SiP32448, SiP32449 www.vishay.com Vishay Siliconix 1.7 V to 5.5 V, 3 A Load Switch with Negative VIN Tolerance DESCRIPTION FEATURES The SiP32448 and SiP32449 are low resistance slew rate controlled load switches. The part operates from 1.7 V to 5.5 V supply and can tolerate negative voltage at input to -2 V. The integrated charge pump drivers enable the part with low on resistance over the wide input voltage range. • 1.7 V to 5.5 V input voltage range • Negative input voltage tolerance down to -2 V • 38 m typical RON from 1.8 V to 5 V • 3 A maximum continuous switch current • Slew rate controlled turn-on: 2.5 ms at 3.6 V Both SiP32448 and SiP32449 feature a controlled soft-on slew rate of typical 2.5 ms that limits the inrush current for designs of heavy capacitive load and minimizes the resulting voltage droop at the power rails. Available • Constant low control logic: VIH = 1.15 V, VIL = 0.7 V • 2 V UVLO when EN is open • Reverse current blocking when switch is off or VIN is ground The SiP32448 and SiP32449 feature a constant low voltage control logic interface over the full operation voltage range. It can interface with low voltage control signals without extra level shifting circuit. When EN is left open, the part will not turn on until VIN is greater than 2.5 V. • Output discharge (SiP32449) • ESD protected - HBM: >6 kV - MM: >300 V - IEC61000-4-2 air discharge: >15 kV - IEC61000-4-2 contact discharge: >8 kV The SiP32449 has a output discharge to help discharge the output capacitor during shutdown mode for fast turn off. • Compact TDFN4 package The SiP32448 and SiP32449 have exceptionally low shutdown current and provides reverse blocking to prevent high current flowing into the power source when the switch is off or VIN is ground. • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS Both SiP32448 and SiP32449 are available in TDFN4 package of 1.2 mm x 1.6 mm x 0.55 mm. • PDAs / smart phones • Notebook / netbook computers • Tablet PC • Portable media players • Digital camera • GPS navigation devices • Data storage devices • Optical, industrial, medical, and healthcare devices TYPICAL APPLICATION CIRCUIT VIN IN OUT VOUT SiP32448, SiP32449 C IN 2.2 µF C OUT 1 µF EN EN GND GND GND Fig. 1 - SiP32448, SiP32449 Typical Application Circuit S15-1920-Rev. C, 24-Aug-15 Document Number: 62959 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix ORDERING INFORMATION Part Number Package SiP32448DNP-T1-GE4 Marking TDFN4 1.2 mm x 1.6 mm SiP32449DNP-T1-GE4 Output Discharge Lx No Px Yes Temperature Range -40 °C to +85 °C Notes • x = Lot code • GE4 denotes halogen-free and RoHS compliant ABSOLUTE MAXIMUM RATINGS Parameter Limit Supply Input Voltage (VIN) -2 to +6 Enable Input Voltage (VEN) -2 to +6 Output Voltage (VOUT) V -0.3 to +6 Maximum Continuous Switch Current (Imax.) c 4 Maximum Repetitive Pulsed Current (1 ms, 10 % Duty Cycle) c Maximum Non-Repetitive Pulsed Current (100 μs, EN = Active) Thermal Resistance (qJA) 12 -40 to +150 °C 170 °C/W a a,b ESD Rating A 7 c Junction Temperature (TJ) Power Dissipation (PD) Unit 735 mW HBM 6 kV V MM 300 IEC41000-4-2 Air Discharge d 15 IEC41000-4-2 Contact Discharge d 8 kV Notes a. Device mounted with all leads and power pad soldered or welded to PC board, see PCB layout. b. Derate 5.9 mW/°C above TA = 25 °C, see PCB layout. c. TA = 25 °C, see PCB layout. d. Tested on VIN with 2.2 μF CIN. VIN connected to micro-USB connector. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating/conditions for extended periods may affect device reliability. RECOMMENDED OPERATING RANGE Parameter Input Voltage Range (VIN) Operating Junction Temperature Range (TJ) S15-1920-Rev. C, 24-Aug-15 Limit Unit 1.7 to 5.5 V -40 to +125 °C Document Number: 62959 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix SPECIFICATIONS Parameter Operating Voltage c Limits -40 °C to +85 °C Test Conditions Unless Specified VIN = 5 V, TA = -40 °C to +85 °C (Typical values are at TA = 25 °C) Symbol VIN Negative Input Voltage Tolerance Under Voltage Lock Out Max. a 1.7 - 5.5 V mA INEG VIN = -2 V - -15 - EN = open, 25 °C (switch On to Off) - - 2 UVLOL-H EN = open, 25 °C (switch Off to On) 2.5 - - IQ Quiescent Current Typ. b UVLOH-L UVLOHYS UVLO Hysteresis Unit Min. a EN = open, 25 °C - 0.25 - VIN = 1.8 V, EN = active - 35 50 VIN = 2.5 V, EN = active - 54 90 VIN = 3.6 V, EN = active - 78 110 VIN = 4.3 V, EN = active - 93 130 VIN = 5 V, EN = active - 110 180 EN = inactive, OUT = open - 8 18 Off Supply Current IQ(off) Off Switch Current IDS(off) EN = inactive, OUT = GND - - 1 IRB VOUT = 5 V, VIN = 0 V, VEN = inactive - - 10 VIN = 1.8 V, IL = 500 mA, TA = 25 °C - 38 43 VIN = 2.5 V, IL = 500 mA, TA = 25 °C - 38 43 VIN = 3.6 V, IL = 500 mA, TA = 25 °C - 38 43 VIN = 4.3 V, IL = 500 mA, TA = 25 °C - 38 43 VIN = 5 V, IL = 500 mA, TA = 25 °C Reverse Blocking Current RDS(on) On-Resistance - 38 43 TCRDS - 3100 - c VIL - - 0.7 EN Input High Voltage c VIH 1.15 d - - On-Resistance Temp.-Coefficient EN Input Low Voltage V VIN = 1.8 V to 5.5 V μA m ppm/°C d V EN Input Leakage ISINK VEN = 5.5 V -6 - 6 μA Output Pulldown Resistance RPD EN = inactive, TA = 25 °C (for SiP32449 only) - 210 280 Output Turn-On Delay Time td(on) - 1.35 - Output Turn-On Rise Time t(on) VIN = 3.6 V, Rload = 10 , TA = 25 °C 1 1.7 3.8 - 0.005 td(off) Output Turn-Off Delay Time Notes a. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. c. For VIN outside this range consult typical EN threshold curve. d. Not tested, guarantee by design. ms PIN CONFIGURATION OUT 4 1 IN Bottom View GND EN 3 2 GND Fig. 2 - TDFN4 1.2 mm x 1.6 mm Package PIN DESCRIPTION Pin Number Name Function 1 IN This is the input pin of the switch 2 GND Ground connection 3 EN Enable input 4 OUT This is the output pin of the switch S15-1920-Rev. C, 24-Aug-15 Document Number: 62959 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix BLOCK DIAGRAM VIN Negative Voltage Detect / Clamp EN Control Logic Charge Pump Turn-on Slew Rate Control SiP32449 only Output Discharge GND SiP32448, SiP32449 Fig. 3 - Functional Block Diagram DETAILED DESCRIPTION SiP32448 and SiP32449 are advanced slew rate controlled high side load switches with an integrated N-channel power switch. When the device is enabled the gate of the power switch is turned on at a controlled rate to avoid excessive inrush current. Once fully on the gate to source voltage of the power switch is biased at a constant level. The design gives a flat on resistance throughout the operating voltages. A special reverse blocking circuitry prevents current flowing from output to input when the switch is off. The VIN and EN pin can tolerate -2 V voltage without drawing excessive current. APPLICATION INFORMATION Input Capacitor In general, under steady state conditions the SiP32448 and SiP32449 do not require an input capacitor. Nevertheless, an input bypass capacitor is recommended in order to reduce the input voltage drop caused by transient inrush currents. Commonly, a 2.2 μF ceramic capacitor is sufficient and should be placed in close proximity to VIN and GND pins. A higher value input capacitor can help to further reduce the voltage drop. Ceramic capacitors are recommended for their low ESR characteristic. Output Capacitor While these devices work without an output capacitor, a 1 μF or higher value capacitor across VOUT and GND is recommended in order to handle potential load transient conditions. In the event that the switch is turning of while running high current, circuit stray inductances might force the output to some negative voltage in order to mitigate this phenomenon a proper output capacitor is required. Enable The device is logic high active. Enable pin voltage can exceed VIN as long as it is within the absolute maximum rating range. The EN pin is compatible with both TTL and CMOS logic voltage levels. The part features a constant S15-1920-Rev. C, 24-Aug-15 control logic threshold over the operation voltage range. When enable pin is left open, a built-in voltage divider sets the internal logic. The switch will turn on when the VIN exceeds the UVLO trip point. Reverse Voltage Protection The SiP32448 and SiP32449 contain a reverse blocking circuitry to protect the current from going to the input from the output when the switch is off. Reverse blocking works for input voltage as low as 0 V. In case the EN pin is left open, the reverse blocking circuitry will prevents current flow from output pin to input pin if the output voltage is higher by at least 1 V than the input voltage. THERMAL CONSIDERATIONS The maximum allowed DC Current depends on the thermal condition in which the device operates. In order to calculate max allowed DC current, first the max power dissipation should be considered. The SiP32448 and SiP32449 are packaged in a TDFN4 1.2 mm x 1.6 mm package which has a thermal resistance of J-Aa = 170 °C/W. Note a. Device mounted with all leads and power pad soldered or welded to PC board, see PCB layout. For any other layout configuration the actual junction to ambient thermal impedance should be considered The following formula shows the maximum allowed power dissipation as a function of the ambient temperature TA when the maximum junction temperature is limited to TJ (max.) = 125 °C: Pmax. = TJ (max.) - TA θJ-A = 125 - TA 170 For example at ambient temperature of 70 °C, the maximum power dissipation will be limited to about 324 mW. Document Number: 62959 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix In order to calculate the maximum allowed DC current the switch RDS(on) temperature dependency should be considered. As an example let us calculate maximum load current at TA = 70 °C and input voltage of 1.8 V. At this input voltage the RDS(on) at 25 °C 43 m (see specification table). The RDS(on) at 125 °C can be extrapolated from this data using the following formula: RDS(on)_125 °C = RDS(on)_25 °C x (1 + TC x (TJ max. - 25)/100 ) Where TC is the RDS(on) temperature coefficient expressed in percent change per degree C. For SiP32448 the approximated value is 0.31 %/°C. TJ max. is the maximum allowed junction temperature (125 °C). Negative Input Voltage The SiP32448 and SiP32449 can withstand maximum negative 2 V at its input due to any spike from abnormal or fault condition of the system. Recommended Board Layout For improved performance, all traces should be as short as possible to minimize stray inductances and parasitic effects. The input and output capacitors should be kept as close as possible to the input and output pins respectively. Connecting the central exposed pad to GND, using wide traces for input, output, and GND help reducing the case to ambient thermal impedance. See fig. 4. BOARD LAYOUT Therefore, RDS(on) (at 125 °C) = 43 mΩ x (1 + 0.31 x (125 - 25)/100 ) ≈ 57 mΩ The maximum current limit is then determined by I LOAD (max.) < P (max.) R DS(on) Which in this case is 2.38 A. Due to device limitation the max switch DC current should exceed 3 A in any condition. To obtain the highest power dissipation the power pad of the device should be connected to a heat sink on the printed circuit board. Figure 4 shows a typical PCB layout. All copper traces and vias for the VIN and VOUT pins should be sized adequately to carry the maximum continuous current. Fig. 4 - Recommended Board Layout TYPICAL APPLICATION SCHEMATIC Fig. 5 - Application Schematic S15-1920-Rev. C, 24-Aug-15 Document Number: 62959 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix TYPICAL ENABLE POWER ON AND OFF WAVEFORMS Typical Turn-On Delay, Rise Time, COUT = 1 μF, CIN = 2.2 μF, IOUT = 3 A Typical Turn-Off Delay, Fall Time, COUT = 1 μF, CIN = 2.2 μF, IOUT = 3 A Typical Turn-On Delay, Rise Time, COUT = 1 μF, CIN = 2.2 μF, ROUT = 10 Typical Turn-Off Delay, Fall Time, COUT = 1 μF, CIN = 2.2 μF, ROUT = 10 S15-1920-Rev. C, 24-Aug-15 Document Number: 62959 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted) 160 140 140 120 IQ - Quiescent Current (μA) IQ - Quiescent Current (μA) 120 100 80 60 40 VIN = 5 V 100 80 VIN = 3.6 V 60 40 VIN = 1.8 V 20 20 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 - 40 5.5 - 20 0 VIN (V) 9.0 80 100 10 8.5 9 8.0 IIQ(OFF) - Off Supply Current (μA) IQ(OFF) - Off Supply Current (μA) 60 Fig. 9 - Quiescent Current vs. Temperature Fig. 6 - Quiescent Current vs. Input Voltage 7.5 7.0 6.5 6.0 5.5 5.0 8 VIN = 5 V 7 VIN = 3.6 V 6 5 VIN = 1.8 V 4 3 4.5 4.0 1.5 2 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 - 40 - 20 0 20 40 60 80 100 Temperature (°C) VIN (V) Fig. 10 - Off Supply Current vs. Temperature Fig. 7 - Off Supply Current vs. Input Voltage -0.3 20 -0.35 0 IDS(off) - Off Switch Current (nA) IDS(off) - Off Switch Current (nA) 20 40 Temperature (°C) -0.4 -0.45 -0.5 -0.55 -0.6 -0.65 -20 -40 VIN = 1.2 V -60 VIN = 3.6 V -80 -100 VIN = 5 V -120 -140 -0.7 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -160 - 40 - 20 0 20 40 60 80 100 VIN (V) Temperature (°C) Fig. 8 - Off Switch Current vs. Input Voltage Fig. 11 - Off Switch Current vs. Temperature S15-1920-Rev. C, 24-Aug-15 Document Number: 62959 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted) 42.0 50 41.5 48 46 40.5 RDS - On-Resistance (mΩ) RDS - On-Resistance (mΩ) 41.0 IO = 0.5 A VIN = 5 V IO = 2.0 A 40.0 IO = 1.2 A 39.5 39.0 38.5 IO = 0.5 A 38.0 44 42 40 38 36 34 37.5 32 37.0 30 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 - 40 - 20 0 Fig. 12 - On-Resistance vs. Input Voltage 60 80 100 230 SiP32449 only VOUT = VIN 350 RPD - Output Pulldown Resistance (Ω) RPD - Output Pulldown Resistance (Ω) 40 Fig. 15 - On-Resistance vs. Temperature 400 300 250 200 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SiP32449 only VOUT = VIN = 5 V 225 220 215 210 205 200 195 190 - 40 5.5 - 20 0 20 40 60 80 100 VIN (V) Temperature (°C) Fig. 13 - Output Pulldown Resistance vs. VIN Fig. 16 - Output Pulldown Resistance vs. Temperature 1.20 2.4 1.15 VIN = 5 V CL = 0.1 μF RL = 10 Ω 2.3 1.10 2.2 1.05 1.00 tr - Rise Time (ms) EN Threshold Voltage (V) 20 Temperature (°C) VIN (V) VIH 0.95 0.90 0.85 VIL 0.80 2.1 2.0 1.9 1.8 1.7 0.75 1.6 0.70 1.5 0.65 0.60 1.5 1.4 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VIN (V) Fig. 14 - Threshold Voltage vs. Input Voltage S15-1920-Rev. C, 24-Aug-15 - 40 - 20 0 20 40 Temperature (°C) 60 80 100 Fig. 17 - Rise Time vs. Temperature Document Number: 62959 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32448, SiP32449 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted) 1.2 4.0 VIN = 5 V CL = 0.1 μF RL = 10 Ω VIN = 5 V CL = 0.1 μF RL = 10 Ω 3.5 td(off) - Turn-Off Delay Time (μs) td(on) - Turn-On Delay Time (ms) 1.2 1.1 1.1 1.0 1.0 0.9 3.0 2.5 2.0 1.5 1.0 0.5 0.9 0.0 0.8 - 40 - 20 0 20 40 60 Temperature (°C) 80 - 40 100 Fig. 18 - Turn-On Delay Time vs. Temperature - 20 0 20 40 Temperature (°C) 60 80 100 Fig. 20 - Turn-Off Delay Time vs. Temperature 2 0.0 0 -2 IVIN - Input Current (mA) IIN - Input Current (nA) -0.5 -1.0 VIN = 0 V -1.5 -2.0 -4 -6 -8 -10 -12 -14 -2.5 -16 -3.0 0.5 -18 1.0 1.5 2.0 2.5 3.0 3.5 VOUT (V) 4.0 4.5 5.0 Fig. 19 - Reverse Blocking Current 5.5 -2.0 -1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 VIN (V) Fig. 21 - Negative Input Voltage Tolerance Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?62959. S15-1920-Rev. C, 24-Aug-15 Document Number: 62959 9 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information www.vishay.com Vishay Siliconix TDFN4 1.2 x 1.6 Case Outline D 4 D2 b 3 Pin #1 ID (Optional) 4 K E E2 3 1 2 e Index Area (D/2 x E/2) Bottom View A A1 Top View A3 1 L 2 Side View MILLIMETERS INCHES DIM. MIN. NOM. MAX. MIN. NOM. MAX. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 - 0.05 0.00 - 0.002 A3 0.15 REF. 0.006 b 0.20 0.25 0.30 0.008 0.010 0.012 D 1.15 1.20 1.25 0.045 0.047 0.049 D2 0.81 0.86 0.91 0.032 0.034 0.036 e 0.50 BSC 0.020 E 1.55 1.60 1.65 0.061 0.063 0.065 E2 0.45 0.50 0.55 0.018 0.020 0.022 0.35 0.010 K L 0.25 TYP. 0.25 0.30 0.010 TYP. 0.012 0.014 ECN: S11-2099-Rev. B, 07-Nov-11 DWG: 5995 Revision: 07-Nov-11 1 Document Number: 65734 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PADS FOR TDFN4 1.2 x 1.6 0.86 0.50 3 1 2 2.0 0.55 0.20 0.50 0.20 4 0.55 0.30 Recommended Minimum Pads Dimensions in mm Document Number: 66558 Revision: 05-Mar-10 www.vishay.com 1 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000