
(W)
TJ Max.
(ºC)
Package
Style
TV110B9P1S4PU
110 x 110 Tape and Reel
TVS Solderable
8.65
9.55
1
7.78
50
TPSMC9.1A
1500
185
DO-214AB
TV134T010S4PV
134 x 134 Tape and Reel
TVS Solderable
11.1
12.3
1
10
5
3KASMC10A
3000
185
DO-214AB
TV134T011S4PV
134 x 134 Tape and Reel
TVS Solderable
12.2
13.5
1
11
5
3KASMC11A
3000
185
DO-214AB
TV134T012S4PV
134 x 134 Tape and Reel
TVS Solderable
13.3
14.7
1
12
5
3KASMC12A
3000
185
DO-214AB
TV134T013S4PV
134 x 134 Tape and Reel
TVS Solderable
14.4
15.9
1
13
5
3KASMC13A
3000
185
DO-214AB
TV134T014S4PV
134 x 134 Tape and Reel
TVS Solderable
15.6
17.2
1
14
5
3KASMC14A
3000
185
DO-214AB
TV134T015S4PV
134 x 134 Tape and Reel
TVS Solderable
16.7
18.5
1
15
5
3KASMC15A
3000
185
DO-214AB
TV134T016S4PV
134 x 134 Tape and Reel
TVS Solderable
17.8
19.7
1
16
5
3KASMC16A
3000
185
DO-214AB
TV134T017S4PV
134 x 134 Tape and Reel
TVS Solderable
18.9
20.9
1
17
5
3KASMC17A
3000
185
DO-214AB
TV134T018S4PV
134 x 134 Tape and Reel
TVS Solderable
20
22.1
1
18
5
3KASMC18A
3000
185
DO-214AB
TV134T020S4PV
134 x 134 Tape and Reel
TVS Solderable
22.2
24.5
1
20
5
3KASMC20A
3000
185
DO-214AB
TV134T022S4PV
134 x 134 Tape and Reel
TVS Solderable
24.4
26.9
1
22
5
3KASMC22A
3000
185
DO-214AB
TV134T024S4PV
134 x 134 Tape and Reel
TVS Solderable
26.7
29.5
1
24
5
3KASMC24A
3000
185
DO-214AB
TV134T026S4PV
134 x 134 Tape and Reel
TVS Solderable
28.9
31.9
1
26
5
3KASMC26A
3000
185
DO-214AB
TV134T028S4PV
134 x 134 Tape and Reel
TVS Solderable
31.1
34.4
1
28
5
3KASMC28A
3000
185
DO-214AB
TV134T030S4PV
134 x 134 Tape and Reel
TVS Solderable
33.3
36.8
1
30
5
3KASMC30A
3000
185
DO-214AB
TV134T033S4PV
134 x 134 Tape and Reel
TVS Solderable
36.7
40.6
1
33
5
3KASMC33A
3000
185
DO-214AB
TV134T036S4PV
134 x 134 Tape and Reel
TVS Solderable
40
44.2
1
36
5
3KASMC36A
3000
185
DO-214AB
TV134T040S4PV
134 x 134 Tape and Reel
TVS Solderable
44.4
49.1
1
40
5
3KASMC40A
3000
185
DO-214AB
TV134T043S4PV
134 x 134 Tape and Reel
TVS Solderable
47.8
52.8
1
43
5
3KASMC43A
3000
185
DO-214AB
TV162L027S6PV
162 x 162 Tape and Reel
TVS Solderable
24
30
10
22
0
SM5A27
3600
175
DO-218AB
TV162T010S4PV
162 x 162 Tape and Reel
TVS Solderable
11.1
12.3
1
10
15
SM5S10A
3600
175
DO-218AB
TV162T011S4PV
162 x 162 Tape and Reel
TVS Solderable
12.2
13.5
1
11
10
SM5S11A
3600
175
DO-218AB
TV162T012S4PV
162 x 162 Tape and Reel
TVS Solderable
13.3
14.7
1
12
10
SM5S12A
3600
175
DO-218AB
TV162T013S4PV
162 x 162 Tape and Reel
TVS Solderable
14.4
15.9
1
13
10
SM5S13A
3600
175
DO-218AB
TV162T014S4PV
162 x 162 Tape and Reel
TVS Solderable
15.6
17.2
1
14
10
SM5S14A
3600
175
DO-218AB
TV162T015S4PV
162 x 162 Tape and Reel
TVS Solderable
16.7
18.5
1
15
10
SM5S15A
3600
175
DO-218AB
TV162T016S4PV
162 x 162 Tape and Reel
TVS Solderable
17.8
19.7
1
16
10
SM5S16A
3600
175
DO-218AB
TV162T017S4PV
162 x 162 Tape and Reel
TVS Solderable
18.9
20.9
1
17
10
SM5S17A
3600
175
DO-218AB
TV162T018S4PV
162 x 162 Tape and Reel
TVS Solderable
20
22.1
1
18
10
SM5S18A
3600
175
DO-218AB
TV162T020S4PV
162 x 162 Tape and Reel
TVS Solderable
22.2
24.5
1
20
10
SM5S20A
3600
175
DO-218AB
TV162T022S4PV
162 x 162 Tape and Reel
TVS Solderable
24.4
26.9
1
22
10
SM5S22A
3600
175
DO-218AB
selector guide
22/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
T VS
TVS Die P / N List
Product
Family
VBR
VBR
at IT
at IT
max
min (V)
(V)
Power
IQ Finished Good
Rating
(µA) Part Number
(W)
TJ Max.
(ºC)
Package
Style
3600
175
DO-218AB
SM5S26A
3600
175
DO-218AB
10
SM5S28A
3600
175
DO-218AB
30
10
SM5S30A
3600
175
DO-218AB
1
33
10
SM5S33A
3600
175
DO-218AB
44.2
1
36
10
SM5S36A
3600
175
DO-218AB
24
30
10
22
0
SM6A27
4600
175
DO-218AB
TVS Solderable
11.1
12.3
5
10
15
SM6S10A
4600
175
DO-218AB
180 x 180 Tape and Reel
TVS Solderable
12.2
13.5
5
11
10
SM6S11A
4600
175
DO-218AB
TV180T012S4PV
180 x 180 Tape and Reel
TVS Solderable
13.3
14.7
5
12
10
SM6S12A
4600
175
DO-218AB
TV180T013S4PV
180 x 180 Tape and Reel
TVS Solderable
14.4
15.9
5
13
10
SM6S13A
4600
175
DO-218AB
TV180T014S4PV
180 x 180 Tape and Reel
TVS Solderable
15.6
17.2
5
14
10
SM6S14A
4600
175
DO-218AB
TV180T015S4PV
180 x 180 Tape and Reel
TVS Solderable
16.7
18.5
5
15
10
SM6S15A
4600
175
DO-218AB
TV180T016S4PV
180 x 180 Tape and Reel
TVS Solderable
17.8
19.7
5
16
10
SM6S16A
4600
175
DO-218AB
TV180T017S4PV
180 x 180 Tape and Reel
TVS Solderable
18.9
20.9
5
17
10
SM6S17A
4600
175
DO-218AB
TV180T018S4PV
180 x 180 Tape and Reel
TVS Solderable
20
22.1
5
18
10
SM6S18A
4600
175
DO-218AB
TV180T020S4PV
180 x 180 Tape and Reel
TVS Solderable
22.2
24.5
5
20
10
SM6S20A
4600
175
DO-218AB
TV180T022S4PV
180 x 180 Tape and Reel
TVS Solderable
24.4
26.9
5
22
10
SM6S22A
4600
175
DO-218AB
TV180T024S4PV
180 x 180 Tape and Reel
TVS Solderable
26.7
29.5
5
24
10
SM6S24A
4600
175
DO-218AB
TV180T026S4PV
180 x 180 Tape and Reel
TVS Solderable
28.9
31.9
5
26
10
SM6S26A
4600
175
DO-218AB
TV180T028S4PV
180 x 180 Tape and Reel
TVS Solderable
31.1
34.4
5
28
10
SM6S28A
4600
175
DO-218AB
TV180T030S4PV
180 x 180 Tape and Reel
TVS Solderable
33.3
36.8
5
30
10
SM6S30A
4600
175
DO-218AB
TV180T033S4PV
180 x 180 Tape and Reel
TVS Solderable
36.7
40.6
5
33
10
SM6S33A
4600
175
DO-218AB
TV180T036S4PV
180 x 180 Tape and Reel
TVS Solderable
40
44.2
5
36
10
SM6S36A
4600
175
DO-218AB
TV210L027S6PV
210 x 210 Tape and Reel
TVS Solderable
24
30
10
22
1
SM8A27
6600
175
DO-218AB
TV210T010S4PV
210 x 210 Tape and Reel
TVS Solderable
11.1
12.3
5
10
15
SM8S10A
6600
175
DO-218AB
TV210T011S4PV
210 x 210 Tape and Reel
TVS Solderable
12.2
13.5
5
11
10
SM8S11A
6600
175
DO-218AB
TV210T012S4PV
210 x 210 Tape and Reel
TVS Solderable
13.3
14.7
5
12
10
SM8S12A
6600
175
DO-218AB
TV210T013S4PV
210 x 210 Tape and Reel
TVS Solderable
14.4
15.9
5
13
10
SM8S13A
6600
175
DO-218AB
TV210T014S4PV
210 x 210 Tape and Reel
TVS Solderable
15.6
17.2
5
14
10
SM8S14A
6600
175
DO-218AB
TV210T015S4PV
210 x 210 Tape and Reel
TVS Solderable
16.7
18.5
5
15
10
SM8S15A
6600
175
DO-218AB
TV210T016S4PV
210 x 210 Tape and Reel
TVS Solderable
17.8
19.7
5
16
10
SM8S16A
6600
175
DO-218AB
Part Number
Die Size
(mils)
TV162T024S4PV
162 x 162 Tape and Reel
TVS Solderable
26.7
TV162T026S4PV
162 x 162 Tape and Reel
TVS Solderable
TV162T028S4PV
162 x 162 Tape and Reel
TV162T030S4PV
IT
(mA)
VWM
(V)
29.5
1
24
10
SM5S24A
28.9
31.9
1
26
10
TVS Solderable
31.1
34.4
1
28
162 x 162 Tape and Reel
TVS Solderable
33.3
36.8
1
TV162T033S4PV
162 x 162 Tape and Reel
TVS Solderable
36.7
40.6
TV162T036S4PV
162 x 162 Tape and Reel
TVS Solderable
40
TV180L027S6PV
180 x 180 Tape and Reel
TVS Solderable
TV180T010S4PV
180 x 180 Tape and Reel
TV180T011S4PV
selector guide
Package
23/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
T VS
TVS Die P / N List
Product
Family
VBR
VBR
at IT
at IT
max
min (V)
(V)
Power
IQ Finished Good
Rating
(µA) Part Number
(W)
TJ Max.
(ºC)
Package
Style
6600
175
DO-218AB
SM8S18A
6600
175
DO-218AB
10
SM8S20A
6600
175
DO-218AB
22
10
SM8S22A
6600
175
DO-218AB
5
24
10
SM8S24A
6600
175
DO-218AB
31.9
5
26
10
SM8S26A
6600
175
DO-218AB
31.1
34.4
5
28
10
SM8S28A
6600
175
DO-218AB
TVS Solderable
33.3
36.8
5
30
10
SM8S30A
6600
175
DO-218AB
210 x 210 Tape and Reel
TVS Solderable
36.7
40.6
5
33
10
SM8S33A
6600
175
DO-218AB
TV210T036S4PV
210 x 210 Tape and Reel
TVS Solderable
40
44.2
5
36
10
SM8S36A
6600
175
DO-218AB
TV210T040S4PV
210 x 210 Tape and Reel
TVS Solderable
44.4
49.1
5
40
10
SM8S40A
6600
175
DO-218AB
TV210T043S4PV
210 x 210 Tape and Reel
TVS Solderable
47.8
52.8
5
43
10
SM8S43A
6600
175
DO-218AB
Part Number
Die Size
(mils)
TV210T017S4PV
210 x 210 Tape and Reel
TVS Solderable
18.9
TV210T018S4PV
210 x 210 Tape and Reel
TVS Solderable
TV210T020S4PV
210 x 210 Tape and Reel
TV210T022S4PV
IT
(mA)
VWM
(V)
20.9
5
17
10
SM8S17A
20
22.1
5
18
10
TVS Solderable
22.2
24.5
5
20
210 x 210 Tape and Reel
TVS Solderable
24.4
26.9
5
TV210T024S4PV
210 x 210 Tape and Reel
TVS Solderable
26.7
29.5
TV210T026S4PV
210 x 210 Tape and Reel
TVS Solderable
28.9
TV210T028S4PV
210 x 210 Tape and Reel
TVS Solderable
TV210T030S4PV
210 x 210 Tape and Reel
TV210T033S4PV
selector guide
Package
24/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Zener Diodes
Zener Diodes Features
Zener diodes are designed to work in the breakdown region of the reverse current-voltage characteristic.
The technology is Silicon Epitaxial Planar. Different wafer and bare die options are available with breakdown voltages from
2 V to 200 V, with voltages graded according to the international E24 standard. The typical voltage tolerance is ±5 %, but
tighter tolerances are available as well. The diodes are used as voltage regulator and voltage references or as voltage
suppressors against surge and ESD events. Essential common features include low reverse leakage current levels and
stable breakdown with low impedance.
Vishay Portfolio
• Vishay offers 5 % tolerance Zener die in wafer or die-on-film form
• Zener voltage ratings from 3.3 V to 36 V
• 2 % VZ tolerance is available on selected number of parts
• Die are available with bondable metalization
Typical Applications For Standard / Fast Diodes
1. Voltage Regulating Diodes
2. Diode Clipper for AC Input Signal
3. Protection of Data Lines Against Voltage Transients by ESD Protection Diodes
Typical Circuits
1. Voltage Regulating Diodes:
a) Simple (Voltage Stabilization)
b) Variety of Different Reference Voltage Values
(Zener Diodes Connected in Series)
2. Diode Clipper for AC Input Signal
3. Protection of Data Lines Against Voltage Transients by
ESD Protection Diodes
Data Line
Ground
selector guide
25/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Zener Diodes
Zener Die P / N List
Part Number (1)
Rated
Nominal
Zener
Technology Voltage
at
IZ = 5 mA
(V)
Rated
Maximum
Reverse
Current
(µA)
Temperature
Coefficient of
Chip Size
Zener Voltage
(µm)
at IZ = 5 mA
(mV / K)
Front
Side
Metal
Bondpad
Size
(µm)
Back
Side
Metal
Die
Wafer
Thickness Diameter
(mm)
(inches)
BDBZX84C3V3-BDx
Znr ±5 %
3.3
5.0 (at 1 V)
−2.64 to −0.99
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C3V9-BDx
Znr ±5 %
3.9
3.0 (at 1 V)
−2.73 to −1.17
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C4V3-BDx
Znr ±5 %
4.3
3.0 (at 1 V)
−2.58 to −0.43
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C4V7-BDx
Znr ±5 %
4.7
3.0 (at 2 V)
−2.35 to +0.94
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84B5V1-BDx
Znr ± 2 %
5.1
2.0 (at 2 V)
−1.53 to +2.04
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C5V1-BDx
Znr ±5 %
5.1
2.0 (at 2 V)
−1.53 to +2.04
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C5V6-BDx
Znr ±5 %
5.6
1.0 (at 2 V)
−1.12 to +3.36
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C6V2-BDx
Znr ±5 %
6.2
3.0 (at 4 V)
−0.62 to +4.34
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84B6V8-BDx
Znr ± 2 %
6.8
2.0 (at 4 V)
+1.36 to +4.76
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C6V8-BDx
Znr ±5 %
6.8
2.0 (at 4 V)
+1.36 to +4.76
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C7V5-BDx
Znr ±5 %
7.5
1.0 (at 5 V)
+1.5 to +5.25
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84B8V2-BDx
Znr ± 2 %
8.2
0.7 (at 5 V)
+3.28 to +5.74
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C8V2-BDx
Znr ±5 %
8.2
0.7 (at 5 V)
+3.28 to +5.74
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84B9V1-BDx
Znr ± 2 %
9.1
0.5 (at 6 V)
+4.55 to +7.28
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C9V1-BDx
Znr ±5 %
9.1
0.5 (at 6 V)
+4.55 to +7.28
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C10-BDx
Znr ±5 %
10
0.2 (at 7 V)
+5.0 to +8.0
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C11-BDx
Znr ±5 %
11
0.1 (at 8 V)
+5.5 to +9.9
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C12-BDx
Znr ±5 %
12
0.1 (at 8 V)
+7.2 to +10.8
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C15-BDx
Znr ±5 %
15
0.05 (at 10.5 V)
+10.5 to +13.5
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C16-BDx
Znr ±5 %
16
0.05 (at 11.2 V)
+12.8 to +15.2
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C18-BDx
Znr ±5 %
18
0.05 (at 12.6 V)
+14.4 to +17.1
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C20-BDx
Znr ±5 %
20
0.05 (at 14 V)
+16 to +20
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C22-BDx
Znr ±5 %
22
0.05 (at 15.4 V)
+17.6 to +22
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C27-BDx
Znr ±5 %
27
0.05 (at 18.9 V)
+21.6 to +27.0
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDMMBZ27V-BDx
Znr ±5 %
27
0.08 (at 22 V)
max. 30 (at 1 mA) 500 x 500
Bondable 342 square Solderable
180 ± 15
4
BDBZX84C33-BDx
Znr ±5 %
33
0.05 (at 23.1 V)
+26.4 to +33.0
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C36-BDx
Znr ±5 %
36
0.05 (at 25.2 V)
+28.8 to +36.0
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C39-BDx
Znr ±5 %
39
0.05 (at 27.3 V)
+39 to +46.8
320 x 320
Bondable 162 square Solderable
180 ± 15
4
BDBZX84C47-BDx
Znr ±5 %
47
0.05 (at 32.9 V)
+47 to +56.4
320 x 320
Bondable 162 square Solderable
180 ± 15
4
(1) In the Part Number “x” stands for the delivery version. Contact Vishay to check which version(s) of Die-on-Wafer or Die-on-Film is/are available for the
chosen part number (voltage group).
selector guide
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VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Switching Diodes
Switching Diodes Features
Switching Diodes are designed for fast switching between the on and off state, i.e. between the forward and the reverse
direction of the diode. They are fast recovery diodes, the switching time is normally reduced by an additional doping
process. The technology is Silicon Epitaxial Planar. Wafers and bare dies are available with different power dissipations
and reverse voltage ratings. The diodes are used for general purposes and at high frequency applications. They have less
reverse leakage current than Schottky diodes, but they are not as fast as Schottky diodes..
Vishay Portfolio
• Vishay offers 1N4148 and 1N4150 in die and wafer form
• Die are available with bondable metalization
Typical Applications For Standard / Fast Diodes
1. Full-Wave Rectification
2. Logic Circuit
3. DC/DC Converter
Typical Circuits
1. Full Wave Rectification
2. Logic Circuit (e.g. and Logic)
+
–
3. DC/DC Converter
30 V
selector guide
5V
27/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Switching Diodes and ESD Protection
ESD Protection Diodes Die P / N List
Part Number (1)
BDESD12D3590-BDx
BDVESD05B-BDx
Rated
Rated
Rated Maximum
Nominal Breakdown
ESD Immunity
Voltage
Zener
Cont. Discharge
Technology
Range at
Voltage
(IEC 61000-4-2)
at IZ = 5 mA IR = 1 mA
(kV)
(V)
(V)
Chip
Size
(µm2)
Front
Side
Metal
Bondpad
Size
(µm)
Back
Side
Metal
Die
Wafer
Thickness Diameter
(mm)
(inches)
ESD Protection 11.0 to 13.0
0.1 (at 8 V)
±8
180 x 180 Bondable 70 square Solderable
100 ± 20
4
ESD Protection
0.1 (at 5 V)
±30
260 x 260 Bondable 90 rounded Solderable
100 ± 5
4
6.0 to 7.5
(1) In the Part Number “x” stands for the delivery version. Contact Vishay to check which among Die-on-Wafer, Die-on-Film are available for chosen
part number.
Switching Diodes Die P / N List
Part Number (1)
IF(AV)
(A) (2)
VR
(V)
VF max
at 25°C
(V) (3)
Chip Size
(µm2)
Front Side
Metal
Bondpad
Size
(µm)
Back
Side
Metal
Die Thickness
(mm)
Wafer
Diameter
(inches)
BD1N4148-BDx
0.15
100
1 at 10 mA
280 x 280
Bondable
108 square
Solderable
200 ± 20
4
BD1N4150-BDx
0.2
75
0.74 at 10 mA
280 x 280
Bondable
108 square
Solderable
200 ± 20
4
(1) In the Part Number “x” stands for the delivery version. Both Die-on-Wafer and Die-on-Film versions are available.
(2) Rated in discrete package or based on technology.
(3) See datasheets for details. Contact Vishay to check which among Die-on-Wafer and Die-on-Film are available for chosen part number.
selector guide
28/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Bare Die
Diodes - A Wide Range of Bare Die and Wafer Form Products
Packaging
Packing Options
Vishay provides you with several packing options which can fit with virutally any assembly line. Parts are 100 % probed
and inspected.
Unsawn wafer — die are not singulated, wafers are provided in box
Sawn wafer on film — wafer is provided on blue film where die are singulated, ready for pick and place
Die in tape and reel — die are located in pocket tape in several different types of reel
Die Waffle Pack — die are located in a tray with dimensions optimized for each die size
Please contact Vishay for all details related to packing options in order to best fit your requirements.
selector guide
29/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Diodes - A Wide Range of Bare Die and Wafer Form Products
Bare Die
Notes:
selector guide
30/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Diodes - A Wide Range of Bare Die and Wafer Form Products
Bare Die
Notes:
selector guide
31/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V i s h ay I n t e r t e c h n o l o g y, I n c .
Diodes - A Wide Range of Bare Die and Wafer Form Products
Bare Die
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95100 Selb
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Ph: +49-9287-71-0
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france
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Fax: +33-4-9337-2726
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PH: +86-21-5258 5000
FAX: +86-21-5258 7979
Vishay Ltd.
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Sunderland SR5 3XJ
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Fax: +44-191-549-9556
japan
VISHAY JAPAN CO., LTD.
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3-12-22, Shibuya
Shibuya-ku
Tokyo 150-0002
Japan
Ph: +81-3-5466-7150
fax: +81-3-5466-7160
selector guide
32/32
VMN-SG2163-1312
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000