TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS Compliant, 890 nm, GaAlAs Double Hetero FEATURES TSMF1000 • Package type: surface mount TSMF1020 • Package form: GW, RGW, yoke, axial • Dimensions (L x W x H in mm): 2.5 x 2 x 2.7 • Peak wavelength: p = 890 nm • High radiant power • Angle of half intensity: = ± 17° TSMF1030 • Low forward voltage • Suitable for high pulse current operation • Versatile terminal configurations 16758-5 • Package matches with detector TEMD1000 • Floor life: 168 h, MSL 3, acc. J-STD-020 • Compliant to RoHS Directive 2002/95/EC and in accordance with WEEE 2002/96/EC DESCRIPTION APPLICATIONS TSMF1000 series are infrared, 890 nm emitting diodes in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Control and drive circuits • Shaft encoders PRODUCT SUMMARY Ie (mW/sr) (deg) P (nm) tr (ns) TSMF1000 5 ± 17 890 30 TSMF1020 5 ± 17 890 30 TSMF1030 5 ± 17 890 30 COMPONENT Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TSMF1000 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing TSMF1020 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing TSMF1030 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Yoke Note • MOQ: minimum order quantity Rev. 1.8, 30-Jun-11 1 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 0.8 A PV 180 mW Power dissipation Junction temperature Tj 100 °C Operating temperature range Tamb - 40 to + 85 °C Storage temperature range Tstg - 40 to + 100 °C t5s Tsd 260 °C Soldered on PCB, pad dimensions: 4 mm x 4 mm RthJA 400 K/W Soldering temperature Thermal resistance junction/ambient 200 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 400 K/W 80 60 40 100 80 60 RthJA = 400 K/W 40 20 20 0 0 0 10 21165 20 30 40 50 60 70 80 90 100 0 Tamb - Ambient Temperature (°C) 10 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21166 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 20 mA VF 1.3 1.5 V IF = 1 A, tp = 100 μs VF 2.4 V IF = 1 mA TKVF - 1.8 mV/K VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 Cj IF = 20 mA Ie IF = 100 mA, tp = 100 μs Ie MIN. 10 μA 13 mW/sr 160 2.5 5 25 pF mW/sr IF = 100 mA, tp = 20 ms e 35 mW IF = 20 mA TKe - 0.6 %/K ± 17 deg Peak wavelength IF = 20 mA p 890 nm Spectral bandwidth IF = 20 mA 40 nm Temperature coefficient of p IF = 20 mA TKp 0.2 nm/K Rise time IF = 20 mA tr 30 ns Fall time IF = 20 mA tf 30 ns IDC = 70 mA, IAC = 30 mA pp fc 12 MHz d 1.2 mm Radiant power Temperature coefficient of e Angle of half intensity Cut-off frequency Virtual source diameter Rev. 1.8, 30-Jun-11 2 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 10 000 1000 Tamb < 60 °C 0.01 1000 Φe - Radiant Power (mW) IF - Forward Current (mA) tp/T = 0.005 0.02 0.05 100 0.2 0.5 DC 0.1 10 1 0.01 0.1 1 10 1 10 4 Fig. 6 - Radiant Power vs. Forward Current 104 1.6 103 1.2 Ie rel; Φe rel IF = 20 mA 102 0.8 0.4 101 100 0 94 8880 1 2 3 0 - 10 0 10 4 VF - Forward Voltage (V) 94 7993 1000 Φe rel - Relative Radiant Power 10 1 16189 101 102 103 140 1.0 0.75 0.5 0.25 0 800 104 IF - Forward Current (mA) 20082 1000 900 λ - Wavelength (nm) Fig. 8 - Relative Radiant Power vs. Wavelength Fig. 5 - Radiant Intensity vs. Forward Current Rev. 1.8, 30-Jun-11 100 1.25 100 0.1 100 50 T amb - Ambient Temperature (°C) Fig. 7 - Rel. Radiant Intensity/Power vs. Ambient Temperature Fig. 4 - Forward Current vs. Forward Voltage Ie - Radiant Intensity (mW/sr) 10 1 10 2 10 3 I F - Forward Current (mA) 94 8007 Fig. 3 - Pulse Forward Current vs. Pulse Duration IF - Forward Current (mA) 10 0.1 10 0 100 tp - Pulse Length (ms) 95 9985 100 3 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors REFLOW SOLDER PROFILE 0° 10° 20° 260 30° 1.0 0.9 50° 0.8 60° 70° 0.7 220 Temperature (°C) 40° ϕ - Angular Displacement Srel - Relative Sensitivity 240 200 160 140 120 0.4 0.2 60 s to 120 s 5s 100 80° 0.6 - 5 °C/s + 5 °C/s 180 80 60 0 0 20 40 60 80 100 120 140 160 180 200 220 94 8248 Time (s) 17172 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile PRECAUTIONS FOR USE 1 °C/s to 5 °C/s 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen). Pre-heating 180 °C to 200 °C 260 °C max. 10 s max. 60 s max. above 220 °C 120 s max. 2. Storage • Storage temperature and rel. humidity conditions are: 5 °C to 35 °C, R.H. 60 %. 1 °C/s to 5 °C/s • Floor life must not exceed 168 h, acc. to JEDEC level 3, J-STD-020. Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with desiccant. Considering tape life, we suggest to use products within one year from production date. 22566 Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020 • If opened more than one week in an atmosphere 5 °C to 35 °C, R.H. 60 %, devices should be treated at 60 °C ± 5 °C for 15 h. • If humidity indicator in the package shows pink color (normal blue), then devices should be treated with the same conditions as 2.3. Rev. 1.8, 30-Jun-11 4 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: TSMF1000 16159 PACKAGE DIMENSIONS in millimeters: TSMF1020 3.8 ± 0.2 2.7 ± 0.2 0.75 0.15 ± 0.05 1.4 0.85 Ø 1.9 ± 0.2 0.3 2.3 ± 0.1 0.4 C Rev. 1.8, 30-Jun-11 4.5 ± 0.1 0.5 2 ± 0.2 1.1 1 ± 0.1 2.5 ± 0.2 16160 A 5 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: TSMF1030 16228 16 ±0.2 Unreel direction X 2. 60.2 ±0.5 REEL DIMENSIONS in millimeters 5 178 ±1 .5 ±0 0. 5 Tape position coming out from reel 13 ± X 13.2 ±1.5 Label posted here Leader and trailer tape: Empty leader (400 mm, min.) Parts mounted Drawing-No.: 9.800-5080.01-4 Direction of pulling out Issue: 3; 11.06.08 Empty trailer (200 mm, min.) 18033 Rev. 1.8, 30-Jun-11 6 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors TAPING DIMENSIONS in millimeters: TSMF1000 3.05 ± 0.1 Top tape Anode 12 ± 0.3 1.75 ± 0.1 2 ± 0.05 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 4 ± 0.1 Feed direction Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs 18030 TAPING DIMENSIONS in millimeters: TSMF1020 3.05 ± 0.1 4 ± 0.1 Feed direction Top tape 12 ± 0.3 2 ± 0.05 1.75 ± 0.1 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs Rev. 1.8, 30-Jun-11 7 18031 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSMF1000, TSMF1020, TSMF1030 www.vishay.com Vishay Semiconductors TAPING DIMENSIONS in millimeters: TSMF1030 3.05 ± 0.1 Feed direction Top tape 4 ± 0.1 Anode Push pin through hole Rev. 1.8, 30-Jun-11 12 ± 0.3 1.75 ± 0.1 2 ± 0.05 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 18032 Quantity per reel: 1000 pcs or 5000 pcs 8 Document Number: 81061 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1