V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Products in Several Versions to Accommodate a Wide Variety of Assembly Techniques and Applications TABLE OF CONTENTS Introduction To Bare Die..................................................................................................................... 02 Die Portfolio........................................................................................................................................ 03 • Nomenclature............................................................................................................................. 03 • Schottky Diodes......................................................................................................................... 05 • Ultrafast Diodes.......................................................................................................................... 10 –– FRED Pt®............................................................................................................................... 11 –– HEXFRED® Gen 2.................................................................................................................. 13 –– HEXFRED® Gen 3.................................................................................................................. 14 • High Voltage Standard / Soft Recovery Diodes......................................................................... 15 • Thyristors.................................................................................................................................... 17 • TVS............................................................................................................................................. 19 • Zener Diodes.............................................................................................................................. 25 • Switching Diodes........................................................................................................................ 27 • Switching Diodes and ESD Protection....................................................................................... 28 Packing Options................................................................................................................................. 29 Resources • For technical support contact [email protected] • For more information contact [email protected], [email protected], or [email protected] One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components selector guide 1/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Vishay supplies a wide range of small-signal and power diodes in bare die and wafer form: • Schottky diodes • Fred Pt® Ultrafast diodes • HEXFRED® Ultrafast diodes • TVS diodes • Zener diodes • ESD protection diodes • Switching diodes • High Voltage Standard/Fast diodes • Thyristors Packing Types Vishay delivers its bare die products in several versions to accommodate a wide variety of assembly techniques and applications: • Unsawn wafer: the wafers are delivered in a sealed bag and die are not singulated • Sawn wafer on film: the wafer is sawn and supplied on blue tape in a plastic frame • Die in tape and reel: each die is located in a pocket on a continuous antistatic coated reel • Waffle pack: each die is in a tray Die Usage Basic Guidelines Bare die products require careful handling and storage as well as optimized assembly processes and tools to avoid damage and deviations from expected performance. The following hints are based on Vishay’s many years of experience in manufacturing and assembling semiconductor devices. Die Attach Silicon cannot be joined to copper without the occurrence of thermal shock due to the significant difference in thermal conductivity between these materials. For this reason, and to ensure optimized electrical conductivity, Vishay wafers are coated on the back side with two or three metallic solderable layers which are suitable for a wide range of solders, ranging from solder alloys to conductive epoxies. Fluxes are not recommended for solders because residuals can contaminate the surface of the die, and cause voids under the die thus compromising heat dissipation and electrical performance. In general the safest approach is to adopt the same materials Vishay uses in the assembly of die into discrete packaged parts. Vishay experts can help you choose the best materials for your assembly requirements. Wire Bonding Vishay die are typically covered with an aluminum metalization which contains a small percentage of silicon (~1 %) for ultrasonic bonding or thermosonic bonding depending on whether aluminum or gold wires are adopted. The application of wires in parallel and stitch bonding provides protection against surge current in the vicinity of soldered chips. Several platforms are also provided with solderable metalization on the anode side which is suitable for solder attach. selector guide 2/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Naming Rules for Schottky, FRED Pt®, HEXFRED® and TVS Diodes SC 105 Product Type Chip size in mils SX = Planar Schottky Fab1 TY = TMBS® Schottky Fab1 TV = PAR® TVS SC = Planar Schottky Fab2 FD = FRED Pt Ultrafast H2 = HEXFRED Ultrafast Gen2 H3 = HEXFRED Ultrafast Gen3 H 100 Process Voltage For Schottky R = Tj max. 125 °C S = Tj max. 150 °C H = Tj max. 175 °C T = Gen5 Schottky For TVS PAR B = Named as Vbr T = Named as Vwm L = Load Dump Rectifier named as Vbr A 5 Surface Metal Wafer Diameter A = Wirebondable Topside: Ti/Al, Ti/Ni/Al 4 = 4" or Pure Al 5 = 5" or Al(1%Si) 6 = 6" Backside: Ti/Ni/Ag or CrNiAg S = Solderable Topside: Ni/Au or Ti/Ni/Ag Backside: Ni/Au or Ti/Ni/Ag or CrNiAg For FRED Pt This is SPEED code W = 14 ns to 17 ns H = 18 ns to 35 ns U = 36 ns to 50 ns C = 51 ns to 70 ns S = 71 ns to 90 ns L = 91 ns to 120 ns T = 121 ns to 200 ns N > 200 ns P R Quality Level (if defined) N Packaging Passivation B = Inked probed (valid for® unsawn wafer FRED Pt only) (wafer in box) none = SiO2 N = Silicon P = Probed die in Nitride waffle pack P = Packaged Die for T1 O = Packaged Die for T2 N = Non-packaged Die T = Known Tested Die D = Probed die in G = Known Good Die waffle pack (HEXFRED only) Thickness (valid for Planar Schottky Fab2 only) F = Inked probed sawn wafer on film none = standard 14 mils T = 10 mils M = Wirebondable for Medical Topside: Ti/Al or Pure Al Backside: Ti/Ni/Au R = Probed die in tape and 13" reel T = Probed die in 12 mm tape and 4 mm pitch, 7" reel (for 35~75 mil chip) Note: Ti(0.12um)/ Ni(0.18um)/ Au(0.05um) For HEXFRED H = Gen2 D = Gen3 E = Gen3 U = Probed die in 12 mm tape and 4 mm pitch, 7" reel (for 76~110 mil chip) V = Probed die in 12 mm tape and 8 mm pitch, 7" reel (for 111~300 mil chip) C = Probed die in plastic can (bulk) Digit always present Digit might miss (see legend) Bare Die Naming Rule for High Voltage Standard / Fast Diodes VS Vishay Semiconductor 180 Chip Size in Mils DM C S02 CB Voltage Code x 100 Surface Metal Speed Code Packaging DM = Standard Recovery Diode Glassivated Moat ‘06 = 600 V ‘08 = 800 V ‘10 = 1000 V ‘12 = 1200 V ‘16 = 1600 V C=Wirebondable Topside: 100% Al Backside: Cr/Ni/Ag None=Standard Recovery S02=200ns S05=500ns CB=Probed Uncut Die (Wafer In Box) None=Probed Die in Chip Carrier LM = Fast Recovery Diode- Glassivated Moat selector guide 12 Process 3/32 H=Solderable Topside: Cr/Ni/Ag Backside: Cr/Ni/Ag VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Digit always present Digit might miss (see legend) DIODES Bare Die Naming Rule for Thyristors VS Vishay Semiconductor 180 Chip Size in Mils B G Passivation Process B = Wirebondable Topside: 100% Al Backside: Cr/Ni/Ag G = Glassivated Mesa ‘06 = 600 V ‘12 = 1200 V ‘16 = 1600 V Voltage Code x 100 D 4/32 CB Metallization Packaging D = Wirebondable Topside: 100% Al Backside: Cr/Ni/Ag CB=Probed Uncut Die (Wafer In Box) None=Probed Die in Chip Carrier H = Solderable Topside: Cr/Ni/Ag Backside: Cr/Ni/Ag S = Solderable Topside: Cr/Ni/Ag Backside: Cr/Ni/Ag selector guide 12 Surface Metal VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Schottky Diode Features Schottky diodes are designed for very fast switching between the forward and the reverse direction of the diode. Their metal-semiconductor junction provides a low forward voltage drop compared to p-n diodes. Schottky diodes can be used for general-purpose applications but their low voltage drops at forward biases makes them useful whenever conduction losses are key to ensure high efficiency and for protection of MOS devices. Vishay Portfolio • Vishay offers one of broadest range of Schottky diodes in the market, ranging from 15 V to 200 V • Maximum junction temperatures from 125 ºC to 175 ºC are available thanks to a variety of proprietary barrier metals • Vishay technologies include products optimized for low conduction losses as well as products with extreme low reverse leakage current: –– TMBS® Trench MOS Barrier Schottky –– Gen2 (Planar) and Gen5 (Trench) • Die are available with bondable or solderable metalizations Typical Applications for Schottky Diodes 1. Bypass Diodes for Solar Cells 2. Reverse Polarity Battery Protection 3. Battery Chargers and Switchmode Power Supplies 2. Reverse Polarity Battery Protection Typical Circuits 1. Bypass Diodes for Solar Cells 3. Battery Chargers and Switchmode Power Supplies selector guide 5/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Schottky Die / N List Part Number Optimized TJ max for (°C) IF(AV) (A) VR (V) VF at 125 ºC (V) Die Size (mils) Die Front Side Back Side Thickness Metal Metal (mils) Wafer Diameter (inches) VS-SC036R015S5x Low VF 125 1 15 0.32 36 x 36 14 Solderable Solderable 5 VS-SC125R015S5x Low VF 125 9 15 0.25 at 75 °C 125 x 125 14 Solderable Solderable 5 VS-SC200R015S5x Low VF 125 60 15 0.43 at 75 °C 200 x 200 14 Solderable Solderable 5 VS-SC036S020S5x Low VF 150 1 20 0.35 36 x 36 14 Solderable Solderable 5 VS-SC125S020A5x Low VF 150 15 20 0.51 at 40 A at 25 °C 125 x 125 10 Bondable Solderable 5 VS-SC036S030A5x Low VF 150 1 30 0.50 36 x 36 14 Bondable Solderable 5 VS-SC036S030S5x Low VF 150 1 30 0.50 36 x 36 10 Solderable Solderable 5 VS-SC070S030A5x Low VF 150 5 30 0.49 70 x 92 14 Bondable Solderable 5 VS-SC105S030A5x Low VF 150 15 30 0.53 105 x 125 14 Bondable Solderable 5 VS-SC170S030A5x Low VF 150 30 30 0.51 115 x 170 14 Bondable Solderable 5 VS-SC200S030A5x Low VF 150 60 30 0.58 200 x 200 14 Bondable Solderable 5 VS-SC200S030S5x Low VF 150 60 30 0.47 200 x 200 14 Solderable Solderable 5 VS-SC275S030S5x Low VF 150 80 30 0.55 at 150 A at 25 °C 275 x 275 14 Solderable Solderable 5 VS-SC036S045A5x Low VF 150 1 45 0.56 36 x 36 14 Bondable Solderable 5 VS-SC036S045S5x Low VF 150 1 45 0.49 36 x 36 14 Solderable Solderable 5 VS-SC050H045A5x Low IR 175 2 45 Not Av. 50 x 50 14 Bondable Solderable 5 VS-SC060S045A5x Low VF 150 3 45 0.49 at 3 A 60 x 60 14 Bondable Solderable 5 VS-SC060S045S5x Low VF 150 3 45 0.43 at 2 A 60 x 60 14 Solderable Solderable 5 VS-SC070S045A5x Low VF 150 5 45 0.65 70 x 92 14 Bondable Solderable 5 VS-SC070H045A5x Low IR 175 5 45 0.64 70 x 92 14 Bondable Solderable 5 SX073H045A6Ox Low IR 175 7.5 45 0.73 at 25 °C 73 x 73 11 Bondable Solderable 6 SX073H045S6Px Low IR 175 7.5 45 0.57 at 25 °C 73 x 73 11 Solderable Solderable 6 SX085H045S6Px Low IR 175 10 45 0.75 at 25 °C 85 x 85 11 Solderable Solderable 6 VS-SC105H045A5x Low IR 175 15 45 0.68 105 x 125 14 Bondable Solderable 5 VS-SC105H045S5x Low IR 175 15 45 0.44 105 x 125 14 Solderable Solderable 5 VS-SC105S045A5x Low VF 150 15 45 0.50 105 x 125 14 Bondable Solderable 5 VS-SC105S045S5x Low VF 150 15 45 0.42 105 x 125 10 / 14 Solderable Solderable 5 VS-SC125H045A5x Low IR 175 15 45 0.62 at 25 °C 125 x 125 14 Bondable Solderable 5 selector guide 6/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Schottky Die / N List Part Number Optimized TJ max for (°C) IF(AV) (A) VR (V) VF at 125 ºC (V) Die Size (mils) Die Front Side Back Side Thickness Metal Metal (mils) Wafer Diameter (inches) VS-SC125H045S5x Low IR 175 15 45 0.62 at 25 °C 125 x 125 14 Solderable Solderable 5 SX110H045A6Ox Low IR 175 15 45 0.76 at 25 °C 110 x 110 11 Bondable Solderable 6 SX110H045S6Px Low IR 175 16 45 0.66 at 25 °C 110 x 110 11 Solderable Solderable 6 VS-SC170H045A5x Low IR 175 30 45 0.53 115 x 170 14 Bondable Solderable 5 VS-SC180H045S5x Low IR 175 40 45 0.61 at 30 A 150 x 180 14 Solderable Solderable 5 VS-SC180S045A5x Low VF 150 40 45 0.56 150 x 180 14 Bondable Solderable 5 VS-SC200H045S5x Low IR 175 60 45 0.69 200 x 200 14 Solderable Solderable 5 VS-SC200S045S5x Low VF 150 60 45 0.69 200 x 200 14 Solderable Solderable 5 VS-SC036S060S5x Low VF 150 1 60 0.57 36 x 36 14 Solderable Solderable 5 VS-SC060S060A5x Low VF 150 3 60 0.65 at 6 A 60 x 60 14 Bondable Solderable 5 VS-SC060S060S5x Low VF 150 3 60 0.43 60 x 60 14 Solderable Solderable 5 TY059S060A6Ox Low VF 150 5 60 0.7 at 25 °C 59 x 59 11 Bondable Solderable 6 SX073H060A6Ox Low IR 175 7.5 60 0.73 at 25 °C 73 x 73 11 Bondable Solderable 6 SX073H060S6Px Low IR 175 7.5 60 0.73 at 25 °C 73 x 73 11 Solderable Solderable 6 TY078S060A6Px Low VF 150 10 60 0.65 at 25 °C 78 x 78 11 Bondable Solderable 6 VS-SC105S060A5x Low VF 150 15 60 0.71 105 x 125 14 Bondable Solderable 5 VS-SC125S060A5x Low VF 150 15 60 0.60 at 25 °C 125 x 125 10 Bondable Solderable 5 SX110H060S4Px Low IR 175 15 60 0.68 at 25 °C 110 x 110 11 Solderable Solderable 6 TY085S060A6Ox Low VF 150 15 60 0.7 at 25 °C 85 x 85 11 Bondable Solderable 6 SX128H060S6Ox Low IR 175 20 60 0.69 at 25 °C 128 x 128 11 Solderable Solderable 4 VS-SC180S060A5x Low VF 150 40 60 0.64 150 x 180 14 Bondable Solderable 5 BDBAS70-BDx Small signal 125 0.015 70 1.00 at 25 °C 0.24 mm x 0.24 mm 6 Bondable Solderable 4 TY056S080A6Ox Low VF 150 5 80 0.72 at 25 °C 56 x 56 11 Bondable Solderable 6 TY073S080A6Px Low VF 150 10 80 0.81 at 25 °C 73 x 73 11 Bondable Solderable 6 TY085S080A6Ox Low VF 150 15 80 0.82 at 25 °C 85 x 85 11 Bondable Solderable 6 TY102S080A6Ox Low VF 150 15 80 0.95 at 25 °C 102 x 102 11 Bondable Solderable 6 VS-SC036H100S5x Low IR 175 1 100 0.68 36 x 36 14 Solderable Solderable 5 SX050H100S4Px Low IR 175 1 100 0.77 at 25 °C 50 x 50 11 Solderable Solderable 4 selector guide 7/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Schottky Die / N List Part Number Optimized TJ max for (°C) IF(AV) (A) VR (V) VF at 125 ºC (V) Die Size (mils) Die Front Side Back Side Thickness Metal Metal (mils) Wafer Diameter (inches) VS-SC050H100A5x Low IR 175 2 100 0.79 50 x 50 14 Bondable Solderable 5 SX061H100S4Px Low IR 175 2 100 0.79 at 25 °C 61 x 61 11 Solderable Solderable 4 VS-SC060H100A5x Low IR 175 3 100 0.74 at 6 A 60 x 60 14 Bondable Solderable 5 VS-SC060H100S5x Low IR 175 3 100 0.62 60 x 60 14 Solderable Solderable 5 TY045S100S6Ox Low VF 150 3 100 0.8 at 25 °C 45 x 45 12 Solderable Solderable 6 TY054S100S6Ox Low VF 150 3 100 0.7 at 25 °C 54 x 54 12 Solderable Solderable 6 VS-SC070H100A5x Low IR 175 5 100 0.78 70 x 92 14 Bondable Solderable 5 SX093H100A4Ox Low IR 175 5 100 0.76 at 25 °C 93 x 93 11 Bondable Solderable 4 TY066S100A6Ox Low VF 150 5 100 0.85 at 25 °C 66 x 66 11 Bondable Solderable 6 SX067H100S4Px Low IR 175 8 100 0.9 at 25 °C 67 x 67 12 Solderable Solderable 4 TY080S100S6Px Low VF 150 8 100 0.68 at 25 °C 80 x 80 12 Solderable Solderable 6 TY080S100A6Ox Low VF 150 10 100 0.73 at 25 °C 80 x 80 11 Bondable Solderable 6 TY093S100S6Px Low VF 150 10 100 0.68 at 25 °C 93 x 93 12 Solderable Solderable 6 TY102S100S6Ox Low VF 150 12 100 0.7 at 25 °C 102 x 102 12 Solderable Solderable 6 VS-SC105H100A5x Low IR 175 15 100 0.69 105 x 125 14 Bondable Solderable 5 VS-SC105H100S5x Low IR 175 15 100 0.52 105 x 125 14 Solderable Solderable 5 VS-SC125H100A5x Low IR 175 15 100 0.86 at 25 °C 125 x 125 14 Bondable Solderable 5 VS-SC125H100S5x Low IR 175 15 100 0.86 at 25 °C 125 x 125 14 Solderable Solderable 5 SX119H100S4Px Low IR 175 15 100 0.82 at 25 °C 119 x 119 11 Solderable Solderable 4 TY093S100A6Ox Low VF 150 15 100 0.8 at 25 °C 93 x 93 11 Bondable Solderable 6 TY102S100A6Ox Low VF 150 20 100 0.81 at 25 °C 102 x 102 11 Bondable Solderable 6 TY119S100A6Ox Low VF 150 20 100 0.73 at 25 °C 119 x 119 11 Bondable Solderable 6 VS-SC180H100A5x Low IR 175 40 100 0.75 150 x 180 14 Bondable Solderable 5 VS-SC180H100S5x Low IR 175 40 100 0.75 150 x 180 14 Solderable Solderable 5 TY144S100A6Ox Low VF 150 40 100 0.78 at 25 °C 144 x 144 11 Bondable Solderable 6 VS-SC200H100A5x Low IR 175 60 100 0.76 200 x 200 14 Bondable Solderable 5 VS-SC200H100S5x Low IR 175 60 100 0.79 200 x 200 14 Solderable Solderable 5 VS-SC275H100S5x Low IR 175 80 100 0.77 at 60 A at 25 °C 275 x 275 14 Solderable Solderable 5 selector guide 8/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Schottky Die / N List Part Number Optimized TJ max for (°C) IF(AV) (A) VR (V) VF at 125 ºC (V) Die Size (mils) Die Front Side Back Side Thickness Metal Metal (mils) Wafer Diameter (inches) TY080S120S6Px Low VF 150 8 120 0.84 at 25 °C 80 x 80 12 Solderable Solderable 6 TY080S120A6Ox Low VF 150 10 120 0.9 at 25 °C 80 x 80 11 Bondable Solderable 6 TY102S120S6Px Low VF 150 12 120 0.8 at 25 °C 102 x 102 12 Solderable Solderable 6 TY093S120A6Ox Low VF 150 15 120 0.97 at 25 °C 93 x 93 11 Bondable Solderable 6 TY102S120A6Ox Low VF 150 15 120 1.28 at 25 °C 102 x 102 11 Bondable Solderable 6 TY119S120A6Ox Low VF 150 15 120 1.1 at 25 °C 119 x 119 11 Bondable Solderable 6 VS-SC070H150A5x Low IR 175 5 150 0.86 70 x 92 14 Bondable Solderable 5 SX081H150A4Ox Low IR 175 5 150 0.88 at 25 °C 81 x 81 11 Bondable Solderable 4 TY056S150A6Ox Low VF 150 5 150 1.41 at 25 °C 56 x 56 11 Bondable Solderable 6 TY080S150A6Ox Low VF 150 10 150 1.2 at 25 °C 80 x 80 11 Bondable Solderable 6 VS-SC105H150A5x Low IR 175 15 150 0.77 105 x 125 14 Bondable Solderable 5 TY093S150A6Ox Low VF 150 15 150 1.36 at 25 °C 93 x 93 11 Bondable Solderable 6 TY102S150A6Ox Low VF 150 20 150 1.43 at 25 °C 102 x 102 11 Bondable Solderable 6 VS-SC200H150A5x Low IR 175 60 150 0.85 200 x 200 14 Bondable Solderable 5 TY045S200S6Ox Low VF 150 2 200 1.23 at 25 °C 45 x 45 11 Solderable Solderable 6 TY054S200S6Ox Low VF 150 3 200 1.4 at 25 °C 54 x 54 11 Solderable Solderable 6 TY056S200S6Ox Low VF 150 3 200 1.2 at 25 °C 56 x 56 11 Solderable Solderable 6 TY066S200A6Ox Low VF 150 5 200 1.6 at 25 °C 66 x 66 11 Bondable Solderable 6 TY080S200A6Ox Low VF 150 10 200 1.7 at 25 °C 80 x 80 11 Bondable Solderable 6 TY093S200A6Ox Low VF 150 10 200 1.6 at 25 °C 93 x 93 11 Bondable Solderable 6 TY119S200A6Ox Low VF 150 15 200 0.95 at 25 °C 119 x 119 11 Bondable Solderable 6 selector guide 9/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Ultrafast Ultrafast Diode Features These diodes are specifically designed to work in switching operations. Their silicon epitaxial planar technology features a design optimized for reliable performance. They are the best diodes for coupling with IGBTs in power supply inverter stages and for boosting the voltage in PFC stage. Vishay Portfolio • Vishay offers the industry’s broadest range of Ultrafast diodes in the market, ranging from 200 V to 1200 V • 150 ºC (HEXFRED®) and 175 ºC (FRED Pt®) maximum junction temperatures are available • Vishay technologies include products optimized for low conduction losses as well as products for reduced switching losses, all with optimized softness to reduce EMI generation and reduce/eliminate the need for snubbers • Our proprietary technology enables several Vf/Trr trade-offs for the same die size, enabling all possible speed requirements • Die are available with bondable metalization Typical Applications for Schottky Diodes 1. High-Voltage High-Frequency Power Management and Battery Chargers 2. Power Supplies 3. Welding Typical Circuits 1. High-Voltage, HIgh-Frequency Power Management and Battery Charges 2. Power Supplies 3.Welding selector guide 10/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Ultrafast FRED Pt® Die P / N List VF max trr typ Die Wafer Die Size Front Side Back Side Tj Max Thickness Diameter at 25 °C at 25 °C (mils2) (ºC) Metal Metal (mils) (inches) (V) (ns) Part Number Optimized for Gen IF(AV) (A) VR (V) VS-FD040H02A6x Switching-Low QRR 1 1 200 1 22 40 x 40 Bondable Solderable 175 14 6 VS-FD046H02A6x Switching-Low QRR 1 2-3 200 1 22 46 x 60 Bondable Solderable 175 14 6 VS-FD060H02A6x Switching-Low QRR 1 4 200 1 22 60 x 80 Bondable Solderable 175 14 6 VS-FD080H02A6x Switching-Low QRR 1 5 200 0.9 26 80 x 80 Bondable Solderable 175 14 6 VS-FD087H02A6x Switching-Low QRR 1 8-10 200 0.975 20 87 x 87 Bondable Solderable 175 14 6 VS-FD122H02A6x Switching-Low QRR 1 15-20 200 1.05 22 122 x 122 Bondable Solderable 175 14 6 VS-FD160H02A6x Switching-Low QRR 1 30-35 200 1.09 26 160 x 160 Bondable Solderable 175 14 6 VS-FD170H02A6x Switching-Low QRR 1 40-50 200 1.02 34 170 x 170 Bondable Solderable 175 14 6 VS-FD200H02A6x Switching-Low QRR 1 75 200 1.13 32 200 x 200 Bondable Solderable 175 14 6 VS-FD100H03A6x Switching-Low QRR 1 8-10 300 1.25 27 100 x 100 Bondable Solderable 175 14 6 VS-FD110H03A6x Switching-Low QRR 1 10 300 1.25 31 110 x 110 Bondable Solderable 175 14 6 VS-FD120H03A6x Switching-Low QRR 1 15-20 300 1.25 32 120 x 120 Bondable Solderable 175 14 6 VS-FD160H03A6x Switching-Low QRR 1 30-35 300 1.25 38 160 x 160 Bondable Solderable 175 14 6 VS-FD170H03A6x Switching-Low QRR 1 40-50 300 1.25 34 170 x 170 Bondable Solderable 175 14 6 VS-FD090U4A6x Sw. / Conduction= 50/50 1 8 400 1.3 43 Bondable Solderable 175 14 6 VS-FD120U04A6x Sw. / Conduction= 50/50 1 15-20 400 1.25 46 120 x 120 Bondable Solderable 175 14 6 VS-FD160S04A6x Sw. / Conduction= 50/50 1 30-40 400 1.32 72 160 x 160 Bondable Solderable 175 14 6 VS-FD200S04A6x Sw. / Conduction= 50/50 1 75 400 1.3 87 200 x 200 Bondable Solderable 175 14 6 VS-FD051H06A6BN Switching-Low QRR 2 1-2 600 1.5 30 51 x 51 Bondable Solderable 175 14 6 VS-FD056H06A6xN Switching-Low QRR 2 2-3 600 1.45 28 56 x 56 Bondable Solderable 175 14 6 VS-FD056U06A6xN Sw. / Conduction= 50/50 2 2-3 600 1.25 37 56 x 56 Bondable Solderable 175 14 6 VS-FD072H06A6xN Switching-Low QRR 2 4-6 600 2.1 18 72 x 72 Bondable Solderable 175 14 6 VS-FD072T06A6xN Conduction - Low VF 2 4-6 600 1.2 60 72 x 72 Bondable Solderable 175 14 6 VS-FD072U06A6xN Sw. / Conduction= 50/50 2 4-6 600 1.5 47 72 x 72 Bondable Solderable 175 14 6 VS-FD083H06A6xN Switching-Low QRR 2 8 600 2.65 16 83 x 83 Bondable Solderable 175 14 6 VS-FD083T06A6xN Conduction - Low VF 2 8 600 1.07 65 83 x 83 Bondable Solderable 175 14 6 VS-FD083W06A6xN Switching-Low QRR 2 8 600 3.4 14 83 x 83 Bondable Solderable 175 14 6 VS-FD097H06a6xN Switching-Low QRR 2 10 600 2.4 21 97 x 97 Bondable Solderable 175 14 6 VS-FD097W06A6xN Switching-Low QRR 2 10 600 3 15 97 x 97 Bondable Solderable 175 14 6 VS-FD111H06A6xN Switching-Low QRR 2 15 600 2.45 21 111 x 111 Bondable Solderable 175 14 6 VS-FD111T06A6xN Conduction - Low VF 2 15 600 1.07 60 111 x 111 Bondable Solderable 175 14 6 VS-FD111U06A6xN Sw. / Conduction= 50/50 2 15 600 1.9 24 111 x 111 Bondable Solderable 175 14 6 90 x 90 *For VF max at 25 °C, typ VF at rated I selector guide 11/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Ultrafast FRED Pt® Die P / N List VF max trr typ Die Wafer Die Size Front Side Back Side Tj Max Thickness Diameter at 25 °C at 25 °C (mils2) (ºC) Metal Metal (mils) (inches) (V) (ns) Part Number Optimized for Gen IF(AV) (A) VR (V) VS-FD111W06A6xN Switching-Low QRR 2 15 600 3.4 17 111 X 111 Bondable Solderable 175 14 6 VS-FD117H06A6xN Switching-Low QRR 2 15-20 600 2.2 22 117 x 117 Bondable Solderable 175 14 6 VS-FD117T06A6xN Conduction - Low VF 2 15-20 600 1.1 60 117 x 117 Bondable Solderable 175 14 6 VS-FD117W06A6xN Switching-Low QRR 2 15-20 600 3.2 18 117 x 117 Bondable Solderable 175 14 6 VS-FD145H06A6xN Switching-Low QRR 2 30 600 2.65 26 145 x 145 Bondable Solderable 175 14 6 VS-FD145U06A6xN Sw. / Conduction= 50/50 2 30 600 2 30 145 x 145 Bondable Solderable 175 14 6 VS-FD157H06A6x Switching-Low QRR 2 30-35 600 2.6 31 160 x 160 Bondable Solderable 175 14 6 VS-FD197H06A6xN Switching-Low QRR 2 75 600 2.6 30 197 x 197 Bondable Solderable 175 14 6 VS-FD197S06A6xN Sw. / Conduction= 50/50 2 75 600 1.68 34 197 x 197 Bondable Solderable 175 14 6 VS-FD111H07A6BN Switching-Low QRR 2 15-18 650 1.68 37 111 x 111 Bondable Solderable 175 14 6 VS-FD117H07A6BN Switching-Low QRR 2 15-18 650 1.52 37 117 x 117 Bondable Solderable 175 14 6 VS-FD145H07A6xN Switching-Low QRR 2 30 650 1.7 39 145 x 145 Bondable Solderable 175 14 6 VS-FD145W07A6xN Switching-Low QRR 2 30 650 2.2 26 145 x 145 Bondable Solderable 175 14 6 VS-FD157H07A6xN Switching-Low QRR 2 35 650 1.7 41 157 x 157 Bondable Solderable 175 14 6 VS-FD184H07A6xN Switching-Low QRR 2 60 650 1.7 42 184 x 184 Bondable Solderable 175 14 6 VS-FD184W07A6xN Switching-Low QRR 2 60 650 2.3 38 184 x 184 Bondable Solderable 175 14 6 VS-FD197H07A6xN Switching-Low QRR 2 75 650 1.65 47 197 x 197 Bondable Solderable 175 14 6 VS-FD310H07A6xN Switching-Low QRR 2 100-120 650 1.75 54 310 x 190 Bondable Solderable 175 14 6 VS-FD310W07A6xN Switching-Low QRR 2 100-120 650 2.2 47 310 x 190 Bondable Solderable 175 14 6 VS-FD394H07A6xN Switching-Low QRR 2 2.2 60 394 x 217 Bondable Solderable 175 14 6 150 650 *For VF max at 25 °C, typ VF at rated I selector guide 12/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Ultrafast HEXFRED® Gen 2 Die P / N List I Optimized Gen F(AV) for (A) VR (V) VF max at 25 °C (V) trr typ at 25 °C (ns) Die Size (mils2) Front Side Metal Back Side Metal BOOST Diode 2 4 600 1.8 41 66 x 66 Bondable Solderable 150 14.8 6 2 12 600 1.7 47 85 x 164 Bondable Solderable 150 14.8 6 VS-H2090H06A6x BOOST Diode 2 8 600 1.7 41 90 x 90 Bondable Solderable 150 14.8 6 VS-H2107H12A6x BOOST Diode 2 6 1200 3 58 107 x 130 Bondable Solderable 150 14.8 6 VS-H2115H06A6x BOOST Diode 2 15 600 1.7 47 115 x 155 Bondable Solderable 150 14.8 6 VS-H2115H12A6x BOOST Diode 2 8 1200 3.3 59 115 x 155 Bondable Solderable 150 14.8 6 VS-H2169H06A6x BOOST Diode 2 25 600 1.7 53 169 x 220 Bondable Solderable 150 14.8 6 VS-H2169H12A6x BOOST Diode 2 16 1200 3 69 169 x 220 Bondable Solderable 150 14.8 6 Part Number VS-H2066H06A6x VS-H2085H06A6x APD Die Wafer Tj Max Thickness Diameter (mils) (inches) VS-H2195H06A6x APD 2 30 600 1.2 at 12 A 62 195 x 340 Bondable Solderable 150 14.8 6 VS-H2195H12A6x APD 2 30 1200 3 at 16 A 78 195 x 340 Bondable Solderable 150 14.8 6 VS-H2200H04A6x APD 2 60 400 1.2 57 200 x 200 Bondable Solderable 150 14.8 6 VS-H2200H06A6x APD 2 60 600 1.7 at 70 A 52 200 x 200 Bondable Solderable 150 14.8 6 VS-H2257H06A6x APD 2 80 600 1.2 at 10 A 62 257 x 257 Bondable Solderable 150 14.8 6 VS-H2257H12A6x APD 2 80 1200 3 at 16 A 78 257 x 257 Bondable Solderable 150 14.8 6 selector guide 13/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Ultrafast HEXFRED® Gen 3 Die P / N List Part Number I Optimized Gen F(AV) for (A) VR (V) VF max at 25 °C (V) trr typ at 25 °C (ns) Die Size (mils2) Front Side Metal Back Side Metal Die Wafer Tj Max Thickness Diameter (mils) (inches) VS-H3051D05A6x APD 3 1 600 1.75 at 3 A 52 51 x 51 Bondable Solderable 150 14.8 6 VS-H3065D06A6x APD 3 3 600 1.35 at 1 A 56 65 x 66 Bondable Solderable 150 14.8 6 VS-H3075D06A6x APD 3 5 600 1.1 at 1 A 57 75 x 76 Bondable Solderable 150 14.8 6 VS-H3085D06A6x APD 3 15 600 1.15 at 3 A 61 85 x 131 Bondable Solderable 150 14.8 6 VS-H3090D12A6x APD 3 5 1200 1.95 at 2 A 50 90 x 91 Bondable Solderable 150 12 6 VS-H3107D12A6x APD 3 8 1200 1.58 at 2.5 A 51 107 x 130 Bondable Solderable 150 12 6 VS-H3115D12A6x APD 3 15 1200 2 at 5 A 52 115 x 155 Bondable Solderable 150 12 6 VS-H3135D06A6x APD 3 30 600 1.2 at 5 A 68 135 x 135 Bondable Solderable 150 14.8 6 VS-H3169D12A6x APD 3 25 1200 1.5 at 5 A 60 169 x 220 Bondable Solderable 150 12 6 VS-H3169E12A6x APD 3 25 1200 1.8 at 5 A 54 169 x 220 Bondable Solderable 150 12 6 VS-H3171D06A6x APD 3 50 600 1.1 at 5 A 69 171 x 171 Bondable Solderable 150 14.8 6 VS-H3195D12A6x APD 3 50 1200 1.3 at 5 A 72 195 x 340 Bondable Solderable 150 12 6 VS-H3230D06A6x APD 3 100 600 1 at 5 A 73 230 x 231 Bondable Solderable 150 14.8 6 VS-H3234D12A6x APD 3 75 1200 1.2 at 5 A 82 234 x 443 Bondable Solderable 150 12 6 VS-H3257D12A6x APD 3 50 1200 1.3 at 5 A 74 257 x 257 Bondable Solderable 150 12 6 VS-H3356D06A6x APD 3 240 600 1.1 at 5 A 90 356 x 356 Bondable Solderable 150 14.8 6 VS-H3357D12A6x APD 3 100 1200 1.2 at 5 A 85 357 x 357 Bondable Solderable 150 12 6 selector guide 14/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products High Voltage Standard / Soft Recover y Diodes High Voltage Standard / Soft Recovery Diodes Features These diodes are specifically designed for high-power applications, such as input rectification and high-frequency welding applications. Electrical and mechanical optimized glass passivation ensures a high breakdown voltage. Vishay Portfolio • Vishay offers standard recovery and fast recovery diodes as bare die, with ratings from 600 V to 1600 V • Tj max is 150 °C • Several die sizes are available with current handling to 100 A and beyond • Available with bondable metalization Typical Applications For High Voltage Standard / Fast Diodes 1. AC Mains Rectification 2. Blocking Diodes for Solar Cells 3. Alternator Rectification Typical Circuits 1. AC Mains Rectification 2. Blocking Diodes for Solar Cells 3. Alternator Rectification selector guide 15/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products High Voltage Standard / Soft Recover y Diodes High Voltage Standard / Soft Recovery MOAT Diodes Die P / N List Part Number Structure IF(AV) (A) VR (V) VF max at 25 °C (V) Die Size (mils2) Front side Metal Back side Metal Die Thickness (mils) Wafer Diameter (inches) VS-VS080DM12Cx MOAT Standard 4 1200 1.1 80 x 80 Bondable Solderable 11.6 4 VS-VS135DM08Cx MOAT Standard 10 800 1.1 100 x 135 Bondable Solderable 11.6 4 VS-VS135DM10Cx MOAT Standard 10 1000 1.1 100 x 135 Bondable Solderable 11.6 4 VS-VS135DM12Cx MOAT Standard 10 1200 1.1 100 x 135 Bondable Solderable 11.6 4 VS-VS135DM16Cx MOAT Standard 8 1600 1.1 100 x 135 Bondable Solderable 13.4 4 VS-VS155DM16Cx MOAT Standard 15 1600 1.1 155 x 155 Bondable Solderable 13.4 5 VS-VS180DM12Cx MOAT Standard 20 1200 1.1 180 x 180 Bondable Solderable 12 5 VS-VS180DM16Cx MOAT Standard 20 1600 1.1 180 x 180 Bondable Solderable 13.4 5 VS-VS207DM12Cx MOAT Standard 20 1200 1.1 157 x 207 Bondable Solderable 12 5 VS-VS210DM12Cx MOAT Standard 20 1200 1.15 210 x 210 Bondable Solderable 13.4 5 VS-VS210DM16Cx MOAT Standard 20 1600 1.15 210 x 210 Bondable Solderable 13.4 5 VS-VS230DM12Cx MOAT Standard 40 1200 1.1 230 x 230 Bondable Solderable 12 5 VS-VS230DM16Cx MOAT Standard 40 1600 1.14 230 x 230 Bondable Solderable 13.4 5 VS-VS340DM12Cx MOAT Standard 60 1200 1.09 350 x 230 Bondable Solderable 12 5 VS-VS340DM16Cx MOAT Standard 60 1600 1.09 230 x 350 Bondable Solderable 13.4 5 VS-VS350DM16Cx MOAT Standard 60 1600 1.07 at 60 A 356 x 356 Bondable Solderable 13.4 5 VS-VS390DM12Cx MOAT Standard 80 1200 1.17 270 x 390 Bondable Solderable 13.4 5 VS-VS480DM16Cx MOAT Standard 100 1600 1.06 at 60 A 480 x 480 Bondable Solderable 13.4 5 VS-VS590DM12Cx MOAT Standard 165 1200 1.43 590 x 590 Bondable Solderable 13.4 5 VS-VS060LM06CS02Cx MOAT Fast 2 600 1.3 60 x 60 Bondable Solderable 10.4 4 VS-VS135LM06CS02Cx MOAT Fast 8 600 1.2 100 x 135 Bondable Solderable 10.4 4 VS-VS135LM12CS05Cx MOAT Fast 8 1200 1.3 100 x 135 Bondable Solderable 10.4 4 VS-VS180LM06CS02Cx MOAT Fast 20 600 1.3 180 x 180 Bondable Solderable 10.4 5 VS-VS180LM12CS05Cx MOAT Fast 20 1200 1.31 180 x 180 Bondable Solderable 10.4 5 VS-VS207LM06CS02Cx MOAT Fast 20 600 1.3 157 x 207 Bondable Solderable 10.4 5 VS-VS230LM06CS02Cx MOAT Fast 40 600 1.25 230 x 230 Bondable Solderable 10.4 5 VS-VS230LM12CS05Cx MOAT Fast 40 1200 1.4 230 x 230 Bondable Solderable 10.4 5 VS-VS340LM06CS02Cx MOAT Fast 60 600 1.3 230 x 350 Bondable Solderable 10.4 5 VS-VS340LM12CS05Cx MOAT Fast 60 1200 1.4 230 x 350 Bondable Solderable 10.4 5 VS-VS390LM06CS02Cx MOAT Fast 80 600 1.25 270 x 390 Bondable Solderable 10.4 5 VS-VS390LM12CS05Cx MOAT Fast 80 1200 1.35 270 x 390 Bondable Solderable 10.4 5 selector guide 16/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Thyristors Thyristor (SCR) Features These are p-n-p-n devices typically utilized for switching high levels of power. Much more capable than a mechanical switch, SCRs can be switched more than 10 000 time per second and widely adopted for motor speed controllers and inverters. Vishay Portfolio • Vishay offers SCRs with ratings from 600 V to 1600 V • Tj max is 125 °C • Vishay technology includes glass passivated high voltage termination • Die are available with bondable and solderable metalization • Contact Vishay for specific requirements on Gate Position options (Center / Corner) Typical Applications For Standard / Fast Diodes 1. AC Mains Rectification 2. Crowbar Protection 3. AC Bypass Switch Typical Circuits 1. AC Mains Rectification 2.Crowbar Protection 3. AC Bypass Switch selector guide 17/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Thyristors Thyristors Die P / N List Die Thickness (mils) Wafer Diameter (inches) Solderable 11.8 4 Solderable 13.8 5 Solderable Solderable 13.8 5 Solderable Solderable 13.8 5 Bondable Solderable 13.8 5 185 x 185 Bondable Solderable 15.9 5 210 x 210 Solderable Solderable 14.6 5 1.1 at 25 A 210 x 210 Solderable Solderable 14.6 5 1.1 at 25 A 210 x 210 Solderable Solderable 14.6 5 600 1.1 at 25 A 230 x 230 Solderable Solderable 14.6 5 1200 1.1 at 25 A 230 x 230 Solderable Solderable 14.6 5 800 1.1 at 25 A 250 x 250 Bondable Solderable 14.6 5 1200 1.1 at 25 A 250 x 250 Bondable Solderable 14.6 5 1.05 at 25 A 250 x 250 Bondable Solderable 15.9 5 1200 1.1 at 25 A 250 x 250 Solderable Solderable 14.6 5 600 1.05 at 25 A 250 x 250 Solderable Solderable 13 5 40 1200 1.05 at 25 A 250 x 250 Solderable Solderable 13 5 40 1600 1.05 at 25 A 250 x 250 Solderable Solderable 15.9 5 VS-VS343SG12Hx 50 1200 0.9 at 25 A 343 x 343 Solderable Solderable 13 5 VS-VS350SG10Hx 50 1000 0.9 at 25 A 350 x 350 Solderable Solderable 14.6 5 IT(AV) (A) VR (V) VTM max at 25 °C (V) Die Size (mils2) VS-VS110BG12Dx 8 1200 .95 at 6.5 A 110 x 110 Bondable VS-VS155BG12Dx 15 1200 1 at 10 A 150 x 150 Bondable VS-VS180SG06Hx 25 600 1.00 at 16 A 180 x 180 VS-VS180SG12Hx 25 1200 1.00 at 16 A 180 x 180 VS-VS185BG12Dx 16 1200 1.00 at 16 A 185 x 185 VS-VS185BG14Dx 16 1400 1.00 at 16 A VS-VS210SG06Hx 25 600 1.1 at 25 A VS-VS210SG10Hx 25 1000 VS-VS210SG12Hx 25 1200 VS-VS230SG06Hx 25 VS-VS230SG12Hx 25 VS-VS250BG08Dx 40 VS-VS250GB12Dx 40 VS-VS250GB14Dx 40 1400 VS-VS250SG12Hx 40 VS-VS255SG06Hx 40 VS-VS255SG12Hx VS-VS255SG16Hx Part Number Front Side Metal Back Side Metal VS-VS350SG12Hx 50 1200 0.9 at 25 A 350 x 350 Solderable Solderable 14.6 5 VS-VS370GB08Dx 70 800 0.91 at 25 A 370 x 370 Bondable Solderable 14.6 5 VS-VS370GB12Dx 70 1200 0.91 at 25 A 370 x 370 Bondable Solderable 14.6 5 VS-VS370SG12Hx 70 1200 0.91 at 25 A 370 x 370 Solderable Solderable 14.6 5 VS-VS370SG16Hx 70 1600 0.93 at 25 A 370 x 370 Solderable Solderable 15.9 5 VS-VS480BG12Dx 110 1200 0.95 at 25 A 480 x 480 Bondable Solderable 14.6 5 VS-VS480SG06Hx 110 600 0.95 at 25 A 480 x 480 Solderable Solderable 14.6 5 VS-VS480SG10Hx 110 1000 0.95 at 25 A 480 x 480 Solderable Solderable 14.6 5 VS-VS480SG12Hx 110 1200 0.95 at 25 A 480 x 480 Solderable Solderable 14.6 5 VS-VS480SG16Hx 110 1600 0.95 at 25 A 480 x 480 Solderable Solderable 15.9 5 VS-VS590SG04Hx 180 400 0.9 at 25 A 590 x 590 Solderable Solderable 11.8 5 VS-VS590SG06Hx 180 600 0.9 at 25 A 590 x 590 Solderable Solderable 11.8 5 VS-VS590SG08Hx 180 800 0.9 at 25 A 590 x 590 Solderable Solderable 11.8 5 VS-VS590SG10Hx 180 1000 0.9 at 25 A 590 x 590 Solderable Solderable 11.8 5 VS-VS590SG12Hx 180 1200 0.9 at 25 A 590 x 590 Solderable Solderable 14.6 5 selector guide 18/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products T VS TVS Diode Features Transit Voltage Suppressors (TVS) are devices used to protect vulnerable circuits from electrical overstress such as that caused by electrostatic discharge, inductive load switching, and induced lightning. Within the TVS device, damaging voltage spikes are limited by clamping or avalanche action of a rugged silicon pn junction, which reduces the amplitude of the transient to a nondestructive level. Vishay Portfolio • Vishay offers PAR® TVS as bare die, unidirectional polarity only • Tj max is 150 °C • VBR ranging from 6.8 V to 47 V with peak pulse power capability from 300 W to 6.6 kW • Die are available with solderable metalization for optimum surge capability Typical Applications For Standard / Fast Diodes 1. General Purpose Surge Protection — lightning, Inductive load, ESD… 2. Automotive Load Dump Protection Typical Circuits 1. General Purpose Surge Protection — lightning, Inductive load, ESD… Clamped Transient + Protected Load Transient Current TVS – 2. Automotive Load Dump Protection 12 V Load Signal Input High Voltage Load Signal Line Protection Battery and Alternator DC/DC Converter Micro Processor Drive Circuit Load Load Dump selector guide Secondary Protection 19/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products T VS TVS Die P / N List VBR VBR at IT at IT max min (V) (V) Part Number Die Size (mils) Package Product Family TV050B010S4PT 50 x 50 Tape and Reel TVS Solderable 9.5 TV050B011S4PT 50 x 50 Tape and Reel TVS Solderable TV050B012S4PT 50 x 50 Tape and Reel TV050B013S4PT 50 x 50 TV050B015S4PT Power IQ Finished Good Rating (µA) Part Number (W) TJ Max. (ºC) Package Style 400 185 MPG06 TMPG06-11A 400 185 MPG06 1 TMPG06-12A 400 185 MPG06 11.1 1 TMPG06-13A 400 185 MPG06 1 12.8 1 TMPG06-15A 400 185 MPG06 16.8 1 13.6 1 TMPG06-16A 400 185 MPG06 17.1 18.9 1 15.3 1 TMPG06-18A 400 185 MPG06 TVS Solderable 19 21 1 17 1 TMPG06-20A 400 185 MPG06 Tape and Reel TVS Solderable 20.9 23.1 1 18.8 1 TMPG06-22A 400 185 MPG06 50 x 50 Tape and Reel TVS Solderable 22.8 25.2 1 20.5 1 TMPG06-24A 400 185 MPG06 TV050B027S4PT 50 x 50 Tape and Reel TVS Solderable 25.7 28.4 1 23.1 1 TMPG06-27A 400 185 MPG06 TV050B030S4PT 50 x 50 Tape and Reel TVS Solderable 28.5 31.5 1 25.6 1 TMPG06-30A 400 185 MPG06 TV050B033S4PT 50 x 50 Tape and Reel TVS Solderable 31.4 34.7 1 28.2 1 TMPG06-33A 400 185 MPG06 TV050B036S4PT 50 x 50 Tape and Reel TVS Solderable 34.2 37.8 1 30.8 1 TMPG06-36A 400 185 MPG06 TV050B039S4PT 50 x 50 Tape and Reel TVS Solderable 37.1 41 1 33.3 1 TMPG06-39A 400 185 MPG06 TV050B043S4PT 50 x 50 Tape and Reel TVS Solderable 40.9 45.2 1 36.8 1 TMPG06-43A 400 185 MPG06 TV050B6P8S4PT 50 x 50 Tape and Reel TVS Solderable 6.45 7.14 10 5.8 300 TMPG06-6.8A 400 185 MPG06 TV050B7P5S4PT 50 x 50 Tape and Reel TVS Solderable 7.13 7.88 10 6.4 150 TMPG06-7.5A 400 185 MPG06 TV050B8P2S4PT 50 x 50 Tape and Reel TVS Solderable 7.79 8.61 10 7.02 50 TMPG06-8.2A 400 185 MPG06 TV050B9P1S4PT 50 x 50 Tape and Reel TVS Solderable 8.65 9.55 1 7.78 10 TMPG06-9.1A 400 185 MPG06 TV060B6P8S4PT 60 x 60 Tape and Reel TVS Solderable 6.45 7.14 10 5.8 300 TPSMA6.8A 400 185 DO-214AC TV060B7P5S4PT 60 x 60 Tape and Reel TVS Solderable 7.13 7.88 10 6.4 150 TPSMA7.5A 400 185 DO-214AC TV060B8P2S4PT 60 x 60 Tape and Reel TVS Solderable 7.79 8.61 10 7.02 50 TPSMA8.2A 400 185 DO-214AC TV060B9P1S4PT 60 x 60 Tape and Reel TVS Solderable 8.65 9.55 1 7.78 10 TPSMA9.1A 400 185 DO-214AC TV070B010S4PT 70 x 70 Tape and Reel TVS Solderable 9.5 10.5 1 8.55 5 TPSMA10A 400 185 DO-214AC TV070B011S4PT 70 x 70 Tape and Reel TVS Solderable 10.5 11.6 1 9.4 2 TPSMA11A 400 185 DO-214AC TV070B012S4PT 70 x 70 Tape and Reel TVS Solderable 11.4 12.6 1 10.2 2 TPSMA12A 400 185 DO-214AC TV070B013S4PT 70 x 70 Tape and Reel TVS Solderable 12.4 13.7 1 11.1 2 TPSMA13A 400 185 DO-214AC TV070B015S4PT 70 x 70 Tape and Reel TVS Solderable 14.3 15.8 1 12.8 1 TPSMA15A 400 185 DO-214AC TV070B016S4PT 70 x 70 Tape and Reel TVS Solderable 15.2 16.8 1 13.6 1 TPSMA16A 400 185 DO-214AC TV070B018S4PT 70 x 70 Tape and Reel TVS Solderable 17.1 18.9 1 15.3 1 TPSMA18A 400 185 DO-214AC TV070B020S4PT 70 x 70 Tape and Reel TVS Solderable 19 21 1 17.1 1 TPSMA20A 400 185 DO-214AC IT (mA) VWM (V) 10.5 1 8.55 5 TMPG06-10A 10.5 11.6 1 9.4 2 TVS Solderable 11.4 12.6 1 10.2 Tape and Reel TVS Solderable 12.4 13.7 1 50 x 50 Tape and Reel TVS Solderable 14.3 15.8 TV050B016S4PT 50 x 50 Tape and Reel TVS Solderable 15.2 TV050B018S4PT 50 x 50 Tape and Reel TVS Solderable TV050B020S4PT 50 x 50 Tape and Reel TV050B022S4PT 50 x 50 TV050B024S4PT selector guide 20/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products T VS TVS Die P / N List VBR VBR at IT at IT max min (V) (V) Part Number Die Size (mils) Package Product Family TV070B022S4PT 70 x 70 Tape and Reel TVS Solderable 20.9 TV070B024S4PT 70 x 70 Tape and Reel TVS Solderable TV070B027S4PT 70 x 70 Tape and Reel TV070B030S4PT 70 x 70 TV070B033S4PT Power IQ Finished Good Rating (µA) Part Number (W) TJ Max. (ºC) Package Style 400 185 DO-214AC TPSMA24A 400 185 DO-214AC 1 TPSMA27A 400 185 DO-214AC 25.6 1 TPSMA30A 400 185 DO-214AC 1 28.2 1 TPSMA33A 400 185 DO-214AC 37.8 1 30.8 1 TPSMA36A 400 185 DO-214AC 37.1 41 1 33.3 1 TPSMA39A 400 185 DO-214AC TVS Solderable 40.9 45.2 1 36.8 1 TPSMA43A 400 185 DO-214AC Tape and Reel TVS Solderable 6.45 7.14 10 5.8 500 TPSMA6.8A 400 185 DO-214AC 70 x 70 Tape and Reel TVS Solderable 7.13 7.88 10 6.4 250 TPSMA7.5A 400 185 DO-214AC TV070B8P2S4PT 70 x 70 Tape and Reel TVS Solderable 7.79 8.61 10 7.02 100 TPSMA8.2A 400 185 DO-214AC TV070B9P1S4PT 70 x 70 Tape and Reel TVS Solderable 8.65 9.55 1 7.78 25 TPSMA9.1A 400 185 DO-214AC TV110B010S4PU 110 x 110 Tape and Reel TVS Solderable 9.5 10.5 1 8.55 20 TPSMC10A 1500 185 DO-214AB TV110B011S4PU 110 x 110 Tape and Reel TVS Solderable 10.5 11.6 1 9.4 5 TPSMC11A 1500 185 DO-214AB TV110B012S4PU 110 x 110 Tape and Reel TVS Solderable 11.4 12.6 1 10.2 2 TPSMC12A 1500 185 DO-214AB TV110B013S4PU 110 x 110 Tape and Reel TVS Solderable 12.4 13.7 1 11.1 2 TPSMC13A 1500 185 DO-214AB TV110B015S4PU 110 x 110 Tape and Reel TVS Solderable 14.3 15.8 1 12.8 1 TPSMC15A 1500 185 DO-214AB TV110B016S4PU 110 x 110 Tape and Reel TVS Solderable 15.2 16.8 1 13.6 1 TPSMC16A 1500 185 DO-214AB TV110B018S4PU 110 x 110 Tape and Reel TVS Solderable 17.1 18.9 1 15.3 1 TPSMC18A 1500 185 DO-214AB TV110B020S4PU 110 x 110 Tape and Reel TVS Solderable 19 21 1 17.1 1 TPSMC20A 1500 185 DO-214AB TV110B022S4PU 110 x 110 Tape and Reel TVS Solderable 20.9 23.1 1 18.8 1 TPSMC22A 1500 185 DO-214AB TV110B024S4PU 110 x 110 Tape and Reel TVS Solderable 22.8 25.2 1 20.5 1 TPSMC24A 1500 185 DO-214AB TV110B027S4PU 110 x 110 Tape and Reel TVS Solderable 25.7 28.4 1 23.1 1 TPSMC27A 1500 185 DO-214AB TV110B030S4PU 110 x 110 Tape and Reel TVS Solderable 28.5 31.5 1 25.6 1 TPSMC30A 1500 185 DO-214AB TV110B033S4PU 110 x 110 Tape and Reel TVS Solderable 31.4 34.7 1 28.2 1 TPSMC33A 1500 185 DO-214AB TV110B036S4PU 110 x 110 Tape and Reel TVS Solderable 34.2 37.8 1 30.8 1 TPSMC36A 1500 185 DO-214AB TV110B039S4PU 110 x 110 Tape and Reel TVS Solderable 37.1 41 1 33.3 1 TPSMC39A 1500 185 DO-214AB TV110B043S4PU 110 x 110 Tape and Reel TVS Solderable 40.9 45.2 1 36.8 1 TPSMC43A 1500 185 DO-214AB TV110B047S4PU 110 x 110 Tape and Reel TVS Solderable 44.7 49.4 1 40.2 1 TPSMC47A 1500 185 DO-214AB TV110B6P8S4PU 110 x 110 Tape and Reel TVS Solderable 6.45 7.14 10 5.8 1000 TPSMC6.8A 1500 185 DO-214AB TV110B7P4S4PU 110 x 110 Tape and Reel TVS Solderable 7.13 7.88 10 6.4 500 TPSMC7.5A 1500 185 DO-214AB TV110B8P2S4PU 110 x 110 Tape and Reel TVS Solderable 7.79 8.61 10 7.02 200 TPSMC8.2A 1500 185 DO-214AB IT (mA) VWM (V) 23.1 1 18.8 1 TPSMA22A 22.8 25.2 1 20.5 1 TVS Solderable 25.7 28.4 1 23.1 Tape and Reel TVS Solderable 28.5 31.5 1 70 x 70 Tape and Reel TVS Solderable 31.4 34.7 TV070B036S4PT 70 x 70 Tape and Reel TVS Solderable 34.2 TV070B039S4PT 70 x 70 Tape and Reel TVS Solderable TV070B043S4PT 70 x 70 Tape and Reel TV070B6P8S4PT 70 x 70 TV070B7P5S4PT selector guide 21/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products T VS TVS Die P / N List Part Number Die Size (mils) Package Product Family VBR VBR at IT at IT max min (V) (V) IT (mA) VWM (V) Power IQ Finished Good Rating (µA) Part Number (W) TJ Max. (ºC) Package Style TV110B9P1S4PU 110 x 110 Tape and Reel TVS Solderable 8.65 9.55 1 7.78 50 TPSMC9.1A 1500 185 DO-214AB TV134T010S4PV 134 x 134 Tape and Reel TVS Solderable 11.1 12.3 1 10 5 3KASMC10A 3000 185 DO-214AB TV134T011S4PV 134 x 134 Tape and Reel TVS Solderable 12.2 13.5 1 11 5 3KASMC11A 3000 185 DO-214AB TV134T012S4PV 134 x 134 Tape and Reel TVS Solderable 13.3 14.7 1 12 5 3KASMC12A 3000 185 DO-214AB TV134T013S4PV 134 x 134 Tape and Reel TVS Solderable 14.4 15.9 1 13 5 3KASMC13A 3000 185 DO-214AB TV134T014S4PV 134 x 134 Tape and Reel TVS Solderable 15.6 17.2 1 14 5 3KASMC14A 3000 185 DO-214AB TV134T015S4PV 134 x 134 Tape and Reel TVS Solderable 16.7 18.5 1 15 5 3KASMC15A 3000 185 DO-214AB TV134T016S4PV 134 x 134 Tape and Reel TVS Solderable 17.8 19.7 1 16 5 3KASMC16A 3000 185 DO-214AB TV134T017S4PV 134 x 134 Tape and Reel TVS Solderable 18.9 20.9 1 17 5 3KASMC17A 3000 185 DO-214AB TV134T018S4PV 134 x 134 Tape and Reel TVS Solderable 20 22.1 1 18 5 3KASMC18A 3000 185 DO-214AB TV134T020S4PV 134 x 134 Tape and Reel TVS Solderable 22.2 24.5 1 20 5 3KASMC20A 3000 185 DO-214AB TV134T022S4PV 134 x 134 Tape and Reel TVS Solderable 24.4 26.9 1 22 5 3KASMC22A 3000 185 DO-214AB TV134T024S4PV 134 x 134 Tape and Reel TVS Solderable 26.7 29.5 1 24 5 3KASMC24A 3000 185 DO-214AB TV134T026S4PV 134 x 134 Tape and Reel TVS Solderable 28.9 31.9 1 26 5 3KASMC26A 3000 185 DO-214AB TV134T028S4PV 134 x 134 Tape and Reel TVS Solderable 31.1 34.4 1 28 5 3KASMC28A 3000 185 DO-214AB TV134T030S4PV 134 x 134 Tape and Reel TVS Solderable 33.3 36.8 1 30 5 3KASMC30A 3000 185 DO-214AB TV134T033S4PV 134 x 134 Tape and Reel TVS Solderable 36.7 40.6 1 33 5 3KASMC33A 3000 185 DO-214AB TV134T036S4PV 134 x 134 Tape and Reel TVS Solderable 40 44.2 1 36 5 3KASMC36A 3000 185 DO-214AB TV134T040S4PV 134 x 134 Tape and Reel TVS Solderable 44.4 49.1 1 40 5 3KASMC40A 3000 185 DO-214AB TV134T043S4PV 134 x 134 Tape and Reel TVS Solderable 47.8 52.8 1 43 5 3KASMC43A 3000 185 DO-214AB TV162L027S6PV 162 x 162 Tape and Reel TVS Solderable 24 30 10 22 0 SM5A27 3600 175 DO-218AB TV162T010S4PV 162 x 162 Tape and Reel TVS Solderable 11.1 12.3 1 10 15 SM5S10A 3600 175 DO-218AB TV162T011S4PV 162 x 162 Tape and Reel TVS Solderable 12.2 13.5 1 11 10 SM5S11A 3600 175 DO-218AB TV162T012S4PV 162 x 162 Tape and Reel TVS Solderable 13.3 14.7 1 12 10 SM5S12A 3600 175 DO-218AB TV162T013S4PV 162 x 162 Tape and Reel TVS Solderable 14.4 15.9 1 13 10 SM5S13A 3600 175 DO-218AB TV162T014S4PV 162 x 162 Tape and Reel TVS Solderable 15.6 17.2 1 14 10 SM5S14A 3600 175 DO-218AB TV162T015S4PV 162 x 162 Tape and Reel TVS Solderable 16.7 18.5 1 15 10 SM5S15A 3600 175 DO-218AB TV162T016S4PV 162 x 162 Tape and Reel TVS Solderable 17.8 19.7 1 16 10 SM5S16A 3600 175 DO-218AB TV162T017S4PV 162 x 162 Tape and Reel TVS Solderable 18.9 20.9 1 17 10 SM5S17A 3600 175 DO-218AB TV162T018S4PV 162 x 162 Tape and Reel TVS Solderable 20 22.1 1 18 10 SM5S18A 3600 175 DO-218AB TV162T020S4PV 162 x 162 Tape and Reel TVS Solderable 22.2 24.5 1 20 10 SM5S20A 3600 175 DO-218AB TV162T022S4PV 162 x 162 Tape and Reel TVS Solderable 24.4 26.9 1 22 10 SM5S22A 3600 175 DO-218AB selector guide 22/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products T VS TVS Die P / N List Product Family VBR VBR at IT at IT max min (V) (V) Power IQ Finished Good Rating (µA) Part Number (W) TJ Max. (ºC) Package Style 3600 175 DO-218AB SM5S26A 3600 175 DO-218AB 10 SM5S28A 3600 175 DO-218AB 30 10 SM5S30A 3600 175 DO-218AB 1 33 10 SM5S33A 3600 175 DO-218AB 44.2 1 36 10 SM5S36A 3600 175 DO-218AB 24 30 10 22 0 SM6A27 4600 175 DO-218AB TVS Solderable 11.1 12.3 5 10 15 SM6S10A 4600 175 DO-218AB 180 x 180 Tape and Reel TVS Solderable 12.2 13.5 5 11 10 SM6S11A 4600 175 DO-218AB TV180T012S4PV 180 x 180 Tape and Reel TVS Solderable 13.3 14.7 5 12 10 SM6S12A 4600 175 DO-218AB TV180T013S4PV 180 x 180 Tape and Reel TVS Solderable 14.4 15.9 5 13 10 SM6S13A 4600 175 DO-218AB TV180T014S4PV 180 x 180 Tape and Reel TVS Solderable 15.6 17.2 5 14 10 SM6S14A 4600 175 DO-218AB TV180T015S4PV 180 x 180 Tape and Reel TVS Solderable 16.7 18.5 5 15 10 SM6S15A 4600 175 DO-218AB TV180T016S4PV 180 x 180 Tape and Reel TVS Solderable 17.8 19.7 5 16 10 SM6S16A 4600 175 DO-218AB TV180T017S4PV 180 x 180 Tape and Reel TVS Solderable 18.9 20.9 5 17 10 SM6S17A 4600 175 DO-218AB TV180T018S4PV 180 x 180 Tape and Reel TVS Solderable 20 22.1 5 18 10 SM6S18A 4600 175 DO-218AB TV180T020S4PV 180 x 180 Tape and Reel TVS Solderable 22.2 24.5 5 20 10 SM6S20A 4600 175 DO-218AB TV180T022S4PV 180 x 180 Tape and Reel TVS Solderable 24.4 26.9 5 22 10 SM6S22A 4600 175 DO-218AB TV180T024S4PV 180 x 180 Tape and Reel TVS Solderable 26.7 29.5 5 24 10 SM6S24A 4600 175 DO-218AB TV180T026S4PV 180 x 180 Tape and Reel TVS Solderable 28.9 31.9 5 26 10 SM6S26A 4600 175 DO-218AB TV180T028S4PV 180 x 180 Tape and Reel TVS Solderable 31.1 34.4 5 28 10 SM6S28A 4600 175 DO-218AB TV180T030S4PV 180 x 180 Tape and Reel TVS Solderable 33.3 36.8 5 30 10 SM6S30A 4600 175 DO-218AB TV180T033S4PV 180 x 180 Tape and Reel TVS Solderable 36.7 40.6 5 33 10 SM6S33A 4600 175 DO-218AB TV180T036S4PV 180 x 180 Tape and Reel TVS Solderable 40 44.2 5 36 10 SM6S36A 4600 175 DO-218AB TV210L027S6PV 210 x 210 Tape and Reel TVS Solderable 24 30 10 22 1 SM8A27 6600 175 DO-218AB TV210T010S4PV 210 x 210 Tape and Reel TVS Solderable 11.1 12.3 5 10 15 SM8S10A 6600 175 DO-218AB TV210T011S4PV 210 x 210 Tape and Reel TVS Solderable 12.2 13.5 5 11 10 SM8S11A 6600 175 DO-218AB TV210T012S4PV 210 x 210 Tape and Reel TVS Solderable 13.3 14.7 5 12 10 SM8S12A 6600 175 DO-218AB TV210T013S4PV 210 x 210 Tape and Reel TVS Solderable 14.4 15.9 5 13 10 SM8S13A 6600 175 DO-218AB TV210T014S4PV 210 x 210 Tape and Reel TVS Solderable 15.6 17.2 5 14 10 SM8S14A 6600 175 DO-218AB TV210T015S4PV 210 x 210 Tape and Reel TVS Solderable 16.7 18.5 5 15 10 SM8S15A 6600 175 DO-218AB TV210T016S4PV 210 x 210 Tape and Reel TVS Solderable 17.8 19.7 5 16 10 SM8S16A 6600 175 DO-218AB Part Number Die Size (mils) TV162T024S4PV 162 x 162 Tape and Reel TVS Solderable 26.7 TV162T026S4PV 162 x 162 Tape and Reel TVS Solderable TV162T028S4PV 162 x 162 Tape and Reel TV162T030S4PV IT (mA) VWM (V) 29.5 1 24 10 SM5S24A 28.9 31.9 1 26 10 TVS Solderable 31.1 34.4 1 28 162 x 162 Tape and Reel TVS Solderable 33.3 36.8 1 TV162T033S4PV 162 x 162 Tape and Reel TVS Solderable 36.7 40.6 TV162T036S4PV 162 x 162 Tape and Reel TVS Solderable 40 TV180L027S6PV 180 x 180 Tape and Reel TVS Solderable TV180T010S4PV 180 x 180 Tape and Reel TV180T011S4PV selector guide Package 23/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products T VS TVS Die P / N List Product Family VBR VBR at IT at IT max min (V) (V) Power IQ Finished Good Rating (µA) Part Number (W) TJ Max. (ºC) Package Style 6600 175 DO-218AB SM8S18A 6600 175 DO-218AB 10 SM8S20A 6600 175 DO-218AB 22 10 SM8S22A 6600 175 DO-218AB 5 24 10 SM8S24A 6600 175 DO-218AB 31.9 5 26 10 SM8S26A 6600 175 DO-218AB 31.1 34.4 5 28 10 SM8S28A 6600 175 DO-218AB TVS Solderable 33.3 36.8 5 30 10 SM8S30A 6600 175 DO-218AB 210 x 210 Tape and Reel TVS Solderable 36.7 40.6 5 33 10 SM8S33A 6600 175 DO-218AB TV210T036S4PV 210 x 210 Tape and Reel TVS Solderable 40 44.2 5 36 10 SM8S36A 6600 175 DO-218AB TV210T040S4PV 210 x 210 Tape and Reel TVS Solderable 44.4 49.1 5 40 10 SM8S40A 6600 175 DO-218AB TV210T043S4PV 210 x 210 Tape and Reel TVS Solderable 47.8 52.8 5 43 10 SM8S43A 6600 175 DO-218AB Part Number Die Size (mils) TV210T017S4PV 210 x 210 Tape and Reel TVS Solderable 18.9 TV210T018S4PV 210 x 210 Tape and Reel TVS Solderable TV210T020S4PV 210 x 210 Tape and Reel TV210T022S4PV IT (mA) VWM (V) 20.9 5 17 10 SM8S17A 20 22.1 5 18 10 TVS Solderable 22.2 24.5 5 20 210 x 210 Tape and Reel TVS Solderable 24.4 26.9 5 TV210T024S4PV 210 x 210 Tape and Reel TVS Solderable 26.7 29.5 TV210T026S4PV 210 x 210 Tape and Reel TVS Solderable 28.9 TV210T028S4PV 210 x 210 Tape and Reel TVS Solderable TV210T030S4PV 210 x 210 Tape and Reel TV210T033S4PV selector guide Package 24/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Zener Diodes Zener Diodes Features Zener diodes are designed to work in the breakdown region of the reverse current-voltage characteristic. The technology is Silicon Epitaxial Planar. Different wafer and bare die options are available with breakdown voltages from 2 V to 200 V, with voltages graded according to the international E24 standard. The typical voltage tolerance is ±5 %, but tighter tolerances are available as well. The diodes are used as voltage regulator and voltage references or as voltage suppressors against surge and ESD events. Essential common features include low reverse leakage current levels and stable breakdown with low impedance. Vishay Portfolio • Vishay offers 5 % tolerance Zener die in wafer or die-on-film form • Zener voltage ratings from 3.3 V to 36 V • 2 % VZ tolerance is available on selected number of parts • Die are available with bondable metalization Typical Applications For Standard / Fast Diodes 1. Voltage Regulating Diodes 2. Diode Clipper for AC Input Signal 3. Protection of Data Lines Against Voltage Transients by ESD Protection Diodes Typical Circuits 1. Voltage Regulating Diodes: a) Simple (Voltage Stabilization) b) Variety of Different Reference Voltage Values (Zener Diodes Connected in Series) 2. Diode Clipper for AC Input Signal 3. Protection of Data Lines Against Voltage Transients by ESD Protection Diodes Data Line Ground selector guide 25/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Zener Diodes Zener Die P / N List Part Number (1) Rated Nominal Zener Technology Voltage at IZ = 5 mA (V) Rated Maximum Reverse Current (µA) Temperature Coefficient of Chip Size Zener Voltage (µm) at IZ = 5 mA (mV / K) Front Side Metal Bondpad Size (µm) Back Side Metal Die Wafer Thickness Diameter (mm) (inches) BDBZX84C3V3-BDx Znr ±5 % 3.3 5.0 (at 1 V) −2.64 to −0.99 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C3V9-BDx Znr ±5 % 3.9 3.0 (at 1 V) −2.73 to −1.17 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C4V3-BDx Znr ±5 % 4.3 3.0 (at 1 V) −2.58 to −0.43 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C4V7-BDx Znr ±5 % 4.7 3.0 (at 2 V) −2.35 to +0.94 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84B5V1-BDx Znr ± 2 % 5.1 2.0 (at 2 V) −1.53 to +2.04 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C5V1-BDx Znr ±5 % 5.1 2.0 (at 2 V) −1.53 to +2.04 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C5V6-BDx Znr ±5 % 5.6 1.0 (at 2 V) −1.12 to +3.36 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C6V2-BDx Znr ±5 % 6.2 3.0 (at 4 V) −0.62 to +4.34 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84B6V8-BDx Znr ± 2 % 6.8 2.0 (at 4 V) +1.36 to +4.76 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C6V8-BDx Znr ±5 % 6.8 2.0 (at 4 V) +1.36 to +4.76 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C7V5-BDx Znr ±5 % 7.5 1.0 (at 5 V) +1.5 to +5.25 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84B8V2-BDx Znr ± 2 % 8.2 0.7 (at 5 V) +3.28 to +5.74 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C8V2-BDx Znr ±5 % 8.2 0.7 (at 5 V) +3.28 to +5.74 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84B9V1-BDx Znr ± 2 % 9.1 0.5 (at 6 V) +4.55 to +7.28 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C9V1-BDx Znr ±5 % 9.1 0.5 (at 6 V) +4.55 to +7.28 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C10-BDx Znr ±5 % 10 0.2 (at 7 V) +5.0 to +8.0 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C11-BDx Znr ±5 % 11 0.1 (at 8 V) +5.5 to +9.9 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C12-BDx Znr ±5 % 12 0.1 (at 8 V) +7.2 to +10.8 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C15-BDx Znr ±5 % 15 0.05 (at 10.5 V) +10.5 to +13.5 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C16-BDx Znr ±5 % 16 0.05 (at 11.2 V) +12.8 to +15.2 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C18-BDx Znr ±5 % 18 0.05 (at 12.6 V) +14.4 to +17.1 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C20-BDx Znr ±5 % 20 0.05 (at 14 V) +16 to +20 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C22-BDx Znr ±5 % 22 0.05 (at 15.4 V) +17.6 to +22 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C27-BDx Znr ±5 % 27 0.05 (at 18.9 V) +21.6 to +27.0 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDMMBZ27V-BDx Znr ±5 % 27 0.08 (at 22 V) max. 30 (at 1 mA) 500 x 500 Bondable 342 square Solderable 180 ± 15 4 BDBZX84C33-BDx Znr ±5 % 33 0.05 (at 23.1 V) +26.4 to +33.0 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C36-BDx Znr ±5 % 36 0.05 (at 25.2 V) +28.8 to +36.0 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C39-BDx Znr ±5 % 39 0.05 (at 27.3 V) +39 to +46.8 320 x 320 Bondable 162 square Solderable 180 ± 15 4 BDBZX84C47-BDx Znr ±5 % 47 0.05 (at 32.9 V) +47 to +56.4 320 x 320 Bondable 162 square Solderable 180 ± 15 4 (1) In the Part Number “x” stands for the delivery version. Contact Vishay to check which version(s) of Die-on-Wafer or Die-on-Film is/are available for the chosen part number (voltage group). selector guide 26/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Switching Diodes Switching Diodes Features Switching Diodes are designed for fast switching between the on and off state, i.e. between the forward and the reverse direction of the diode. They are fast recovery diodes, the switching time is normally reduced by an additional doping process. The technology is Silicon Epitaxial Planar. Wafers and bare dies are available with different power dissipations and reverse voltage ratings. The diodes are used for general purposes and at high frequency applications. They have less reverse leakage current than Schottky diodes, but they are not as fast as Schottky diodes.. Vishay Portfolio • Vishay offers 1N4148 and 1N4150 in die and wafer form • Die are available with bondable metalization Typical Applications For Standard / Fast Diodes 1. Full-Wave Rectification 2. Logic Circuit 3. DC/DC Converter Typical Circuits 1. Full Wave Rectification 2. Logic Circuit (e.g. and Logic) + – 3. DC/DC Converter 30 V selector guide 5V 27/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Switching Diodes and ESD Protection ESD Protection Diodes Die P / N List Part Number (1) BDESD12D3590-BDx BDVESD05B-BDx Rated Rated Rated Maximum Nominal Breakdown ESD Immunity Voltage Zener Cont. Discharge Technology Range at Voltage (IEC 61000-4-2) at IZ = 5 mA IR = 1 mA (kV) (V) (V) Chip Size (µm2) Front Side Metal Bondpad Size (µm) Back Side Metal Die Wafer Thickness Diameter (mm) (inches) ESD Protection 11.0 to 13.0 0.1 (at 8 V) ±8 180 x 180 Bondable 70 square Solderable 100 ± 20 4 ESD Protection 0.1 (at 5 V) ±30 260 x 260 Bondable 90 rounded Solderable 100 ± 5 4 6.0 to 7.5 (1) In the Part Number “x” stands for the delivery version. Contact Vishay to check which among Die-on-Wafer, Die-on-Film are available for chosen part number. Switching Diodes Die P / N List Part Number (1) IF(AV) (A) (2) VR (V) VF max at 25°C (V) (3) Chip Size (µm2) Front Side Metal Bondpad Size (µm) Back Side Metal Die Thickness (mm) Wafer Diameter (inches) BD1N4148-BDx 0.15 100 1 at 10 mA 280 x 280 Bondable 108 square Solderable 200 ± 20 4 BD1N4150-BDx 0.2 75 0.74 at 10 mA 280 x 280 Bondable 108 square Solderable 200 ± 20 4 (1) In the Part Number “x” stands for the delivery version. Both Die-on-Wafer and Die-on-Film versions are available. (2) Rated in discrete package or based on technology. (3) See datasheets for details. Contact Vishay to check which among Die-on-Wafer and Die-on-Film are available for chosen part number. selector guide 28/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Packaging Packing Options Vishay provides you with several packing options which can fit with virutally any assembly line. Parts are 100 % probed and inspected. Unsawn wafer — die are not singulated, wafers are provided in box Sawn wafer on film — wafer is provided on blue film where die are singulated, ready for pick and place Die in tape and reel — die are located in pocket tape in several different types of reel Die Waffle Pack — die are located in a tray with dimensions optimized for each die size Please contact Vishay for all details related to packing options in order to best fit your requirements. selector guide 29/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Diodes - A Wide Range of Bare Die and Wafer Form Products Bare Die Notes: selector guide 30/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Diodes - A Wide Range of Bare Die and Wafer Form Products Bare Die Notes: selector guide 31/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . Diodes - A Wide Range of Bare Die and Wafer Form Products Bare Die Worldwide Sales Contacts The Americas EUROPE United states Germany Vishay Americas One Greenwich Place Shelton, CT 06484 United States Ph: +1-402-563-6866 Fax: +1-402-563-6296 Vishay Electronic GmbH Dr.-Felix-Zandman-Platz 1 95100 Selb Germany Ph: +49-9287-71-0 Fax: +49-9287-70435 Asia france singapore Vishay intertechnology Asia Pte Ltd. 37A Tampines Street 92 #07-00 Singapore 528886 Ph: +65-6788-6668 Fax: +65-6788-0988 Vishay S.A. 199, blvd de la madelEine 06003 nice, cedex 1 France Ph: +33-4-9337-2727 Fax: +33-4-9337-2726 p.r. China united kingdom Vishay China Co., Ltd. 15D, Sun Tong Infoport Plaza 55 Huai Hai West Road Shanghai 200030 P.R. China PH: +86-21-5258 5000 FAX: +86-21-5258 7979 Vishay Ltd. Suite 6C, Tower House St. Catherine’s Court Sunderland Enterprise Park Sunderland SR5 3XJ UNITED KINGDOM Ph: +44-191-516-8584 Fax: +44-191-549-9556 japan VISHAY JAPAN CO., LTD. Shibuya Prestige Bldg. 4F 3-12-22, Shibuya Shibuya-ku Tokyo 150-0002 Japan Ph: +81-3-5466-7150 fax: +81-3-5466-7160 selector guide 32/32 VMN-SG2163-1312 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000